CN212629043U - Integrated circuit board with detachable heat dissipation mechanism - Google Patents
Integrated circuit board with detachable heat dissipation mechanism Download PDFInfo
- Publication number
- CN212629043U CN212629043U CN202021786382.2U CN202021786382U CN212629043U CN 212629043 U CN212629043 U CN 212629043U CN 202021786382 U CN202021786382 U CN 202021786382U CN 212629043 U CN212629043 U CN 212629043U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- integrated circuit
- dissipation mechanism
- fixture block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 67
- 238000009434 installation Methods 0.000 abstract description 4
- 239000000428 dust Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an integrated circuit board with can dismantle heat dissipation mechanism belongs to integrated circuit board technical field, and this integrated circuit board with can dismantle heat dissipation mechanism includes into circuit board main part, integrated circuit board main part fixed connection is on the surface of fixed plate, the fixed fixture block of both sides fixedly connected with of fixed plate upper surface, first screw hole has been seted up to the side of fixed fixture block. This integrated circuit board with can dismantle heat dissipation mechanism, through first screw hole, first bolt, the setting of second screw hole and second fixing bolt, when using, fix fan base on the heat dissipation case through second fixing bolt, place the heat dissipation case on fixed fixture block again, it makes the heat dissipation case fixed to rotate first bolt, can accomplish the installation, after the use is accomplished or when needing to be changed, it makes heat dissipation case and fixed fixture block break away from to rotate first bolt, it can also unpack fan base apart to rotate second fixing bolt, and easy dismounting, simple and practical.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit board, concretely relates to integrated circuit board with can dismantle heat dissipation mechanism.
Background
The integrated circuit board is a carrier for loading an integrated circuit, but the integrated circuit is usually carried on the carrier, and is mainly made of silica gel, so the integrated circuit board is generally green, and the integrated circuit board adopts a semiconductor manufacturing process to manufacture a plurality of components such as transistors, resistors, capacitors and the like on a smaller single crystal silicon chip and combines the components into a complete electronic circuit according to a multilayer wiring or tunnel wiring method.
At present, the existing integrated circuit board in the market has a single structure and poor heat dissipation performance, needs to be frequently replaced, causes the integrated circuit board to be overheated and incapable of working, and even scrapped, and the heat dissipation mechanism can not be detached, and the circuit is abnormal due to the fact that the flowing of air often causes the circuit board to accumulate a large amount of dust, and the fault frequency occurs.
To prior art not enough, the utility model provides an integrated circuit board with can dismantle heat dissipation mechanism can effectively overcome the defect that the aforesaid exists.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit board with can dismantle heat dissipation mechanism aims at solving among the prior art heat dissipation mechanism and can not dismantle, and a large amount of dusts are gathered easily to the circuit board, lead to the unusual problem of circuit.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated circuit board with can dismantle heat dissipation mechanism, includes the integrated circuit board main part, integrated circuit board main part fixed connection is on the surface of fixed plate, the both sides fixedly connected with fixed fixture block of fixed plate upper surface, first screw hole has been seted up to the side of fixed fixture block, there is the heat dissipation case fixed fixture block's inside through first bolt threaded connection, the air intake has been seted up to the both sides of heat dissipation case, the second screw hole is seted up to the interior roof of heat dissipation case, the inside threaded connection of second screw hole has second fixing bolt, fan base has been cup jointed on the surface of second fixing bolt.
In order to make this integrated circuit board that has detachable heat dissipation mechanism reach the effect of filtering the ash layer, conduct the utility model relates to an it is preferred, the inside fixedly connected with filter screen of air intake.
In order to make this kind have integrated circuit board that can dismantle heat dissipation mechanism reach the purpose of airing exhaust, as the utility model relates to an it is preferred, fan base's interior diapire is provided with the fan.
In order to make this integrated circuit board that has detachable heat dissipation mechanism reach the effect that the radiating efficiency is high, conduct the utility model relates to an it is preferred, the quantity of fan is two.
In order to make this integrated circuit board with can dismantle heat dissipation mechanism reach the smooth purpose of ventilation, conduct the utility model relates to an it is preferred, the air outlet has been seted up to the upper surface of heat dissipation case, the position of air outlet is corresponding with the fan.
In order to make this integrated circuit board that has detachable heat dissipation mechanism reach the quick purpose of heat dissipation, conduct the utility model relates to an it is preferred, the inner wall fixedly connected with fin of heat dissipation case.
Compared with the prior art, the beneficial effects of the utility model are that:
1. this integrated circuit board with can dismantle heat dissipation mechanism, through first screw hole, first bolt, the setting of second screw hole and second fixing bolt, when using, fix fan base on the heat dissipation case through second fixing bolt, place the heat dissipation case on fixed fixture block again, it makes the heat dissipation case fixed to rotate first bolt, can accomplish the installation, after the use is accomplished or when needing to be changed, it makes heat dissipation case and fixed fixture block break away from to rotate first bolt, it can also unpack fan base apart to rotate second fixing bolt, and easy dismounting, simple and practical.
2. This integrated circuit board with can dismantle heat dissipation mechanism through the setting of air intake and filter screen, when using, opens the fan switch, and in the air inlet was inhaled to the ash layer, the filter screen was the large granule ash layer in the ability effective filtration air, avoided because of the too much circuit board trouble that leads to of ash layer.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of the front view explosion structure of the present invention;
fig. 2 is a schematic front view of the cross-sectional structure of the present invention;
fig. 3 is a schematic front view of the structure of the present invention.
In the figure: 1. an integrated circuit board main body; 2. a fixing plate; 3. fixing the fixture block; 4. a first threaded hole; 5. a first bolt; 6. a heat dissipation box; 7. an air inlet; 8. a second threaded hole; 9. A second fixing bolt; 10. a fan base; 11. filtering with a screen; 12. a fan; 13. an air outlet; 14. and a heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides an integrated circuit board with can dismantle heat dissipation mechanism, including integrated circuit board main part 1, 1 fixed connection of integrated circuit board main part is on the surface of fixed plate 2, the both sides fixedly connected with fixture block 3 of fixed plate 2 upper surface, first screw hole 4 has been seted up to fixture block 3's side, fixture block 3's inside has heat dissipation case 6 through 5 threaded connection of first bolt, air intake 7 has been seted up to heat dissipation case 6's both sides, second screw hole 8 is seted up to heat dissipation case 6's interior roof, the inside threaded connection of second screw hole 8 has second fixing bolt 9, fan base 10 has been cup jointed on the surface of second fixing bolt 9.
The utility model discloses an in the embodiment, when using, fix fan base 10 on heat dissipation case 6 through second fixing bolt 9, place heat dissipation case 6 again on fixed fixture block 3, rotate first bolt 5 and make heat dissipation case 6 fixed, can accomplish the installation, use after accomplishing or when needing to be changed, rotate first bolt 5 and make heat dissipation case 6 break away from with fixed fixture block 3, rotate second fixing bolt 9 and still can unpack fan base 10 apart, easy dismounting, simple and practical.
Specifically, the inside of the air inlet 7 is fixedly connected with a filter screen 11.
In this embodiment: when the dust filter is used, the fan 12 is turned on, the dust layer in the air is sucked into the air inlet 7, the filter screen 11 can effectively filter the dust layer with large particles in the air, and circuit board faults caused by excessive dust layers are avoided.
Specifically, the inner bottom wall of the fan base 10 is provided with a fan 12.
In this embodiment: when in use, the switch of the fan 12 is turned on, and a large amount of hot air can be blown out of the heat dissipation box 6.
Specifically, the number of the fans 12 is two.
In this embodiment: the two fans 12 work simultaneously, the efficiency is higher, and the air exhaust is faster.
Specifically, an air outlet 13 is formed in the upper surface of the heat dissipation box 6, and the position of the air outlet 13 corresponds to the position of the fan 12.
In this embodiment: the fan 12 discharges hot air in the heat dissipation box 6 through the air outlet 13, so that air is smoothly discharged, and the heat dissipation efficiency is higher.
Specifically, the inner wall of the heat dissipation box 6 is fixedly connected with a heat dissipation fin 14.
In this embodiment: the heat sink 14 can absorb heat in the heat dissipation box 6, thereby facilitating heat dissipation.
The electrical components presented in this document are all electrically connected to an external master controller and 12V mains, and the master controller may be a conventional known device controlled by a computer or the like.
The utility model discloses a theory of operation and use flow: this integrated circuit board with can dismantle heat dissipation mechanism when using, fix fan base 10 on heat dissipation case 6 through second fixing bolt 9, place heat dissipation case 6 on fixed fixture block 3 again, it makes heat dissipation case 6 fixed to rotate first bolt 5, can accomplish the installation, fan 12 switch is opened to the during operation, in the air intake 7 is inhaled to the ash blanket, large granule ash blanket in the filter screen 11 can the effective filtration air, avoid the circuit board trouble because of the too much leads to of ash blanket, use after accomplishing or when needing to be changed, it breaks away from to rotate first bolt 5 messenger heat dissipation case 6 and fixed fixture block 3, it can also take fan base 10 apart to rotate second fixing bolt 9, and easy dismounting, and simple and practical.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An integrated circuit board with a detachable heat dissipation mechanism, comprising an integrated circuit board main body (1), characterized in that: the integrated circuit board comprises an integrated circuit board body (1) and is characterized in that the integrated circuit board body is fixedly connected to the surface of a fixing plate (2), two fixing clamping blocks (3) are fixedly connected to the two sides of the upper surface of the fixing plate (2), first threaded holes (4) are formed in the side faces of the fixing clamping blocks (3), a heat dissipation box (6) is connected to the inside of each fixing clamping block (3) through first bolts (5) in a threaded mode, air inlets (7) are formed in the two sides of the heat dissipation box (6), second threaded holes (8) are formed in the inner top wall of the heat dissipation box (6), second fixing bolts (9) are connected to the inner threads of the second threaded holes (8), and fan bases (10) are sleeved on the surface of the.
2. The integrated circuit board with the detachable heat dissipation mechanism according to claim 1, wherein: the inside fixedly connected with filter screen (11) of air intake (7).
3. The integrated circuit board with the detachable heat dissipation mechanism according to claim 1, wherein: the inner bottom wall of the fan base (10) is provided with a fan (12).
4. The integrated circuit board with the detachable heat dissipation mechanism according to claim 3, wherein: the number of the fans (12) is two.
5. The integrated circuit board with the detachable heat dissipation mechanism according to claim 1, wherein: an air outlet (13) is formed in the upper surface of the heat dissipation box (6), and the position of the air outlet (13) corresponds to that of the fan (12).
6. The integrated circuit board with the detachable heat dissipation mechanism according to claim 5, wherein: the inner wall of the heat dissipation box (6) is fixedly connected with a heat dissipation sheet (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021786382.2U CN212629043U (en) | 2020-08-25 | 2020-08-25 | Integrated circuit board with detachable heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021786382.2U CN212629043U (en) | 2020-08-25 | 2020-08-25 | Integrated circuit board with detachable heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212629043U true CN212629043U (en) | 2021-02-26 |
Family
ID=74704020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021786382.2U Expired - Fee Related CN212629043U (en) | 2020-08-25 | 2020-08-25 | Integrated circuit board with detachable heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212629043U (en) |
-
2020
- 2020-08-25 CN CN202021786382.2U patent/CN212629043U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |