CN212113638U

CN212113638U - Die bonder

Info

Publication number: CN212113638U
Application number: CN202020809411.6U
Authority: CN
Inventors: 蒋仟; 单佳伟; 黎理明; 黎理杰
Original assignee: Shenzhen Yuanmingjie Technology Co ltd
Current assignee: Shenzhen Yuanmingjie Technology Co ltd
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2020-12-08
Anticipated expiration: 2030-05-14

Abstract

The utility model discloses a die bonder, wherein the die bonder comprises a frame and a plurality of chip bonding mechanisms; the plurality of patch mechanisms are arranged on the rack in parallel at intervals; each chip mounting mechanism comprises a wafer disc, a thimble and a thimble; the wafer disc is movably connected to the rack and used for bonding wafers; the ejector pin is movably connected to the rack, is positioned above the wafer disc and is arranged at an interval with the wafer disc; the positioning piece is arranged on the rack and positioned on one side of the thimble opposite to the wafer disc, the positioning piece is provided with a chip mounting position, and the positioning piece is used for placing a chip mounting base material; when the wafer disc moves to the position above the chip mounting position of the positioning piece, the positioning piece is placed with the chip mounting base material, and the ejector pin drives the wafer of the wafer disc to descend, so that the wafer is abutted to the chip mounting base material. The utility model discloses technical scheme improves production efficiency.

Description

Die bonder

Technical Field

The utility model relates to a solid brilliant equipment technical field, in particular to solid brilliant equipment.

Background

At present, the die bonder is a single die bonder for positioning and bonding wafers, so that the production efficiency is low and the production capacity requirement is not met.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a solid brilliant equipment aims at improving production efficiency.

In order to achieve the above object, the utility model provides a solid brilliant equipment, solid brilliant equipment includes:

a frame; and

the patch attaching mechanisms are arranged on the rack in parallel at intervals;

each said patch mechanism comprising:

the wafer disc is movably connected to the rack and used for bonding wafers;

the ejector pin is movably connected to the rack, is positioned above the wafer disc and is arranged at an interval with the wafer disc; and

the positioning piece is arranged on the rack and positioned on one side of the thimble opposite to the wafer disc, the positioning piece is provided with a chip mounting position, and the positioning piece is used for placing a chip mounting base material;

when the wafer disc moves to the position above the chip mounting position of the positioning piece, the positioning piece is placed with the chip mounting base material, and the ejector pin drives the wafer of the wafer disc to descend, so that the wafer is abutted to the chip mounting base material.

In one embodiment, the patch mechanism further comprises a first driving assembly, a horizontal plate and a vertical plate; the horizontal plate is connected with the rack in a sliding mode, the vertical plate is connected with one side, back to the rack, of the horizontal plate in a sliding mode, and the wafer disc is detachably connected to one side, back to the horizontal plate, of the vertical plate.

In one embodiment, the first drive assembly comprises:

the first motor is arranged on the rack;

the first screw rod is connected with an output shaft of the first motor; the horizontal plate is connected with the first screw rod in a sliding manner;

the second motor is arranged on the horizontal plate; and

the second screw rod is connected with an output shaft of the second motor; the vertical plate is connected with the second screw rod in a sliding manner;

the first motor drives the first screw rod to drive the horizontal plate to move on the rack, and the second motor drives the second screw rod to drive the vertical plate to move on the horizontal plate.

In one embodiment, the positioning part is a positioning cylinder, the positioning cylinder is provided with an inner cavity and a through hole communicated with the inner cavity, the extending direction of the through hole is consistent with the extending direction of the thimble, and the through hole penetrates through the positioning cylinder; and one end of the through hole close to the wafer disc is provided with a transparent sheet which is arranged opposite to the position of the patch, and the transparent sheet is used for being abutted against the thimble.

In an embodiment, the die bonder further comprises an anti-collision mechanism connected with the periphery of the ejector pin, the horizontal plate and the vertical plate are provided with through holes, the anti-collision mechanism and the edges of the through holes are arranged at intervals, and the anti-collision mechanism is used for being in contact with the hole walls of the through holes in advance.

In one embodiment, the patch mechanism further comprises a plurality of second drive assemblies, each of the second drive assemblies comprising:

the third motor is arranged on the rack and penetrates through the horizontal plate; and

one end of the ball screw is connected with an output shaft of the third motor, the ball screw penetrates through the vertical plate, and a telescopic rod of the ball screw is connected with the ejector pin.

In an embodiment, the die bonder further includes a plurality of first sensors, each of the first sensors is disposed on one of the third motors and spaced apart from the ejector pin and the positioning element of each of the chip mounting mechanisms, and the first sensors are configured to detect a relative position between the die pad and the ejector pin.

In an embodiment, the die bonder further includes a plurality of second sensors disposed on the frame, each of the second sensors is disposed at an interval with the ejector pin and the wafer plate of each of the mounting mechanisms, and each of the second sensors is disposed opposite to the wafer plate; the second sensor is used for detecting whether wafers exist at the position of the wafer disc, which is just opposite to the paster.

In an embodiment, the die bonding apparatus further includes a plurality of third sensors disposed on the frame, and each of the third sensors is disposed opposite to one of the die bonding positions and is configured to detect whether a wafer is located at the die bonding position.

In an embodiment, the die bonder further includes a plurality of fourth sensors disposed on the rack, and each of the fourth sensors is configured to detect whether the die bonder is bonded to a die bonder substrate when the fourth sensor is disposed opposite to the die bonder substrate.

The technical proposal of the utility model is that a plurality of paster mechanisms are arranged on the frame side by side at intervals; the crystal disc and the ejector pins of each chip mounting mechanism are movably connected to the rack, and the ejector pins are positioned above the crystal disc and are arranged at intervals; the positioning piece is arranged on the rack and is positioned below the thimble, and the positioning piece is provided with a patch position; so, the brilliant disc removes to when the setting element the paster position top, the thimble drives the wafer decline of brilliant disc with be located the paster position paster substrate butt saves the step that the material device of inhaling of current solid brilliant equipment absorbs the wafer, overturns the wafer and fixes a position the laminating position, has improved wafer laminating efficiency, and has improved the laminating precision.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a viewing angle of an embodiment of the die bonding apparatus of the present invention;

fig. 2 is a schematic structural diagram of another view angle of one embodiment of the die bonding apparatus of the present invention;

fig. 3 is a left side view of the die bonder of the present invention.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a solid brilliant equipment.

In the embodiment of the present invention, referring to fig. 1 to 3, the die bonder includes a frame and a plurality of die attaching mechanisms 10, wherein the plurality of die attaching mechanisms 10 are arranged in the frame in parallel at intervals; each chip mounting mechanism 10 comprises a wafer disc 11, a thimble 12 and a positioning piece 13; the wafer disc 11 is movably connected to the rack, and the wafer disc 11 is used for bonding wafers; the ejector pins 12 are movably connected to the frame, and the ejector pins 12 are located above the wafer disc 11 and spaced from the wafer disc 11; the positioning element 13 is arranged on the rack and is positioned on one side of the thimble 12, which faces away from the wafer disc 11, the positioning element 13 is provided with a chip mounting position 13a, and the positioning element 13 is used for placing a chip mounting substrate; when the wafer disc 11 moves to the position above the chip mounting position 13a of the positioning part 13, the ejector pin 12 drives the wafer of the wafer disc 11 to descend, so that the wafer is abutted to the chip mounting base material.

In this embodiment, the wafer disks 11 of the plurality of die attaching mechanisms 10 are moved to the designated positions at the same time, and when it is determined that the wafer disks 11 are located at the designated positions, the ejector pins 12 corresponding to the wafer disks 11 are controlled to eject a plurality of wafers to be ejected out of the wafer disks 11 at the same time, and the wafers are attached to the die attaching base material at the same time, so that an attached product is obtained. After the positions of the chip base material and the wafer disc 11 are determined, the wafer disc 11 is controlled to move to the designated position, and the mode that the ejector pins 12 directly eject the wafers in the wafer disc 11 to the chip base material is adopted, so that the steps of sucking the wafers by a material sucking device of the existing die bonding equipment, turning the wafers and positioning the bonding position are omitted, the wafer bonding efficiency is improved, and the bonding precision is improved.

The die bonding equipment of the embodiment further comprises a sucker corresponding to the ejector pin 12, when the position of the wafer to be ejected is determined, the wafer attaching device also determines the size of the wafer to be ejected, it can be understood that the wafer has multiple specifications, each specification has different sizes, in practical application, common wafer specifications have sizes of 6 inches, 8 inches, 12 inches and the like, because the size of the wafer is determined according to the practical production requirements, the wafer needing 6 inches in the month is one of the raw materials, the wafer needing 8 inches in the next month is one of the raw materials, namely, in the practical production, the wafer replacement condition exists, in order to ensure that the production equipment is not affected, the die bonding equipment provided by the embodiment is suitable for the wafers of various specifications, in the design process, the device is modularized and has good universality, the wafer in the range of 0.2 x 0.2-2 mm is produced without replacing equipment components, and equipment cost is saved.

The technical proposal of the utility model is that a plurality of paster mechanisms 10 are arranged on the frame side by side at intervals; the wafer disc 11 and the ejector pins 12 of each chip mounting mechanism 10 are movably connected to the frame, and the ejector pins 12 are located above the wafer disc 11 and are arranged at intervals; the positioning element 13 is arranged on the frame and positioned below the thimble 12, and the positioning element 13 is provided with a patch position 13 a; so, wafer disc 11 moves to setting element 13 when paster position 13a top, thimble 12 drives wafer 11 descends and is located paster position 13a paster substrate butt saves the step that the material device of inhaling of current solid brilliant equipment absorbs the wafer, overturns the wafer and the location laminating position, has improved wafer laminating efficiency, and has improved the laminating precision.

In one embodiment, referring to fig. 1-3, the patch mechanism further includes a first drive assembly 14, a horizontal plate 15, and a vertical plate 16; the horizontal plate 15 is slidably connected to the rack, the vertical plate 16 is slidably connected to a side of the horizontal plate 15 facing away from the rack, and the wafer plate 11 is detachably connected to a side of the vertical plate 16 facing away from the horizontal plate 15.

The first driving assembly 14 includes a first motor, a first lead screw 141, a second motor and a second lead screw 142; the first motor is arranged on the frame; the first screw rod 141 is connected with an output shaft of the first motor, and the horizontal plate 15 is slidably connected with the first screw rod 141; the second motor is arranged on the horizontal plate 15, and the second screw rod is connected with an output shaft of the second motor; the vertical plate 16 is connected with the second screw rod 142 in a sliding manner; the first motor drives the first screw rod 141 to drive the horizontal plate 15 to move on the rack, and the second motor drives the second screw rod 142 to drive the vertical plate 16 to move on the horizontal plate 15.

Specifically, the first screw rod 141 is slidably connected with a first slider, and the first slider is connected with the horizontal plate 15; the second motor is arranged on the horizontal plate 15; the second screw rod 141 is connected with an output shaft of the second motor; a second sliding block is connected to the second screw rod 142 in a sliding manner and is connected with the vertical plate 16; the first motor drives the horizontal plate 15 to move on the rack, and the second motor drives the vertical plate 16 to move on the horizontal plate 15. When the distance that the wafer disc 11 needs to move is detected, the first motor is controlled to rotate to drive the first screw rod 141 to rotate, and further the first sliding block is driven to move along the first screw rod 141, so that the horizontal plate 15 is also driven to move, and the adjustment of the wafer disc 11 in the horizontal direction is completed; the second motor is controlled to rotate to drive the second screw rod 142 to rotate, so as to drive the second sliding block to move along the second screw rod 142, thereby also driving the vertical plate 16 to move, completing the adjustment of the wafer 11 in the vertical direction, and enabling the wafer 11 to be just opposite to the patch substrate on the positioning part 13. As can be appreciated, the first lead screw 141 extends along the horizontal direction of the horizontal plate 15, and the second lead screw 142 extends along the vertical direction of the horizontal plate 15, wherein the horizontal direction and the vertical direction form an included angle of 90 degrees. The first driving assembly 10 further comprises a horizontal sliding rail and a vertical sliding rail, and the horizontal sliding rail is arranged on the rack; the horizontal plate 15 is provided with a horizontal sliding block which is connected with the horizontal sliding rail in a sliding manner; the vertical slide rail is arranged on one surface of the horizontal plate 15, which is back to the horizontal slide rail; the vertical plate 16 is provided with a vertical slider slidably connected to the vertical slide rail. When the first motor drives the horizontal plate 15 to move and the second motor drives the vertical plate 16 to move, the horizontal sliding block of the horizontal plate 15 can slide relative to the horizontal sliding rail arranged on the rack, so that the horizontal plate 15 can move smoothly; and the vertical sliding block of the vertical plate 16 can slide relative to the vertical sliding rail arranged on the horizontal plate 15, so that the vertical plate can move more smoothly. When it can be understood that, the horizontal slide rail extends along the horizontal direction of the horizontal plate 15, and is consistent with the extending direction of the first lead screw 141; the vertical slide rail extends along the vertical direction of the horizontal plate 15, and is consistent with the extending direction of the second screw rod 142.

In an embodiment, referring to fig. 1 to 3, the die attaching mechanism 10 further includes a bracket 17 disposed on the vertical plate 16 and facing away from the horizontal plate 15, the bracket 17 is provided with a mounting position 17a, and the die plate 11 is detachably mounted at the mounting position 17 a. In this way, wafer disks 11 with different sizes can be installed through the installation positions 17a, so that the chip mounting range of the die bonder is enlarged.

In an embodiment, referring to fig. 1 to 3, the positioning member 13 is a positioning cylinder, the positioning cylinder is provided with an inner cavity 13b and a through hole 13c communicating with the inner cavity 13b, an extending direction of the through hole 13c is the same as an extending direction of the thimble 12, and the through hole 13c penetrates through the positioning cylinder 13; one end of the through hole 13c close to the wafer disc 11 is provided with a transparent sheet opposite to the patch position 13a, and the transparent sheet is used for abutting against the thimble 12.

In the present embodiment, by providing the positioning member 13 in the shape of a positioning cylinder, the patch substrate is easily driven on the surface of the positioning cylinder. An inner cavity 13b and a perforation 13c are provided in the positioning cylinder, and the extending direction of the positioning cylinder coincides with the extending direction of the vertical plate 16, that is, coincides with the horizontal direction.

The hole depth direction of the through hole 13c and the extending direction of the positioning cylinder form an included angle of 90 degrees, so that the thimble 12 is driven by a nut of the ball screw to lift, one end of the thimble 12 is driven to descend and abut against the transparent sheet of the through hole 13c, the transparent sheet is arranged opposite to the surface mounting position 13a, so that the transparent sheet can support the surface mounting base material transmitted to the position, at the moment, the thimble 12 can eject one of the wafers on the wafer disc 11, and the wafers can be attached to the surface mounting base material. The transparent sheet not only plays a role of supporting the substrate of the patch, but also enables a user to easily see whether the wafer is positioned on the wafer disc.

In an embodiment, referring to fig. 1 to 3, the die bonder further includes an anti-collision mechanism connected to the periphery of the thimble 12, the horizontal plate 15 and the vertical plate 16 are both provided with a through hole 10a, the anti-collision mechanism is located between the thimble 12 and a hole wall of the through hole 10a, and the anti-collision mechanism is used for being in contact with the hole wall of the through hole 10a in advance. In this embodiment, an anti-collision mechanism is provided to connect with the thimble, and the anti-collision mechanism is provided at the periphery of the thimble to prevent the horizontal plate 15, the vertical plate 16 and the thimble 12 from colliding during the relative movement, so as to reduce the damage of the thimble 12 by the pre-contact of the anti-collision mechanism with the hole wall of the through hole 10 a.

The die bonder further comprises a second driving assembly for driving the ejector pin 12 to move, the second driving assembly comprises a third motor and a ball screw, and the third motor is arranged on the rack and penetrates through the horizontal plate; one section of the ball screw is connected with an output shaft of the third motor and penetrates through the vertical plate, and a telescopic rod of the ball screw is connected with the ejector pin. The third motor can drive the ball screw to rotate, and then the telescopic rod of the ball screw is used for driving the thimble 12 to lift, so that the thimble 12 lifts and pushes out the wafer on the wafer disc 11, and the wafer can be abutted and attached to the surface mount substrate of the positioning part 13.

In an embodiment, referring to fig. 1 to 3, the die bonder further includes a plurality of first sensors 50, each of the first sensors 50 is disposed on a third motor, and the thimble 12 and the positioning element 13 of each of the die bonding mechanisms are disposed at an interval; when the second driving assembly moves to a designated position, the first sensor 50 is arranged opposite to the patch position 13 a; the first sensor 50 is used for detecting the relative position of the wafer disc 11 and the thimble 12.

In this embodiment, the third motor is provided with a mounting bracket, and the first sensor 50 is arranged on the mounting bracket, is positioned at one side of the third motor, and is spaced from the thimble 12; a detection light source is arranged on the opposite side of the third motor and is symmetrically arranged with the first sensor 50, and the detection light source is utilized to provide a better detection environment for the first sensor 50 so as to improve the detection precision of the first sensor 50; when the first sensor 50 detects the relative position between the wafer disc 11 and the positioning member 13, if it is determined that the wafer disc 11 is opposite to the mounting position 13a of the positioning member 13, the main controller controls the other components to move, so as to accelerate the alignment between the wafer of the wafer disc 11 and the mounting position 13a of the positioning member 13.

In an embodiment, referring to fig. 1 to 3, the die bonder further includes a plurality of second sensors 60 disposed on the rack, each of the second sensors 60 is disposed at an interval with the ejector pins 12 and the wafer plate 11 of each of the sheet attaching mechanisms 10, and the second sensors 60 are disposed opposite to the wafer plate 11; the second sensor 60 is used for detecting whether the wafer disc 11 faces the mounting position 13a or not.

In the present embodiment, the second sensor 60 is disposed on the frame and spaced apart from the ejector pins 12 and the wafer plate 11. Alternatively, the positioning member 13 is a positioning cylinder, and an inner cavity 13b and a through hole 13c communicating with the inner cavity 13b are arranged in the positioning cylinder 13, and the second sensor 60 is fixed in the inner cavity 13b through the through hole 13 c; when the first driving assembly 14 drives the wafer disk 11 to move to a position opposite to the preset position of the patch substrate on the positioning member 13, the main controller of the die bonder controls the second sensor 60 to detect the position of the wafer disk 11 facing the patch position 13a of the positioning member 13, and if one wafer of the wafer disk 11 is opposite to the patch position 13a of the positioning member 13, the main controller controls the second driving assembly to drive the thimble 12 to descend so as to eject the wafer on the wafer disk 11. If no wafer on the wafer disk 11 is opposite to the position 13a of the positioning member 13, the main controller continues to control the first driving assembly to drive the wafer disk 11 to adjust the position.

In an embodiment, referring to fig. 1 to 3, the die bonder further includes a transmission mechanism disposed on the frame, and the transmission mechanism is configured to drive the die bonding substrate to the die bonding position 13a of the positioning element 13. In this embodiment, a transmission mechanism is arranged on the rack, optionally, the transmission mechanism is a transmission motor and a transmission gear, the transmission motor is arranged on the rack, an output shaft of the transmission motor is connected with the transmission gear, the chip substrate is coiled on the transmission gear, and then the transmission gear is driven to rotate by the transmission motor, so that the chip substrate is transmitted on the positioning part 13 along with the transmission gear, and the chip mounting efficiency of the die bonder is improved.

In an embodiment, referring to fig. 1 to 3, the die bonding apparatus further includes a plurality of third sensors 70 disposed on the frame, and each of the third sensors 70 is disposed opposite to one of the die bonding positions 13a, and is configured to detect whether a wafer is located at the die bonding position 13 a.

In the present embodiment, the third sensor 70 is located at one side of the positioning member 13, and the detecting element of the third sensor 70 is opposite to the patch position 13a of the positioning member 13; when the third sensor 70 detects that the wafer is not on the surface mount substrate at the surface mount position 13a, the third sensor 70 sends an electrical signal to the main controller, and the main controller controls the second driving assembly to drive the ejector pin 12 to descend according to the electrical signal, so that the wafer on the wafer disc 11 is driven to eject by the ejector pin 12.

In an embodiment, referring to fig. 1 to 3, the die bonder further includes a plurality of fourth sensors 80 disposed on the frame, and each of the fourth sensors 80 is configured to detect whether the die bonder is bonded to a die bonder substrate when the fourth sensor 80 is disposed opposite to the die bonder substrate.

In the present embodiment, by providing the fourth sensor 80 on the frame, the fourth sensor 80 is disposed opposite to the patch substrate; after the wafer is pasted to the paster substrate to being driven by drive mechanism and removing the back, fourth sensor 80 detects the paster substrate, when fourth sensor 80 did not detect the wafer in the paster preset position of paster substrate, the master controller can control drive mechanism reverse motion, returns the paster substrate to 13 paster positions of setting element and carries out the paster, thereby improves solid brilliant equipment's paster exactness.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A die bonder is characterized by comprising:

a frame; and

each said patch mechanism comprising:

the wafer disc is movably connected to the rack and used for bonding wafers;

when the wafer disc moves to the upper part of the surface mounting position, the ejector pin drives the wafer of the wafer disc to descend, so that the wafer is abutted to the surface mounting base material.

2. The die bonding apparatus according to claim 1, wherein the die bonding mechanism further comprises a first driving assembly, a horizontal plate and a vertical plate; the horizontal plate is connected with the rack in a sliding mode, the vertical plate is connected with one side, back to the rack, of the horizontal plate in a sliding mode, and the wafer disc is detachably connected to one side, back to the horizontal plate, of the vertical plate.

3. The die bonding apparatus according to claim 2, wherein the first driving assembly comprises:

the first motor is arranged on the rack;

the first screw rod is connected with an output shaft of the first motor, and the horizontal plate is connected with the first screw rod in a sliding manner;

the second motor is arranged on the horizontal plate; and

4. The die bonding apparatus according to claim 3, wherein the positioning member is a positioning cylinder, the positioning cylinder is provided with an inner cavity and a through hole communicated with the inner cavity, an extending direction of the through hole is consistent with an extending direction of the thimble, and the through hole penetrates through the positioning cylinder; and one end of the through hole close to the wafer disc is provided with a transparent sheet which is arranged opposite to the position of the patch, and the transparent sheet is used for being abutted against the thimble.

5. The die bonding equipment as claimed in claim 2, further comprising an anti-collision mechanism connected with the periphery of the ejector pin, wherein the horizontal plate and the vertical plate are provided with through holes, the anti-collision mechanism is arranged at intervals with the edges of the through holes, and the anti-collision mechanism is used for being in contact with the hole walls of the through holes in advance.

6. The die bonding apparatus of claim 5, wherein the die bonding mechanism further comprises a plurality of second driving assemblies, each of the second driving assemblies comprising:

7. The die bonding apparatus according to claim 6, further comprising a plurality of first sensors, each of the first sensors being disposed on one of the third motors and spaced apart from the ejector pins and the positioning members of each of the sheet mounting mechanisms, the first sensors being configured to detect relative positions of the wafer disks and the ejector pins.

8. The die bonding apparatus according to any one of claims 1 to 4, further comprising a plurality of second sensors disposed on the frame, each of the second sensors being disposed opposite to one of the wafer disks; the second sensor is used for detecting whether wafers exist at the position of the wafer disc, which is just opposite to the paster.

9. The die bonding apparatus according to any one of claims 1 to 4, further comprising a plurality of third sensors disposed on the frame, wherein each third sensor is disposed opposite to one of the die bonding positions and is configured to detect whether a wafer is located at the die bonding position.

10. The die bonding apparatus according to any one of claims 1 to 4, further comprising a plurality of fourth sensors disposed on the frame, wherein each of the fourth sensors is configured to detect whether or not a die bonding of a die bonding substrate is completed when the fourth sensor is disposed opposite to a die bonding substrate.