CN211931144U - Electronic component heat dissipation device capable of quickly exchanging heat and cooling - Google Patents

Abstract

The utility model provides a heat-dissipating device for rapid heat exchange and cooling of electronic components, which relates to the technical field of heat-dissipation of electronic components. The upper and lower sides of the heat-conducting fins are movably provided with expansion joints, so that when a driving motor is turned on, a push rod pushes The thermal conduction fins move inward, and the thermal conduction fins are connected by expansion joints, so that the thermal conduction fins shrink back and forth to generate negative pressure air. The speed is exported to the heat exchange cavity and discharged through the external vents, which improves the flow rate of heat with high heat flux density, promotes the use of chip heat dissipation, and solves the problem of using heat sinks and fans to dissipate heat from electronic devices, but this heat dissipation method can The removed heat flux density is relatively low, and the heat dissipation speed is slow, which is suitable for the use of low-power electronic components, but cannot meet the problem of the heat dissipation needs of electronic components with high heat flux density.

Description

A rapid heat exchange and cooling electronic component cooling device

technical field

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation device for electronic components for rapid heat exchange and cooling.

Background technique

With the development of electronic technology, electronic information devices continue to develop in the direction of high precision, reliability and miniaturization. The package volume of some chips is getting smaller and smaller, and their power is getting bigger and bigger. The heat flux density of some chips has exceeded 200W/cm2, in the traditional heat dissipation technology, radiators and fans are often used to dissipate heat from electronic devices, but this heat dissipation method can remove the heat flux density is relatively low, the heat dissipation speed is slow, suitable for the use of low-power electronic components, can not meet the There is a need for heat dissipation of electronic components with high heat flux density, so further innovations need to be made on this basis to provide a heat dissipation device for rapid heat exchange and cooling of electronic components.

Utility model content

The utility model aims to solve the problem of using a radiator and a fan to dissipate heat from electronic devices, but the heat flux density that can be removed by this heat dissipation method is relatively low and the heat dissipation speed is slow. The technical problem of heat dissipation of electronic components is provided, and a heat dissipation device of electronic components for rapid heat exchange and cooling is provided.

In order to achieve the above purpose, the present invention provides the following technical solutions: a heat-dissipating device for rapid heat exchange and cooling for electronic components, comprising a heat-dissipating device, an external vent and a dust-proof screen, and the middle part above the front of the heat-dissipating device is provided throughout. There are external air vents, and the outer sides of the external vents are fixedly connected with dust-proof screens;

The heat dissipation device includes a heat dissipation cavity, a heat conduction assembly, a driving motor, a push rod, a heat conduction fin, a fixing rod, a heat exchange cavity, a mounting support rod and a heat exchange fin, and the heat dissipation cavity is embedded and arranged under the interior of the heat dissipation device. The heat conduction assembly is arranged above the heat dissipation cavity, the drive motors are fixedly connected to the left and right sides of the heat conduction assembly, the push rods are all movably connected to the middle of the inner side of the drive motor, and the heat conduction fins are all movably connected to the inside of the push rods , the fixing rod is fixedly connected in the middle of the heat-conducting component, the heat-exchanging cavity is arranged above the heat-conducting component, the mounting support rods are all fixedly connected in the heat-exchanging cavity, and the heat-exchanging fins are all movably connected to the mounting support on the rod.

Preferably: expansion joints are movably provided on both the upper and lower sides of the heat-conducting fins.

Preferably, support plates are fixed on both sides of the fixing rod, and the middle part of the upper and lower sides of the support plate is provided with a movable hole, and the movable hole is movably connected with the expansion joint.

Preferably, an installation groove is fixedly arranged on the front of the installation support rod, and the heat exchange fins are movably placed in the installation groove.

Preferably: the heat exchange fins are made of graphite material.

Preferably: the external vents are all arranged through the heat exchange cavity.

Preferably: the dust-proof screens are all matched with the length, width, and diameter of the external air vents.

Beneficial effects:

(1) The device is provided with heat-conducting fins, telescopic joints, drive motors, push rods, heat-dissipating chambers and heat-exchanging chambers, and expansion joints are movably provided on the upper and lower sides of the heat-conducting fins, so that when the drive motor is turned on, the The push rod pushes the heat-conducting fins to move inward, and the heat-conducting fins are connected by expansion joints, so that the heat-conducting fins shrink back and forth to generate negative pressure air. The heat exchange speed is accelerated to be exported to the heat exchange cavity and discharged through the external vent, which improves the flow speed of the heat with high heat flux density and promotes the use of heat dissipation of the chip.

(2) Supporting plates are fixed on both sides of the fixing rod, so that the supporting plates can be used together with the fixing rod to stabilize the heat conduction fins to shrink back and forth, so as to avoid the disconnection between the heat conduction fins, and the setting of the movable holes facilitates the movement of the expansion joints. In and out of the support board.

(3) The heat exchange fins are made of graphite material, so that the heat exchanged in the heat exchange cavity can be further dissipated and cooled, and the heat dissipation rate can be promoted.

Description of drawings

Fig. 1 is a partial frontal structural schematic diagram of the present invention.

FIG. 2 is a schematic diagram of the internal cross-sectional structure of the heat dissipation device of the present invention.

FIG. 3 is a schematic diagram of the internal cross-sectional structure of the heat dissipation device of the present invention.

In Fig. 1-3: heat sink 1, heat dissipation cavity 101, heat conduction assembly 102, drive motor 103, push rod 104, heat conduction fin 105, fixing rod 106, heat exchange cavity 107, installation support rod 108, heat exchange fin 109, External vents 2, dust-proof screens 3.

Detailed ways

Referring to FIGS. 1 to 3 , in an embodiment of the present invention, a heat dissipation device for rapid heat exchange and cooling of electronic components includes a heat dissipation device 1 , an external vent 2 and a dust-proof screen 3 . The middle part above the front of the heat dissipation device 1 External ventilation openings 2 are provided throughout, and dustproof screens 3 are fixedly connected to the outside of the external ventilation openings 2;

The heat dissipation device 1 includes a heat dissipation cavity 101, a heat conduction component 102, a drive motor 103, a push rod 104, a heat conduction fin 105, a fixing rod 106, a heat exchange cavity 107, a mounting support rod 108 and a heat exchange fin 109. The heat dissipation cavity 101 is embedded in the Below the interior of the heat dissipation device 1, the heat conducting component 102 is arranged through the heat dissipation cavity 101, the driving motor 103 is fixedly connected to the left and right sides of the interior of the heat conducting component 102, the push rod 104 is movably connected to the middle of the inner side of the drive motor 103, and the heat conducting fins 105 They are all movably connected to the inside of the push rod 104, the fixing rod 106 is fixedly connected to the middle of the heat-conducting component 102, the heat-exchange cavity 107 is arranged above the heat-conducting component 102, and the mounting support rods 108 are all fixedly connected to the heat-exchange cavity 107. 109 are movably connected to the mounting struts 108 .

In this embodiment, preferably, the upper and lower sides of the thermally conductive fins 105 are movably provided with expansion joints, and the upper and lower sides of the thermally conductive fins 105 are movably provided with expansion joints, so that when the driving motor 103 is turned on, the push rod 104 pushes the thermally conductive fins The fins 105 move inward, and the thermally conductive fins 105 are connected by the expansion joints, so that the thermally conductive fins 105 shrink back and forth to generate negative pressure air. The heat exchange speed is accelerated and exported to the heat exchange cavity 107, and discharged through the external vent 2, which improves the flow speed of the heat with high heat flux density, promotes the use of chip heat dissipation, and solves the problem of using a radiator and a fan to dissipate heat from electronic devices. The heat flow density that can be removed by this heat dissipation method is relatively low, and the heat dissipation speed is slow, which is suitable for the use of low-power electronic components, but cannot meet the problem of the heat dissipation needs of electronic components with high heat flow density.

Preferably in this embodiment, support plates are fixed on both sides of the fixing rod 106 , and the middle of the upper and lower sides of the support plate is provided with a movable hole, and the movable hole is movably connected with the expansion joint, and the two sides of the fixing rod 106 are fixedly installed. There is a support plate, so that the support plate can cooperate with the fixing rod 106 to stabilize the thermal conduction fins 105 to shrink back and forth, so as to avoid disconnection between the thermal conduction fins 105, and the movable holes are arranged to facilitate the movement of the expansion joints into and out of the support plate.

Preferably in this embodiment, a mounting groove is fixed on the front of the mounting support rod 108, and the heat exchange fins 109 are movably placed in the mounting groove. When it fails or is damaged, it can be quickly removed from the mounting slot to replace it with a new one, which promotes the effect of heat dissipation.

In this embodiment, preferably, the heat exchange fins 109 are made of graphite material, and the heat exchange fins 109 are made of graphite material, so that the heat exchanged in the heat exchange cavity 107 can be further dissipated and cooled, and the heat dissipation can be promoted. rate.

In this embodiment, preferably, the external vents 2 are arranged through the heat exchange cavity 107, and the external ventilation openings 2 are arranged through the heat exchange cavity 107, so that the exchanged heat can be quickly exported to the outside, and the heat exported from the cavity can be avoided. gather.

Preferably, in this embodiment, the dust-proof partitions 3 are matched with the length, width, and diameter of the external ventilation openings 2, and the dust-proof partitions 3 are set to match the length, width, and diameter of the external ventilation openings 2, so as to prevent the external Dust enters into the heat sink 1 to avoid affecting the use of the internal components of the heat sink 1 .

Working principle: First, install the heat dissipation device 1 on the electronic chip components with high heat flux density. During the operation of the chip, the driving motor 103 is turned on, and the push rod 104 pushes the thermal conduction fins 105 to move inward, and the thermal conduction fins 105 are connected by the expansion joints. The thermal conduction fins 105 are made to shrink back and forth to generate negative pressure air. When the thermal conduction fins 105 export the heat of high heat flux generated by the chip components from the heat dissipation cavity 101, the heat exchange speed can be accelerated and the heat can be exported to the heat exchange cavity 107 through the external vents. 2 is discharged, which improves the flow rate of heat with high heat flux density, and promotes the use of heat dissipation of the chip. At the same time, support plates are fixed on both sides of the fixing rod 106, so that the support plate cooperates with the fixing rod 106 to stabilize the heat conduction fin 105 back and forth. The shrinkage is used to avoid disconnection between the thermally conductive fins 105. Finally, the heat exchange fins 109 are made of graphite material, so that the heat exchanged in the heat exchange cavity 107 can be further dissipated and cooled, and the heat dissipation rate can be promoted.

Claims (7)

1. The utility model provides an electronic components heat abstractor of rapid heat transfer cooling, includes heat abstractor (1), outside vent (2) and dust screen (3), its characterized in that: an external vent (2) penetrates through the middle part above the front surface of the heat dissipation device (1), and dustproof separation nets (3) are fixedly connected to the outer sides of the external vent (2);

the heat dissipation device (1) comprises a heat dissipation cavity (101), a heat conduction assembly (102), a driving motor (103), a pushing rod (104), heat conduction fins (105), a fixing rod (106), a heat exchange cavity (107), an installation supporting rod (108) and heat exchange fins (109), wherein the heat dissipation cavity (101) is embedded in the lower portion of the inner portion of the heat dissipation device (1), the heat conduction assembly (102) is arranged above the heat dissipation cavity (101) in a penetrating mode, the driving motor (103) is fixedly connected to the left side and the right side of the inner portion of the heat conduction assembly (102), the pushing rod (104) is movably connected to the middle portion of the inner side of the driving motor (103), the heat conduction fins (105) are movably connected to the inner side of the pushing rod (104), the fixing rod (106) is fixedly connected to the middle of the inner portion of the heat conduction assembly (102), the heat exchange cavity (107) is arranged above the heat conduction assembly (102) in a penetrating mode, and the, the heat exchange plates (109) are movably connected to the mounting support rods (108).

2. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: telescopic joints are movably arranged on the upper side and the lower side of the heat conduction fins (105).

3. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: support plates are fixedly arranged on two sides of the fixing rod (106), movable holes penetrate through the middle parts of the upper and lower sides of the support plates, and the movable holes are movably connected with the telescopic joints.

4. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: the front of the mounting support rod (108) is fixedly provided with a mounting groove, and the heat exchange fins (109) are movably arranged in the mounting groove.

5. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: the heat exchange plates (109) are made of graphite materials.

6. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: the external ventilation openings (2) are all arranged in a penetrating mode with the heat exchange cavity (107).

7. The electronic component heat dissipation device capable of rapidly exchanging heat and reducing temperature according to claim 1, wherein: the dustproof separation net (3) is matched with the length, width, size and size of the external ventilation opening (2).

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