CN211801992U - Nitrogen and oxygen sensor chip clamping equipment and side coating equipment - Google Patents

Abstract

The utility model relates to a centre gripping equipment and side coating equipment of nitrogen oxygen sensor chip, include: the clamping device comprises a plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged in a staggered mode, the height of the second workpieces is smaller than that of the first workpieces, so that a clamping gap between every two adjacent first workpieces is formed, and the third workpiece is used for fixing the first workpieces and the second workpieces. Above-mentioned side coating equipment of centre gripping equipment and nitrogen oxygen sensor chip can hold nitrogen oxygen sensor in order to realize the centre gripping to nitrogen oxygen sensor in the centre gripping clearance, and the quantity of the nitrogen oxygen sensor of centre gripping simultaneously can set up as required for the quantity of first work piece and second work piece to carry out side coating technology to a plurality of nitrogen oxygen sensors easily, realize nitrogen oxygen sensor's batch production, production efficiency can improve.

Description

Nitrogen and oxygen sensor chip clamping equipment and side coating equipment

technical field

The utility model relates to the technical field of sensor equipment, in particular to a clamping device for a nitrogen-oxygen sensor chip and a side coating device for the nitrogen-oxygen sensor chip.

Background technique

In recent years, the application of nitrogen and oxygen sensors has become more and more extensive, so the professional production equipment of nitrogen and oxygen sensors has become more and more important. Due to the complicated circuit of the nitrogen and oxygen sensor, it is difficult to realize all the electrodes through conduction through the hole, and part of the circuit needs to be routed to the side of the nitrogen and oxygen sensor chip, and the traditional nitrogen and oxygen sensor equipment cannot effectively clamp multiple nitrogen and oxygen sensor chips. The sides of these nitrogen and oxygen sensor chips are coated, making it impossible to mass-produce nitrogen and oxygen sensor chips.

Utility model content

Based on this, it is necessary to provide a clamping device for nitrogen and oxygen sensor chips and a side coating device for nitrogen and oxygen sensor chips in view of the above problems.

A clamping device for a nitrogen and oxygen sensor chip, comprising: a plurality of first workpieces, a plurality of second workpieces and a third workpiece, the first workpieces and the second workpieces are staggered and the height of the second workpiece is less than The height of the first workpiece is to form a clamping gap between two adjacent first workpieces, and the third workpiece is used for fixing the first workpiece and the second workpiece.

In one of the embodiments, the distance between two adjacent first workpieces is equal to the thickness of the second workpiece.

In one of the embodiments, the first workpiece and/or the second workpiece is a rectangular parallelepiped.

In one of the embodiments, the corners of the cuboid are chamfered.

In one of the embodiments, the size of the chamfer is 0.5*45°.

In one embodiment, the bottom end face of the first workpiece and the bottom end face of the second workpiece are coplanar.

In one embodiment, two end surfaces of the first workpiece perpendicular to the bottom end surface are coplanar with two end surfaces of the second workpiece perpendicular to the bottom end surface, respectively.

In one embodiment, the difference between the height of the first workpiece and the height of the second workpiece is greater than half of the height of the nitrogen-oxygen sensor chip.

In one embodiment, the first workpiece and the second workpiece are provided with opposite through holes, and the third workpiece includes a nut and a bolt, and the nut and the bolt pass through the through hole to the through hole. The first workpiece and the second workpiece are fixed.

A side coating device for a nitrogen and oxygen sensor chip, comprising the clamping device described in any of the above and a silicone pad printing head, and the silicone pad printing head is used for the nitrogen and oxygen sensor chip clamped by the clamping device. Side coated.

The above-mentioned clamping device and side coating device for nitrogen and oxygen sensor chips include a plurality of first workpieces, a plurality of second workpieces and a third workpiece. The staggered first workpiece and the second workpiece are fixed by the third workpiece. Since the height of the second workpiece is smaller than the height of the first workpiece to form a clamping gap between two adjacent first workpieces, the nitrogen oxygen sensor is accommodated in the clamping The number of the first workpiece and the second workpiece can be set according to the number of nitrogen and oxygen sensors to be clamped at the same time, so that the side coating process of multiple nitrogen and oxygen sensors is easy to be carried out. , the mass production of nitrogen and oxygen sensors is realized, and the production efficiency is improved.

Description of drawings

1 is a perspective view of a clamping device in an embodiment when clamping a nitrogen-oxygen sensor chip;

Fig. 2 is the front view in the embodiment of Fig. 1;

Fig. 3 is the left side view in the embodiment of Fig. 1;

Fig. 4 is a top view in the embodiment of Fig. 1;

5 is a perspective view of a clamping device in an embodiment;

Fig. 6 is the front view in the embodiment of Fig. 5;

Fig. 7 is the left side view in the embodiment of Fig. 5;

Fig. 8 is a top view in the embodiment of Fig. 5;

9 is a front view of a first workpiece in an embodiment;

10 is a left side view of the first workpiece in an embodiment;

11 is a front view of a second workpiece in one embodiment;

Figure 12 is a left side view of the second workpiece in one embodiment.

Detailed ways

The specific embodiments of the present utility model will be further described below with reference to the accompanying drawings.

Referring to FIGS. 1 to 12 , the present application provides a clamping device for simultaneously clamping a plurality of nitrogen and oxygen sensor chips for side coating of nitrogen and oxygen sensor chips (hereinafter referred to as a clamping device), enabling mass production of nitrogen and oxygen sensor chips. Oxygen sensor chip to improve production efficiency.

Referring to FIGS. 1 to 8 , the clamping apparatus 100 includes a plurality of first workpieces 110 , a plurality of second workpieces 120 and a third workpiece (not shown in the figures). Wherein, the first workpiece 110 and the second workpiece 120 are staggered and the height of the second workpiece 120 is smaller than that of the first workpiece 110 to form a clamping gap 130 between two adjacent first workpieces 110 , and the third workpiece is used for The first workpiece 110 and the second workpiece 120 are fixed.

Exemplarily, when the first workpiece 110 and the second workpiece 120 are staggered, the adjacent surfaces of the first workpiece 110 and the second workpiece 120 are arranged close to each other, so that the distance between the two adjacent first workpieces 110 is equal to the second workpiece. 120 thickness. Since the height of the second workpiece 120 is smaller than the height of the first workpiece 110, a clamping gap 130 is formed between two adjacent first workpieces 110. In this embodiment, the thickness of the clamping gap 130 is at least greater than that of the nitrogen-oxygen sensor The thickness of the chip 200 , that is, the thickness of the second workpiece 120 is greater than the thickness of the nitrogen-oxygen sensor chip 200 , so that the clamping gap 130 can accommodate the nitrogen-oxygen sensor chip 200 . For example, when the thickness of the nitrogen and oxygen sensor chip 200 is 1.75 mm, the thickness of the second workpiece 120 can be set to be 1.8 mm, so that the clamping gap 130 has a certain margin so that the nitrogen and oxygen sensor chip 200 can be easily placed, but can be clamped Nitrogen and oxygen sensor chip 200 . The number of the first workpiece 110 and the second workpiece 120 can be set according to the number of nitrogen and oxygen sensor chips 200 to be clamped.

In one embodiment, referring to FIGS. 9 to 12 , the first workpiece 110 and/or the second workpiece 120 are rectangular parallelepipeds, so that the process of producing the first workpiece 110 and the second workpiece 120 is simplified. Further, the corners of the cuboid are chamfered, for example, the size of each chamfer is 0.5*45°, so that the corners of the clamping device are more rounded, and it is not easy to be scratched during the production and processing of the nitrogen and oxygen sensor chip 200. Nitrogen and oxygen sensor chip 200 .

In one embodiment, the bottom end surface of the first workpiece 110 and the bottom end surface of the second workpiece 120 are coplanar. Further, the two end faces of the first workpiece 110 that are perpendicular to the bottom end face are coplanar with the two end faces of the second workpiece 120 that are perpendicular to the bottom end face. In this embodiment, the assembly between the second workpiece 120 and the first workpiece 110 is more efficient. compact and can form a more stable structure.

Further, the difference between the height of the first workpiece 110 and the height of the second workpiece 120 is greater than half of the height of the nitrogen and oxygen sensor chip 200, that is, the height of the clamping gap 130 can be at least greater than half of the height of the nitrogen and oxygen sensor chip 200, which is not easy to cause. The nitrogen and oxygen sensor chip 200 falls off during the clamping process. For example, the height of the nitrogen and oxygen sensor chip 200 is 5.40 mm, the height of the first workpiece 110 is 15 mm, the height of the second workpiece 120 is 10 mm, and the height of the nitrogen and oxygen sensor chip 200 is 0.40 mm higher than the height of the clamping gap 130 .

In one embodiment, the first workpiece 110 and the second workpiece 120 are provided with through holes 140 located opposite to each other. The third workpiece includes nuts and bolts, and the nuts and bolts fix the first workpiece 110 and the second workpiece 120 through the through holes 140 to tighten the clamping gap 130 between the two adjacent first workpieces 110 .

The present application also provides a side coating device for a nitrogen and oxygen sensor chip. The side coating device for the nitrogen oxygen sensor chip includes the clamping device 100 described in any of the above embodiments and a silica gel pad printing head, and the silica gel pad printing head is used for side coating the nitrogen oxygen sensor chip 200 clamped by the clamping device. , so as to simultaneously perform side coating on a plurality of nitrogen and oxygen sensor chips 200 to realize mass production of nitrogen and oxygen sensor chips 200 . Specifically, during the side coating process, the platinum paste is transferred to the side of the nitrogen and oxygen sensor chip 200 by using a silica gel pad printing head to realize the conduction of the inner leads of the nitrogen and oxygen sensor chip 200. After the transfer is completed, the clamping device 100 and the nitrogen-oxygen sensor chip 200 sandwiched therebetween are sent to an oven for drying together, and after drying, the reverse side of the nitrogen-oxygen sensor chip 200 is transferred.

The above-mentioned clamping device 100 and the side coating device of the nitrogen-oxygen sensor chip include a plurality of first workpieces 110 , a plurality of second workpieces 120 and a third workpiece. The staggered first workpiece 110 and the second workpiece 120 are fixed by the third workpiece. Since the height of the second workpiece 120 is smaller than the height of the first workpiece 110 to form a clamping gap 130 between two adjacent first workpieces 110, the The nitrogen and oxygen sensor is accommodated in the clamping gap 130 to realize the clamping of the nitrogen and oxygen sensor. The number of the first workpiece 110 and the second workpiece 120 can be set according to the number of nitrogen and oxygen sensors to be clamped at the same time, so as to easily A nitrogen and oxygen sensor is subjected to a side coating process to achieve mass production of nitrogen and oxygen sensors, and the production efficiency is improved.

Claims (10)

1. A clamping device of a nitrogen-oxygen sensor chip is characterized by comprising: the clamping device comprises a plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged in a staggered mode, the height of the second workpieces is smaller than that of the first workpieces, so that a clamping gap between every two adjacent first workpieces is formed, and the third workpiece is used for fixing the first workpieces and the second workpieces.

2. The clamping apparatus of claim 1, wherein the distance between two adjacent first workpieces is equal to the thickness of the second workpiece.

3. The clamping apparatus of claim 2, wherein the first workpiece and/or the second workpiece is a cuboid.

4. The clamping device for the oxynitride sensor chip according to claim 3, wherein the corners of the rectangular parallelepiped are chamfered.

5. The device of claim 4, wherein the chamfer has a dimension of 0.5 x 45 °.

6. The oxynitride sensor die holder of claim 3 wherein the bottom end surface of the first workpiece and the bottom end surface of the second workpiece are coplanar.

7. The clamping device of claim 6, wherein two end faces of the first workpiece perpendicular to the bottom end face are coplanar with two end faces of the second workpiece perpendicular to the bottom end face.

8. The NOx sensor die clamping apparatus of claim 6, wherein the difference between the first workpiece height and the second workpiece height is greater than half of the NOx sensor die height.

9. The device for clamping the NOx sensor chip of claim 1, wherein the first and second workpieces are provided with through holes at opposite positions, and the third workpiece comprises a nut and a bolt, and the nut and the bolt fix the first and second workpieces through the through holes.

10. A device for coating the sides of a chip of a nitroxide sensor, comprising a holding device according to any one of claims 1 to 9 and a silicone pad, wherein the silicone pad is used for coating the sides of the chip of the nitroxide sensor held by the holding device.

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