CN212256224U

CN212256224U - High-efficient radiating computer mainboard

Info

Publication number: CN212256224U
Application number: CN202021015401.1U
Authority: CN
Inventors: 吴佩林
Original assignee: Honghe Dixin Technology Co ltd
Current assignee: Honghe Dixin Technology Co ltd
Priority date: 2020-06-05
Filing date: 2020-06-05
Publication date: 2020-12-29
Anticipated expiration: 2030-06-05

Abstract

The utility model provides a computer mainboard with high-efficiency heat dissipation, which relates to the technical field of computer mainboards, and comprises a mainboard body, wherein the surface of the mainboard body is provided with a through hole, the surface of the mainboard body is provided with a heat dissipation device, the heat dissipation device is fixedly connected with the surface of the mainboard body, two sides of the heat dissipation device are fixedly connected with a refrigerating device, a blowing fan is arranged on the computer mainboard, the blowing fan dissipates heat generated by the surface of the computer mainboard in the rotating process, the blowing fan and the blowing fan are simultaneously started, the surface of the blowing fan is covered with a wind guide cover, when the blowing fan rotates, wind is intensively conveyed into an exhaust pipe through the wind guide cover, the exhaust pipe is connected in the wind guide pipe, wind energy generated by the rotation of the blowing fan enters the wind guide pipe through the exhaust pipe, the wind guide pipe surrounds two sides of the heat dissipation device, the wind generated by the blowing fan is discharged, the heat of effectual computer mainboard surface cycle dispels the heat, has improved the thermal diffusivity of computer mainboard.

Description

High-efficient radiating computer mainboard

Technical Field

The utility model relates to a computer motherboard field especially relates to a high-efficient radiating computer motherboard.

Background

The computer main board is one of the most basic important components of a computer, and the computer main board is used for bearing most of the components of the computer, so that the computer main board generates heat seriously during work.

The existing computer mainboard is usually only provided with a cooling fan to cool the computer mainboard, so that heat generated during the operation of a computer can not be completely dissipated, and the computer mainboard can still circulate around near the computer mainboard, so that the heat dissipation of the computer mainboard is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a high-efficiency heat-dissipation computer mainboard.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the through-hole has been seted up on mainboard body surface, mainboard body surface is equipped with heat abstractor, and heat abstractor and mainboard body fixed surface are connected, heat abstractor both sides fixedly connected with refrigerating plant, and the mutual symmetry of refrigerating plant, the heat abstractor bottom fixedly connected with dead lever all around, and the dead lever inserts in the through-hole on the mainboard body surface.

Preferably, the heat dissipation device comprises a supporting plate, a groove is formed in the surface of the supporting plate, a blowing fan is arranged in the groove and fixedly connected with the inner wall of the groove, two sides of the blowing fan are provided with suction fans which are fixedly connected to the supporting plate, and the two suction fans are symmetrical to each other by taking the blowing fan as a center.

Preferably, the surface of the support plate is provided with an air guide pipe, the air guide pipe surrounds the surface of the support plate, the surfaces of the two exhaust fans are provided with air scoopers, the air scoopers are fixedly connected with the surfaces of the exhaust fans, the top ends of the air scoopers are fixedly connected with exhaust pipes, and the air guide pipes of the exhaust pipes are communicated with each other.

Preferably, the bottom end of the support plate is provided with two radiating fins, the two radiating fins are fixedly connected with the bottom of the support plate, and the two radiating fins are respectively positioned at the bottoms of the two exhaust fans.

Preferably, the refrigerating device comprises a refrigerating box, the inside of the refrigerating box is fixedly connected with a semiconductor refrigerating pipe, a water inlet is formed in the top of the refrigerating box, a sealing cover is arranged on the surface of the water inlet, and the two refrigerating devices are connected with a liquid circulating pipe in the opposite direction.

Preferably, the bottom of the radiating fin is provided with a hose, the hose is fixedly connected with the bottom of the radiating fin, the bottom end of the hose is fixedly connected with a low-temperature sheet, and the low-temperature sheet is attached to the surface of the main board.

Advantageous effects

1. The utility model discloses in, adopt fan and the suction fan of blowing, the realization carries out radiating effect to the produced heat of computer mainboard, install on the computer mainboard through the fan of will blowing, the computer mainboard starts to drive the fan of blowing and rotates, the fan of blowing is at rotatory in-process, dispel the heat to the produced heat of computer mainboard surface, the suction fan starts simultaneously with the fan of blowing, the suction fan surface is covered with the wind scooper, concentrate the wind through the wind scooper when the suction fan is rotatory and carry to the convulsions in, the exhaust column is connected in the wind-guiding pipe, produced wind energy passes through the exhaust column and gets into in the wind-guiding pipe when the suction fan is rotatory, the wind-guiding pipe encircles in the heat abstractor both sides, the produced wind of suction fan passes through the exhaust column both sides, the circulation is on the computer mainboard surface, effectual heat to computer mainboard surface circulation dispels the heat, the thermal diffusivity.

2. The utility model discloses in, adopt refrigerating plant and low temperature piece, the realization is carried out the effect of initiatively cooling to the computer mainboard, through respectively installing a refrigerating plant at the heat abstractor both ends, two refrigerating plant lateral wall interconnect liquid circulation pipes, through dialling the closing cap, pass through the water inlet with the refrigeration liquid and pour into in the refrigeration case, refrigerate through semiconductor refrigeration pipe, then, the refrigeration liquid circulates in two refrigerating plant through liquid circulation pipe, liquid circulation pipe is pressed close to with the computer mainboard mutually, the produced air conditioning of refrigeration liquid through in the refrigeration circulation pipe effectively cools down the mainboard, the fin is installed to two extraction fan bottoms, be connected with the low temperature piece at scattered people's piece bottom, laminate the low temperature piece on the computer mainboard, cool down the computer mainboard through the low temperature piece, the effectual computer mainboard that has prevented produces the high temperature.

Drawings

Fig. 1 is a schematic perspective view of a computer motherboard with high heat dissipation efficiency according to the present invention;

fig. 2 is a front view of a computer motherboard with high heat dissipation efficiency according to the present invention;

fig. 3 is a bottom view of the heat dissipation device of the computer motherboard with high heat dissipation efficiency of the present invention;

fig. 4 is a schematic structural diagram of a refrigerating apparatus for a high-efficiency heat dissipation computer motherboard according to the present invention.

Illustration of the drawings:

1. a main board body; 2. a heat sink; 3. a refrigeration device; 301. a refrigeration case; 302. a semiconductor refrigeration tube; 303. sealing the cover; 304. a water inlet; 305. a liquid circulation pipe; 4. a support plate; 5. a groove; 6. a through hole; 7. a blower fan; 8. an exhaust fan; 9. a wind scooper; 10. an exhaust pipe; 11. an air guide pipe; 12. a heat sink; 13. a hose; 14. a low-temperature sheet; 15. and (5) fixing the rod.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, a computer motherboard with high heat dissipation efficiency comprises a motherboard body 1, a through hole 6 is provided on the surface of the motherboard body 1, a heat dissipation device 2 is provided on the surface of the motherboard body 1, the heat dissipation device 2 is fixedly connected with the surface of the motherboard body 1, two sides of the heat dissipation device 2 are fixedly connected with refrigeration devices 3, the refrigeration devices 3 are symmetrical to each other, a fixing rod 15 is fixedly connected around the bottom of the heat dissipation device 2, the fixing rod 15 is inserted into the through hole 6 on the surface of the motherboard body 1, the heat dissipation device 2 comprises a support plate 4, a groove 5 is provided on the surface of the support plate 4, a blowing fan 7 is provided in the groove 5, the blowing fan 7 is fixedly connected with the inner wall of the groove 5, two sides of the blowing fan 7 are provided with suction fans 8, the suction fans 8 are fixedly connected to the support plate 4, the wind guide pipes 11 surround the surface of the support plate 4, wind guide covers 9 are arranged on the surfaces of the two exhaust fans 8, the wind guide covers 9 are fixedly connected with the surfaces of the exhaust fans 8, exhaust pipes 10 are fixedly connected to the top ends of the wind guide covers 9, the exhaust pipes 10 are communicated with each other, the blowing fan 7 is mounted on a computer mainboard, the computer mainboard is started to drive the blowing fan 7 to rotate, the blowing fan 7 dissipates heat generated on the surface of the computer mainboard in the rotating process, the exhaust fans 8 and the blowing fan 7 are started simultaneously, the wind guide covers 9 cover the surfaces of the exhaust fans 8, when the exhaust fans 8 rotate, wind is intensively conveyed into the exhaust pipes 10 through the wind guide covers 9, the exhaust pipes 10 are connected into the wind guide pipes 11, when the exhaust fans 8 rotate, wind generated by the exhaust fans 8 enters the wind guide pipes 11 through the exhaust pipes 10, the wind guide pipes 11 surround the two sides of the heat dissipation device 2, and the wind generated by the exhaust fans 8 is exhausted through the two sides of, the heat circulating on the surface of the computer mainboard is effectively dissipated, the heat dissipation performance of the computer mainboard is improved, two heat dissipation fins 12 are arranged at the bottom end of the supporting plate 4, the two heat dissipation fins 12 are fixedly connected with the bottom of the supporting plate 4, the two heat dissipation fins 12 are respectively arranged at the bottoms of the two exhaust fans 8, the refrigerating device 3 comprises a refrigerating box 301, a semiconductor refrigerating pipe 302 is fixedly connected inside the refrigerating box 301, a water inlet 304 is formed in the top of the refrigerating box 301, a sealing cover 303 is arranged on the surface of the water inlet 304, liquid circulating pipes 305 are connected in opposite directions of the two refrigerating devices 3, hoses 13 are arranged at the bottoms of the heat dissipation fins 12, the bottoms of the hoses 13 are fixedly connected with low-temperature fins 14, the low-temperature fins 14 are attached to the surface of the mainboard, the two refrigerating devices 3 are respectively arranged at two ends of the heat dissipation device 2, and the side, through pulling out closing cap 303, pour into the refrigeration liquid into refrigeration case 301 through water inlet 304 in, refrigerate through semiconductor refrigeration pipe 302, then, the refrigeration liquid circulates in two refrigerating plant 3 through liquid circulating pipe 305, liquid circulating pipe 305 is pressed close to with the computer mainboard mutually, the produced air conditioning of refrigeration liquid through in the refrigeration circulating pipe effectively cools down to the mainboard, fin 12 is installed to 8 bottoms of two suction fans, be connected with low temperature piece 14 at the bottom of loosing one's seat, with 14 laminating of low temperature piece on the computer mainboard, cool down to the computer mainboard through low temperature piece 14, the effectual computer mainboard that has prevented produces the high temperature.

The utility model discloses a theory of operation: the fixing rod 15 is inserted into the through hole 6 on the computer mainboard, the heat dissipation device 2 is fixed with the computer mainboard, when the computer mainboard is started, the blowing fan 7 and the suction fan 8 are driven to rotate, the blowing fan 7 dissipates heat generated around the computer mainboard, the suction fan 8 is connected with the air guide pipe 11 through the exhaust pipe 10, the air generated by the suction fan 8 is dispersed around the computer mainboard through the air guide pipe 11 to dissipate heat circulating around the computer mainboard, the bottom of the suction fan 8 is provided with the radiating fin 12, the bottom of the radiating fin 12 is connected with the low temperature fin 14, the low temperature fin 14 is adhered to the surface of the computer mainboard to cool, the cooling devices are arranged on two sides of the heat dissipation device 2, the cooling liquid is injected into the refrigeration box 301 through the water inlet 304, the semiconductor refrigeration pipe 302 is arranged in the refrigeration box 301 to cool the cooling liquid, the cooling liquid enters the liquid circulation pipe 305 to circulate, the liquid circulation pipe 305 is close to the computer motherboard, and the cold air generated by the cooling liquid is emitted through the liquid circulation pipe 305 to effectively cool the computer motherboard.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a high-efficient radiating computer mainboard, includes mainboard body (1), its characterized in that: through-hole (6) have been seted up on mainboard body (1) surface, mainboard body (1) surface is equipped with heat abstractor (2), and heat abstractor (2) and mainboard body (1) fixed surface are connected, heat abstractor (2) both sides fixedly connected with refrigerating plant (3), and refrigerating plant (3) mutual symmetry, fixedly connected with dead lever (15) all around heat abstractor (2) bottom, and dead lever (15) insert mainboard body (1) in through-hole (6) on the surface.

2. The computer motherboard with efficient heat dissipation of claim 1, wherein: heat abstractor (2) is including backup pad (4), backup pad (4) surface is seted up flutedly (5), be equipped with in recess (5) and blow fan (7), and blow fan (7) and recess (5) inner wall fixed connection, blow fan (7) both sides and be equipped with extraction fan (8), and extraction fan (8) fixed connection is on backup pad (4), and two extraction fan (8) use blow fan (7) as central mutual symmetry.

3. The computer motherboard with efficient heat dissipation of claim 2, wherein: the air guide pipes (11) are arranged on the surfaces of the supporting plates (4), the air guide pipes (11) surround the surfaces of the supporting plates (4), air guide covers (9) are arranged on the surfaces of the two exhaust fans (8), the air guide covers (9) are fixedly connected with the surfaces of the exhaust fans (8), exhaust pipes (10) are fixedly connected to the top ends of the air guide covers (9), and the air guide pipes (11) of the exhaust pipes (10) are communicated with each other.

4. The computer motherboard with efficient heat dissipation of claim 2, wherein: two radiating fins (12) are arranged at the bottom end of the supporting plate (4), the two radiating fins (12) are fixedly connected with the bottom of the supporting plate (4), and the two radiating fins (12) are respectively positioned at the bottoms of the two exhaust fans (8).

5. The computer motherboard with efficient heat dissipation of claim 1, wherein: refrigerating plant (3) are including refrigeration case (301), refrigeration case (301) inside fixedly connected with semiconductor refrigeration pipe (302), water inlet (304) have been seted up at refrigeration case (301) top, water inlet (304) surface mounting has closing cap (303), two refrigerating plant (3) relative direction are connected with liquid circulation pipe (305).

6. The computer motherboard with efficient heat dissipation of claim 4, wherein: the radiating fin is characterized in that a hose (13) is arranged at the bottom of the radiating fin (12), the hose (13) is fixedly connected with the bottom of the radiating fin (12), a low-temperature sheet (14) is fixedly connected to the bottom end of the hose (13), and the low-temperature sheet (14) is attached to the surface of the main board.