CN212519396U - Earphone active noise reduction structure - Google Patents

Abstract

The utility model discloses a structure of making an uproar falls in earphone initiative, including support and feedback microphone, fixed electrically conductive path and the mike pad of being equipped with on the support, electrically conductive path's one end and mike pad electric conductance are led to, and feedback microphone welds on mike pad. The feedback microphone is directly welded on the support, the conductive path is directly arranged on the support, the feedback microphone is electrically connected with the conductive path after being welded on the support, other connecting structures do not need to be additionally arranged between the support and the feedback microphone, the feedback microphone is convenient to assemble in the earphone, and the feedback microphone is firmly and reliably connected with the support.

Description

Earphone active noise reduction structure

Technical Field

The utility model relates to an earphone technical field, in particular to structure of making an uproar falls in earphone initiative.

Background

In the earphone, a feedback microphone is arranged in the earphone, and when the earphone is worn, the feedback microphone absorbs sound fed back by human ears, so that the purpose of noise reduction is achieved.

The feedback microphone is arranged inside the earphone and close to the loudspeaker. The feedback microphone has a large volume and is difficult to place in the front sound cavity, so that the design of the feedback microphone has difficulty. In the current earphone, for example, airpots pro are used, a feedback microphone needs a metal mesh and a metal rod to be matched and fixed on a horn bracket, and the earphone is difficult to assemble and high in overall cost.

Therefore, how to reduce the assembly difficulty of the feedback microphone is a technical problem that needs to be solved by those skilled in the art at present.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides an active noise reduction structure for an earphone, wherein the difficulty of assembling a feedback microphone is small.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a structure of making an uproar falls in earphone initiative, includes support and feedback microphone, fixed conducting path and the mike pad of being equipped with on the support, the one end of conducting path with mike pad electric conductance, feedback microphone welding in on the mike pad.

Preferably, the support comprises a tray body and a connecting sheet, one end of the connecting sheet is fixed on the edge of the tray body, and the microphone pad is arranged on the tray body; the conductive path extends from the microphone pad to the connection piece and further extends to one end of the connection piece far away from the disc body.

Preferably, the edge of one end of the connecting sheet far away from the disc body is provided with a main control bonding pad which is electrically conducted with the conductive path.

Preferably, the support is arranged in the earphone shell, an earphone sound outlet is formed in the earphone shell, the disk body is covered on the earphone sound outlet, and the disk body is hollowed out to be communicated with the earphone sound outlet and the inner cavity of the earphone shell.

Preferably, a hot melting hole penetrates through the disc body, and a hot melting column which is spliced and matched with the hot melting hole and is fixed through hot melting is fixedly arranged on the earphone shell.

Preferably, the support is arranged in the earphone shell, an installation groove is formed in the inner wall of the earphone shell, and the connecting sheet is accommodated in the installation groove.

Preferably, the support is arranged in the earphone shell, the earphone sound outlet and the feedback microphone are respectively arranged at two sides of the disk body, and the connecting sheet and the feedback microphone are arranged at the same side of the disk body.

Preferably, a loudspeaker is fixedly arranged on the support, and a sound receiving port of the feedback microphone is opposite to a sound outlet of the loudspeaker.

Preferably, the speaker and the feedback microphone are arranged on the same side of the bracket.

Preferably, the support is a plastic part, the conductive path is a metal path, and the conductive path is integrally formed on the support by adopting an LDS technology.

The utility model provides a structure of making an uproar falls in earphone initiative, including support and feedback microphone, fixed electrically conductive path and the mike pad of being equipped with on the support, electrically conductive path's one end and mike pad electric conductance are led to, and feedback microphone welds on mike pad.

The feedback microphone is directly welded on the support, the conductive path is directly arranged on the support, the feedback microphone is electrically connected with the conductive path after being welded on the support, other connecting structures do not need to be additionally arranged between the support and the feedback microphone, the feedback microphone is convenient to assemble in the earphone, and the feedback microphone is firmly and reliably connected with the support.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a first direction structure diagram of a support in an active noise reduction structure of an earphone provided by the present invention;

fig. 2 is a second directional structure diagram of the support in the active noise reduction structure of the earphone provided by the present invention;

fig. 3 is a first direction structure diagram of the earphone active noise reduction structure provided by the present invention after a feedback microphone is mounted on a support, the feedback microphone is partially shown in a perspective view;

fig. 4 is a second direction structure diagram after the feedback microphone is installed on the support in the active noise reduction structure of the earphone provided by the present invention;

fig. 5 is a structural diagram of a shell of the earphone in the active noise reduction structure of the earphone provided by the present invention;

fig. 6 is a connecting structure diagram of the support and the earphone housing in the active noise reduction structure of the earphone provided by the present invention;

fig. 7 is a first direction structure diagram of the active noise reduction structure of the earphone provided by the present invention;

fig. 8 is a second directional structure diagram of the active noise reduction structure of the earphone provided by the present invention;

fig. 9 is a partial cross-sectional view of the active noise reduction structure of the earphone according to the present invention.

Reference numerals:

the earphone comprises a feedback microphone 1, a support 2, a disc body 21, an outer ring 211, a middle sheet 212, a connecting sheet 22, a microphone pad 23, a main control pad 24, a conductive path 25, a hot melting hole 26, an earphone shell 3, an earphone sound outlet hole 31, a hot melting column 32, a mounting groove 33, a loudspeaker 4 and a welding point A.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The core of the utility model is to provide a structure of making an uproar falls in earphone initiative, the assembly degree of difficulty of its feedback microphone is less.

It will be understood that when an element is referred to as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

The utility model provides a structure of making an uproar falls in earphone initiative a concrete embodiment, specifically be applied to TWS (True Wireless Stereo) earphone. Referring to fig. 1 to 4, the active noise reduction structure of the earphone includes a support 2 and a feedback microphone 1. The support 2 is fixedly provided with a conductive path 25 and a microphone pad 23, one end of the conductive path 25 is electrically conducted with the microphone pad 23, the feedback microphone 1 is welded on the microphone pad 23, the conductive path 25 is used for electrically conducting the feedback microphone 1 and a mainboard, the mainboard receives a feedback signal of the feedback microphone 1 and performs noise reduction control, and a loudspeaker 4 in the earphone is also electrically connected with the mainboard.

In this embodiment, the feedback microphone 1 is directly welded to the support 2, and the conductive path 25 is directly disposed on the support 2, and the feedback microphone 1 is electrically connected to the conductive path 25 after being welded to the support 2, and there is no need to add another connection structure between the support 2 and the feedback microphone 1, which is convenient for assembling the feedback microphone 1 in an earphone, and the connection between the feedback microphone 1 and the support 2 is firm and reliable.

Further, referring to fig. 1 and 2, the bracket 2 includes a tray body 21 and a connecting piece 22, the tray body 21 is substantially circular, and the connecting piece 22 is approximately in a strip-shaped structure. One end of the connecting piece 22 is fixed to the edge of the tray body 21, and the microphone pad 23 is provided on the tray body 21. A conductive path 25 extends from the microphone pad 23 to the connection pad 22 and further to an end of the connection pad 22 remote from the disc 21. The plate 21 can stably support the feedback microphone 1, and the connection pad 22 can draw out the conductive path 25 to have a sufficient length to electrically connect to the main board.

Further, referring to fig. 1, the connecting sheet 22 is provided with a main control pad 24 electrically connected to the conductive path 25 at an edge of an end thereof away from the tray body 21, and the main control pad 24 is used for being soldered to a terminal of the motherboard to ensure reliability of electrical connection between the motherboard and the bracket 2. Specifically, as shown in fig. 1 and 2, three rectangular microphone pads 23 are juxtaposed on the board 21, and three rectangular main control pads 24 are juxtaposed on the connection piece 22.

Further, as shown in fig. 5 and 6, the holder 2 is provided in the earphone housing 3, and the earphone housing 3 is provided with an earphone sound outlet hole 31. The disk body 21 is covered on the earphone sound outlet hole 31, so that the connection stability of the disk body 21 can be ensured. Disk body 21 fretwork sets up the inner chamber in order to communicate earphone sound outlet 31 and earphone shell 3, and loudspeaker 4's sound can send out outside earphone sound outlet 31 through fretwork department on the disk body 21, and the fretwork setting is avoided disk body 21 to influence loudspeaker 4's normal sound production. More specifically, the disc body 21 includes an outer ring 211 and a middle plate 212 disposed in the middle of the outer ring 211, a hollow portion on the disc body 21 is formed by a space between the middle plate 212 and the outer ring 211, the microphone pad 23 is disposed on the middle plate 212, and after the feedback microphone 1 is mounted on the middle plate 212, the feedback microphone 1 does not block the hollow portion on the disc body 21.

Further, referring to fig. 5 and 6, a heat-melting hole 26 is formed through the tray body 21, and a heat-melting column 32 is fixedly disposed on the earphone housing 3 and is inserted into and engaged with the heat-melting hole 26 for heat-melting fixation. After fixing feedback microphone 1 on support 2, with the in-process of support 2 installation in to earphone shell 3, hot melt post 32 can play the guide effect, can carry out prepositioning to support 2 through the cooperation of hot melt post 32 and hot melt hole 26, improves assembly efficiency. Alternatively, as shown in fig. 5, four heat fusion posts 32 are disposed at equal intervals around the earphone sound outlet hole 31. Of course, in other embodiments, the support 2 and the earphone housing 3 may be fixed by adhesive connection or other means.

Further, as shown in fig. 5 and 6, an installation groove 33 is formed on the inner wall of the earphone housing 3, and the connecting piece 22 is accommodated in the installation groove 33, so that the installation stability of the connecting piece 22 can be improved. After the connecting piece 22 is mounted in the mounting groove 33, the side surface of the connecting piece 22 on which the conductive path 25 is disposed is exposed to the mounting groove 33 for welding with the motherboard.

Further, as shown in fig. 6 and 9, the earphone sound outlet 31 and the feedback microphone 1 are respectively disposed on two sides of the disc body 21, and the connecting piece 22 and the feedback microphone 1 are disposed on the same side of the disc body 21, so that there is no risk that the feedback microphone 1 and the earphone housing 3 collide with each other in the process of assembling the support 2 to the earphone housing 3, and the assembling efficiency can be further improved. Of course, in other embodiments, the feedback microphone 1 and the earphone sound outlet 31 may be disposed on the same side of the disc body 21.

Further, referring to fig. 7, 8 and 9, a speaker 4 is fixedly disposed on the bracket 2, and a sound receiving port of the feedback microphone 1 is disposed opposite to a sound outlet of the speaker 4, that is, the feedback microphone 1 is disposed on the front surface of the speaker 4. It should be noted that, the fact that the feedback microphone 1 is arranged on the front surface of the loudspeaker 4 specifically means that the sound receiving port of the feedback microphone 1 is substantially parallel to the sound outlet of the loudspeaker 4, and in addition, along a direction perpendicular to the sound outlet of the loudspeaker 4, the projection of the sound receiving port of the feedback microphone 1 on the sound outlet of the loudspeaker 4 does not exceed the edge of the sound outlet of the loudspeaker 4; otherwise, the feedback microphone 1 may be considered to be disposed at the side of the speaker 4. By adopting the acoustic layout that the feedback microphone 1 is over against the loudspeaker 4, compared with the layout that the feedback microphone 1 is placed on the side surface of the loudspeaker 4, the audio signal of the loudspeaker 4 can be better picked up, and a better noise reduction effect is obtained. In particular, compared with the airpots pro with the feedback microphone 1 arranged on the front side of the speaker 4 in the prior art, the active noise reduction structure of the earphone in the embodiment can greatly simplify the assembly difficulty and reduce the overall production cost on the premise of realizing the same acoustic layout and performance.

Further, referring to fig. 9, the speaker 4 and the feedback microphone 1 are disposed on the same side of the bracket 2, which facilitates adjusting the positions of the feedback microphone 1 and the speaker 4 during the assembling process. Of course, in other embodiments, the feedback microphone 1 and the speaker 4 may be disposed on two sides of the bracket 2, respectively.

Further, the bracket 2 is a plastic part, and is specifically formed by injection molding, the conductive path 25 is a metal path, the conductive path 25 is integrally formed on the bracket 2 by an LDS (laser direct structuring) technology, and the application of the LDS technology can ensure the miniaturization of the product.

The assembly process of the active noise reduction structure of the earphone provided by the embodiment is as follows: the feedback microphone 1 is connected with the bracket 2 through a welding process; placing the assembled support 2 with the feedback microphone 1 into the earphone shell 3 and fixing the support by hot melting, and placing the connecting sheet 22 into the mounting groove 33 to position the connecting sheet 22; after the assembly is completed, the loudspeaker 4 is placed in the glue dispensing device.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

It is right above the utility model provides a structure of making an uproar falls in earphone initiative has carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims (10)

1. The utility model provides a structure of making an uproar falls in earphone initiative, includes support (2) and feedback microphone (1), its characterized in that, fixed electrically conductive path (25) and microphone pad (23) of being equipped with on support (2), the one end of electrically conductive path (25) with microphone pad (23) electric conductance, feedback microphone (1) weld in on microphone pad (23).

2. The active noise reduction structure of the earphone according to claim 1, wherein the bracket (2) comprises a disk body (21) and a connecting sheet (22), one end of the connecting sheet (22) is fixed on the edge of the disk body (21), and the microphone pad (23) is arranged on the disk body (21); the conductive path (25) extends from the microphone pad (23) to the connecting sheet (22) and further extends to an end of the connecting sheet (22) away from the disc body (21).

3. The active noise reduction structure of a headphone as claimed in claim 2, wherein the connecting sheet (22) is provided with a main control pad (24) at an edge of an end thereof away from the disc body (21) and electrically connected with the conductive path (25).

4. The active noise reduction structure of the earphone according to claim 2, wherein the support (2) is disposed in an earphone housing (3), an earphone sound outlet (31) is disposed on the earphone housing (3), the disc body (21) is disposed on the earphone sound outlet (31), and the disc body (21) is hollowed to communicate the earphone sound outlet (31) with an inner cavity of the earphone housing (3).

5. The active noise reduction structure of the earphone according to claim 4, wherein the disc body (21) is provided with a hot melting hole (26) in a penetrating manner, and the earphone housing (3) is fixedly provided with a hot melting column (32) which is spliced, matched and fixed with the hot melting hole (26) in a hot melting manner.

6. The active noise reduction structure of the earphone according to claim 2, wherein the support (2) is disposed in an earphone housing (3), a mounting groove (33) is formed on an inner wall of the earphone housing (3), and the connecting sheet (22) is received in the mounting groove (33).

7. The structure of claim 2, wherein the support (2) is disposed in a headphone housing (3), a headphone sound outlet (31) and the feedback microphone (1) on the headphone housing (3) are respectively disposed on two sides of the disc body (21), and the connecting piece (22) and the feedback microphone (1) are disposed on the same side of the disc body (21).

8. The active noise reduction structure of the earphone according to any one of claims 1 to 7, wherein a speaker (4) is fixedly arranged on the support (2), and a sound receiving port of the feedback microphone (1) is arranged opposite to a sound outlet of the speaker (4).

9. The active noise reduction structure of the earphone according to claim 8, wherein the speaker (4) and the feedback microphone (1) are disposed on the same side of the bracket (2).

10. The active noise reduction structure of the earphone according to any of claims 1 to 7, wherein the support (2) is a plastic part, the conductive path (25) is a metal path, and the conductive path (25) is integrally formed on the support (2) by LDS technology.

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