CN211959695U - Multilayer circuit board laminating device - Google Patents

Multilayer circuit board laminating device Download PDF

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Publication number
CN211959695U
CN211959695U CN202021030061.XU CN202021030061U CN211959695U CN 211959695 U CN211959695 U CN 211959695U CN 202021030061 U CN202021030061 U CN 202021030061U CN 211959695 U CN211959695 U CN 211959695U
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China
Prior art keywords
circuit board
plate
fixed
mounting
groove
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CN202021030061.XU
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Chinese (zh)
Inventor
黄木林
付五林
黄旋
赵炳�
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Longyan Xingyao Multilayer Circuit Co Ltd
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Longyan Xingyao Multilayer Circuit Co Ltd
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Priority to CN202021030061.XU priority Critical patent/CN211959695U/en
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Abstract

The utility model discloses a multilayer circuit board laminating device, which comprises a workbench, wherein supports are fixed on two sides of the top of the workbench, a plurality of mounting plates are slidably connected to the side surfaces of the supports, a circuit board is placed on the top of the mounting plates, an upper laminating component is placed on the top of the circuit board, a fixed plate is slidably connected to the top of the workbench, a lower laminating component located right below the circuit board is placed on the top of the fixed plate, a pressing column which can move up and down is arranged above the supports, a plurality of knife boards which surround and form a square shape are vertically arranged at the bottom of the pressing column, and a pressing plate located on the inner side of the knife boards is installed; the pressing plate is positioned right above the upper laminated assembly; the outer side surface of the knife board is aligned with the end surface of the mounting board. The device can be used for stacking and cutting the circuit board, and the stacking efficiency is high.

Description

Multilayer circuit board laminating device
Technical Field
The utility model relates to a circuit device field especially relates to a multilayer circuit board stromatolite device.
Background
When the circuit board carries out multilayer closed assembly, will adopt glue or other viscidity material to be in the same place every layer of hot stamping, such mounting means, have several problems, need the position of every layer of mould fixed like this, when too many layers (including the closed assembly of circuit board generally are five above), too many layers of closed assembly, can be that fashioned stromatolite is difficult to deviate from the mould, secondly whether use the mould, will deviate from fashioned closed assembly circuit board at last, just need pass through the process of cutting, the process is more, process time is long.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a multilayer circuit board laminating device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a multilayer circuit board laminating device comprises a workbench, wherein supports are fixed on two sides of the top of the workbench, a plurality of mounting plates are connected to the side faces of the supports in a sliding mode, a circuit board is placed on the top of the mounting plates, an upper laminating assembly is placed on the top of the circuit board, a fixing plate is connected to the top of the workbench in a sliding mode, a lower laminating assembly located right below the circuit board is placed on the top of the fixing plate, a pressing column moving up and down is arranged above the supports, a plurality of cutter boards which are enclosed to form a square shape are vertically arranged at the bottom of the pressing column, and a pressing plate located on the inner side of the cutter boards is installed at the bottom of the pressing column; the pressing plate is positioned right above the upper laminated assembly; the outer side surface of the knife board is aligned with the end surface of the mounting board.
Preferably, a sliding groove is formed in the support, and a limiting plate which is connected with the sliding groove in a sliding manner is arranged on one side of the mounting plate; the support is internally provided with a limiting groove communicated with the sliding groove, the bottom of the limiting groove is fixedly provided with a plurality of first springs, and the top ends of the first springs are connected to the bottom of the mounting plate.
Preferably, the support is provided with a slide way communicated with the limiting groove, and the mounting plate is connected in the slide way in a sliding manner.
Preferably, the top of workstation is equipped with the mounting groove, the mounting groove bottom is fixed with a plurality of second springs, the fixed plate is fixed the top of second spring.
Preferably, a square annular limiting block is fixed at the top of the workbench, and the inner side surface of the limiting block is flush with the groove wall of the mounting groove; the fixed plate is connected with the limiting block in a sliding mode.
Preferably, a plurality of third springs are fixed at the bottom of the pressing column, the bottom ends of the third springs are connected with the pressing plate, and the pressing plate is connected with the cutting board in a sliding manner.
The utility model has the advantages that: in the utility model, firstly, the circuit board is stacked and cut on a workbench, and the edges are directly cut after stacking, thereby reducing the working procedures and improving the processing efficiency; and secondly, the original mold is stacked layer by layer to be divided into three parts, namely the circuit board, the upper stacked component and the lower stacked component, and then stacking is carried out, so that the dependence on the mold can be eliminated, and the problem of difficult demolding existing in the stacked state of the circuit board is eliminated. The device can be used for stacking and cutting the circuit board, and the stacking efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of a lamination device according to the present invention;
FIG. 2 is a top view of a mounting structure for a circuit board;
fig. 3 is a top view of the internal structure of the holder.
Reference numbers in the figures: the automatic pressing device comprises a support, a mounting plate, a first spring, a circuit board, a laminated assembly, a workbench, a fixing plate, a laminated assembly, a sliding groove, a limiting groove, a sliding rail, a limiting plate, a mounting groove, a second spring, a limiting block, a pressing column, a knife plate, a third spring, a pressing plate and a cylinder, wherein the support is 1, the mounting plate is 2, the first spring is 3, the circuit board is 4, the laminated assembly is 5, the workbench is 6, the fixing plate is 7, the laminated assembly is.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a multilayer circuit board laminating device comprises a workbench 6, wherein two sides of the top of the workbench 6 are fixed with a support 1, the side surface of the support 1 is connected with a plurality of mounting plates 2 in a sliding manner, a circuit board 4 is placed at the top of the mounting plates 2, an upper laminated assembly 5 is placed at the top of the circuit board 4, the top of the workbench 6 is connected with a fixing plate 7 in a sliding manner, a lower laminated assembly 8 positioned right below the circuit board 4 is placed at the top of the fixing plate 7, a pressing column 16 moving up and down is arranged above the support 1, a plurality of knife boards 17 which are enclosed into a square shape are vertically arranged at the bottom of the pressing column 16, and a pressing plate 19 positioned at the inner side of; the pressing plate 19 is positioned right above the upper laminated assembly 5; the outer side of the knife plate 17 is aligned with the end face of the mounting plate 2.
A sliding chute 9 is arranged in the support 1, and a limiting plate 12 which is in sliding connection with the sliding chute 9 is arranged on one side of the mounting plate 2; be equipped with the spacing groove 10 with spout 9 intercommunication in the support 1, the tank bottom of spacing groove 10 is fixed with a plurality of first springs 3, and the bottom at mounting panel 2 is connected on the top of first spring 3.
The support 1 is provided with a slideway 11 communicated with the limiting groove 10, and the mounting plate 2 is connected in the slideway 11 in a sliding way.
The top of workstation 6 is equipped with mounting groove 13, and mounting groove 13 bottom is fixed with a plurality of second springs 14, and fixed plate 7 is fixed at the top of second spring 14.
A square annular limiting block 15 is fixed at the top of the workbench 6, and the inner side surface of the limiting block 15 is flush with the wall of the mounting groove 13; the fixed plate 7 is connected with the limiting block 15 in a sliding way.
A plurality of third springs 18 are fixed at the bottom of the pressing column 16, the bottom ends of the third springs 18 are connected with a pressing plate 19, and the pressing plate 19 is connected with the knife plate 17 in a sliding manner.
The working principle is as follows: the original lamination is divided into three parts, the number of layers to be bonded can be shortened, die sticking is avoided, on the basis, the lower lamination assembly 8 is placed on the fixing plate 7, the circuit board 4 is placed on the mounting plate 2, the upper lamination assembly 5 is placed on the circuit board 4, the pressing column 16 is pressed downwards, the mounting plate 2 and the fixing plate 7 move downwards to different degrees, the cutter plate 17 cuts edges of the lamination, and cutting is completed; on the basis, pressure melt adhesive layers are arranged at the bottom of the upper laminated assembly 5 and the top of the lower laminated assembly 8, and the three parts can be connected together to complete lamination due to the pressure effect when the pressing column 16 presses downwards; the device can realize simultaneous lamination and edge cutting; it should be noted that the shape of the cut stack is determined by the shape of the knife plate 17, and the stack is automatically released by the second spring 14 after the cutting and stacking are completed.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A multilayer wiring board laminating apparatus is characterized by comprising a worktable (6), the two sides of the top of the workbench (6) are fixed with a support (1), the side surface of the support (1) is connected with a plurality of mounting plates (2) in a sliding way, a circuit board (4) is arranged on the top of the mounting plate (2), an upper laminated assembly (5) is arranged on the top of the circuit board (4), the top of the workbench (6) is connected with a fixed plate (7) in a sliding way, a lower laminated assembly (8) positioned under the circuit board (4) is placed at the top of the fixed plate (7), a pressing column (16) moving up and down is arranged above the support (1), a plurality of square knife boards (17) are vertically arranged at the bottom of the pressing column (16), a pressing plate (19) positioned on the inner side of the knife plate (17) is arranged at the bottom of the pressing column (16); the pressing plate (19) is positioned right above the upper laminated assembly (5); the outer side surface of the knife plate (17) is aligned with the end surface of the mounting plate (2).
2. The multilayer circuit board laminating device according to claim 1, wherein a sliding groove (9) is formed in the support (1), and a limiting plate (12) slidably connected with the sliding groove (9) is arranged on one side of the mounting plate (2); be equipped with in support (1) with spacing groove (10) of spout (9) intercommunication, the tank bottom of spacing groove (10) is fixed with a plurality of first springs (3), the top of first spring (3) is connected the bottom of mounting panel (2).
3. A multilayer circuit board stacking apparatus according to claim 2, wherein the support (1) is provided with a slide (11) communicating with the limiting groove (10), and the mounting plate (2) is slidably connected in the slide (11).
4. A multilayer circuit board stacking apparatus according to claim 1, wherein the top of the working table (6) is provided with a mounting groove (13), a plurality of second springs (14) are fixed at the bottom of the mounting groove (13), and the fixing plate (7) is fixed at the top of the second springs (14).
5. The multilayer circuit board laminating device as claimed in claim 4, wherein a square ring-shaped limiting block (15) is fixed on the top of the workbench (6), and the inner side surface of the limiting block (15) is flush with the groove wall of the mounting groove (13); the fixed plate (7) is connected with the limiting block (15) in a sliding mode.
6. A multilayer circuit board stacking apparatus according to claim 1, wherein a plurality of third springs (18) are fixed at the bottom of the pressing column (16), the bottom ends of the third springs (18) are connected to the pressing plate (19), and the pressing plate (19) is slidably connected to the knife plate (17).
CN202021030061.XU 2020-06-08 2020-06-08 Multilayer circuit board laminating device Active CN211959695U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021030061.XU CN211959695U (en) 2020-06-08 2020-06-08 Multilayer circuit board laminating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021030061.XU CN211959695U (en) 2020-06-08 2020-06-08 Multilayer circuit board laminating device

Publications (1)

Publication Number Publication Date
CN211959695U true CN211959695U (en) 2020-11-17

Family

ID=73172310

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021030061.XU Active CN211959695U (en) 2020-06-08 2020-06-08 Multilayer circuit board laminating device

Country Status (1)

Country Link
CN (1) CN211959695U (en)

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