CN212182280U - Crystal supplementing equipment for oversized substrate - Google Patents

Abstract

The application provides oversized substrate crystal supplementing equipment which comprises a machine table, wherein the top surface of the machine table is provided with a glue dispensing station, a crystal filling station and a crystal supplying station, and the glue dispensing station and the crystal supplying station are connected to two sides of the crystal filling station; the conveying platform is arranged on the top surface of the machine table, penetrates through the dispensing station and the crystal filling station and is used for conveying the oversized substrate; the glue dispensing mechanism is arranged at the glue dispensing station and used for supplementing glue at the crystal lacking position of the oversized substrate; the crystal filling mechanism is arranged at the crystal filling station and used for grabbing the wafer and filling the wafer on the crystal lacking position of the oversized substrate; and the crystal supply mechanism is arranged at the crystal supply station and used for storing the wafer and conveying the chip to the crystal filling station. The utility model provides a brilliant equipment is mended to super large base plate has adopted the board to establish ties conveying platform, point gum machine structure, fill out brilliant mechanism and supply brilliant mechanism compactly together for the structure is compacter, accomplishes the brilliant task of benefit accurately through conveying platform, point gum machine structure, fill out brilliant mechanism and supply brilliant mechanism to mutually support, makes to mend brilliant efficiency higher.

Description

Crystal supplementing equipment for oversized substrate

Technical Field

The application belongs to the technical field of LED packaging, and particularly relates to oversized substrate crystal supplementing equipment.

Background

The LED packaging process generally requires a Die bonding process, which is also called Die Bond or Die attach, i.e., a process of bonding a wafer to a designated area of a substrate through a glue (conductive glue, insulating glue or solder paste) to form a thermal or electrical path and provide conditions for subsequent wire bonding. And the step of crystal filling refers to the process of filling glue and filling a wafer in the crystal leakage and solidification area of the substrate.

With the development of LED display technology and the improvement of living standard of people, large-size LED displays in the market are more and more favored by people; and the production of large-sized LED displays requires oversized substrates. At present, no special equipment for supplementing crystals for the oversized substrate exists in the market, and when the crystals are needed to be supplemented for the oversized substrate, only the traditional crystal fixing equipment is used, but the traditional crystal fixing equipment is large in structure, large in occupied area, not intelligent and automatic enough, poor in crystal supplementing effect and not suitable for being used as special crystal supplementing equipment.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a super-large substrate crystal supplementing device, which comprises but is not limited to solving the technical problems of large structure and large occupied area of the traditional crystal fixing device.

In order to achieve the above object, the present application adopts a technical solution that a super-large substrate crystal supplementing apparatus includes:

the device comprises a machine table, wherein the top surface of the machine table is provided with a glue dispensing station, a crystal filling station and a crystal supplying station, and the glue dispensing station and the crystal supplying station are connected to two sides of the crystal filling station;

the conveying platform is arranged on the top surface of the machine table, penetrates through the dispensing station and the crystal filling station and is used for conveying the oversized substrate;

the glue dispensing mechanism is arranged at the glue dispensing station and used for supplementing glue at the crystal lacking position of the oversized substrate;

the crystal filling mechanism is arranged at the crystal filling station and used for grabbing the wafer and filling the wafer in the crystal lacking position of the oversized substrate; and

and the crystal supply mechanism is arranged at the crystal supply station and used for storing the wafer and conveying the chip to the crystal filling station.

In one embodiment, the crystal filling mechanism comprises:

a suction nozzle unit for sucking and discharging the wafer;

the first linear module is in transmission connection with the suction nozzle unit and is used for driving the suction nozzle unit to reciprocate between the top side of the conveying platform and the top side of the crystal supply mechanism;

the first image acquisition assembly is fixed on the top side of the wafer supply mechanism and used for identifying the position of the wafer;

the second image acquisition assembly is used for assisting the suction nozzle unit to accurately fill crystals; and

and the second linear module is in transmission connection with the second image acquisition assembly and is used for driving the second image acquisition assembly to move towards the direction close to and far away from the first image acquisition assembly.

In one embodiment, the suction nozzle unit includes:

a suction nozzle assembly;

the cross guide rail is fixed on the first linear module and extends along the vertical direction, and the suction nozzle assembly is connected to the cross guide rail in a sliding manner;

the first driving assembly is arranged on the first linear module, is in transmission connection with the suction nozzle assembly and is used for driving the suction nozzle assembly to slide along the cross guide rail; and

and the detection assembly is fixed on the first straight line module, is positioned beside the suction nozzle assembly and is used for detecting the position of the suction nozzle assembly.

In one embodiment, the glue dispensing mechanism comprises:

the glue supply unit is used for storing glue;

the glue dispensing unit is used for dipping the glue and dipping the glue on the crystal lacking position of the oversized substrate; and

and the third linear module is in transmission connection with the glue supply unit and the glue dispensing unit and used for driving the glue supply unit and the glue dispensing unit to move along the first direction.

In one embodiment, the dispensing unit includes:

dispensing a glue head; and

the second driving assembly is arranged on the third linear module and is in transmission connection with the dispensing head, and the second driving assembly comprises a fourth linear module and a fifth linear module, wherein the fourth linear module is used for driving the dispensing head to ascend and descend, and the fifth linear module is used for driving the dispensing head to move in and out of the glue supply unit.

In one embodiment, the dispensing mechanism further comprises:

and the third image acquisition assembly is arranged on the third linear module, is positioned on the top side of the dispensing head and is used for assisting the dispensing head in accurately dispensing.

In one embodiment, the fourth linear module comprises:

the first rotating motor is fixed on the third linear module;

the first eccentric wheel is sleeved on an output shaft of the first rotating motor; and

the first sliding table is connected to one of the third linear module and the second sliding table in a sliding manner;

the fifth linear module includes:

the second rotating motor is fixed on the third linear module;

the second eccentric wheel is sleeved on an output shaft of the second rotating motor; and

the second sliding table is connected to the other one of the third linear module and the first sliding table in a sliding manner;

the dispensing head is fixed to the bottom of the first sliding table or the bottom of the second sliding table.

In one embodiment, the crystal supply mechanism comprises:

the storage unit is used for storing the fixing ring with the wafer and conveying the fixing ring;

the wafer supply unit is arranged at the bottom side of the first image acquisition assembly and used for locking the fixing ring and separating the wafer from the wafer; and

the manipulator unit is located the storage unit with supply the side of brilliant unit, be used for with gu fixed ring is in the storage unit with supply reciprocal the transporting between the brilliant unit.

In one embodiment, the crystal supply unit includes:

the locking assembly is used for locking the fixing ring;

the third driving assembly is in transmission connection with the locking assembly and is used for driving the locking assembly to move along the first direction and the second direction;

the rotating module is in transmission connection with the locking assembly and is used for driving the locking assembly to rotate; and

and the top end of the ejector pin component extends into the locking component and is used for jacking the chips on the wafer one by one.

In one embodiment, the delivery platform comprises:

the fourth driving assembly is used for feeding the oversized substrate onto the conveying platform;

the positioning assembly is used for positioning the oversized substrate on the fourth driving assembly; and

and the sixth linear module is in transmission connection with the fourth driving assembly and is used for driving the fourth driving assembly to sequentially move to the dispensing station and the crystal filling station.

The application provides a brilliant equipment is mended to super large base plate's beneficial effect lies in: the conveying platform, the glue dispensing mechanism, the crystal filling mechanism and the crystal supplying mechanism are connected in series compactly by adopting a machine table, so that the occupied area of the oversized substrate crystal filling equipment is reduced, the technical problems of large structure and large occupied area of the traditional crystal fixing equipment are solved effectively, the placement flexibility of the oversized substrate crystal filling equipment is improved, the tasks of glue dispensing, crystal filling, crystal supplying and the like can be accurately completed through the mutual matching of the conveying platform, the glue dispensing mechanism, the crystal filling mechanism and the crystal supplying mechanism, the automation and the accuracy of the oversized substrate crystal filling are realized, and the crystal filling efficiency of the oversized substrate is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of a super-large substrate crystal supplementing apparatus provided in an embodiment of the present application;

fig. 2 is a schematic perspective view of a crystal filling mechanism provided in an embodiment of the present application;

fig. 3 is a perspective view of a suction nozzle unit provided in an embodiment of the present application;

fig. 4 is a schematic perspective view of a dispensing mechanism provided in an embodiment of the present application;

fig. 5 is a schematic perspective view of a dispensing unit according to an embodiment of the present application;

FIG. 6 is a schematic perspective view of a crystal supply mechanism provided in an embodiment of the present application;

fig. 7 is a schematic perspective view of a conveying platform provided in an embodiment of the present application.

The figures are numbered:

1-extra-large substrate crystal supplementing equipment, 2-extra-large substrate, 3-fixing ring, Y-first direction and X-second direction;

10-conveying platform, 11-fourth driving component, 12-positioning component, 13-sixth linear module and 14-third base;

20-glue dispensing mechanism, 21-glue supplying unit, 22-glue dispensing unit, 23-third linear module, 24-third image collecting assembly, 25-second base, 221-glue dispensing head, 223-glue dispensing connecting base, 224-first photoelectric switch, 225-second photoelectric switch, 2221-fourth linear module, 2222-fifth linear module, 22211-first rotating motor, 22212-first eccentric wheel, 22213-first sliding table, 22221-second rotating motor, 22222-second eccentric wheel, 22223-second sliding table;

30-crystal filling mechanism, 31-suction nozzle unit, 32-first linear module, 33-first image acquisition component, 34-second image acquisition component, 35-second linear module, 36-first base, 311-suction nozzle component, 312-cross guide rail, 313-first driving component, 314-detection component, 315-suction nozzle connecting seat, 316-adapter, 317-first tension spring;

40-a crystal supply mechanism, 41-a storage unit, 42-a crystal supply unit, 43-a manipulator unit, 411-a material rack, 412-a fifth driving component, 421-a locking component, 422-a third driving component, 423-a rotating module, 424-an ejector pin component, 431-a manipulator and 432-a ninth linear module;

50-a machine table, 51-a dispensing station, 52-a crystal filling station and 53-a crystal supplying station;

60-control unit.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It should be noted that: when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly connected to the other element. When an element is referred to as being "connected" to another element, it can be directly or indirectly connected to the other element. When a component is referred to as being "electrically connected" to another component, it can be electrically connected by conductors, or can be electrically connected by radios, or can be connected by various other means capable of carrying electrical signals. The terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience of description only and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular orientation, and therefore are not to be construed as limiting the patent, the particular meaning of which terms will be understood by those skilled in the art as appropriate. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1, the extra-large substrate wafer repairing apparatus 1 provided in this embodiment includes a conveying platform 10, a dispensing mechanism 20, a wafer filling mechanism 30, and a wafer supplying mechanism 40, wherein the conveying platform 10 is used for conveying the extra-large substrate 2 to sequentially pass through a dispensing station 51 and a wafer filling station 52; the glue dispensing mechanism 20 is arranged at the glue dispensing station 51 and positioned at the top side of the conveying platform 10 and used for supplementing glue at the crystal lacking position of the oversized substrate 2; the crystal filling mechanism 30 is arranged at the crystal filling station 52 and is positioned at the top side of the conveying platform 10 and used for grabbing the wafer and filling the wafer on the crystal lacking position of the oversized substrate 2; the wafer supply mechanism 40 is disposed beside the wafer filling mechanism 30 for storing wafers and transporting chips to the wafer filling station 52. It is understood that the oversized substrate 2 refers to an oversized substrate; a wafer is a substrate on which a plurality of chips are adhered on one surface to manufacture a semiconductor transistor or an integrated circuit.

When the oversized substrate 2 is subjected to crystal supplement, the conveying platform 10 conveys the oversized substrate 2 to be subjected to crystal supplement to the glue dispensing station 51, the glue dispensing mechanism 20 dispenses the crystal lacking position of the oversized substrate 2, meanwhile, the crystal supplying mechanism 40 conveys the wafer to the crystal filling station 52 and separates out the chips on the wafer, then the conveying platform 10 conveys the crystal lacking position of the oversized substrate 2 subjected to glue dispensing to the crystal filling station 52, the crystal filling mechanism 30 grabs the chips separated from the wafer and fills the chips in the crystal lacking position of the oversized substrate 2 subjected to glue dispensing, and crystal supplement of the oversized substrate 2 is completed.

The utility model provides a brilliant equipment 1 is mended to super large base plate, conveying platform 10 has been adopted, point gum machine constructs 20, it constructs 30 and supplies brilliant mechanism 40 cooperation to fill out brilliant mechanism, transport super large base plate 2 through conveying platform 10, it glues to carry out the benefit to the crystalline substance position of lacking of super large base plate 2 through point gum machine constructs 20, it provides the wafer to filling out brilliant mechanism 30 through supplying brilliant mechanism 40, snatch the wafer and fill up the wafer on the crystalline substance position of lacking of super large base plate 2 through filling out brilliant mechanism 30, thereby independently accomplish the benefit brilliant operation of super large base plate, the technological blank that does not have the benefit brilliant equipment of special target to super large base plate on the existing market has been filled up, the brilliant automation and the accuracy of super large base plate benefit have been realized, the benefit brilliant efficiency of super large base plate has.

Optionally, referring to fig. 1, as a specific embodiment of the oversized substrate die attach apparatus provided in the present application, the oversized substrate die attach apparatus 1 further includes a machine table 50 and a control unit 60, wherein a dispensing station 51, a die filling station 52 and a die supplying station 53 are disposed on a top surface of the machine table 50, the dispensing station 51 and the die supplying station 53 are connected to two sides of the die filling station 52, the conveying platform 10, the dispensing mechanism 20, the die filling mechanism 30 and the die supplying mechanism 40 are disposed on the top surface of the machine table 50, the conveying platform 10 penetrates through the dispensing station 51 and the die filling station 52, and the die supplying mechanism 40 is disposed at the die supplying station 53, so that the conveying platform 10, the dispensing mechanism 20, the die filling mechanism 30 and the die supplying mechanism 40 are connected in series in a compact manner, which is beneficial to reducing a floor area of the oversized substrate die attach apparatus 1 and is convenient to place; the control unit 60 is arranged inside the machine table 50, the machine table 50 plays a role in supporting the conveying platform 10, the glue dispensing mechanism 20, the crystal filling mechanism 30, the crystal supplying mechanism 40 and protecting the control unit 60, the conveying platform 10, the glue dispensing mechanism 20, the crystal filling mechanism 30 and the crystal supplying mechanism 40 are respectively electrically connected with the control unit 60, and the control unit 60 can control the conveying platform 10, the glue dispensing mechanism 20, the crystal filling mechanism 30 and the crystal supplying mechanism 40 to operate according to a computer program preset by a technician, so that production automation is realized, and the production efficiency of crystal supplementing operation is improved. Of course, according to specific situations and requirements, in other embodiments of the present application, the control unit 60 may also be connected to the conveying platform 10, the dispensing mechanism 20, the crystal filling mechanism 30, and the crystal supply mechanism 40 through wires or a wireless communication protocol, independent of the oversized substrate crystal repairing apparatus 1, and is not limited herein.

Optionally, referring to fig. 1 and fig. 2, as a specific embodiment of the extra-large substrate wafer repairing apparatus provided in the present application, the wafer filling mechanism 30 includes a suction nozzle unit 31, a first linear module 32, a first image capturing assembly 33, a second image capturing assembly 34, and a second linear module 35, where the suction nozzle unit 31 is used for sucking and releasing a wafer; the first linear module 32 is in transmission connection with the nozzle unit 31 and is used for driving the nozzle unit 31 to reciprocate between the top side of the conveying platform 10 and the top side of the crystal supply mechanism 40; the first image acquisition assembly 33 is fixed on the top side of the wafer supply mechanism 40 and is used for identifying the position of the wafer; the second image acquisition assembly 34 is used for assisting the suction nozzle unit 31 in accurate crystal filling; the second linear module 35 is in transmission connection with the second image capturing assembly 34, and is configured to drive the second image capturing assembly 34 to move toward and away from the first image capturing assembly 33. Specifically, the first linear module 32 is a linear motor, the second linear module 35 is a ball screw type linear module, the first image capturing assembly 33 includes a camera, and the second image capturing assembly 34 includes a camera and a code scanner; the crystal filling mechanism 30 may further include a first base 36, the first linear module 32, the first image capturing assembly 33, and the second linear module 35 may be directly mounted on the top surface of the machine 50 or mounted on the top surface of the machine 50 through the first base 36, the first linear module 32 and the second linear module 35 are arranged in parallel, the suction nozzle unit 31 is fixed on a slider of the first linear module 32, the second image capturing assembly 34 is fixed on a slider of the second linear module 35, and under the driving of the first linear module 32 and the second linear module 35, the suction nozzle unit 31 and the second image capturing assembly 34 may stably and accurately move along the first direction Y; and the first image acquisition component 33 is arranged close to one end of the first linear module 32, which is positioned at the top side of the wafer supply mechanism 40, and can assist the suction nozzle unit 31 in accurately sucking the wafer, the second image acquisition component 34 can synchronously reciprocate between the area close to the first image acquisition component 33 and the top side of the conveying platform 10 with the suction nozzle unit 31, so that the suction nozzle unit 31 is assisted in accurately filling the wafer, and when the oversized substrate 2 is arranged above, the substrate information of the oversized substrate 2 can be automatically identified by code scanning through a code scanner, and is sent to the control unit 60 for being compared with the front-end equipment information, so that the substrate information is prevented from being not butted with the wafer filling information, and the accurate execution of the wafer filling task is ensured. Therefore, under the cooperation of the first image acquisition assembly 33 and the second image acquisition assembly 34, the operation process of the suction nozzle unit 31 is monitored in the whole process, and the first image acquisition assembly 33 can synchronously monitor the wafer separation operation of the wafer supply mechanism 40 during the operation of the suction nozzle unit 31, so that the effect of the first image acquisition assembly 33 is fully exerted, the wafer filling mechanism 30 and the wafer supply mechanism 40 share the first image acquisition assembly 33, the waste of resources is avoided, the occupied space of the wafer filling mechanism 30 and the wafer supply mechanism 40 is saved, and the overall structure of the oversized substrate wafer supplement device 1 is more compact. It is understood that, in the present application, the first direction Y is a direction perpendicular to the conveying direction and the vertical direction of the conveying platform 10; according to specific situations and requirements, in other embodiments of the present application, the first linear module 32 may also be a synchronous belt type linear module or a ball screw type linear module, and the second linear module 35 may also be a synchronous belt type linear module or a linear motor.

Optionally, referring to fig. 3, as a specific embodiment of the oversized substrate die-filling apparatus provided in the present application, the nozzle unit 31 includes a nozzle assembly 311, a cross-guide 312, a first driving assembly 313, and a detecting assembly 314, where the cross-guide 312 is fixed on the first linear module 32, the cross-guide 312 extends in a vertical direction, and the nozzle assembly 311 is slidably connected to the cross-guide 312; the first driving component 313 is arranged on the first linear module 32, and the first driving component 313 is in transmission connection with the suction nozzle component 311 and is used for driving the suction nozzle component 311 to slide along the cross guide 312; the sensing member 314 is fixed to the first linear module 32, and the sensing member 314 is located at a side of the suction nozzle assembly 311 for sensing the position of the suction nozzle assembly 311. Specifically, the suction nozzle unit 31 may further include a suction nozzle connection seat 315, an adaptor 316 and a first tension spring 317, wherein the cross guide 312, the first driving component 313 and the detecting component 314 may be directly mounted on the slider of the first linear module 32 or mounted on the slider of the first linear module 32 through the suction nozzle connection seat 315, the adaptor 316 is slidably connected on the cross guide 312, the suction nozzle component 311 is fixed on the adaptor 316, the first driving component 313 is preferably a voice coil motor, one end of the adaptor 316 is fixedly connected with an output shaft of the first driving component 313, the other end of the adaptor 316 extends into the detecting component 314, the detecting component 314 identifies the position of the suction nozzle component 311 by detecting the position of the adaptor 316, one end of the first tension spring is connected with the suction nozzle connection seat 315, and the other end of the first tension spring 317 is connected with the adaptor 316. In the process of crystal supplement, the first driving component 313 drives the suction nozzle component 311 to move up and down along the cross guide rail 312 through the adapter 316 under the control of the control unit 60, so that the suction nozzle component 311 fills the wafer on the wafer lacking position of the oversized substrate 2, the first tension spring 317 always provides reset tension for the suction nozzle component 311, the weights of the suction nozzle component 311 and the adapter 316 can be partially offset, and the first driving component 313 is favorable for driving the suction nozzle component 311 to move up and down. This ensures that the nozzle unit 31 precisely fills the wafer in the missing position of the oversized substrate 2.

Optionally, referring to fig. 1 and fig. 4, as an embodiment of the oversized substrate die-filling apparatus provided in the present application, the glue dispensing mechanism 20 includes a glue supply unit 21, a glue dispensing unit 22, and a third linear module 23, where the glue supply unit 21 is used for storing glue; the glue dispensing unit 22 is used for dipping glue and attaching the glue to the crystal lacking position of the oversized substrate 2; the third linear module 23 is in transmission connection with the glue supply unit 21 and the glue dispensing unit 22, and is used for driving the glue supply unit 21 and the glue dispensing unit 23 to move along the first direction Y. Specifically, the third linear module 23 is a linear motor, the glue dispensing mechanism 20 may further include a second base 25, the third linear module 23 may be directly mounted on the top surface of the machine table 50 or mounted on the top surface of the machine table 50 through the second base 25, and the glue supplying unit 21 and the glue dispensing unit 22 are fixed on a slider of the third linear module 23. When the conveying platform 10 conveys the oversized substrate 2 to the dispensing station 51, the third linear module 23 can drive the glue supply unit 21 and the dispensing unit 22 to move to the upper side of the crystal lacking position of the oversized substrate 2, and then the dispensing unit 22 sticks the glue from the glue supply unit 21 and accurately sticks the glue to the crystal lacking position of the oversized substrate 2, thereby completing glue filling of the oversized substrate 2. Thus, under the cooperation of the glue supply unit 21, the glue dispensing unit 22 and the third linear module 23, a glue dispensing mode of glue dipping is adopted, so that the glue supplementing precision is higher, and the consistency is better.

Optionally, referring to fig. 4 and fig. 5, as a specific embodiment of the extra-large substrate die-filling apparatus provided in the present application, the dispensing unit 22 includes a dispensing head 221 and a second driving assembly, wherein the second driving assembly is disposed on the third linear module 23 and is in transmission connection with the dispensing head 221, where the second driving assembly includes a fourth linear module 2221 and a fifth linear module 2222, the fourth linear module 2221 is configured to drive the dispensing head 221 to ascend and descend, and the fifth linear module 2222 is configured to drive the dispensing head 221 to move into and out of the glue supply unit 21; meanwhile, the dispensing mechanism 20 further includes a third image capturing assembly 24, the third image capturing assembly 24 is disposed on the third linear module 23, and the third image capturing assembly 24 is located on the top side of the dispensing head 221 for assisting the dispensing head 221 in dispensing precisely. In particular, the third image acquisition assembly 24 comprises a camera, which is always held on the top side of the dispensing head 221. When the dispensing head 221 is accurately moved above the coordinates of the wafer-lacking position of the oversized substrate 2 by the third linear module 23, the fifth linear module 2222 moves the dispensing head 221 into the wafer-supplying unit 21, then the fourth linear module 2221 drives the dispensing head 221 to descend by a first preset distance until the dispensing head 221 is stained with the glue, then the fourth linear module 2221 drives the dispensing head 221 to ascend to the original height, then the fifth linear module 2222 drives the dispensing head 221 to move out of the wafer-supplying unit 21 until the dispensing head 221 returns to the position above the coordinates of the wafer-lacking position of the oversized substrate 2, then the fourth linear module 2221 drives the dispensing head 221 to descend by a second preset distance until the dispensing head 221 stains the glue on the wafer-lacking position of the oversized substrate 2, and then the fourth linear module 2221 drives the dispensing head 221 to ascend to the original height again, thereby completing one glue-time of glue replenishment. Thereby ensuring that the dispensing head 221 can accurately complete the dispensing operation under the cooperation of the second driving assembly and the third image capturing assembly 24. It can be understood that the first preset distance and the second preset distance are the descending distance of the dispensing head 221 preset by a technician, the first preset distance ensures that the dispensing head 221 can extend into the glue layer to be stained with enough glue, the second preset distance ensures that the dispensing head 221 can approach the crystal-lacking position of the oversized substrate 2 and stick the glue on the surface of the crystal-lacking position of the oversized substrate 2, and the first preset distance is smaller than the second preset distance because the glue supply unit 21 is always kept above the oversized substrate 2.

Optionally, referring to fig. 5, as a specific embodiment of the oversized substrate crystal repairing apparatus provided in the present application, the fourth linear module 2221 includes a first rotating motor 22211, a first eccentric 22212 and a first sliding table 22213, and the fifth linear module 2222 includes a second rotating motor 22221, a second eccentric 22222 and a second sliding table 22223, wherein the first rotating motor 22211 is fixed on the third linear module 23, the first eccentric 22212 is sleeved on an output shaft of the first rotating motor 22211, and the first sliding table 22213 is slidably connected to one of the third linear module 23 and the second sliding table 22223; the second rotating motor 22221 is fixed on the third linear module 23, the second eccentric wheel 22222 is sleeved on the output shaft of the second rotating motor 22221, and the second sliding table 22223 is slidably connected to the other of the third linear module 23 and the first sliding table 22213; the dispensing head 221 is fixed to the bottom of the first sliding table 22213 or the bottom of the second sliding table 22223. Specifically, the dispensing unit 22 may further include a dispensing connection seat 223, the first rotating motor 22211, the second rotating motor 22221, the first sliding table 22213, or the second sliding table 22223 may be directly mounted on the slider of the third linear module 23 or mounted on the third linear module 23 through the dispensing connection seat 223, the fourth linear module 2221 further includes a first wear pad and a second tension spring (not shown), the fifth linear module 2222 further includes a second wear pad and a second tension spring (not shown), the first wear pad is fixed on the first sliding table 22213, the second wear pad is fixed on the second sliding table 22223, in order to avoid rigid contact and improve durability, the first sliding table 22213 abuts against the first eccentric 22212 through the first wear pad, the second sliding table 22223 abuts against the second eccentric 22222 through the second wear pad, when the second sliding table 22223 is slidably connected to the dispensing connection seat, the first sliding table 22213 is slidably connected to the second sliding table 22223, the first tension spring is connected between the first sliding table 22213 and the second sliding table 22223, the second tension spring is connected between the second sliding table 22223 and the dispensing connecting seat 223, when the first sliding table 22213 is slidably connected to the dispensing connecting seat 223 and the second sliding table 22223 is slidably connected to the first sliding table 22213, the first tension spring is connected between the first sliding table 22213 and the dispensing connecting seat 223, and the second tension spring is connected between the second sliding table 22223 and the first sliding table 22213, so that the first sliding table 22213 can reciprocate up and down in the vertical direction under the cooperation of the first eccentric 22212 and the first tension spring, and the second sliding table 22223 can reciprocate in the direction close to the dispensing unit 21 or in the direction far from the dispensing unit 21 under the cooperation of the second eccentric 22222 and the second tension spring, thereby ensuring that the dispensing head 221 can smoothly and accurately complete the dispensing and dispensing tasks. In addition, the dispensing unit 22 may further include a first photoelectric switch 224 and a second photoelectric switch 225, the first photoelectric switch 224 is disposed on a top side of the first eccentric 22212, and the second photoelectric switch 225 is disposed on a side of the second eccentric 22222 away from the second sliding table 22223, for detecting a rising position and a falling position of the dispensing head 221 by a position of the first eccentric 22212 and detecting a traverse position of the dispensing head 221 by a position of the second eccentric 22222. Of course, in other embodiments of the present application, the fourth linear module 2221 and the fifth linear module 2222 may also be a synchronous belt type linear module or a ball screw type linear module, respectively, according to specific situations and requirements, and are not limited herein.

Optionally, referring to fig. 1 and fig. 6, as an embodiment of the oversized substrate die-filling apparatus provided in the present application, the die-supplying mechanism 40 includes a storage unit 41, a die-supplying unit 42, and a robot unit 43, wherein the storage unit 41 is used for storing the fixing ring 3 with the wafer and transporting the fixing ring 3; the wafer supply unit 42 is arranged at the bottom side of the first image acquisition assembly 33 and is used for locking the fixing ring 3 and separating the chip from the wafer; the robot unit 43 is provided beside the magazine unit 41 and the crystal supply unit 42, and is configured to transport the fixing ring 3 back and forth between the magazine unit 41 and the crystal supply unit 42. Specifically, the material storage unit 41 includes a material rack 411 and a fifth driving assembly 412, the material rack 411 is detachably disposed on the top surface of the machine table 50, the material rack 411 has a plurality of horizontally disposed fixing rings 3, and the plurality of fixing rings 3 are disposed at intervals along the vertical direction, wherein each fixing ring 3 has a wafer thereon, and the fifth driving assembly 412 is in transmission connection with the material rack 411 and is used for driving the material rack 411 to ascend and descend along the vertical direction; the wafer supply unit 42 includes a locking assembly 421, a third driving assembly 422, a rotation module 423 and a needle assembly 424, the locking assembly 421 is used for locking the fixing ring 3, the needle assembly 424 is installed on the top surface of the machine table 50, and the top end of the needle assembly 424 extends into the locking assembly 421 for jacking up the wafers on the wafer one by one, the third driving assembly 422 is installed on the top surface of the machine table 50, and the third driving assembly 422 includes a seventh linear module and an eighth linear module, wherein the seventh linear module is in transmission connection with the locking assembly 421 for driving the locking assembly 421 to move along the first direction Y, the seventh linear module is installed on the slider of the eighth linear module, and the eighth linear module is used for driving the locking assembly 421 to move along the second direction X, so that the wafers on the wafer can be driven one by one under the cooperation of the seventh linear module and the eighth linear module, Precisely move above the ejector pin assembly 424, the rotating module 423 is in transmission connection with the locking assembly 421, and is used for driving the locking assembly 421 to rotate around the vertical axis thereof, so as to drive the fixing ring 3 to rotate to adjust the angle of the wafer, and the angle of the wafer to be ejected by the ejector pin assembly 424 meets the mounting requirement; the robot unit 43 includes a robot 431 and a ninth linear module 432, the robot 431 is used for grabbing the holding ring 3 on the rack 411 or the locking assembly 421, the ninth linear module 432 is installed on the top surface of the machine 50 and is in transmission connection with the robot 431 for driving the robot 431 to reciprocate between the rack 411 and the locking assembly 421, that is, during the wafer feeding process, the ninth linear module 432 drives the robot 431 to transport the holding ring 3 with the wafer to the locking assembly 421, after the wafer on the wafer is completely sucked by the nozzle unit 31, the ninth linear module 432 drives the robot 431 to transport the holding ring 3 with the emptied wafer back to the rack 411, the fifth driving module 412 drives the robot 411 to ascend until the holding ring 3 with the wafer fully loaded with the wafer is flush with the robot 431, and waits for the next grabbing by the robot 431, so that under the cooperation of the robot 431 and the ninth linear module 432, the wafer can be automatically replaced, and the wafer supply automation is favorably realized. It is understood that the second direction X is a direction parallel to the conveying direction of the conveying platform 10; the fifth driving assembly 412, the locking assembly 421, the seventh linear module, the eighth linear module, the manipulator 431 and the ninth linear module 432 are controlled by the control unit 60, and the seventh linear module, the eighth linear module and the ninth linear module 432 may be linear motors or ball screw type linear modules, etc.

Optionally, referring to fig. 1 and fig. 7, as a specific embodiment of the oversized substrate crystal supplementing apparatus provided in the present application, the conveying platform 10 includes a fourth driving assembly 11, a positioning assembly 12, and a sixth linear module 13, where the fourth driving assembly 11 is used to feed the oversized substrate 2 onto the conveying platform 10, and the positioning assembly 12 is used to position the oversized substrate 2 on the fourth driving assembly 11; the sixth linear module 13 is in transmission connection with the fourth driving component 11 and the positioning component 12, and is used for driving the fourth driving component 11 and the positioning component 12 to sequentially move to the glue dispensing station 51 and the crystal filling station 52. Specifically, the conveying platform 10 may further include a third base 14, the sixth linear module 13 may be directly mounted on the top surface of the machine 50 or mounted on the top surface of the machine 50 through the third base 14, the fourth driving module 11 and the positioning module 12 are fixed on a slider of the sixth linear module 13, the sixth linear module 13 may be a linear motor or a ball screw type linear module, and the like, the fourth driving module 11 includes two tenth linear modules, the tenth linear module is a synchronous belt type linear module, when the oversized substrate 2 is conveyed, the two tenth linear modules abut against the bottom surfaces of the opposite side edges of the oversized substrate 2, the positioning module 12 is located between the two tenth linear modules and is close to the inner end of the tenth linear module, when the oversized substrate 2 finishes covering the fourth driving module 11, the positioning module 12 blocks the oversized substrate 2, so that the oversized substrate 2 stays on the two tenth linear modules, after the wafer repairing process is started, the sixth linear module 13 drives the fourth driving assembly 11 and the positioning assembly 12 to transport the oversized substrate 2 to the dispensing station 51 and the wafer filling station 52. Thereby ensuring that the oversized substrate 2 smoothly and accurately enters the dispensing station 51 and the crystal filling station 52.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. The utility model provides a super large base plate mends brilliant equipment which characterized in that includes:

the device comprises a machine table, wherein the top surface of the machine table is provided with a glue dispensing station, a crystal filling station and a crystal supplying station, and the glue dispensing station and the crystal supplying station are connected to two sides of the crystal filling station;

the conveying platform is arranged on the top surface of the machine table, penetrates through the dispensing station and the crystal filling station and is used for conveying the oversized substrate;

the glue dispensing mechanism is arranged at the glue dispensing station and used for supplementing glue at the crystal lacking position of the oversized substrate;

the crystal filling mechanism is arranged at the crystal filling station and used for grabbing the wafer and filling the wafer in the crystal lacking position of the oversized substrate; and

and the crystal supply mechanism is arranged at the crystal supply station and used for storing the wafer and conveying the chip to the crystal filling station.

2. The extra large substrate wafer replenishing device of claim 1, wherein the wafer filling mechanism comprises:

a suction nozzle unit for sucking and discharging the wafer;

the first linear module is in transmission connection with the suction nozzle unit and is used for driving the suction nozzle unit to reciprocate between the top side of the conveying platform and the top side of the crystal supply mechanism;

the first image acquisition assembly is fixed on the top side of the wafer supply mechanism and used for identifying the position of the wafer;

the second image acquisition assembly is used for assisting the suction nozzle unit to accurately fill crystals; and

and the second linear module is in transmission connection with the second image acquisition assembly and is used for driving the second image acquisition assembly to move towards the direction close to and far away from the first image acquisition assembly.

3. The extra large substrate wafer replenishing apparatus of claim 2, wherein the suction nozzle unit comprises:

a suction nozzle assembly;

the cross guide rail is fixed on the first linear module and extends along the vertical direction, and the suction nozzle assembly is connected to the cross guide rail in a sliding manner;

the first driving assembly is arranged on the first linear module, is in transmission connection with the suction nozzle assembly and is used for driving the suction nozzle assembly to slide along the cross guide rail; and

and the detection assembly is fixed on the first straight line module, is positioned beside the suction nozzle assembly and is used for detecting the position of the suction nozzle assembly.

4. The extra large substrate wafer replenishing device of claim 2, wherein the glue dispensing mechanism comprises:

the glue supply unit is used for storing glue;

the glue dispensing unit is used for dipping the glue and dipping the glue on the crystal lacking position of the oversized substrate; and

and the third linear module is in transmission connection with the glue supply unit and the glue dispensing unit and used for driving the glue supply unit and the glue dispensing unit to move along the first direction.

5. The extra large substrate wafer repairing apparatus according to claim 4, wherein said dispensing unit comprises:

dispensing a glue head; and

the second driving assembly is arranged on the third linear module and is in transmission connection with the dispensing head, and the second driving assembly comprises a fourth linear module and a fifth linear module, wherein the fourth linear module is used for driving the dispensing head to ascend and descend, and the fifth linear module is used for driving the dispensing head to move in and out of the glue supply unit.

6. The extra large substrate wafer replenishing equipment of claim 5, wherein the glue dispensing mechanism further comprises:

and the third image acquisition assembly is arranged on the third linear module, is positioned on the top side of the dispensing head and is used for assisting the dispensing head in accurately dispensing.

7. The extra large substrate wafer repair apparatus of claim 5, wherein the fourth linear module comprises:

the first rotating motor is fixed on the third linear module;

the first eccentric wheel is sleeved on an output shaft of the first rotating motor; and

the first sliding table is connected to one of the third linear module and the second sliding table in a sliding manner;

the fifth linear module includes:

the second rotating motor is fixed on the third linear module;

the second eccentric wheel is sleeved on an output shaft of the second rotating motor; and

the second sliding table is connected to one of the third linear module and the first sliding table in a sliding mode;

the dispensing head is fixed to the bottom of the first sliding table or the bottom of the second sliding table.

8. The extra large substrate wafer replenishing apparatus of claim 2, wherein said wafer supply mechanism comprises:

the storage unit is used for storing the fixing ring with the wafer and conveying the fixing ring;

the wafer supply unit is arranged at the bottom side of the first image acquisition assembly and used for locking the fixing ring and separating the wafer from the wafer; and

the manipulator unit is located the storage unit with supply the side of brilliant unit, be used for with gu fixed ring is in the storage unit with supply reciprocal the transporting between the brilliant unit.

9. The extra large substrate wafer replenishing device of claim 8, wherein the wafer supply unit comprises:

the locking assembly is used for locking the fixing ring;

the third driving assembly is in transmission connection with the locking assembly and is used for driving the locking assembly to move along the first direction and the second direction;

the rotating module is in transmission connection with the locking assembly and is used for driving the locking assembly to rotate; and

and the top end of the ejector pin component extends into the locking component and is used for jacking the chips on the wafer one by one.

10. The apparatus of any of claims 2 to 9, wherein the transfer platform comprises:

the fourth driving assembly is used for feeding the oversized substrate onto the conveying platform;

the positioning assembly is used for positioning the oversized substrate on the fourth driving assembly; and

and the sixth linear module is in transmission connection with the fourth driving assembly and is used for driving the fourth driving assembly to sequentially move to the dispensing station and the crystal filling station.

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