CN212544403U - Thermal structure of heat sink - Google Patents

Abstract

The utility model discloses a heat conduction structure of a heat sink, which relates to the technical field of heat sinks, in particular to a heat conduction structure of a heat sink, comprising a heat conduction base, the top of the heat conduction base is fixedly connected with a main heat sink, and the right side of the heat conduction base is fixed A heat-conducting pipe is connected, the top end of the heat-conducting pipe is fixedly connected with a heat-conducting block, the heat-conducting block is fixedly installed inside the main heat sink, the inside of the main heat sink is fixedly installed with a cooling pipe, and the outside of the cooling pipe is fixedly installed The fixed sleeve is connected with a heat-conducting sleeve. By setting a heat-conducting block inside the main heat sink, the heat at the heat-conducting base is introduced into the heat-conducting block by the heat-conducting pipe, and then the heat-conducting block conducts the heat to the top of the main heat-sink, so that the heat of the upper and lower parts of the main heat-sink is The distribution is more uniform and the heat dissipation efficiency of the main heat sink is improved. By setting the cooling pipe inside the main heat sink, the water cooling liquid circulates inside the cooling pipe, which increases the heat dissipation path in the main heat sink.

Description

Heat conduction structure of radiating fin

Technical Field

The utility model relates to a fin technical field specifically is heat conduction structure of fin.

Background

The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a plurality of sheet shapes and the like, for example, a CPU (central processing unit) in a computer needs to use a relatively large radiating fin, and power tubes, row tubes and power amplifier tubes in a power amplifier in a television set need to use the radiating fin. Generally, a layer of heat-conducting silicone grease is coated on the contact surface of an electronic component and a heat sink when the heat sink is in use, so that heat emitted by the component is more effectively conducted to the heat sink and then dissipated to the ambient air through the heat sink.

The bottom of the existing radiating fin is higher than the top of the radiating fin in the using process, so that the upper temperature and the lower temperature of the radiating fin are uneven, the radiating efficiency of the radiating fin is influenced, meanwhile, the radiating area of the existing radiating fin is fixed, and when the calorific value is large, the radiating effect is irrational, so that a heat conducting structure of the radiating fin is provided.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a heat conduction structure of fin has solved the problem of proposing in the above-mentioned background art.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the heat conduction structure of the radiating fin comprises a heat conduction base, wherein a main radiating fin is fixedly connected to the top of the heat conduction base, a heat conduction pipe is fixedly connected to the right side of the heat conduction base, a heat conduction block is fixedly connected to the top end of the heat conduction pipe, the heat conduction block is fixedly installed inside the main radiating fin, a cooling pipe is fixedly installed inside the main radiating fin, a heat conduction sleeve is fixedly sleeved on the outer portion of the cooling pipe, the cooling pipe is located at the bottom of the heat conduction block, a connecting clamping block is fixedly connected to the front of the heat conduction base, and an auxiliary heat conduction seat is clamped on the outer portion of the connecting clamping block.

Optionally, the bottom of the heat conduction base is provided with heat conduction glue, the bottom of the heat conduction glue is provided with a heating circuit board, and the heat conduction base, the heat conduction glue and the heating circuit board are in close contact with each other.

Optionally, the left and right sides fixedly connected with mounting panel of heat conduction base, the bottom fixedly connected with fixing bolt of mounting panel, fixing bolt's outside screw thread has cup jointed the nut, the circuit board that generates heat links together through fixing bolt and heat conduction base.

Optionally, the heat conducting block is located at one third of the top of the main heat dissipation fin, two ends of the heat conducting block are connected with two ends of the heat conducting base through heat conducting pipes, and the number of the heat conducting pipes on each side is not less than three.

Optionally, a clamping groove is formed in the right side of the auxiliary heat conducting seat, the clamping groove is matched with the connecting clamping block, and an auxiliary cooling fin is arranged at the top of the clamping groove.

Optionally, a heat conducting coating is arranged outside the heat conducting sleeve, and the heat conducting coating is made of a nano graphene material.

The utility model provides a heat conduction structure of fin possesses following beneficial effect:

1. this heat conduction structure of fin, inside through at main radiating fin sets up the heat conduction piece, utilize the heat pipe with the heat conduction of heat conduction base department in leading-in to the heat conduction piece, then conduct the heat to the top of main radiating fin by the heat conduction piece again, make the heat distribution of each position more even about main radiating fin, improve the radiating efficiency of main radiating fin, inside through at main radiating fin sets up the cooling tube, the inside circulation of cooling tube has water-cooling liquid, utilize the heat conduction cover with the heat on the main radiating fin to the inside transmission of cooling tube, carry out the heat exchange with the inside water-cooling liquid of cooling tube, the route of heat derivation in the main radiating fin has been increased, accelerate the heat dissipation of main radiating fin.

2. This heat conduction structure of fin, set up the connection fixture block through the both sides at the heat conduction base, can utilize the connection fixture block to link together vice heat conduction seat and heat conduction base, make the heat on the heat conduction base can be conducted on vice fin through vice heat conduction seat, the area of fin has been increased, help the heat dissipation, surface through at main fin sets up the heat conduction coating, the heat conduction coating can increase the heat exchange efficiency of main fin, make main fin can distribute out more heats in the same time, further improvement the radiating efficiency of device.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural diagram of the right side of the present invention;

fig. 3 is a schematic sectional view of the main heat dissipation fin of the present invention.

In the figure: 1. a thermally conductive base; 2. heat conducting glue; 3. a heat-generating circuit board; 4. mounting a plate; 5. fixing the bolt; 6. a nut; 7. a primary heat sink sheet; 8. a heat conducting pipe; 9. a heat conducting block; 10. a cooling tube; 11. a heat conducting sleeve; 12. connecting a clamping block; 13. a secondary heat conducting seat; 14. a card slot; 15. a secondary heat sink; 16. a thermally conductive coating.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 3, the present invention provides a technical solution: a heat conduction structure of a heat dissipation plate comprises a heat conduction base 1, heat conduction glue 2 is arranged at the bottom of the heat conduction base 1, a heating circuit board 3 is arranged at the bottom of the heat conduction glue 2, the heat conduction base 1, the heat conduction glue 2 and the heating circuit board 3 are in close contact, mounting plates 4 are fixedly connected to the left side and the right side of the heat conduction base 1, fixing bolts 5 are fixedly connected to the bottoms of the mounting plates 4, nuts 6 are sleeved on external threads of the fixing bolts 5, the heating circuit board 3 is connected with the heat conduction base 1 through the fixing bolts 5, a main heat dissipation plate 7 is fixedly connected to the top of the heat conduction base 1, a heat conduction pipe 8 is fixedly connected to the right side of the heat conduction base 1, a heat conduction block 9 is fixedly connected to the top of the heat conduction pipe 8, the heat conduction block 9 is arranged inside the main heat dissipation plate 7, the heat at the position of the heat conduction base 1 is guided into, the heat distribution of the upper and lower parts of the main radiating fin 7 is more uniform, the radiating efficiency of the main radiating fin 7 is improved, the heat conducting block 9 is positioned at one third of the top of the main radiating fin 7, two ends of the heat conducting block 9 are connected with two ends of the heat conducting base 1 through the heat conducting pipes 8, the number of the heat conducting pipes 8 on each side is not less than three, the heat conducting block 9 is fixedly arranged in the main radiating fin 7, the cooling pipe 10 is fixedly arranged in the main radiating fin 7, the heat conducting sleeve 11 is fixedly arranged in the main radiating fin 10, the cooling pipe 10 is fixedly sleeved and connected with the heat conducting sleeve 11 outside the cooling pipe 10, the cooling pipe 10 is arranged in the main radiating fin 7, water cooling liquid flows in the cooling pipe 10, the heat on the main radiating fin 7 is transferred to the inside of the cooling pipe 10 by utilizing the heat conducting sleeve 11 to exchange heat with the water cooling liquid in the cooling pipe 10, the path for leading out the heat in the main radiating fin 7 is increased, the heat radiation of the main radiating fin 7 is accelerated, the front surface of the heat conduction base 1 is fixedly connected with a connecting clamping block 12, the outer part of the connecting clamping block 12 is clamped with an auxiliary heat conduction seat 13, the connecting clamping blocks 12 are arranged on the two sides of the heat conduction base 1, the auxiliary heat conduction seat 13 and the heat conduction base 1 can be connected together by using the connecting clamping blocks 12, so that heat on the heat conduction base 1 can be conducted to an auxiliary radiating fin 15 through the auxiliary heat conduction seat 13, the area of the radiating fin is increased, and the heat radiation is facilitated, the right side of the auxiliary heat conduction seat 13 is provided with a clamping groove 14, the clamping groove 14 is matched with the connecting clamping block 12, the top of the clamping groove 14 is provided with the auxiliary radiating fin 15, the outer part of the heat conduction sleeve 11 is provided with a heat conduction coating 16, the heat conduction coating 16 is made of nano graphene materials, the outer surface of the main radiating fin 7 is provided with a heat conduction coating 16, the heat conduction coating 16 can increase the, the heat dissipation efficiency of the device is further improved.

In conclusion, in the heat conduction structure of the heat sink, when in use, the bottom of the heat conduction base 1 is coated with the heat conduction glue 2, then the heat conduction base 1 is installed on the heating circuit board 3, the heat conduction base 1 and the heating circuit board 3 are connected together by using the fixing bolt 5 and the nut 6, the heat generated by the heating circuit board 3 is conducted onto the heat conduction base 1 through the heat conduction glue 2, then the heat is transferred to the main heat dissipation fins 7 through the heat conduction base 1, the heat is dissipated by the contact of the main heat dissipation fins 7 and the air, meanwhile, the heat at the position of the heat conduction base 1 is led into the heat conduction block 9 by using the heat conduction pipe 8, then the heat is conducted to the top of the main heat dissipation fins 7 by using the heat conduction block 9, so that the heat distribution at the upper and lower parts of the main heat dissipation fins 7 is more uniform, the water cooling liquid flows in the cooling pipe 10, and the heat on the main heat dissipation fins 7 is transferred to the inside, the heat exchange with the water cooling liquid in the cooling pipe 10 increases the path for heat conduction from the main heat dissipation plate 7, when the heat productivity is large, the auxiliary heat conduction seat 13 and the heat conduction base 1 can be connected together, and the auxiliary heat dissipation plate 15 on the auxiliary heat conduction seat 13 is used for copying and heat dissipation.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A heat-conducting structure of a heat sink, comprising a heat-conducting base (1), characterized in that: the top of the heat-conducting base (1) is fixedly connected with a main heat sink (7), and the right side of the heat-conducting base (1) is fixedly connected There is a heat conduction pipe (8), the top end of the heat conduction pipe (8) is fixedly connected with a heat conduction block (9), and the heat conduction block (9) is fixedly installed inside the main heat sink (7), the main heat sink A cooling pipe (10) is fixedly installed inside of (7), a heat-conducting sleeve (11) is fixedly sleeved on the outside of the cooling pipe (10), and the cooling pipe (10) is located at the bottom of the heat-conducting block (9), so A connection block (12) is fixedly connected to the front surface of the heat conduction base (1), and an auxiliary heat conduction seat (13) is clamped to the outside of the connection block (12). 2. The heat-conducting structure of the heat sink according to claim 1, characterized in that: the bottom of the heat-conducting base (1) is provided with a heat-conducting glue (2), and the bottom of the heat-conducting glue (2) is provided with a heating circuit board (3), the thermally conductive base (1), the thermally conductive adhesive (2), and the heating circuit board (3) are in close contact. 3. The heat-conducting structure of the heat sink according to claim 2, characterized in that: the left and right sides of the heat-conducting base (1) are fixedly connected with a mounting plate (4), and the bottom of the mounting plate (4) is fixedly connected There are fixing bolts (5), the outer threads of the fixing bolts (5) are sleeved with nuts (6), and the heating circuit board (3) is connected with the heat conducting base (1) through the fixing bolts (5). 4. The heat-conducting structure of a heat sink according to claim 1, wherein the heat-conducting block (9) is located at one-third of the top of the main heat-dissipating fin (7), and two parts of the heat-conducting block (9) are located at one-third of the top of the main heat sink (7). Both ends are connected with both ends of the heat conducting base (1) through heat conducting pipes (8), and the number of the heat conducting pipes (8) on each side is not less than three. 5. The heat-conducting structure of the heat sink according to claim 1, characterized in that: the right side of the auxiliary heat-conducting seat (13) is provided with a card slot (14), and the card slot (14) is connected to the connection block ( 12) Matching, the top of the card slot (14) is provided with an auxiliary heat sink (15). 6. The heat-conducting structure of a heat sink according to claim 1, characterized in that: a heat-conducting coating (16) is provided on the outside of the heat-conducting sleeve (11), and the heat-conducting coating (16) adopts nano-graphene material. made.

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