CN212525699U - Wafer barrel forming die - Google Patents
Wafer barrel forming die Download PDFInfo
- Publication number
- CN212525699U CN212525699U CN202021034722.6U CN202021034722U CN212525699U CN 212525699 U CN212525699 U CN 212525699U CN 202021034722 U CN202021034722 U CN 202021034722U CN 212525699 U CN212525699 U CN 212525699U
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- China
- Prior art keywords
- die
- fixedly connected
- lower die
- upper die
- arm
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- Expired - Fee Related
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- 238000005096 rolling process Methods 0.000 claims abstract description 17
- 235000017166 Bambusa arundinacea Nutrition 0.000 abstract description 2
- 235000017491 Bambusa tulda Nutrition 0.000 abstract description 2
- 241001330002 Bambuseae Species 0.000 abstract description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 abstract description 2
- 239000011425 bamboo Substances 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 235000012773 waffles Nutrition 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a wafer section of thick bamboo forming die, including a fixed instrument base, the upper surface of fixed instrument base has a lower mould support through slide rail mechanism sliding connection, be two upper die supports of vertical form fixedly connected with on the relative lateral wall of lower mould support, the beneficial effects of the utility model are that: when the device is used, the lower die support is in circular surrounding motion on the sliding rail through the support sliding block, meanwhile, the lower die driving arm roller rolls on the second stroke track, the two lower dies can be driven to open and close, the two lower dies jointly form the lower dies when being closed, the two lower dies are separated simultaneously when being separated, meanwhile, the upper die lifting rolling wheel can drive the upper die to lift and separate from the contact with the wafer drum through rolling on the first stroke track, the two lower dies can also move in opposite directions and separate from the contact with the wafer drum, so that after the upper die and the lower dies are separated from the contact with the wafer drum, the demolding of the wafer drum is convenient.
Description
Technical Field
The utility model relates to a forming die technical field specifically is a wafer section of thick bamboo forming die.
Background
In recent years, the existing wafer tube forming die is generally operated by hands on a machine, large-scale production cannot be realized, the production efficiency is low, the labor intensity is high, manual operation is easy to cross and generate pollution, and adhesion is easy to generate with the die during demoulding.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a waffle cone forming die to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a wafer drum forming die comprises a fixed instrument base, wherein the upper surface of the fixed instrument base is connected with a lower die support in a sliding manner through a slide rail mechanism, two upper die supports are fixedly connected to the opposite outer side walls of the lower die support in a vertical manner, a fixed positioning locking arm is fixedly connected to orders of the two upper die supports together, two upper die guide shafts which are vertically arranged are fixedly connected between the lower surface of the fixed positioning locking arm and the two upper die supports together, an upper die sliding block is connected to each of the two upper die guide shafts in a sliding manner, an upper die fixing frame is fixedly connected between the two upper die sliding blocks together, an upper die is fixedly connected to the lower surface of the upper die fixing frame, two lower die guide shafts are fixedly connected to the upper surface of the lower die support in a sliding manner, and two lower dies are connected to the two lower die guide shafts in a, one of the lower dies is fixedly connected with a sliding seat, one end of the sliding seat, which is far away from the lower die, is rotatably connected with a lower die telescopic adjusting rod through a rotating shaft, one end of the lower die telescopic adjusting rod, which is far away from a lower die support, is rotatably connected with a lower die rear driven arm through a rotating shaft, one end of the lower die rear driven arm, which is far away from the lower die telescopic adjusting rod, is fixedly connected with a connecting rotating shaft, one end of the connecting rotating shaft, which is far away from the lower die rear driven arm, is fixedly connected with a lower die front driven arm, one end of the lower die front driven arm, which is far away from the connecting rotating shaft, is rotatably connected with another lower die, one side edge of the upper surface of the upper die fixing frame is fixedly connected with an upper die lifting rolling wheel, a first stroke track is arranged right below the upper die lifting, and a second stroke track is arranged right below the roller of the driving arm of the lower die.
Preferably, the upper die lifting rolling wheel is connected to the first stroke track in a rolling mode, and the lower die driving arm roller is connected to the second stroke track in a rolling mode.
Preferably, a part of the first travel track is arranged in an inclined convex shape, and a part of the second travel track is arranged in a side edge inclined shape.
Preferably, the upper surface of the upper die fixing frame is fixedly connected with a lifting limiting rod, and the upper end of the lifting limiting rod is movably sleeved on the fixed positioning locking arm.
Preferably, the slide rail mechanism comprises a slide rail which is annularly arranged, the upper surface of the slide rail is connected with four support sliding blocks, and the support sliding blocks are fixedly connected to the lower surface of the lower mold support.
Compared with the prior art, the beneficial effects of the utility model are that: when the device is used, the lower die support is in circular surrounding motion on the sliding rail through the support sliding block, meanwhile, the lower die driving arm roller rolls on the second stroke track, the two lower dies can be driven to open and close, the two lower dies jointly form the lower dies when being closed, the two lower dies are separated simultaneously when being separated, meanwhile, the upper die lifting rolling wheel can drive the upper die to lift and separate from the contact with the wafer drum through rolling on the first stroke track, the two lower dies can also move in opposite directions and separate from the contact with the wafer drum, so that after the upper die and the lower dies are separated from the contact with the wafer drum, the demolding of the wafer drum is convenient.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the present invention;
fig. 3 is a schematic side view of the present invention.
In the figure: 1. fixing an instrument base; 2. a lower die support; 3. an upper die support; 4. fixing a positioning locking arm; 5. an upper die guide shaft; 6. an upper die slide block; 7. an upper die fixing frame; 8. an upper die; 9. a lifting limiting rod; 10. a lower die telescopic adjusting rod; 11. a rear driven arm of the lower die; 12. connecting the rotating shaft; 13. a front driven arm of the lower die; 14. a lower die guide shaft; 15. a lower die; 16. a slide base; 17. the upper die lifts the rolling wheel; 18. a first travel track; 19. a lower die driving arm; 20. a lower die driving arm roller; 21. a second travel track; 22. a slide rail; 23. and a support sliding block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a wafer drum forming die comprises a fixed instrument base 1, wherein the upper surface of the fixed instrument base 1 is connected with a lower die support 2 in a sliding manner through a slide rail mechanism, two upper die supports 3 are fixedly connected to the opposite outer side walls of the lower die support 2 in a vertical manner, an order of the two upper die supports 3 is fixedly connected with a fixed positioning locking arm 4 together, two upper die guide shafts 5 arranged in a vertical manner are fixedly connected between the lower surface of the fixed positioning locking arm 4 and the two upper die supports 3 together, an upper die slide block 6 is connected to each of the two upper die guide shafts 5 in a sliding manner, an upper die fixing frame 7 is fixedly connected between the two upper die slide blocks 6 together, the lower surface of the upper die fixing frame 7 is fixedly connected with an upper die 8, the upper surface of the lower die support 2 is fixedly connected with two lower die guide shafts 14, and two lower die 15 are connected to the two, one of the lower dies 15 is fixedly connected with a sliding seat 16, one end of the sliding seat 16, which is far away from the lower die 15, is rotatably connected with a lower die telescopic adjusting rod 10 through a rotating shaft, one end of the lower die telescopic adjusting rod 10, which is far away from the lower die support 2, is rotatably connected with a lower die rear driven arm 11 through a rotating shaft, one end of the lower die rear driven arm 11, which is far away from the lower die telescopic adjusting rod 10, is fixedly connected with a connecting rotating shaft 12, one end of the connecting rotating shaft 12, which is far away from the lower die rear driven arm 11, is fixedly connected with a lower die front driven arm 13, one end of the lower die front driven arm 13, which is far away from the connecting rotating shaft 12, is rotatably connected to the other lower die 15, one side edge of the upper surface of the upper die fixing frame 7 is fixedly connected with an, the lower die driving arm 19 is rotatably connected with a lower die driving arm roller 20, and a second stroke track 21 is arranged right below the lower die driving arm roller 20.
Wherein, the upper die lifting rolling wheel 17 is connected on the first stroke track 18 in a rolling way, and the lower die driving arm roller 20 is connected on the second stroke track 21 in a rolling way.
Wherein, the partial track of the first stroke track 18 is arranged in an inclined convex shape, and the partial track of the second stroke track 21 is arranged in a side edge inclined shape.
Wherein, the upper surface of the upper die fixing frame 7 is fixedly connected with a lifting limiting rod 9, and the upper end of the lifting limiting rod 9 is movably sleeved on the fixed positioning locking arm 4.
Wherein, slide rail mechanism includes a slide rail 22 that is the annular setting, and the upper surface sliding connection of slide rail 22 has four support sliders 23, and four equal fixed connection of support slider 23 are at the lower surface of lower mould support 2.
Specifically, when the utility model is used, the lower die support 2 makes circular surrounding motion on the slide rail 22 through the support slider 23 and drives the parts on the lower die support 2 to move synchronously, meanwhile, the upper die lifting rolling wheel 17 rolls on the first stroke track 18, because part of the track of the first stroke track 18 is arranged in an inclined convex shape, the upper die lifting rolling wheel 17 can drive the upper die fixing frame 7 to lift synchronously, the upper die fixing frame 7 drives the upper die 8 to lift synchronously, the wafer cylinder can be processed and molded through matching with the lower die 15 when the upper die 8 descends, the device processes the wafer cylinder through the repeated twice lifting of the upper die 8, the adhesion between the wafer cylinder and the upper die 8 can be avoided, the upper die 8 rises after the wafer cylinder is processed and molded to facilitate the demolding of the wafer cylinder, and simultaneously, the lower die driving arm 19 drives the lower die driving arm idler wheel 20 to move synchronously, because the partial track of second stroke track 21 is the side slope form setting, make lower mould initiative arm gyro wheel 20 roll formula on second stroke track 21, can be through lower mould initiative arm 19 pulling connection pivot 12, connect pivot 12 synchronous pulling behind the lower mould passive arm 11 and the lower mould passive arm 13 in front of the synchronous pulling of pivot 12, and then behind the lower mould passive arm 11 through lower mould telescopic adjusting rod 10 and 16 pulling one of them bed die 15 remove, by swing arm 13 before the lower mould simultaneously, pulling another bed die 15 removes, make two bed die 15 do opposite direction motion, opened between two bed die 15 this moment, make the inside waffle tube of mould demoulded, whole working process is simple convenient and full automation, improved the efficiency of production when having reduced artifical intensity of labour.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A wafer drum forming die comprises a fixed instrument base (1) and is characterized in that the upper surface of the fixed instrument base (1) is connected with a lower die support (2) in a sliding mode through a sliding rail mechanism, two upper die supports (3) are fixedly connected to the opposite outer side wall of the lower die support (2) in a vertical mode, two orders of the upper die supports (3) are fixedly connected with a fixed positioning locking arm (4) together, two upper die guide shafts (5) which are vertically arranged are fixedly connected between the lower surface of the fixed positioning locking arm (4) and the two upper die supports (3) together, an upper die sliding block (6) is connected to each of the two upper die guide shafts (5) in a sliding mode, an upper die fixing frame (7) is fixedly connected between the two upper die sliding blocks (6) together, and an upper die (8) is fixedly connected to the lower surface of the upper die fixing frame (7), the upper surface of the lower die support (2) is fixedly connected with two lower die guide shafts (14), the two lower die guide shafts (14) are connected with two lower dies (15) in a sliding mode, one of the lower dies (15) is fixedly connected with a sliding seat (16), one end, away from the lower die (15), of the sliding seat (16) is rotatably connected with a lower die telescopic adjusting rod (10) through a rotating shaft, one end, away from the lower die support (2), of the lower die telescopic adjusting rod (10) is rotatably connected with a lower die rear driven arm (11) through a rotating shaft, one end, away from the lower die telescopic adjusting rod (10), of the lower die rear driven arm (11) is fixedly connected with a connecting rotating shaft (12), one end, away from the lower die rear driven arm (11), of the connecting rotating shaft (12) is fixedly connected with a lower die front driven arm (13) through the connecting rotating shaft (13), of the lower die front driven arm (13) is rotatably connected, go up a mould lift roller wheel (17) of a side edge fixedly connected with of mould mount (7) upper surface, go up the mould and go up and down roller wheel (17) and set up in a first stroke track (18) under, connect pivot (12) and go up lower mould initiative arm (19) of fixedly connected with, rotate on lower mould initiative arm (19) and be connected with a lower mould initiative arm gyro wheel (20), a second stroke track (21) that sets up under lower mould initiative arm gyro wheel (20).
2. A wafer cone forming die according to claim 1, wherein: the upper die lifting rolling wheel (17) is connected to the first stroke track (18) in a rolling mode, and the lower die driving arm roller (20) is connected to the second stroke track (21) in a rolling mode.
3. A wafer cone forming die according to claim 1, wherein: and part of the first travel track (18) is arranged in an inclined convex shape, and part of the second travel track (21) is arranged in a side edge inclined shape.
4. A wafer cone forming die according to claim 1, wherein: the upper surface of the upper die fixing frame (7) is fixedly connected with a lifting limiting rod (9), and the upper end of the lifting limiting rod (9) is movably sleeved on the fixed positioning locking arm (4).
5. A wafer cone forming die according to claim 1, wherein: the slide rail mechanism comprises a slide rail (22) which is annularly arranged, the upper surface of the slide rail (22) is connected with four support sliding blocks (23) in a sliding manner, and the four support sliding blocks (23) are fixedly connected to the lower surface of the lower mold support (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021034722.6U CN212525699U (en) | 2020-06-08 | 2020-06-08 | Wafer barrel forming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021034722.6U CN212525699U (en) | 2020-06-08 | 2020-06-08 | Wafer barrel forming die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212525699U true CN212525699U (en) | 2021-02-12 |
Family
ID=74638858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021034722.6U Expired - Fee Related CN212525699U (en) | 2020-06-08 | 2020-06-08 | Wafer barrel forming die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212525699U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783706A (en) * | 2022-04-28 | 2022-07-22 | 华智源电气集团股份有限公司 | Transformer insulation paper ring pipe removing machine |
-
2020
- 2020-06-08 CN CN202021034722.6U patent/CN212525699U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114783706A (en) * | 2022-04-28 | 2022-07-22 | 华智源电气集团股份有限公司 | Transformer insulation paper ring pipe removing machine |
| CN114783706B (en) * | 2022-04-28 | 2023-10-27 | 华智源电气集团股份有限公司 | A transformer insulation paper ring tube removal machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210212 |