CN211890128U - Grinding roller device for reducing surface roughness of copper foil for aluminum substrate - Google Patents

Grinding roller device for reducing surface roughness of copper foil for aluminum substrate Download PDF

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Publication number
CN211890128U
CN211890128U CN202020439393.7U CN202020439393U CN211890128U CN 211890128 U CN211890128 U CN 211890128U CN 202020439393 U CN202020439393 U CN 202020439393U CN 211890128 U CN211890128 U CN 211890128U
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CN
China
Prior art keywords
copper foil
grinding roller
roller
aluminum substrate
reducing
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Expired - Fee Related
Application number
CN202020439393.7U
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Chinese (zh)
Inventor
张守金
江东红
洪得利
陈建明
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Xiamen Metal Board Electronics Co ltd
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Xiamen Metal Board Electronics Co ltd
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Priority to CN202020439393.7U priority Critical patent/CN211890128U/en
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Publication of CN211890128U publication Critical patent/CN211890128U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a reduce aluminum base plate copper foil roughness's grinding roller device is provided with dull polish running roller, turn-over roller, soft round roller, clean sticky tape, the surface of dull polish running roller is sand paper, the surface of clean sticky tape has viscidity, there is a tangential point between the surface of turn-over roller and the surface of soft round roller, the copper foil material area is in proper order through dull polish running roller and turn-over roller, the sticky surface of treating of dull polish running roller contact copper foil material area, and turn-over roller contact copper foil material area treats the back of sticky surface, and clean sticky tape and copper foil material area pass through simultaneously tangent point between turn-over roller surface and the soft round roller surface, and the sticky tape of treating of copper foil material area only has the contact at this tangential point, treats the particle adhesion of remaining of sticky surface with the copper foil material area with the help of the packing force between turn-over roller and the soft round roller and takes away on the clean sticky tape.

Description

Grinding roller device for reducing surface roughness of copper foil for aluminum substrate
Technical Field
The utility model relates to a circuit board field of making especially relates to a reduce aluminium base plate copper foil roughness's grinding roller device.
Background
The aluminum substrate is a light source substrate of an LED lighting product, and the LED light source needs to be welded on the aluminum substrate so as to conduct heat emitted by the LED light source out. The aluminum substrate generally includes an aluminum plate layer, a thermal conductive adhesive, and a copper foil, wherein the thermal conductive adhesive is disposed between the aluminum plate layer and the copper foil. The copper foil is in a copper foil material belt form, heat-conducting glue is coated on the copper foil through gluing, and then the copper foil with the heat-conducting glue is pressed on the aluminum plate layer. The surface roughness of the copper foil before gluing has important influence on the thickness consistency of the heat-conducting glue after gluing and the exhaust in the pressing process. If the surface roughness of the copper foil is too large, a relatively sharp bulge exists, which may result in a small thickness of the heat conducting glue after the local gluing, resulting in insufficient insulation and voltage resistance at the local position, possibly causing breakdown of the aluminum substrate at the local position, and causing insulation failure of the aluminum substrate. If the surface roughness of the copper foil is too large, deep pits are present, which makes it difficult to discharge air contained in the local portion, and the copper foil at the local portion is bubbled during the soldering of the aluminum substrate, which lowers the peel strength of the copper foil. Therefore, it is necessary to reduce the surface roughness of the copper foil for the aluminum substrate before the heat conductive paste is applied to the surface of the copper foil.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate, which is simple and easy to adjust. In order to solve the technical problem, the technical scheme of the utility model is that: a grinding roller device for reducing the surface roughness of copper foil for an aluminum substrate is applied to a gluing production line of heat-conducting glue of the aluminum substrate on the copper foil, and is used for treating a to-be-glued surface of a copper foil material belt, the grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is provided with a grinding roller wheel, a turnover roller, a soft roller and a cleaning sticky belt, the outer surface of the grinding roller wheel is sand paper, the surface of the cleaning sticky belt is sticky, a tangent point is arranged between the outer surface of the turnover roller and the outer surface of the soft roller, the copper foil material belt sequentially passes through the grinding roller wheel and the turnover roller, the to-be-glued surface of the grinding roller wheel contacting the copper foil material belt is contacted with the turnover roller to-be-glued surface, the back of the copper foil material belt to-be-glued surface is contacted with the copper foil material belt simultaneously through the tangent point between the outer surface of the turnover roller and the, and adhering the residual particles on the surface to be coated of the copper foil material belt to the cleaning adhesive tape by virtue of the pressing force between the turn-over roller and the soft roller.
Further preferably, the tooth thinning brush is further provided with tooth thinning bristles, and the end portions of the tooth thinning bristles are in contact with the outer surface of the grinding roller wheel.
Further preferably, the dust collector is further arranged and provided with a dust collection opening, and the dust collection opening is arranged right below the sanding roller.
Further preferably, a second sparse tooth brush is further arranged, the second sparse tooth brush is provided with second sparse tooth brush hair, the end portion of the second sparse tooth brush hair contacts with the outer surface of the grinding roller wheel, and the second sparse tooth brush and the sparse tooth brush hair are symmetrically arranged on the left side and the right side of the grinding roller wheel.
Further preferably, the sanding roller wheel and the turnover roller rotate in opposite directions.
Further preferably, the polishing device is further provided with a cleaning groove, a cleaning agent is arranged in the cleaning groove, and the lower part of the outer surface of the polishing roller is immersed in the cleaning agent.
Further preferably, the cleaning device is further provided with a hot air gun, the hot air gun is provided with an air outlet, the air outlet is aligned with the outer surface of the sanding roller wheel, and the hot air gun is arranged above the cleaning groove.
Further preferably, the hot air gun and the sparse tooth brush are arranged above the cleaning groove, and the hot air gun and the sparse tooth brush are respectively arranged on the left side and the right side of the sanding roller wheel.
Further preferably, when the grinding roller wheel rotates, the outer surface of the grinding roller wheel sequentially passes through the sparse tooth hairbrush, the cleaning agent for cleaning the groove and the hot air gun.
Further preferably, the temperature of the air outlet of the hot air gun is not higher than the boiling point temperature of the cleaning agent.
Compared with the prior art, the utility model discloses following beneficial effect has: grind the lower surface in copper foil material area through the dull polish running roller, reduce copper foil roughness, melt into rubber coated assembly line with the dull polish running roller, only need to transform the partial transmission running roller of original production line and can realize, do not lead to the fact the influence to original rubber coating production line, and can improve the adjustment at any time as required. Not only the input cost is low, but also the operation is simple and easy.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic view of a grinding roller device for reducing the surface roughness of a copper foil for an aluminum substrate according to an embodiment of the present invention.
Fig. 2 is a schematic view of a grinding roller device for reducing the surface roughness of a copper foil for an aluminum substrate according to an embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Example one
Referring to fig. 1, a grinding roller device for reducing the surface roughness of a copper foil for an aluminum substrate is applied to a gluing production line of a heat-conducting glue of the aluminum substrate on the copper foil, and is used for treating a surface to be glued of a copper foil material belt 1, the grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is provided with a grinding roller 2, a turn-over roller 3, a soft roller 4 and a cleaning adhesive tape 5, the outer surface of the grinding roller 2 is made of abrasive paper, the surface of the cleaning adhesive tape 5 is sticky, a tangent point is arranged between the outer surface of the turn-over roller 3 and the outer surface of the soft roller 4, the copper foil material belt 1 sequentially passes through the grinding roller 2 and the turn-over roller 3, the grinding roller 2 contacts the surface to be glued of the copper foil material belt 1, the turn-over roller 3 contacts the back surface to be glued of the copper foil material belt 1, the cleaning adhesive tape 5 and the copper foil material belt 1, and the surface to be coated of the copper foil material belt 1 is in contact with the cleaning adhesive tape 5 only at the tangent point, and residual particles on the surface to be coated of the copper foil material belt 1 are adhered to the cleaning adhesive tape 5 to be taken away by virtue of the pressing force between the turn-over roller 3 and the soft roller 4.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is further provided with a thinning tooth brush 6, the thinning tooth brush 6 is provided with thinning tooth bristles, and the end parts of the thinning tooth bristles are in contact with the outer surface of the grinding roller wheel 2.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is further provided with a dust suction device 7, the dust suction device 7 is provided with a dust suction port, and the dust suction port is arranged under the grinding roller 2.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is further provided with a second sparse tooth brush 8, the second sparse tooth brush 8 is provided with a second sparse tooth brush hair, the end part of the second sparse tooth brush hair is in contact with the outer surface of the grinding roller wheel 2, and the second sparse tooth brush 8 and the sparse tooth brush 6 are symmetrically arranged on the left side and the right side of the grinding roller wheel 2.
The rotation directions of the sanding roller wheel 2 and the turn-over roller 3 are opposite.
Example two
Referring to fig. 2, a grinding roller device for reducing the surface roughness of a copper foil for an aluminum substrate is applied to a gluing production line of a heat-conducting glue of the aluminum substrate on the copper foil, and is used for treating a surface to be glued of a copper foil material belt 1, the grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is provided with a grinding roller 2, a turn-over roller 3, a soft roller 4 and a cleaning adhesive tape 5, the outer surface of the grinding roller 2 is made of abrasive paper, the surface of the cleaning adhesive tape 5 is sticky, a tangent point is arranged between the outer surface of the turn-over roller 3 and the outer surface of the soft roller 4, the copper foil material belt 1 sequentially passes through the grinding roller 2 and the turn-over roller 3, the grinding roller 2 contacts the surface to be glued of the copper foil material belt 1, the turn-over roller 3 contacts the back surface to be glued of the copper foil material belt 1, the cleaning adhesive tape 5 and the copper foil material belt 1, and the surface to be coated of the copper foil material belt 1 is in contact with the cleaning adhesive tape 5 only at the tangent point, and residual particles on the surface to be coated of the copper foil material belt 1 are adhered to the cleaning adhesive tape 5 to be taken away by virtue of the pressing force between the turn-over roller 3 and the soft roller 4.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is further provided with a thinning tooth brush 6, the thinning tooth brush 6 is provided with thinning tooth bristles, and the end parts of the thinning tooth bristles are in contact with the outer surface of the grinding roller wheel 2.
The rotation directions of the sanding roller wheel 2 and the turn-over roller 3 are opposite.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is also provided with a cleaning groove 9, a cleaning agent is arranged in the cleaning groove 9, and the lower part of the outer surface of the grinding roller 2 is immersed in the cleaning agent.
The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is further provided with a hot air gun 10, the hot air gun 10 is provided with an air outlet, the air outlet is aligned to the outer surface of the sanding roller 2, and the hot air gun is arranged above the cleaning groove 9.
Reduce grinding roller device of copper foil surface roughness for aluminum substrate hot-blast rifle 10, dredge tooth brush 6 all set up in clean groove 9's top, and hot-blast rifle 10, dredge tooth brush 6 set up respectively in the left and right sides of dull polish running roller 2.
When the grinding roller wheel 2 rotates, the outer surface of the grinding roller wheel 2 sequentially passes through the sparse tooth brush 6, the cleaning agent in the cleaning groove 9 and the hot air gun 10.
The temperature of the air outlet of the hot air gun 10 is not higher than the boiling point temperature of the cleaning agent.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed by the preferred embodiment, it is not limited to the present invention, and any person skilled in the art can make modifications or changes equivalent to the equivalent embodiments by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the modifications, changes and changes of the technical spirit of the present invention made to the above embodiments are also within the scope of the technical solution of the present invention.

Claims (10)

1. A grinding roller device for reducing the surface roughness of copper foil for an aluminum substrate is applied to a gluing production line of heat-conducting glue of the aluminum substrate on the copper foil and used for processing a surface to be glued of a copper foil material belt, and is characterized in that the grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate is provided with a grinding roller wheel, a turnover roller, a soft roller and a cleaning adhesive tape, the outer surface of the grinding roller wheel is sand paper, the surface of the cleaning adhesive tape is sticky, a tangent point is arranged between the outer surface of the turnover roller and the outer surface of the soft roller, the copper foil material belt sequentially passes through the grinding roller wheel and the turnover roller, the grinding roller wheel contacts the surface to be glued of the copper foil material belt, the turnover roller contacts the back surface of the copper foil material belt to be glued, the cleaning adhesive tape and the copper foil material belt simultaneously pass through the tangent point between the outer surface of the turnover roller and the outer surface of the soft roller, and the surface to, and adhering the residual particles on the surface to be coated of the copper foil material belt to the cleaning adhesive tape by virtue of the pressing force between the turn-over roller and the soft roller.
2. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 1, wherein a sparse-teeth brush is further provided, the sparse-teeth brush is provided with sparse-teeth bristles, and the end parts of the sparse-teeth bristles contact with the outer surface of the grinding roller.
3. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 1, wherein a dust suction device is further provided, the dust suction device is provided with a dust suction port, and the dust suction port is arranged right below the grinding roller.
4. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 2, wherein a second sparse tooth brush is further provided, the second sparse tooth brush is provided with a second sparse tooth brush, the end part of the second sparse tooth brush contacts the outer surface of the grinding roller, and the second sparse tooth brush and the sparse tooth brush are symmetrically arranged on the left side and the right side of the grinding roller.
5. A grinding roll apparatus for reducing the surface roughness of a copper foil for an aluminum substrate as set forth in claim 1, wherein said grinding roll wheel rotates in a direction opposite to that of said turn-over roll.
6. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 2, wherein a cleaning tank is further provided, a cleaning agent is provided in the cleaning tank, and the lower part of the outer surface of the grinding roller is immersed in the cleaning agent.
7. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 6, wherein a hot air gun is further provided, the hot air gun is provided with an air outlet, the air outlet is aligned with the outer surface of the grinding roller wheel, and the hot air gun is arranged above the cleaning groove.
8. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 7, wherein the hot air gun and the tooth thinning brush are both disposed above the cleaning groove, and the hot air gun and the tooth thinning brush are respectively disposed at left and right sides of the grinding roller.
9. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 8, wherein when the grinding roller rotates, the outer surface of the grinding roller passes through the thinning hairbrush, the cleaning agent for cleaning the groove and the hot air gun in sequence.
10. The grinding roller device for reducing the surface roughness of the copper foil for the aluminum substrate as claimed in claim 7, wherein the temperature of the air outlet of the hot air gun is not higher than the boiling point temperature of the cleaning agent.
CN202020439393.7U 2020-03-31 2020-03-31 Grinding roller device for reducing surface roughness of copper foil for aluminum substrate Expired - Fee Related CN211890128U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020439393.7U CN211890128U (en) 2020-03-31 2020-03-31 Grinding roller device for reducing surface roughness of copper foil for aluminum substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020439393.7U CN211890128U (en) 2020-03-31 2020-03-31 Grinding roller device for reducing surface roughness of copper foil for aluminum substrate

Publications (1)

Publication Number Publication Date
CN211890128U true CN211890128U (en) 2020-11-10

Family

ID=73274673

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020439393.7U Expired - Fee Related CN211890128U (en) 2020-03-31 2020-03-31 Grinding roller device for reducing surface roughness of copper foil for aluminum substrate

Country Status (1)

Country Link
CN (1) CN211890128U (en)

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Granted publication date: 20201110