CN211979525U - Bus type temperature control module - Google Patents
Bus type temperature control module Download PDFInfo
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- CN211979525U CN211979525U CN201922416381.2U CN201922416381U CN211979525U CN 211979525 U CN211979525 U CN 211979525U CN 201922416381 U CN201922416381 U CN 201922416381U CN 211979525 U CN211979525 U CN 211979525U
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- upper cover
- temperature control
- control module
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Abstract
The utility model discloses a bus type temperature control module, which comprises a base and an upper cover, wherein the upper cover of the base is provided with the upper cover, a first circuit board is arranged in the base, a second circuit board is arranged on the first circuit board, two ends of the top of the second circuit board are both provided with I/O connecting terminals, one side of two ends of the upper cover is provided with a notch, the I/O connecting terminals pass through the notch, an I/O channel indicating lamp is arranged at the middle position of one side of the top of the upper cover, a system indicating lamp is arranged at the other side of the top of the upper cover, a communication bus interface and a power input interface are arranged on the first circuit board, and the communication bus interfaces are provided with two groups; the utility model discloses design communication bus interface, power input interface, IO binding post for high integrated single module, compact structure, the stable performance adopts the binding post of exempting from the screw type, and the wiring is simple reliable, reduces the work load of field installation, practices thrift installation time.
Description
Technical Field
The utility model relates to an electrical equipment technical field especially relates to a bus type temperature control module.
Background
The temperature control module is a series of automatic control elements which generate on-off actions according to the physical deformation inside the temperature control module according to the temperature change of the working environment, or the temperature is transmitted to the temperature controller through the temperature protector, and the temperature controller sends out a switching command, so that the operation of the equipment is controlled to achieve the ideal temperature and energy-saving effect, the application range of the temperature control module is very wide, and the temperature control module is applied to various products such as household appliances, motors, refrigeration or heating and the like according to different types of temperature controllers;
in the prior art, the temperature control module has the following problems and disadvantages: the supported communication bus types are few, only the MODBUS bus communication can be supported, and the current mainstream communication buses such as EtherCAT, PROFINET, CC-LINK, PROFIBUS-DP, Devicenet and the like can not be supported, so the application range is relatively limited; the communication real-time is poor because communication bus adopts Modbus, because communication bus self characteristics lead to the real-time of system response lower, consequently, the utility model provides a bus type temperature control module is in order to solve the problem that exists among the prior art.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model aims to provide a total line formula temperature control module, this total line formula temperature control module adopt the integral type structure, simple structure, reliable and stable, and the multibus communication, communication speed is high, and is compatible strong, and application scope is wider.
For realizing the purpose of the utility model, the utility model discloses a following technical scheme realizes: the utility model provides a bus formula temperature control module, includes base and upper cover, the base upper cover is equipped with the upper cover, the inside of base is equipped with first circuit board, and is equipped with the second circuit board on the first circuit board, the both ends at second circuit board top all are equipped with IO binding post, one side at upper cover both ends all is equipped with the notch, IO binding post passes the notch, the intermediate position department of upper cover top one side is equipped with IO passageway pilot lamp, and the opposite side at upper cover top is equipped with system indicator, be equipped with communication bus interface and power input interface on the first circuit board, and communication bus interface is equipped with two sets ofly.
The further improvement lies in that: the bottom of the I/O channel indicator light is connected with a first light guide column, the lower end of the first light guide column is electrically connected with the second circuit board, and the I/O channel indicator light is used for indicating a wiring passage of the I/O wiring terminal.
The further improvement lies in that: the bottom of the system indicator light is provided with a second light guide column, and the lower end of the second light guide column is electrically connected with the first circuit board.
The further improvement lies in that: the bottom of the I/O wiring terminal is connected with a pin, and the lower end of the pin is electrically connected with the first circuit board.
The further improvement lies in that: one side at upper cover top is equipped with first socket and second socket, first socket is equipped with two sets ofly, communication bus interface extends first socket, power input interface extends the second socket.
The further improvement lies in that: the base is characterized in that clamping grooves are formed in the middle positions of two sides of the bottom of the base, a first clamping spring and a second clamping spring are clamped in the clamping grooves respectively, and heat dissipation holes are formed in the side wall of the base.
The further improvement lies in that: the base is internally provided with a bus communication and a control circuit, the bus communication is an ASIC bus communication chip, the control circuit is an MCU circuit, the ASIC bus communication chip is used for analyzing data information issued by the master station PLC and processing bottom IO data sent by the MCU circuit, and the MCU circuit is mainly used for processing the data information analyzed by the ASIC bus communication chip and processing the data of a bottom IO port.
The utility model has the advantages that: the utility model designs the communication bus interface, the power input interface and the I/O wiring terminal into a single module with high integration, the structure is compact, the performance is stable, the cost performance is high, the wiring terminal adopting a screw-free type is adopted, the wiring is simple and reliable, the workload of field installation is reduced, the installation time is saved, the structure is simple, the parts of the product are fewer, the workload of product production and assembly is small, the production and processing are relatively easy, the production efficiency is high, the hardware cost and the production cost are relatively lower, the product pricing has great advantages, and the product competitiveness is stronger; meanwhile, the communication bus interface adopts a standard communication bus, can support various field buses and industrial Ethernet, realizes multi-bus communication, is more compatible with most controllers on the market, and has the advantages of high communication speed, low control delay, wider application range and wider scenes; in addition, the bus communication and control circuit part adopts a special ASIC bus communication chip + MCU scheme to effectively combine bus communication with temperature control, a PID algorithm with high efficiency, stability, high response speed and high control precision is realized through internal program design, a user only needs to fill some simple control parameters to realize temperature control, and the communication bus supports mainstream communication buses in the market, is convenient to use and is widely applicable.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a schematic diagram of the present invention;
fig. 3 is a schematic top view of the present invention;
fig. 4 is a schematic side view of the present invention;
fig. 5 is a bottom schematic view of the present invention;
fig. 6 is an electrical block diagram of the present invention;
fig. 7 is a schematic diagram illustrating the definition of the communication bus interface according to the present invention;
fig. 8 is a schematic diagram illustrating the definition of the power input interface according to the present invention;
FIG. 9 is a schematic diagram illustrating the definition of the I/O channel indicator light of the present invention;
fig. 10 is a schematic diagram illustrating the definition of the I/O connection terminal according to the present invention.
Wherein: 1. a base; 2. an upper cover; 3. a first circuit board; 4. a second circuit board; 5. an I/O terminal; 6. an I/O channel indicator light; 7. a system indicator light; 8. a communication bus interface; 9. a power input interface; 10. a first light guide pillar; 11. a second light guide pillar; 12. a stitch; 13. a first socket; 14. a second socket; 15. a first clamp spring; 16. a second clamp spring; 17. And (4) heat dissipation holes.
Detailed Description
In order to deepen the understanding of the present invention, the following embodiments will be combined to make the present invention do further details, and the present embodiment is only used for explaining the present invention, and does not constitute the limitation of the protection scope of the present invention.
According to fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 show, this embodiment provides a total line formula temperature control module, including base 1 and upper cover 2, base 1 upper cover is equipped with upper cover 2, base 1's inside is equipped with first circuit board 3, and is equipped with second circuit board 4 on the first circuit board 3, the both ends at second circuit board 4 top all are equipped with IO binding post 5, one side at upper cover 2 both ends all is equipped with the notch, IO binding post 5 passes the notch, the intermediate position department of upper cover 2 top one side is equipped with IO passageway pilot lamp 6, and the opposite side at upper cover 2 top is equipped with system indicator lamp 7, be equipped with communication bus interface 8 and power input interface 9 on the first circuit board 3, and communication bus interface 8 is equipped with two sets ofly.
The bottom of the I/O channel indicator lamp 6 is connected with a first light guide column 10, the lower end of the first light guide column 10 is electrically connected with the second circuit board 4, and the I/O channel indicator lamp 6 is used for indicating a wiring passage of the I/O wiring terminal 5.
The bottom of the system indicator light 7 is provided with a second light guide column 11, and the lower end of the second light guide column 11 is electrically connected with the first circuit board 3.
The bottom of the I/O wiring terminal 5 is connected with a pin 12, and the lower end of the pin 12 is electrically connected with the first circuit board 3.
One side at the top of upper cover 2 is equipped with first socket 13 and second socket 14, first socket 13 is equipped with two sets ofly, communication bus interface 8 extends first socket 13, power input interface 9 extends second socket 14.
The middle positions of two sides of the bottom of the base 1 are provided with clamping grooves, a first clamping spring 15 and a second clamping spring 16 are clamped in the clamping grooves respectively, and heat dissipation holes 17 are formed in the side wall of the base 1.
The base 1 is inside to be equipped with bus communication and control circuit, the bus communication is ASIC bus communication chip, control circuit is the MCU circuit, ASIC bus communication chip is used for resolving the data message that master station PLC issued and handles the bottom IO data that the MCU circuit sent, the MCU circuit is mainly used for handling the data message after ASIC bus communication chip resolved and handle the data of bottom IO port. And an advanced PID algorithm is adopted, so that the response speed is high, the control precision is high, and overshoot is avoided.
The system indicator light 7 is defined as follows:
| abbreviations | Explaining the meaning | Colour(s) |
| PWR | Power indicator lamp, which is lighted up when power system is normal | Green colour |
| RUN | An operation indicator light which is lighted when the system is in normal operation | Green colour |
| ERR | A system fault indicator lamp which is lighted when the system is in fault | Red colour |
Adopt standard communication bus, can support multiple field bus and industrial ethernet, can be convenient realize accessible with PLC or industrial computer and be connected, communication bus interface mode can be divided into two kinds, one is in ethernet interface mode, module internal design has 2 RJ45 hundred mega ethernet interfaces, and inside port switching function that realizes need not to increase in addition, can easily realize a plurality of slave station cascades, another kind of mode is serial ports communication, adopt binding post direct connection, easy operation is convenient.
The bus type temperature control module has the advantages that the communication bus interface 8, the power input interface 9 and the I/O wiring terminal 5 are designed into a single highly integrated module, the structure is compact, the performance is stable, the cost performance is ultrahigh, the screw-free wiring terminal is adopted, the wiring is simple and reliable, the workload of field installation is reduced, the installation time is saved, the structure is integrated, the structure is simple, and the number of parts of a product is less, so the workload of product production and assembly is small, the production and processing are relatively easy, the production efficiency is high, the hardware cost and the production cost are relatively low, the product pricing is greatly superior, and the product competitiveness is stronger; meanwhile, the communication bus interface 8 adopts a standard communication bus, can support various field buses and industrial Ethernet, is in multi-bus communication, is more compatible with most controllers on the market, and has high communication speed, low control delay, wider application range and wider scenes; in addition, the bus communication and control circuit part adopts a special ASIC bus communication chip + MCU scheme to effectively combine bus communication with temperature control, a PID algorithm with high efficiency, stability, high response speed and high control precision is realized through internal program design, a user only needs to fill some simple control parameters to realize temperature control, and the communication bus supports mainstream communication buses in the market, is convenient to use and is widely applicable.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a bus formula temperature control module, includes base (1) and upper cover (2), its characterized in that: the utility model discloses a communication terminal, including base (1), upper cover, first circuit board (3), second circuit board (4) on first circuit board (3), the both ends at second circuit board (4) top all are equipped with IO binding post (5), one side at upper cover (2) both ends all is equipped with the notch, IO binding post (5) pass the notch, the intermediate position department of upper cover (2) top one side is equipped with IO passageway pilot lamp (6), and the opposite side at upper cover (2) top is equipped with system indicator (7), be equipped with communication bus interface (8) and power input interface (9) on first circuit board (3), and communication bus interface (8) are equipped with two sets ofly.
2. The bus-based temperature control module of claim 1, wherein: the bottom of IO passageway pilot lamp (6) is connected with first leaded light post (10), and the lower extreme of first leaded light post (10) with second circuit board (4) electric connection, IO passageway pilot lamp (6) are used for instructing the wiring passageway of IO binding post (5).
3. The bus-based temperature control module of claim 1, wherein: the bottom of the system indicator light (7) is provided with a second light guide column (11), and the lower end of the second light guide column (11) is electrically connected with the first circuit board (3).
4. The bus-based temperature control module of claim 1, wherein: the bottom of the I/O wiring terminal (5) is connected with a pin (12), and the lower end of the pin (12) is electrically connected with the first circuit board (3).
5. The bus-based temperature control module of claim 1, wherein: one side at upper cover (2) top is equipped with first socket (13) and second socket (14), first socket (13) are equipped with two sets ofly, first socket (13) are extended in communication bus interface (8), power input interface (9) extend second socket (14).
6. The bus-based temperature control module of claim 1, wherein: the middle positions of two sides of the bottom of the base (1) are provided with clamping grooves, a first clamping spring (15) and a second clamping spring (16) are clamped in the clamping grooves respectively, and heat dissipation holes (17) are formed in the side wall of the base (1).
7. The bus-based temperature control module of claim 1, wherein: the base (1) is internally provided with a bus communication and a control circuit, the bus communication is an ASIC bus communication chip, the control circuit is an MCU circuit, the ASIC bus communication chip is used for analyzing data information issued by a master station PLC and processing bottom IO data sent by the MCU circuit, and the MCU circuit is mainly used for processing the data information analyzed by the ASIC bus communication chip and processing the data of a bottom IO port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922416381.2U CN211979525U (en) | 2019-12-29 | 2019-12-29 | Bus type temperature control module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922416381.2U CN211979525U (en) | 2019-12-29 | 2019-12-29 | Bus type temperature control module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211979525U true CN211979525U (en) | 2020-11-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922416381.2U Active CN211979525U (en) | 2019-12-29 | 2019-12-29 | Bus type temperature control module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211979525U (en) |
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2019
- 2019-12-29 CN CN201922416381.2U patent/CN211979525U/en active Active
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