CN211909285U

CN211909285U - Printed circuit board heat dissipation device

Info

Publication number: CN211909285U
Application number: CN202020740368.2U
Authority: CN
Inventors: 郑冰伟
Original assignee: Guangzhou Lufo Trading Co ltd
Current assignee: Guangzhou Lufo Trading Co ltd
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-11-10
Anticipated expiration: 2030-05-07

Abstract

The utility model discloses a printed circuit board heat abstractor relates to the radiating element field, this printed circuit board heat abstractor, which comprises a circuit board, be provided with heat dissipation mechanism on the circuit board, heat dissipation mechanism includes heat dissipation aluminum plate, strip radiating fin, annular radiating fin one, annular radiating fin two, sunflower radiating fin and heat conduction cushion, strip radiating fin, annular radiating fin one, annular radiating fin two and sunflower radiating fin all set up the upper surface at heat dissipation aluminum plate, strip radiating fin links up position department with annular radiating fin one and forms a body structure, annular radiating fin two is located annular radiating fin one's inner circle, and form annular cavity between annular radiating fin two and the annular radiating fin one. The utility model discloses a set up heat dissipation aluminum plate, strip radiating fin, annular radiating fin one, annular radiating fin two, sunflower radiating fin and heat conduction cushion, solved printed circuit board and need dispel the heat fast and improve the problem of radiating effect.

Description

Printed circuit board heat dissipation device

Technical Field

The utility model relates to a radiating element technical field specifically is a printed circuit board heat abstractor.

Background

The printed circuit board is a circuit board for laying out circuits, and mainly comprises a pad, a via hole, a mounting hole, a lead, a component, a connector, a filler, an electrical boundary and the like, wherein the component, the connector and other parts are laid out on the circuit board, a radiating fin is usually required to be laid out on the circuit board, and the radiating fin plays a role in radiating the component, the connector and the whole circuit board, and the radiating effect has a crucial influence on the service life and the quality of the circuit board, so that a radiating structure which can quickly radiate heat and has an excellent radiating effect is required to be provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a printed circuit board heat abstractor for solve the problem that printed circuit board dispels the heat fast and improve the radiating effect.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a printed circuit board heat dissipation device comprises a circuit board, wherein a heat dissipation mechanism is arranged on the circuit board, the heat dissipation mechanism comprises a heat dissipation aluminum plate, a strip-shaped heat dissipation fin, a first annular heat dissipation fin, a second sunflower heat dissipation fin and a heat conduction rubber mat, the strip-shaped heat dissipation fin, the first annular heat dissipation fin, the second annular heat dissipation fin and the first sunflower heat dissipation fin are all arranged on the upper surface of the heat dissipation aluminum plate, the strip-shaped heat dissipation fin and the first annular heat dissipation fin are connected to form an integrated structure, the second annular heat dissipation fin is positioned in an inner ring of the first annular heat dissipation fin, an annular cavity is formed between the second annular heat dissipation fin and the first annular heat dissipation fin, the second sunflower heat dissipation fin and the second annular heat dissipation fin are positioned in an inner ring of the second annular heat dissipation fin, and two groups of the heat conduction rubber mats are respectively distributed, one group of heat-conducting rubber pads is clamped by the inner wall of the first annular radiating fin and the outer wall of the second annular radiating fin, and the other group of heat-conducting rubber pads is clamped by the inner wall of the second annular radiating fin and the outer wall of the sunflower radiating fin.

Preferably, the heat dissipation aluminum plate, the strip-shaped heat dissipation fins, the first annular heat dissipation fins, the second annular heat dissipation fins and the sunflower heat dissipation fins are all of an integrated structure.

Preferably, the strip-shaped radiating fins, the annular radiating fins I, the annular radiating fins II and the sunflower radiating fins are all vertically arranged on the upper surface of the radiating aluminum plate.

Preferably, the strip-shaped heat dissipation fins are connected with the outer wall of the first annular heat dissipation fin.

Preferably, a group of the heat-conducting rubber pads is bonded with the inner wall of the first annular radiating fin and the outer wall of the second annular radiating fin.

Preferably, the other group of heat-conducting rubber pads are bonded with the inner walls of the two annular radiating fins and the outer walls of the sunflower radiating fins.

Preferably, the sunflower radiating fin consists of an inner ring, an outer ring and an intermediate connecting sheet.

(III) advantageous effects

The utility model provides a printed circuit board heat abstractor possesses following beneficial effect:

the utility model has the advantages that the heat radiating aluminum plate, the strip-shaped heat radiating fins, the annular first heat radiating fins, the annular second heat radiating fins, the sunflower heat radiating fins and the heat conducting rubber pad are arranged, because the heat conductivity of the air is smaller, the heat radiating capacity is extremely small through direct conduction in the air, the heat conducting rubber pad is a high-performance gap filling heat conducting material, the heat conducting rubber pad is fully contacted with the annular first heat radiating fins, the annular second heat radiating fins and the sunflower heat radiating fins in use to replace air heat conduction, the excellent heat conductivity of the heat conducting rubber pad is utilized, so that the heat conducting efficiency is accelerated in the heat conducting and radiating process, the surfaces of the annular first heat radiating fins, the annular second heat radiating fins and the sunflower heat radiating fins quickly absorb heat and radiate the heat to the periphery, the heat radiating effect is increased, meanwhile, the heat conducting rubber pad has certain viscosity, is bonded through, the operation is convenient, and the problems that the printed circuit board needs to dissipate heat quickly and improve the heat dissipation effect are solved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the heat dissipation mechanism of the present invention;

FIG. 3 is a top view of the heat dissipation mechanism of the present invention;

FIG. 4 is a top view of the sunflower heat sink fin of the present invention;

fig. 5 is a top view of a heat dissipation mechanism according to an embodiment of the present invention.

In the figure: 1. a circuit board; 2. a heat dissipation mechanism; 201. a heat dissipation aluminum plate; 202. strip-shaped heat dissipation fins; 203. a first annular heat dissipation fin; 204. a second annular heat dissipation fin; 205. sunflower radiating fins; 206. a heat-conducting rubber pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: a printed circuit board heat dissipation device comprises a circuit board 1, a heat dissipation mechanism 2 is arranged on the circuit board 1, the heat dissipation mechanism 2 comprises a heat dissipation aluminum plate 201, a strip-shaped heat dissipation fin 202, a first annular heat dissipation fin 203, a second annular heat dissipation fin 204, a sunflower heat dissipation fin 205 and a heat conduction rubber mat 206, the strip-shaped heat dissipation fin 202, the first annular heat dissipation fin 203, the second annular heat dissipation fin 204 and the sunflower heat dissipation fin 205 are all arranged on the upper surface of the heat dissipation aluminum plate 201, the joint position of the strip-shaped heat dissipation fin 202 and the first annular heat dissipation fin 203 forms an integral structure, the first annular heat dissipation fin 203 can be a circular ring or a square ring, the second annular heat dissipation fin 204 is positioned in the inner ring of the first annular heat dissipation fin 203, the second annular heat dissipation fin 204 can be a circular ring or a square ring, an annular cavity is formed between the second annular heat dissipation fin 204 and the, be convenient for install the heat conduction cushion 206 that volume size is the same, sunflower radiating fin 205 is located the inner circle of annular radiating fin two 204, and form annular cavity between sunflower radiating fin 205 and the annular radiating fin two 204, the space equidistance between the annular cavity, be convenient for install the heat conduction cushion 206 that volume size is the same, heat conduction cushion 206 is globular, two sets of heat conduction cushions 206 distribute respectively in two sets of annular cavities, a set of heat conduction cushion 206 is by the centre gripping of the two 204 outer walls of annular radiating fin 203 inner wall and annular radiating fin, another set of heat conduction cushion 206 is by the centre gripping of the two 204 inner walls of annular radiating fin and sunflower radiating fin 205 outer wall, every group heat conduction cushion 206 is the annular distribution.

As a technical optimization scheme of the utility model, heat radiating aluminum plate 201, strip radiating fin 202, an annular radiating fin 203, two 204 annular radiating fins and sunflower radiating fin 205 are a body structure, and are the aluminium fin.

As a technical optimization scheme of the utility model, strip radiating fin 202, annular radiating fin 203, two 204 and the sun flower radiating fin 205 all set up the upper surface at heat dissipation aluminum plate 201 perpendicularly.

As a technical optimization scheme of the present invention, the outer wall of the strip-shaped heat dissipation fin 202 is connected to the outer wall of the annular heat dissipation fin 203.

As a technical optimization scheme of the utility model, a set of heat conduction cushion 206 bonds through self viscidity and two 204 outer walls of annular radiating fin 203 inner walls and annular radiating fin.

As a technical optimization scheme of the present invention, another set of heat conducting rubber pads 206 is bonded to the inner wall of the second ring-shaped heat dissipating fin 204 and the outer wall of the sunflower heat dissipating fin 205 through its own viscosity.

As a technical optimization scheme of the present invention, the sunflower heat dissipation fin 205 is composed of an inner ring, an outer ring and an intermediate connection piece.

Example one

As shown in fig. 5, the utility model provides a technical solution: a printed circuit board heat dissipation device comprises a circuit board 1, a heat dissipation mechanism 2 is arranged on the circuit board 1, the heat dissipation mechanism 2 comprises a heat dissipation aluminum plate 201, strip-shaped heat dissipation fins 202, annular heat dissipation fins, sunflower heat dissipation fins 205 and a heat conduction rubber pad 206, the annular heat dissipation fins comprise a plurality of groups of annular heat dissipation fins including a first annular heat dissipation fin 203 and a second annular heat dissipation fin 204, the plurality of groups of annular heat dissipation fins are all concentric circles, an annular cavity is formed between every two adjacent annular heat dissipation fins, the heat conduction rubber pad 206 is distributed in the annular cavity, the strip-shaped heat dissipation fins 202, the annular heat dissipation fins and the sunflower heat dissipation fins 205 are all arranged on the upper surface of the heat dissipation aluminum plate 201, the connecting positions of the strip-shaped heat dissipation fins 202 and the first annular heat dissipation fins 203 form an integral structure, the second annular heat dissipation fins 204 are positioned in the inner ring of the first annular heat dissipation fins 203, and an annular cavity, the sunflower radiating fins 205 are located in the inner ring of the innermost ring-shaped radiating fin, an annular cavity is formed between the sunflower radiating fin 205 and the adjacent ring-shaped radiating fin, each group of heat-conducting rubber pads 206 is clamped by each group of annular cavities, the number of the ring-shaped radiating fins can be increased or decreased according to actual needs, the number of the ring-shaped radiating fins is increased, the number of the heat-conducting rubber pads 206 is correspondingly increased, the radiating effect can be improved, the size of the sunflower radiating fins 205 is designed according to the diameter of the adjacent ring-shaped radiating fins, the sunflower radiating fins are mutually adaptive, and the sunflower radiating fin 205 is located in the inner ring of the adjacent ring-shaped.

As a technical optimization scheme of the utility model, heat dissipation aluminum plate 201, strip radiating fin 202, annular radiating fin and sunflower radiating fin 205 are a body structure.

As a technical optimization scheme of the utility model, strip radiating fin 202, annular radiating fin and sunflower radiating fin 205 all set up the upper surface at heat dissipation aluminum plate 201 perpendicularly.

As a technical optimization scheme of the present invention, the strip-shaped heat dissipation fins 202 are connected to the outer wall of the outermost ring of annular heat dissipation fins.

To sum up, the utility model discloses a set up heat dissipation aluminum plate 201, strip radiating fin 202, an annular radiating fin 203, two 204 of annular radiating fin, sunflower radiating fin 205 and heat conduction cushion 206, solved printed circuit board and need dispel the heat fast and improve the problem of radiating effect.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A printed circuit board heat dissipation device comprises a circuit board (1), and is characterized in that: the heat dissipation structure comprises a circuit board (1), wherein a heat dissipation mechanism (2) is arranged on the circuit board (1), the heat dissipation mechanism (2) comprises a heat dissipation aluminum plate (201), a strip-shaped heat dissipation fin (202), an annular heat dissipation fin I (203), an annular heat dissipation fin II (204), a sunflower heat dissipation fin (205) and a heat conduction rubber gasket (206), the strip-shaped heat dissipation fin (202), the annular heat dissipation fin I (203), the annular heat dissipation fin II (204) and the sunflower heat dissipation fin (205) are all arranged on the upper surface of the heat dissipation aluminum plate (201), the joint position of the strip-shaped heat dissipation fin (202) and the annular heat dissipation fin I (203) forms an integrated structure, the annular heat dissipation fin II (204) is located in the inner ring of the annular heat dissipation fin I (203), an annular cavity is formed between the annular heat dissipation fin II (204) and the annular heat dissipation fin I (203), and the sunflower heat dissipation fin (205) is located in, and an annular cavity is formed between the sunflower radiating fin (205) and the second annular radiating fin (204), the heat-conducting rubber pads (206) are respectively distributed in the two annular cavities, one heat-conducting rubber pad (206) is clamped by the inner wall of the first annular radiating fin (203) and the outer wall of the second annular radiating fin (204), and the other heat-conducting rubber pad (206) is clamped by the inner wall of the second annular radiating fin (204) and the outer wall of the sunflower radiating fin (205).

2. A printed circuit board heat sink according to claim 1, wherein: the radiating aluminum plate (201), the strip-shaped radiating fins (202), the first annular radiating fins (203), the second annular radiating fins (204) and the sunflower radiating fins (205) are all of an integrated structure.

3. A printed circuit board heat sink according to claim 1, wherein: the strip-shaped radiating fins (202), the annular radiating fins I (203), the annular radiating fins II (204) and the sunflower radiating fins (205) are all vertically arranged on the upper surface of the radiating aluminum plate (201).

4. A printed circuit board heat sink according to claim 1, wherein: the strip-shaped heat radiating fins (202) are connected with the outer wall of the first annular heat radiating fin (203).

5. A printed circuit board heat sink according to claim 1, wherein: and the group of heat-conducting rubber pads (206) are bonded with the inner wall of the first annular heat-radiating fin (203) and the outer wall of the second annular heat-radiating fin (204).

6. A printed circuit board heat sink according to claim 1, wherein: and the other group of heat-conducting rubber pads (206) are bonded with the inner walls of the second annular radiating fins (204) and the outer walls of the sunflower radiating fins (205).

7. A printed circuit board heat sink according to claim 1, wherein: the sunflower radiating fin (205) consists of an inner ring, an outer ring and an intermediate connecting sheet.