CN211806595U

CN211806595U - Die carrier for QDC hardware die

Info

Publication number: CN211806595U
Application number: CN201922433335.3U
Authority: CN
Inventors: 周维江
Original assignee: Suzhou WBRoymax Electronic Technology Co ltd
Current assignee: Suzhou WBRoymax Electronic Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-10-30
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a QDC hardware mould die carrier, which comprises a lower die carrier, wherein an upper die carrier is arranged at the top end outside the lower die carrier, an etching blade is embedded and arranged on the surface of the middle part of the top end of the lower die carrier, two side edge parts inside the etching blade and the corresponding position part of the top end of the lower die carrier are respectively provided with a positioning hole in a penetrating way, the etching blade is fixedly connected with the positioning holes through a positioning screw rod, a fastening rubber pad is sleeved at the middle part outside the positioning screw rod, the top end surface of the fastening rubber pad is fixedly connected with the top end of the positioning screw rod through the fastening rubber pad, guide pillars are arranged at two sides of the top edge part of the lower die carrier, the lower die carrier is contacted with the outer wall of the etching blade through the fastening rubber pad, and the fastening rubber pad is supported through a support spring, thereby solving the problem that, the firmness of the installation of the etching blade is improved.

Description

Die carrier for QDC hardware die

Technical Field

The utility model relates to a mould manufacturing technical field specifically is a QDC is die carrier for hardware mould.

Background

The mold can realize the one-step die cutting process of the appearance of a product when a die-cut product is processed, is stable during production and processing of the mold, has long service life, and can process products with high material thickness and hardness, wherein the QDC mold needs to be fixed by using a mold frame.

However, when the conventional locating hole is used for fixing the existing mold frame for the QDC hardware mold, the etching blade is easy to loosen, and the accuracy of locating when the upper mold frame is downwards stamped is poor, so that the production quality of the mold is affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a QDC is die carrier for hardware mould to when there is traditional locating hole fixed in the current QDC for hardware mould die carrier that proposes in solving above-mentioned background art when using, the etching blade takes place easily not hard up and the accuracy of going up the die carrier location when carrying out the punching press downwards is relatively poor, influences mould production quality's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a QDC is die carrier for five metals mould, includes die carrier down, the die carrier is installed on the outside top of die carrier down, fixed establishment is installed to lower die carrier top surface middle part embedding, fixed establishment includes etching blade, locating hole, positioning screw, supporting spring and fastening cushion, the etching blade is installed in die carrier top middle part surface embedding down, the inside both sides limit portion of etching blade and lower die carrier top correspond position department and all run through and seted up the locating hole, through positioning screw fixed connection between etching blade and the locating hole, the fastening cushion has been cup jointed at the outside middle part of positioning screw, through fastening cushion fixed connection between fastening cushion top surface and the positioning screw top.

Further, go up through guiding mechanism fixed connection between die carrier and the lower die carrier, guiding mechanism includes guide pillar, oiling mouth, T type draw-in groove, guide way, lug and intercommunication groove, the guide pillar is all installed to die carrier top limit portion both sides down, lower die carrier top surface middle part embedding is installed oiling mouth, T type draw-in groove has been seted up to guide pillar outer wall one side, go up the inside guide pillar position department of corresponding of die carrier and all seted up the guide way, the lug has been seted up to guide way inner wall one side.

Furthermore, the outer diameter of the bump is equal to the inner diameter of the T-shaped clamping groove, and lubricating grease is sleeved on the inner wall of the guide groove.

Further, the communication grooves are formed in the positions, corresponding to the guide grooves, of the lower die frame, and the dustproof rubber plugs are embedded into the guide grooves.

Furthermore, a handrail is welded on one side of the outer wall of the lower die frame, and silica gel gaskets are respectively attached to two sides of the outer wall of the handrail.

Furthermore, the top end of the lower die frame is uniformly provided with fixing holes corresponding to the positions of the etching blades, and punching needles are arranged in the fixing holes.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a be provided with fixed establishment, when installing the location with the etching blade on die carrier top down, wear to establish in the locating hole of etching blade and the inside each position department of die carrier down through positioning screw, and when advancing to screw up positioning screw, contact through fastening cushion and etching blade outer wall, and support the fastening cushion through supporting spring, thereby when having solved traditional locating hole fixed, the etching blade takes place not hard up easily, lead to going up the inside relatively poor problem of cope match-plate pattern punching press quality of die carrier, the fastness of etching blade installation has been improved.

Through being provided with guiding mechanism, when last die carrier when punching press down to lower die carrier under the punching machine effect, lead through the inside guide way of last die carrier and the guide way of lower die carrier limit portion, and the joint of the lug through guide way department and the T type draw-in groove of guide pillar department, thereby the accuracy of location when going on punching press has been guaranteed to last die carrier downwards, and the cooperation is lubricated between guide way and the guide pillar to the glib talker, the wearing and tearing between guide pillar and the guide way have been reduced, be favorable to prolonging the actual life of die carrier.

Drawings

Fig. 1 is a schematic structural diagram in an embodiment of the present invention;

FIG. 2 is a schematic structural view of the securing mechanism in the embodiment of FIG. 1;

FIG. 3 is a schematic structural diagram of a positioning screw in the embodiment of FIG. 1;

fig. 4 is a schematic structural diagram of the guide mechanism in the embodiment of fig. 1.

Reference numerals: 1. a lower die frame; 2. feeding a mold frame; 3. a fixing mechanism; 301. etching the blade; 302. positioning holes; 303. positioning a screw rod; 304. a support spring; 305. fastening the rubber cushion; 4. a guide mechanism; 401. a guide post; 402. an oil injection nozzle; 403. a T-shaped clamping groove; 404. a guide groove; 405. a bump; 406. a communicating groove; 5. a handrail.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4 together, a mold frame for a QDC hardware mold comprises a lower mold frame 1, an upper mold frame 2 is installed at the top end of the outer portion of the lower mold frame 1, a fixing mechanism 3 is installed at the middle portion of the top end surface of the lower mold frame 1 in an embedded manner, the fixing mechanism 3 comprises an etching blade 301, a positioning hole 302, a positioning screw 303, a supporting spring 304 and a fastening rubber pad 305, the etching blade 301 is installed at the middle portion of the top end of the lower mold frame 1 in an embedded manner, the positioning hole 302 is formed in the corresponding positions of the two side edge portions inside the etching blade 301 and the top end of the lower mold frame 1 in a penetrating manner, the etching blade 301 is fixedly connected with the positioning hole 302 through the positioning screw 303, the fastening rubber pad 305 is sleeved at the middle portion of the outer portion of the positioning screw 303, the top end surface of the fastening rubber pad 305 is fixedly connected with the top, be convenient for have the punching machine inside to take out die carrier 1 down through handrail 5 and silica gel gasket, the die carrier installation is used conveniently, and the fixed orifices has evenly been seted up to 1 top of lower die carrier corresponding etching blade 301 position department, and the fixed orifices internally mounted has the punching needle, can carry out the stamping forming to the cope match-plate pattern of going up 2 internally mounted of die carrier through the punching needle of fixed orifices inside.

The upper die frame 2 is fixedly connected with the lower die frame 1 through a guide mechanism 4, the guide mechanism 4 comprises a guide post 401, an oil nozzle 402, a T-shaped clamping groove 403, a guide groove 404, a bump 405 and a communicating groove 406, the guide posts 401 are respectively installed on two sides of the top end edge of the lower die frame 1, the oil nozzle 402 is embedded and installed in the middle of the top end surface of the lower die frame 1, the T-shaped clamping groove 403 is formed in one side of the outer wall of the guide post 401, the guide grooves 404 are formed in the positions, corresponding to the guide post 401, in the upper die frame 2, the bump 405 is formed in one side of the inner wall of the guide groove 404, the outer diameter of the bump 405 is equal to the inner diameter of the T-shaped clamping groove 403, lubricating grease is sleeved on the inner wall of the guide groove 404, when the upper die frame 2 performs downward punching, the bump 405 in the guide groove 404 is connected and fixed in the guide groove 404 in the, influence the production quality of die carrier, and lubricate between guide way 404 and guide pillar 401 through lubricating grease, the wearing and tearing of guide pillar 401 outer wall have been reduced, intercommunication groove 406 has all been seted up to the inside guide way 404 position department that corresponds of lower die carrier 1, dustproof plug is installed in the inside embedding of guide way 404, can be inside the lubricating oil guide way 404 that leads simultaneously of glib talker 402 department through intercommunication groove 406, lubricate inside the guide way 404 by replenishing, and after the oiling, carry out airtight protection to glib talker 402 through dustproof plug.

To sum up, the utility model provides a QDC hardware mould is die carrier for mould, in operation, firstly, when installing the etching blade 301 at the top of die carrier 1 down, wear to establish in the locating hole 302 of etching blade 301 and each position department in the die carrier 1 through positioning screw 303, and when screwing up positioning screw 303, contact with the outer wall of etching blade 301 through fastening cushion 305, and support fastening cushion 305 through supporting spring 304, thus when having solved traditional locating hole 302 and being fixed, etching blade 301 easily becomes flexible, lead to the problem of the interior cope match-plate pattern stamping quality of die carrier 2 poor, improved the fastness of etching blade 301 installation, then, install the cope match-plate pattern in the interior of cope match-plate pattern 2, install the lower bolster in the interior of die carrier 1 down,

next, when the upper die carrier 2 downwardly punches the lower die carrier 1 under the action of the punch, the upper die carrier 2 is guided by the guide groove 404 inside the upper die carrier 2 and the guide groove 404 on the edge of the lower die carrier 1, and is clamped by the projection 405 on the guide groove 404 and the T-shaped slot 403 on the guide post 401, so that the positioning accuracy of the upper die carrier 2 in the downward punching process is ensured, the guide groove 404 and the guide post 401 are lubricated by matching with the oil nozzle 402, the abrasion between the guide post 401 and the guide groove 404 is reduced, and the actual service life of the die carrier is prolonged.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a QDC is die carrier for hardware mould, includes die carrier (1) down, its characterized in that, die carrier (2) are installed on die carrier (1) outside top down, die carrier (1) top surface middle part embedding is installed fixed establishment (3) down, fixed establishment (3) are including etching blade (301), locating hole (302), positioning screw (303), supporting spring (304) and fastening cushion (305), die carrier (1) top middle part surface embedding down installs etching blade (301), etching blade (301) inside both sides limit portion and die carrier (1) top correspond position department down and all run through and seted up locating hole (302), through positioning screw (303) fixed connection between etching blade (301) and locating hole (302), fastening cushion (305) have been cup jointed at positioning screw (303) outside middle part, through fastening cushion (305) fixed connection between fastening cushion (305) top surface and positioning screw (303) top .

2. The mold frame for the QDC hardware mold according to claim 1, wherein the upper mold frame (2) is fixedly connected with the lower mold frame (1) through a guide mechanism (4), the guide mechanism (4) comprises a guide pillar (401), an oil injection nozzle (402), a T-shaped clamping groove (403), a guide groove (404), a bump (405) and a communicating groove (406), the guide pillar (401) is installed on two sides of the edge portion of the top end of the lower mold frame (1), the oil injection nozzle (402) is installed in the middle of the surface of the top end of the lower mold frame (1) in an embedded mode, the T-shaped clamping groove (403) is formed in one side of the outer wall of the guide pillar (401), the guide groove (404) is formed in the inner portion of the upper mold frame (2) corresponding to the position of the guide pillar (401), and the bump (405).

3. The die carrier for the QDC hardware die as claimed in claim 2, wherein the outer diameter of the projection (405) is equal to the inner diameter of the T-shaped clamping groove (403), and lubricating grease is sleeved on the inner wall of the guide groove (404).

4. The mold frame for the QDC hardware mold as claimed in claim 2, wherein the lower mold frame (1) is provided with communicating grooves (406) at positions corresponding to the guide grooves (404), and dustproof rubber plugs are embedded in the guide grooves (404).

5. The formwork support for the QDC hardware mould is characterized in that a handrail (5) is welded on one side of the outer wall of the lower formwork (1), and silica gel gaskets are respectively pasted on two sides of the outer wall of the handrail (5).

6. The die carrier for the QDC hardware die as claimed in claim 1, wherein fixing holes are uniformly formed in the positions, corresponding to the etching blades (301), of the top end of the lower die carrier (1), and punching pins are installed inside the fixing holes.