CN212211260U

CN212211260U - Superspeed switch based on 5G technology

Info

Publication number: CN212211260U
Application number: CN202021342280.1U
Authority: CN
Inventors: 胡兴荣
Original assignee: Qingdao Qianhe Xiangrui Intelligent Technology Co ltd
Current assignee: Qingdao Qianhe Xiangrui Intelligent Technology Co ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2020-12-22
Anticipated expiration: 2030-07-09

Abstract

The utility model discloses an hypervelocity switch based on 5G technique, including device main part, heat dissipation mechanism and power source, the inside of device main part is provided with the chip box, and the inboard of chip box is provided with dragon core processing chip, the left of chip box is provided with integrated circuit board, and integrated circuit board's inboard welding has double-deck copper-plated PCB, heat dissipation mechanism all sets up the left and right sides in the device main part, and the top of device main part is provided with the hangers, the below of device main part is provided with the rotary rod, and the below of rotary rod is provided with the ya keli visor, the place ahead outside of ya keli visor is provided with connection platform, and connection platform's inboard all is provided with the giga port. A5G technology-based ultra-high-speed switch is provided with a gigabit port, so that the port can be matched with a proper network independently in the process of using the device, the transmission speed of the device is increased, and the working efficiency of the device is improved.

Description

Superspeed switch based on 5G technology

Technical Field

The utility model relates to a switch technical field specifically is a hypervelocity switch based on 5G technique.

Background

The switch is a network device for forwarding electrical and optical signals, and can provide an exclusive electrical signal path for any two network nodes accessing the switch, and the switch is used as a main connection device of a local area network, so that the switch is indispensable for a super-high-speed switch based on 5G technology.

In the traditional switch, because the structure of the device is single, in the process of using the device, a port can not be automatically matched with a proper network, so that the transmission speed is low, and the working efficiency of the device is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a hypervelocity switch based on 5G technique to propose in solving above-mentioned background art because the device's structure is comparatively single, at the in-process that uses the device, the port often can't independently match suitable network, leads to transmission speed lower, has reduced the device's work efficiency's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an hypervelocity switch based on 5G technique, includes device main part, heat dissipation mechanism and power source, the inside of device main part is provided with the chip box, and the inboard of chip box is provided with dragon core processing chip, the left of chip box is provided with integrated circuit board, and integrated circuit board's inboard welding has double-deck copper-plated PCB, heat dissipation mechanism all sets up the left and right sides in the device main part, and the top of device main part is provided with the hangers, the below of device main part is provided with the rotary rod, and the below of rotary rod is provided with the ya keli visor, the place ahead outside of ya keli visor is provided with connection platform, and connection platform's inboard all is provided with the giga port, power source sets up the left at connection platform, and power source's top all is provided with.

Preferably, the Loongson processing chip is tightly attached to the chip box, and the Loongson processing chip is connected with the chip box through a clamping groove.

Preferably, the outer wall of the heat dissipation mechanism and the outer wall of the device main body are both in open-cell design, and the heat dissipation mechanism is symmetrically arranged about the central axis of the device main body.

Preferably, the heat dissipation mechanism comprises a ventilation hole, a filter screen and a fixing block, the filter screen is tightly attached to the ventilation hole, and the filter screen is connected with the ventilation hole through a clamping groove.

Preferably, the outer wall of hangers and the outer wall of device main part are open-cell design, and the axis of hangers and the axis of device main part are on same vertical straight line.

Preferably, the upper end of the acrylic protective cover is rotatably connected with the lower end of the device body through the outer wall of the rotating rod, and the width of the acrylic protective cover is smaller than that of the device body.

Preferably, the outer wall of the gigabit port and the outer wall of the connection platform are both in an open-cell design, and the gigabit port is symmetrically arranged about the central axis of the connection platform.

Compared with the prior art, the beneficial effects of the utility model are that: A5G technology-based ultra-high-speed switch is provided with a gigabit port, so that the port can be automatically matched with a proper network in the process of using the device, the transmission speed of the device is increased, and the working efficiency of the device is improved;

(1) a superspeed switch based on 5G technology is provided with a Loongson processing chip, and the Loongson processing chip is connected with a chip box through a clamping groove, so that installation and disassembly of workers are facilitated when the Loongson processing chip needs to be replaced;

(2) the superspeed switch based on the 5G technology is provided with the heat dissipation mechanism, so that the heat dissipation treatment can be performed on the device by utilizing the fluidity of air, and the damage caused by overhigh internal temperature in the use process of the device is avoided;

(3) the utility model provides a hypervelocity switch based on 5G technique, through setting up the filter screen, can avoid like this when carrying out the heat dissipation to the device, the dust spot in the air enters into the inside of the device, causes the damage to inside part, improves the device's life.

Drawings

Fig. 1 is a schematic top view of the internal structure of the present invention;

fig. 2 is a schematic front view of the structure of the present invention;

fig. 3 is a schematic structural view of the heat dissipation mechanism of the present invention;

fig. 4 is an enlarged schematic structural diagram of a in fig. 1 according to the present invention.

In the figure: 1. a device main body; 2. a chip cartridge; 3. a Loongson processing chip; 4. an integrated circuit board; 5. double-layer copper-plated PCB; 6. a heat dissipation mechanism; 601. a vent hole; 602. a filter screen; 603. a fixed block; 7. hanging a lug; 8. rotating the rod; 9. an acrylic protective cover; 10. connecting the platform; 11. a gigabit port; 12. a power interface; 13. a signal lamp.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a superspeed switch based on 5G technology comprises a device body 1, a heat dissipation mechanism 6 and a power interface 12, wherein a chip box 2 is arranged inside the device body 1, a godson processing chip 3 is arranged on the inner side of the chip box 2, an integrated circuit board 4 is arranged on the left side of the chip box 2, a double-layer copper-plated PCB5 is welded on the inner side of the integrated circuit board 4, the heat dissipation mechanism 6 is arranged on the left side and the right side of the device body 1, a hanging lug 7 is arranged above the device body 1, a rotating rod 8 is arranged below the device body 1, an acrylic protective cover 9 is arranged below the rotating rod 8, a connecting platform 10 is arranged on the outer side in front of the acrylic protective cover 9, a kilomega port 11 is arranged on the inner side of the connecting platform 10, the power interface 12 is arranged on the left side of the connecting platform 10, and a signal lamp 13;

specifically, the Loongson processing chip 3 is tightly attached to the chip box 2, the Loongson processing chip 3 is connected with the chip box 2 through a clamping groove, and the Loongson processing chip 3 is arranged, so that the Loongson processing chip 3 can be conveniently mounted and dismounted by workers when the Loongson processing chip 3 needs to be replaced due to the fact that the Loongson processing chip 3 is connected with the chip box 2 through the clamping groove;

specifically, the outer wall of the heat dissipation mechanism 6 and the outer wall of the device main body 1 are both in open-hole design, the heat dissipation mechanism 6 is symmetrically arranged about the central axis of the device main body 1, and by arranging the heat dissipation mechanism 6, the device can be subjected to heat dissipation treatment by utilizing the fluidity of air, so that the damage caused by overhigh internal temperature in the use process of the device is avoided;

specifically, the heat dissipation mechanism 6 comprises a vent hole 601, a filter screen 602 and a fixing block 603, the filter screen 602 is tightly attached to the vent hole 601, and the filter screen 602 is connected to the vent hole 601 through a clamping groove, so that dust and dirt in the air can be prevented from entering the device to damage internal parts when the device is subjected to heat dissipation treatment by arranging the filter screen 602, and the service life of the device is prolonged;

specifically, the outer wall of the hanging lug 7 and the outer wall of the device main body 1 are both in open-hole design, the central axis of the hanging lug 7 and the central axis of the device main body 1 are on the same vertical straight line, and the hanging lug 7 is arranged, so that the device can be subjected to position adjustment through the hanging lug 7 according to requirements, and the application range of the device is expanded;

specifically, the upper end of the acrylic protective cover 9 is rotatably connected with the lower end of the device main body 1 through the outer wall of the rotating rod 8, the width of the acrylic protective cover 9 is smaller than that of the device main body 1, and by arranging the acrylic protective cover 9, the acrylic protective cover 9 can be rotated to be in a state of being attached to the connecting platform 10 through the rotating rod 8, so that the kilomega port 11 is protected, and external dust and water stains are prevented from entering the inside of the kilomega port 11 to cause damage;

specifically, the outer wall of the gigabit port 11 and the outer wall of the connection platform 10 are both in an open-cell design, and the gigabit port 11 is symmetrically arranged about the central axis of the connection platform 10, and by setting the gigabit port 11, the port can be automatically matched with a suitable network in the process of using the device, so that the transmission speed of the device is increased, and the working efficiency of the device is improved.

The working principle is as follows: when the utility model is used, firstly the device is moved to the required use position, then the device is connected with an external power supply through the power interface 12, then the signal wire is connected with the corresponding kilomega port 11, by setting the kilomega port 11, in the process of using the device, the port can be automatically matched with a proper network, the transmission speed of the device is improved, the working efficiency of the device is improved, finally when the position of the device is required to be adjusted, the device is installed and connected through the hanging lugs 7, by setting the hanging lugs 7, the device can be adjusted in position through the hanging lugs 7 according to the requirement, the application range of the device is improved, by setting the dragon core processing chip 3, because the dragon core processing chip 3 is connected with the chip box 2 through the clamping groove, when the dragon core processing chip 3 is required to be replaced, make things convenient for staff's installation and dismantlement, through setting up heat dissipation mechanism 6, the mobility that can utilize the air like this carries out the heat dissipation treatment to the device, avoid the device at the in-process that uses, inside high temperature, cause the damage, through setting up filter screen 602, can avoid like this when carrying out the heat dissipation treatment to the device, dust spot in the air enters into the device's inside, cause the damage to internal part, improve the device's life, through setting up ya keli visor 9, can pass through rotary rod 8 rotation with ya keli visor 9 like this to with connection platform 10 laminating state, protect giga port 11, avoid outside dust water stain to enter into the inside of giga port 11, cause the damage, just such working process based on the hypervelocity switch of 5G technique has been accomplished.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a hypervelocity switch based on 5G technique, includes device main part (1), heat dissipation mechanism (6) and power source (12), its characterized in that: a chip box (2) is arranged in the device main body (1), a Loongson processing chip (3) is arranged on the inner side of the chip box (2), an integrated circuit board (4) is arranged on the left side of the chip box (2), and the inner side of the integrated circuit board (4) is welded with a double-layer copper-plated PCB (5), the heat dissipation mechanisms (6) are arranged on the left side and the right side of the device main body (1), a hanging lug (7) is arranged above the device main body (1), a rotating rod (8) is arranged below the device main body (1), an acrylic protective cover (9) is arranged below the rotating rod (8), a connecting platform (10) is arranged on the outer side in front of the acrylic protective cover (9), and the inboard of connecting platform (10) all is provided with giga port (11), power source (12) set up the left at connecting platform (10), and power source (12)'s top all is provided with signal lamp (13).

2. A superspeed switch based on 5G technology according to claim 1, characterized in that: the Loongson processing chip (3) is tightly attached to the chip box (2), and the Loongson processing chip (3) is connected with the chip box (2) through a clamping groove.

3. A superspeed switch based on 5G technology according to claim 1, characterized in that: the outer wall of the heat dissipation mechanism (6) and the outer wall of the device main body (1) are both in open-hole design, and the heat dissipation mechanism (6) is symmetrically arranged relative to the central axis of the device main body (1).

4. A superspeed switch based on 5G technology according to claim 1, characterized in that: heat dissipation mechanism (6) are including ventilation hole (601), filter screen (602) and fixed block (603), and closely laminate between filter screen (602) and ventilation hole (601) to be the draw-in groove connection between filter screen (602) and ventilation hole (601).

5. A superspeed switch based on 5G technology according to claim 1, characterized in that: the outer wall of hangers (7) and the outer wall of device main part (1) are open-cell design, and the axis of hangers (7) and the axis of device main part (1) are on same vertical straight line.

6. A superspeed switch based on 5G technology according to claim 1, characterized in that: the upper end of inferior gram force visor (9) passes through the outer wall of rotary rod (8) and the lower extreme swivelling joint of device main part (1), and the width of inferior gram force visor (9) is less than the width of device main part (1).

7. A superspeed switch based on 5G technology according to claim 1, characterized in that: the outer wall of giga port (11) and the outer wall of connecting platform (10) are open-cell design, and giga port (11) set up about the axis symmetry of connecting platform (10).