CN212603110U - Mold for preparing epoxy resin composition sample strips - Google Patents

Mold for preparing epoxy resin composition sample strips Download PDF

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Publication number
CN212603110U
CN212603110U CN202021263093.4U CN202021263093U CN212603110U CN 212603110 U CN212603110 U CN 212603110U CN 202021263093 U CN202021263093 U CN 202021263093U CN 212603110 U CN212603110 U CN 212603110U
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China
Prior art keywords
cavity
glue inlet
mold
sample strip
equal
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Active
Application number
CN202021263093.4U
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Chinese (zh)
Inventor
林建彰
王殿年
杨春梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Xingkai Semiconductor Material Co ltd
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Eternal Electronic Materials Kunshan Co Ltd
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Priority to CN202021263093.4U priority Critical patent/CN212603110U/en
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Abstract

The utility model relates to the field of mold design, and discloses a mold for preparing an epoxy resin composition sample strip, a plurality of cavities and a plurality of glue inlet channels; the glue inlet channels are communicated with each other; a runner port is arranged on each glue inlet channel; a glue inlet is arranged at the intersection of the glue inlet channel and the cavity; the glue inlet is vertical to the length direction of the cavity; a plugging groove is formed at the tail end of the cavity; the aspect ratio of the cavity is greater than or equal to 15; the thickness and the width of the cavity are equal; the draft angle of the cavity is less than 2 deg. The tail end of the manufactured sample strip in the length direction is smooth and burr-free through a glue inlet vertical to the length direction of the cavity; the length-width ratio of the cavity is greater than or equal to 15, the thickness of the cavity is equal to the width of the cavity, when the sample strip is pressed, the influence of expansion deformation of the sample strip in the width direction and the thickness direction when the sample strip is heated at high temperature can be ignored, the change in the length direction only needs to be tested when the shrinkage rate is tested, and the accuracy of the shrinkage rate test is improved.

Description

Mold for preparing epoxy resin composition sample strips
Technical Field
The utility model relates to a mould, in particular to a mould for preparing epoxy resin composition spline.
Background
The sample strip with the shrinkage rate of the existing epoxy resin composition is prepared by adopting mould injection, the traditional glue feeding design is adopted, the existing mould usually feeds glue along the longitudinal direction of the sample strip with the length of the sample strip, the healing part of a glue feeding port is uneven, burrs are large, and the accuracy of shrinkage rate measurement data is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a mould for preparing epoxy composition spline, through perpendicular to die cavity length direction's the mouth of advancing to glue for the spline length direction end of making levels and neatly does not have the burr, improves the accuracy of shrinkage factor test.
The utility model provides a technical scheme that its technical problem adopted is: a mold for preparing epoxy resin composition sample bars comprises a plurality of cavities and a plurality of glue inlet channels; the glue inlet channels are communicated with each other; a runner port is arranged on each glue inlet channel; a glue inlet is formed at the intersection of the glue inlet channel and the cavity; the glue inlet is vertical to the length direction of the cavity; and a blocking groove is formed at the tail end of the cavity.
Further, the method comprises the following steps: the aspect ratio of the cavity is greater than or equal to 15.
Further, the method comprises the following steps: the thickness and the width of the cavity are equal.
Further, the method comprises the following steps: the draft angle full circumference of the cavity is less than 2 degrees.
The utility model has the advantages that: by adopting the parallel and serial glue feeding mode, the cavity vacancy and spline incomplete defect caused by insufficient glue feeding amount can be avoided, the cavity close to the runner port can be ensured to be filled under the condition of insufficient glue feeding amount, and the spline reject ratio is reduced; the glue is fed in the length direction of the vertical cavity, and the tail end of the pressed sample strip in the length direction is smooth and has no burrs; the design of a demoulding angle with a full circumferential angle smaller than 2 degrees is adopted, so that the tail end of the pressed sample strip in the length direction is regular and flat; the tail ends of the parallel cavities are provided with an exhaust groove and a blocking groove to prevent the tail ends from overflowing too much glue; by adopting the design that the length-width ratio of the cavity is more than or equal to 15 and the thickness and the width are equal, when the sample strip is pressed, the expansion deformation influence of the sample strip in the width and thickness directions when the sample strip is heated at high temperature can be ignored, the change of the length direction only needs to be tested when the shrinkage rate is tested, the testing efficiency is improved, and the accuracy of the shrinkage rate test is improved.
Drawings
FIG. 1 is a schematic view of the structure of a mold for producing a sample of the epoxy resin composition.
Labeled as: 1. a cavity; 2. a glue inlet channel; 3. a runner port; 4. a glue inlet; 5. plugging the groove; 6. an exhaust groove; 7. a positioning pin hole.
Detailed Description
In order to deepen the understanding of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and embodiments, which are only used for explaining the present invention and are not limited to the protection scope of the present invention.
Examples
A mould for preparing epoxy resin composition sample strips comprises a plurality of cavities 1 and a plurality of glue inlet channels 2; the glue inlet channels 2 are communicated with each other; a runner port 3 is arranged on each glue inlet channel 2; a glue inlet 4 is arranged at the intersection of the glue inlet channel 2 and the cavity 1; the glue inlet 4 is vertical to the length direction of the cavity 1; a plugging groove 5 is formed at the tail end of the cavity 1; the length-width ratio of the cavity 1 is greater than or equal to 15; the thickness and the width of the cavity 1 are equal; the draft angle of the cavity 1 is less than 2 degrees; the mould is also provided with a plurality of positioning pin holes 7 and an exhaust groove 6. The glue stock is injected into the glue inlet channel 2 from the runner port 3 and enters the cavity 1 through the glue inlet 4.
According to the technical scheme of the embodiment, the mold is made of metal materials, a parallel serial glue feeding mode perpendicular to the length direction of the cavity 1 is adopted, and the tail end of the pressed sample strip in the length direction is flat and free of burrs; the design of a demoulding angle with a full circumferential angle smaller than 2 degrees is adopted, so that the tail end of the pressed sample strip in the length direction is regular and flat; by adopting the design that the length-width ratio of the cavity 1 is more than or equal to 15 and the thickness and the width are equal, when the sample strip is pressed, the expansion deformation influence of the sample strip in the width and thickness directions when the sample strip is heated at high temperature can be ignored, the change of the length direction only needs to be tested when the shrinkage rate is tested, the testing efficiency is improved, and the accuracy of the shrinkage rate test is improved.
The above-mentioned embodiments should not limit the present invention in any way, and all the technical solutions obtained by adopting equivalent replacement or equivalent conversion fall within the protection scope of the present invention.

Claims (4)

1. A mold for producing a sample of an epoxy resin composition, characterized in that: comprises a plurality of cavities (1) and a plurality of glue inlet channels (2); the glue inlet channels (2) are communicated with each other; a runner port (3) is arranged on each glue inlet channel (2); a glue inlet (4) is formed at the intersection of the glue inlet channel (2) and the cavity (1); the glue inlet (4) is vertical to the length direction of the cavity (1); and a blocking groove (5) is formed at the tail end of the cavity (1).
2. A mold for manufacturing a bar of an epoxy resin composition according to claim 1, wherein: the length-width ratio of the cavity (1) is greater than or equal to 15.
3. A mold for manufacturing a bar of an epoxy resin composition according to claim 2, wherein: the thickness and the width of the cavity (1) are equal.
4. A mold for manufacturing a bar of an epoxy resin composition according to claim 1, wherein: the demolding angle full-circumference angle of the cavity (1) is smaller than 2 degrees.
CN202021263093.4U 2020-07-02 2020-07-02 Mold for preparing epoxy resin composition sample strips Active CN212603110U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021263093.4U CN212603110U (en) 2020-07-02 2020-07-02 Mold for preparing epoxy resin composition sample strips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021263093.4U CN212603110U (en) 2020-07-02 2020-07-02 Mold for preparing epoxy resin composition sample strips

Publications (1)

Publication Number Publication Date
CN212603110U true CN212603110U (en) 2021-02-26

Family

ID=74757002

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021263093.4U Active CN212603110U (en) 2020-07-02 2020-07-02 Mold for preparing epoxy resin composition sample strips

Country Status (1)

Country Link
CN (1) CN212603110U (en)

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GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 215000 No. 267, Qingyang Middle Road, Kunshan Development Zone, Suzhou, Jiangsu

Patentee after: Kunshan Xingkai semiconductor material Co.,Ltd.

Address before: 215000 267 Qingyang Middle Road, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: CHANGXING ELECTRONIC MATERIAL (KUNSHAN) Co.,Ltd.

CP03 Change of name, title or address