CN212412002U

CN212412002U - Continuous semiconductor etching equipment

Info

Publication number: CN212412002U
Application number: CN202021083124.8U
Authority: CN
Inventors: 廖海涛
Original assignee: Jiangsu Yiwen Microelectronics Technology Co Ltd
Current assignee: Jiangsu Yiwen Microelectronics Technology Co Ltd
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2021-01-26
Anticipated expiration: 2030-06-12

Abstract

The utility model discloses a continuous type semiconductor etching equipment relates to semiconductor etching equipment field, including the device body, one side of device body is equipped with and is equipped with the device door on electrical control cabinet, the device body, is equipped with glass on the device door, and the bottom side inner wall of device body is equipped with the waste liquid and collects the box, and the bottom side inner wall of device body is equipped with the heater. The utility model discloses it is rational in infrastructure, through setting up heater and agitator, make etching solution temperature keep suitable temperature and etching solution stirring to keep suitable concentration, the speed of etching has been improved, the single line sets up two semiconductor etching, the etching speed has been improved, through setting up vertical plate and baffle, avoid the etching solution to splash to other semiconductors on, through setting up heating cabinet and fan, mainly weather semiconductor surface, through setting up air cleaner, impurity among the filtered air, avoid the semiconductor to influence the service function by the impurity contamination in the air.

Description

Continuous semiconductor etching equipment

Technical Field

The utility model relates to a semiconductor etching equipment field, in particular to continuous type semiconductor etching equipment.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion and the like, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and an important step in the manufacturing process of the semiconductor is etching, and etching equipment is required for etching the semiconductor.

The wet etching method is used for etching semiconductors, the concentration of etching solution, the temperature of the etching solution and the stirring of the etching solution have important influence on the etching rate, the etching rate is obviously increased by increasing the temperature of the etching solution and stirring the etching solution, a plurality of single lines of etching equipment can only etch one semiconductor, the etching speed is lower, a partition is not arranged between etching nozzles, the etching solution is easy to splash onto other semiconductors, other semiconductors are scrapped, and after the semiconductor is etched, a main blow-drying device for the surface of the semiconductor is not arranged or an air filtering device is not arranged in the main blow-drying device, so that impurities in the air fall onto the etched semiconductor, the semiconductor is polluted, and the use function is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a continuous type semiconductor etching equipment to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a continuous semiconductor etching device comprises a device body, wherein one side of the device body is provided with an electric control cabinet, a device door is arranged on the device body, glass is arranged on the device door, a waste liquid collecting box is arranged on the inner wall of the bottom side of the device body, a heater is arranged on the inner wall of the bottom side of the device body, an etching liquid box is arranged on the top side of the heater, a stirrer is arranged in the etching liquid box, a placing plate is fixedly arranged on the inner wall of one side of the device body, a motor is fixedly arranged on the top side of the placing plate, a coupler is fixedly arranged at one end of an output shaft of the motor, a rotating shaft is fixedly arranged at one end of the coupler, a driving roller is fixedly arranged at one end of the rotating shaft, a rotating shaft is fixedly arranged on the inner wall of one side of, two equal fixed mounting in one side of two columniform have two L type poles, and the top side inner wall fixed mounting of device body has vertical plate, and one side fixed mounting of vertical plate has the baffle, and the top side inner wall fixed mounting of device body has the water pipe fixed bolster, and the top side fixed mounting of device body has air cleaner, and the top side fixed mounting of device body has the air pump, and the top side fixed mounting of device body has the heating cabinet.

Preferably, the same conveying belt is arranged on the driving roller and the driven roller, a plurality of semiconductor fixing blocks are uniformly and fixedly arranged on one side of the conveying belt, and a plurality of liquid leakage holes are uniformly formed in one side of the conveying belt.

Preferably, the water pipe fixed orifices has been seted up to one side of water pipe fixed bolster, is equipped with main water pipe in the water pipe fixed orifices, and the one end of main water pipe extends to outside the water pipe fixed orifices and fixed mounting has two water pipes, and the equal fixed mounting in one end of two water pipes has the hydrojet head, and the position of two hydrojet heads is located the both sides of vertical plate, and the other end fixed mounting of main water pipe is served at water pump outlet pipe, and the one end fixed mounting of water pump inlet tube is on one side of etching solution case.

Preferably, a heating plate is arranged in the heating box.

Preferably, the clearing hole has been seted up to the top side of device body, is equipped with the air hose in the clearing hole, and the one end of air hose extends to outside the clearing hole and fixed mounting has the fan case, and the other end fixed mounting of air hose has one side at the heating cabinet, and the one end fixed mounting of heating cabinet intake pipe has one of air pump outlet duct to serve, and the one end fixed mounting of air pump intake pipe is on one side of air cleaner.

Preferably, be equipped with the fan in the fan case, one side fixed mounting of fan case has two main trachea, and two main tracheal positions are based on the geometric centre symmetry of fan case, and two equal fixed mounting in tracheal one end have two bronchus, and the equal fixed mounting in tracheal one end of four has the jet-propelled head, electrical control cabinet and motor, water pump, air pump, heater and fan electric connection.

Preferably, the side of the four L-shaped bars adjacent to the two auxiliary rollers is in contact with both sides of the conveyor belt.

The utility model discloses a technological effect and advantage:

1. the utility model has reasonable structure, two semiconductors are placed on the conveying belt, the two semiconductors are respectively fixed through the semiconductor fixing blocks on the conveying belt, the electric control cabinet is used for starting the motor, the water pump, the air pump, the heater and other electric devices, the motor drives the driving roller to rotate, so as to drive the conveying belt to rotate, so as to drive the semiconductors to move, the auxiliary roller and the L-shaped rod are arranged, so that the conveying belt keeps stable in the process of conveying the semiconductors, etching liquid in the etching liquid box is heated through the heater and is stirred through the stirrer, so that the etching liquid is controlled at proper temperature and concentration, the etching liquid flows to the main water pipe through the water pump and then flows to the branch water pipe, and finally is sprayed to the semiconductors through the liquid spraying head to etch the semiconductors, and the etched semiconductors are moved to the position of the gas spraying head through the conveying belt, the air pump filters outside air through the air filter, flows into the heating box, heats the air through the heating sheet in the heating box, discharges hot air to the two main air pipes through the fan in the fan box, then flows to the air nozzle through the branch air pipes, and dries the residual etching solution on the semiconductor;

2. through setting up the waste liquid and collecting the box, avoid remaining etching solution to fall to corroding the device in the device, through setting up the glass door, be convenient for survey the etching process in the device, through setting up heater and agitator, make etching solution temperature keep suitable temperature and etching solution stirring and keep suitable concentration, the speed of etching has been improved, the single line sets up two semiconductor etching, the etching speed has been improved, through setting up vertical plate and baffle, avoid the etching solution to splash to other semiconductors, make other semiconductors scrap, through setting up heating cabinet and fan, mainly weather the semiconductor surface, through setting up air cleaner, impurity in the filtered air, avoid the semiconductor to be contaminated by the impurity in the air and influence the service function, through setting up the conveyer belt, can etch in succession.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is a schematic front view of the present invention;

FIG. 4 is a schematic view of the local enlarged structure of the present invention;

fig. 5 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

In the figure: 1. a device body; 2. an electrical control cabinet; 3. a waste liquid collection box; 4. placing the plate; 5. a motor; 6. a heater; 7. an etching solution tank; 8. a stirrer; 9. a water pump; 10. a drive roller; 11. a cylinder; 12. an auxiliary roller; 13. an L-shaped rod; 14. a driven roller; 15. a conveyor belt; 16. a fan case; 17. a heating box; 18. an air pump; 19. an air cleaner; 20. a main air pipe; 21. a bronchus; 22. a gas showerhead; 23. a water pipe fixing bracket; 24. a longitudinal plate; 25. a baffle plate; 26. a main water pipe; 27. a branch water pipe; 28. and a liquid spray head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a continuous semiconductor etching device as shown in figures 1-5, which comprises a device body 1, an electrical control cabinet 2 is arranged on one side of the device body 1, a device door is arranged on the device body 1, glass is arranged on the device door, a waste liquid collecting box 3 is arranged on the inner wall of the bottom side of the device body 1, a heater 6 is arranged on the inner wall of the bottom side of the device body 1, an etching liquid box 7 is arranged on the top side of the heater 6, an agitator 8 is arranged in the etching liquid box 7, a placing plate 4 is fixedly arranged on the inner wall of one side of the device body 1, a motor 5 is fixedly arranged on the top side of the placing plate 4, a shaft coupler is fixedly arranged at one end of an output shaft of the motor 5, a rotating shaft is fixedly arranged at one end of the shaft coupler, a driving roller 10 is fixedly arranged at, two cylinders 11 are fixedly arranged on the inner wall of one side of the device body 1, auxiliary rollers 12 are rotatably sleeved on the two cylinders 11, two L-shaped rods 13 are fixedly arranged on one sides of the two cylinders 11, a longitudinal plate 24 is fixedly arranged on the inner wall of the top side of the device body 1, a baffle 25 is fixedly arranged on one side of the longitudinal plate 24, a water pipe fixing support 23 is fixedly arranged on the inner wall of the top side of the device body 1, an air filter 19 is fixedly arranged on the top side of the device body 1, an air pump 18 is fixedly arranged on the top side of the device body 1, a heating box 17 is fixedly arranged on the top side of the device body, by arranging the heater 6 and the stirrer 8, the temperature of the etching solution is kept at a proper temperature, the etching solution is uniformly stirred and kept at a proper concentration, the etching speed is improved, the air filter 19 is arranged to filter impurities in the air, so that the semiconductor is prevented from being polluted by the impurities in the air to influence the use function.

Further, in the above scheme, the same conveying belt 15 is arranged on the driving roller 10 and the driven roller 14, a plurality of semiconductor fixing blocks are uniformly and fixedly mounted on one side of the conveying belt 15, and a plurality of liquid leakage holes are uniformly formed on one side of the conveying belt 15.

Further, in the above scheme, the water pipe fixed orifices has been seted up to one side of water pipe fixed bolster 23, be equipped with main water pipe 26 in the water pipe fixed orifices, the one end of main water pipe 26 extends to outside the water pipe fixed orifices and fixed mounting has two water pipes 27, the equal fixed mounting of one end of two water pipes 27 has hydrojet head 28, the position of two hydrojet heads 28 is located the both sides of vertical plate 24, the other end fixed mounting of main water pipe 26 is served at water pump 9 outlet pipe, the one end fixed mounting of water pump 9 inlet tube is on one side of etching solution case 7, through setting up a plurality of hydrojet heads 28, be convenient for etch a plurality of semiconductors, improve etching speed.

Further, in the above scheme, a heating sheet is arranged in the heating box 17.

Further, in the above scheme, the top side of device body 1 has seted up the clearing hole, is equipped with the air hose in the clearing hole, and the one end of air hose extends to outside the clearing hole and fixed mounting has fan case 16, and the other end fixed mounting of air hose has on one side of heating cabinet 17, and the one end fixed mounting of heating cabinet 17 intake pipe has one of air pump 18 outlet duct to serve, and the one end fixed mounting of air pump 18 intake pipe is on one side of air cleaner 19.

Further, in the above scheme, a fan is arranged in the fan box 16, two main air pipes 20 are fixedly mounted on one side of the fan box 16, the positions of the two main air pipes 20 are symmetrical based on the geometric center of the fan box 16, two branch air pipes 21 are fixedly mounted at one ends of the two main air pipes 20, air nozzles 22 are fixedly mounted at one ends of the four branch air pipes 21, the electric control cabinet 2 is electrically connected with the motor 5, the water pump 9, the air pump 18, the heater 6 and the fan, and the semiconductor is convenient to blow dry by arranging the branch air pipes 21.

Further, in the above-described configuration, the side where the four L-bars 13 and the two auxiliary rollers 12 are close to each other is in contact with both sides of the conveying belt 15, respectively, and the conveying belt 15 is kept stable during the process of conveying the semiconductor by providing the auxiliary rollers 12 and the L-bars 13.

This practical theory of operation: the model of the motor 5 is 5IK120RGN, through setting up the waste liquid collecting box 3, avoid the remaining etching liquid to fall to the device in to corrode the device, through setting up the glass door, it is convenient to observe the etching process in the device, place two semiconductors on the conveyer belt 15, fix two semiconductors respectively through the semiconductor fixed block on the conveyer belt 15, start the motor 5 through the electrical control cabinet 2, the water pump 9, the air pump 18, the heater 6 and other electrical apparatus, the shaft coupling is rotated to the motor 5 output shaft, the shaft coupling drives the axis of rotation to rotate, the axis of rotation drives the drive roller 10 to rotate, thus drive the conveyer belt 15 to rotate, thus drive the semiconductor to move, through setting up the auxiliary roller 12 and L-shaped rod 13, make the conveyer belt 15 keep stable in the process of conveying the semiconductor, the etching liquid in the etching liquid tank 7 is heated through the heater 6, stirring by a stirrer 8 to control the etching solution at a proper temperature and concentration, flowing the etching solution to a main water pipe 26 by a water pump 9, then flowing to a branch water pipe 27, finally spraying the etching solution to a semiconductor by a liquid spraying head 28 to etch the semiconductor, moving the etched semiconductor to the position of a gas spraying head 22 by a conveyer belt 15, filtering external air by an air pump 18 through an air filter 19, flowing into a heating box 17, heating the air by a heating sheet in the heating box 17, discharging hot air to two main air pipes 20 by a fan in a fan box 16, then flowing to the gas spraying head 22 through the branch air pipe 21 to dry the residual etching solution on the semiconductor, keeping the temperature of the etching solution at a proper temperature and uniformly stirring the etching solution at a proper concentration by arranging a heater 6 and the stirrer 8, improving the etching rate, setting two semiconductor etches by a single line, the etching speed is improved, the etching liquid is prevented from splashing to other semiconductors by arranging the longitudinal plate 24 and the baffle 25, so that other semiconductors are scrapped, the semiconductor surface is mainly dried by blowing by arranging the heating box 17 and the fan, and the impurities in the filtered air are prevented from being polluted by the impurities in the air to influence the use function by arranging the air filter 19.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a continuous type semiconductor etching equipment, includes device body (1), and one side of device body (1) is equipped with electrical control cabinet (2), is equipped with the device door on device body (1), is equipped with glass, its characterized in that on the device door: the device is characterized in that a waste liquid collecting box (3) is arranged on the inner wall of the bottom side of the device body (1), a heater (6) is arranged on the inner wall of the bottom side of the device body (1), an etching liquid box (7) is arranged on the top side of the heater (6), a stirrer (8) is arranged in the etching liquid box (7), a placing plate (4) is fixedly arranged on the inner wall of one side of the device body (1), a motor (5) is fixedly arranged on the top side of the placing plate (4), a coupler is fixedly arranged at one end of an output shaft of the motor (5), a rotating shaft is fixedly arranged at one end of the coupler, a driving roller (10) is fixedly arranged at one end of the rotating shaft, a rotating shaft is fixedly arranged on the inner wall of one side of the device body (1), a driven roller (14) is rotatably arranged at one end of the, the device comprises two cylinders (11), wherein two L-shaped rods (13) are fixedly mounted on one side of each cylinder (11), a longitudinal plate (24) is fixedly mounted on the inner wall of the top side of the device body (1), a baffle (25) is fixedly mounted on one side of the longitudinal plate (24), a water pipe fixing support (23) is fixedly mounted on the inner wall of the top side of the device body (1), an air filter (19) is fixedly mounted on the top side of the device body (1), an air pump (18) is fixedly mounted on the top side of the device body (1), and a heating box (17) is fixedly mounted on the top side of the device.

2. A continuous semiconductor etching apparatus according to claim 1, wherein: the driving roller (10) and the driven roller (14) are provided with the same conveying belt (15), one side of the conveying belt (15) is uniformly and fixedly provided with a plurality of semiconductor fixing blocks, and one side of the conveying belt (15) is uniformly provided with a plurality of liquid leakage holes.

3. A continuous semiconductor etching apparatus according to claim 1, wherein: the water pipe fixed orifices has been seted up to one side of water pipe fixed bolster (23), be equipped with main water pipe (26) in the water pipe fixed orifices, the one end of main water pipe (26) extends to outside the water pipe fixed orifices and fixed mounting has two water pipes (27), the equal fixed mounting in one end of two water pipes (27) has hydrojet head (28), the position of two hydrojet heads (28) is located the both sides of vertical plate (24), the other end fixed mounting of main water pipe (26) is served at one of water pump (9) outlet pipe, the one end fixed mounting of water pump (9) inlet tube is on one side of etching liquid case (7).

4. A continuous semiconductor etching apparatus according to claim 1, wherein: and a heating sheet is arranged in the heating box (17).

5. A continuous semiconductor etching apparatus according to claim 1, wherein: the clearing hole has been seted up to the top side of device body (1), is equipped with the air hose in the clearing hole, and the one end of air hose extends to outside the clearing hole and fixed mounting has fan case (16), and the other end fixed mounting of air hose has on one side of heating cabinet (17), and the one end fixed mounting of heating cabinet (17) intake pipe is served at one of air pump (18) outlet duct, and the one end fixed mounting of air pump (18) intake pipe is on one side of air cleaner (19).

6. A continuous semiconductor etching apparatus according to claim 5, characterized in that: be equipped with the fan in fan case (16), one side fixed mounting of fan case (16) has two main trachea (20), and the position of two main trachea (20) is based on the geometric centre symmetry of fan case (16), and the equal fixed mounting of one end of two main trachea (20) has two bronchus (21), and the equal fixed mounting of one end of four bronchus (21) has jet head (22), electrical control cabinet (2) and motor (5), water pump (9), air pump (18), heater (6) and fan electric connection.

7. A continuous semiconductor etching apparatus according to claim 1, wherein: the side of the four L-shaped rods (13) close to the two auxiliary rollers (12) is respectively contacted with the two sides of the conveying belt (15).