CN211746958U - Electronic atomization device and atomization core thereof - Google Patents
Electronic atomization device and atomization core thereof Download PDFInfo
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- CN211746958U CN211746958U CN201922140170.0U CN201922140170U CN211746958U CN 211746958 U CN211746958 U CN 211746958U CN 201922140170 U CN201922140170 U CN 201922140170U CN 211746958 U CN211746958 U CN 211746958U
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Abstract
The utility model discloses an electron atomizing device and atomizing core thereof. The atomizing core comprises a porous ceramic substrate, a ceramic covering layer and a heating film, wherein the ceramic covering layer is combined on the surface of the porous ceramic substrate, the heating film is combined on the surface of the ceramic covering layer far away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than that of the porous ceramic substrate, and a plurality of through holes are formed in the ceramic covering layer. The ceramic covering layer with lower porosity than the porous ceramic substrate is combined on the surface of the porous ceramic substrate close to the heating element, and the ceramic covering layer with lower porosity has higher density and does not have the powder falling phenomenon, so that the powder falling phenomenon of the atomizing core can be prevented; moreover, the ceramic covering layer with low porosity can isolate the precipitation of heavy metals in the porous ceramic substrate, so that the heavy metals can be prevented from being brought into airflow during suction, and the safety performance of the electronic atomization device is improved.
Description
Technical Field
The utility model relates to an electron cigarette technical field, concretely relates to electron atomizing device and atomizing core thereof.
Background
The electronic cigarette has the appearance and taste similar to that of a cigarette, but generally does not contain tar, suspended particles and other harmful ingredients in the cigarette, so that the harm to the body of a user is greatly reduced, and the electronic cigarette is often used as a substitute of the cigarette for smoking cessation. The safety of an e-cigarette is a primary consideration.
At present, in the smoking process, the atomizing core of the electronic cigarette is inevitably subjected to the risk of powder falling due to repeated thermal circulation and tobacco tar erosion; in addition, the heavy metal in the atomizing core and the heavy metal in the heating film under the high-temperature environment can be brought into airflow during suction, and the heavy metal can bring potential safety hazards to the health of users.
SUMMERY OF THE UTILITY MODEL
The utility model provides an electron atomizing device and atomizing core thereof to solve the technical problem that powder and heavy metal suction fall to atomizing core among the prior art.
In order to solve the technical problem, the utility model discloses a technical scheme be: provided is an atomizing core of an electronic atomizing device, comprising: the heating film is combined on the surface of the ceramic covering layer far away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than that of the porous ceramic substrate, and a plurality of through holes are formed in the ceramic covering layer.
Optionally, the porosity of the porous ceramic substrate is 40% -80%; and/or the average pore diameter of the micropores on the porous ceramic substrate is 10 μm to 40 μm; and/or the material used to form the porous ceramic substrate is zirconia, silica, alumina or mullite; and/or the thickness of the porous ceramic substrate is 1-4 mm.
Optionally, the porosity of the ceramic capping layer is 10% to 20%; and/or the material used to form the ceramic overlay is zirconia, silica, alumina, silicon carbide or mullite; and/or the thickness of the ceramic covering layer is 0.05-0.2 mm; and/or the powder particle size of the material used to form the ceramic coating is 0.1-5 μm.
Optionally, each of the holes has a diameter of 5-50 μm.
Optionally, the sum of the areas of the openings of the plurality of holes accounts for 5% -15% of the area of the cross section of the ceramic covering layer perpendicular to the extending direction of the holes.
Optionally, the heat generating film is made of metal or alloy; and/or the thickness of the heating film is 2-10 μm.
In order to solve the above technical problem, the utility model discloses a still another technical scheme be: there is provided an electronic atomising device comprising a reservoir for storing a liquid smoke and an atomising core according to the previous paragraph, the liquid smoke in the reservoir being transferable to the ceramic cover layer via the porous ceramic substrate.
The utility model has the advantages that: different from the prior art, the embodiment of the utility model combines the ceramic covering layer with porosity lower than that of the porous ceramic substrate on the surface of the porous ceramic substrate close to the heating element, and the ceramic covering layer with lower porosity has higher density and does not have the powder falling phenomenon, so that the powder falling phenomenon of the atomizing core can be prevented; moreover, the ceramic covering layer with low porosity can isolate the precipitation of heavy metals in the porous ceramic substrate, so that the heavy metals can be prevented from being brought into airflow during suction, and the safety performance of the electronic atomization device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic cross-sectional view of an atomizing core in an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the atomizing core of FIG. 1 taken along the direction I-I;
fig. 3 is a partially enlarged schematic view of a cross-sectional structure of an atomizing core in another embodiment of the present invention;
fig. 4 is a schematic flow chart of a method for manufacturing an atomizing core according to an embodiment of the present invention;
FIG. 5 is a schematic view of a process flow corresponding to the fabrication flow of FIG. 4;
FIG. 6 is a flowchart illustrating step S104 in FIG. 4;
fig. 7 is a schematic flow chart of a method of making an atomizing core in another embodiment of the present invention;
fig. 8 is a schematic view of a processing flow corresponding to the manufacturing flow of fig. 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an atomizing core according to an embodiment of the present invention. The utility model provides an electronic atomization device's atomizing core 100, this atomizing core 100 includes porous ceramic substrate 10, ceramic overburden 20 and heating film 30. The ceramic cover layer 20 is combined on the surface of the porous ceramic substrate 10, the heat generating film 30 is combined on the surface of the ceramic cover layer 20 far away from the porous ceramic substrate 10, the porosity of the ceramic cover layer 20 is lower than that of the porous ceramic substrate 10, and a plurality of through holes 21 are formed on the ceramic cover layer 20.
The porosity is a ratio of a total volume of the micro voids in the porous medium to a total volume of the porous medium. The ceramic cover layer 20 is bonded to the surface of the porous ceramic substrate 10, specifically, the ceramic cover layer 20 is bonded to the surface of the porous ceramic substrate 10 close to the heat generating element, so as to prevent the porous ceramic substrate 10 from directly contacting the heat generating element. As shown in fig. 1, in the present embodiment, a ceramic cover layer 20 is bonded on the upper surface of a porous ceramic substrate 10.
The embodiment of the utility model provides a through combine a porosity to be less than the ceramic overburden 20 of porous ceramic substrate 10 on the surface that is close to the heating element of porous ceramic substrate 10, because the ceramic overburden 20 that the porosity is lower has higher density and does not have the phenomenon of falling powder, so can prevent that atomizing core 100 from taking place the phenomenon of falling powder; moreover, the ceramic covering layer 20 with low porosity can isolate the precipitation of heavy metals in the porous ceramic substrate 10, so that the heavy metals can be prevented from being brought into airflow during suction, and the safety performance of the electronic atomization device is improved.
Alternatively, the material for forming the porous ceramic substrate 10 may be zirconia, silica, alumina, mullite, or the like, and the material for forming the ceramic covering layer 20 may be zirconia, silica, alumina, silicon carbide, mullite, or the like. The material of the porous ceramic substrate 10 may be the same as or different from the material of the ceramic cover layer 20, and the embodiment of the present invention does not limit the types of the material of the porous ceramic substrate 10 and the material of the ceramic cover layer 20.
Alternatively, the porosity of the porous ceramic substrate 10 may be 40% to 80%. The porosity can be adjusted according to the components of the tobacco juice, for example, when the viscosity of the tobacco juice is high, the porosity is high, so that the liquid guiding effect is ensured.
In the present embodiment, the porosity of the porous ceramic substrate 10 is 50 to 60%. By controlling the porosity of the porous ceramic substrate 10 to be 50-60%, on one hand, the porous ceramic substrate 10 can be ensured to have better liquid guiding efficiency, and the phenomenon of dry burning caused by unsmooth smoke liquid circulation is prevented, so that the atomization effect is improved. On the other hand, the porous ceramic substrate 10 can avoid the phenomenon that the liquid is difficult to lock because of too fast liquid guiding, and the probability of liquid leakage is greatly increased.
Alternatively, the average pore diameter of the micropores on the porous ceramic substrate 10 is 10 μm to 40 μm. For example, the thickness may be 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, or 40 μm, and the embodiment of the present invention is not particularly limited.
Above optional embodiment, through setting up the aperture that the size is suitable, the micropore that distributes evenly can make porous ceramic substrate 10 drain even, and the atomization effect is better.
Optionally, the porous ceramic substrate 10 has a thickness of 1-4 mm. Here, the thickness of the porous ceramic substrate 10 refers to the length of the porous ceramic substrate 10 in the stacking direction of the porous ceramic substrate 10 and the ceramic cover layer 20. In this example, the lamination direction of the porous ceramic substrate 10 and the ceramic cover layer 20 is the X direction shown in FIG. 1, and the thickness H of the porous ceramic substrate 10 in the X direction is 1 to 4 mm. By arranging the porous ceramic substrate 10 with proper thickness, the liquid guide path can be shortened, and the liquid discharging is smooth; on the other hand, the phenomenon of dry burning can be avoided.
Optionally, the thickness H of the porous ceramic substrate 10 in the X direction may be 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, or 4mm, etc., and the embodiment of the present invention is not particularly limited.
Optionally, the ceramic blanket 20 has a porosity of 10% to 20%. In the same atomizing core 100, the porosity of the ceramic cover layer 20 is lower than that of the porous ceramic substrate 10, and thus a dense ceramic cover layer 20 is formed on the surface of the porous ceramic substrate 10. In one embodiment, the porosity of the ceramic blanket 20 may be 10-18%, 10-16%, 10-14%, 10-12%, 12-18%, 12-16%, 12-14%, 14-16%, 14-18%, 16-18%, or the like. In another embodiment, the porosity of the porous ceramic substrate 10 is 50-60% and the porosity of the ceramic overlay layer 20 is 14-16%.
Optionally, the ceramic blanket 20 has a thickness of 0.05-0.2 mm. Here, the thickness of the ceramic cover layer 20 refers to the length of the ceramic cover layer 20 in the stacking direction of the porous ceramic substrate 10 and the ceramic cover layer 20. In this example, the lamination direction of the porous ceramic substrate 10 and the ceramic cover layer 20 is the X direction shown in FIG. 1, and the thickness R of the ceramic cover layer 20 in the X direction is 0.05 to 0.2 mm. For example, the thickness R of the ceramic covering layer 20 in the X direction may be 0.05mm, 0.07mm, 0.09mm, 0.11mm, 0.13mm, 0.15mm, 0.17mm, or 0.2mm, etc., and the embodiment of the present invention is not particularly limited.
Alternatively, the powder particle size of the material used to form the ceramic blanket 20 is 0.1-5 μm. Wherein, the powder particle size is also called particle size, which refers to the dimension of the space occupied by the particles. For a spherical particle, the powder particle size is the single parameter: the diameter D. For an irregularly shaped particle, the powder particle size can be expressed in terms of projected height H (arbitrary), maximum length M, horizontal width W, diameter of spheres of equal volume, or diameter D of spheres of equal surface area.
Alternatively, the powder particle size of the material for forming the ceramic covering layer 20 may be 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, or 4 μm, etc., and the embodiment of the present invention is not particularly limited.
In the above alternative embodiment, by providing the ceramic covering layer 20 with a suitable thickness, the pore size of the micropores with a suitable size and uniform distribution, and the raw material with a smaller powder particle size, the ceramic covering layer 20 can effectively isolate the heavy metals from being sucked out.
Further, as shown in fig. 1 and 2, fig. 2 is a schematic sectional view of the atomizing core of fig. 1 taken along the direction I-I. Each of the pores 21 formed on the ceramic blanket 20 has a diameter of 5 to 50 μm. For example, the diameter of the hole 21 may be 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm, and the embodiment of the present invention is not limited in particular. It should be noted that the pores 21 on the ceramic covering layer 20 do not belong to the tiny voids in the porous medium, and the existence of the pores 21 does not affect the porosity of the ceramic covering layer 20; in other words, the porosity of the ceramic blanket 20 is independent of the plurality of pores 21 formed in the ceramic blanket 20.
Specifically, a plurality of pores 21 are formed in the ceramic cover layer 20, and each pore 21 penetrates through the ceramic cover layer 20 in the lamination direction of the porous ceramic substrate 10 and the ceramic cover layer 20. The ceramic coating 20 can be easily drained by forming a plurality of through holes 21 in the ceramic coating 20.
Alternatively, the diameters of the plurality of holes 21 formed on the same ceramic covering layer 20 may be equal or different, and the embodiment of the present invention is not limited in particular.
In the present embodiment, as shown in fig. 2, a plurality of holes 21 are arranged in an array on the ceramic cover layer 20. In another embodiment, the plurality of holes 21 may also be distributed in a ring shape, and the embodiment of the present invention does not specifically limit the arrangement manner of the plurality of holes 21.
Alternatively, in the present embodiment, the holes 21 formed on the ceramic cover layer 20 are circular holes. In other embodiments, the shape of the hole 21 may also be a rectangle, an ellipse, a triangle, a diamond, a regular or irregular polygon, etc., and the embodiment of the present invention is not limited specifically.
Further, the sum of the areas of the openings of the plurality of holes 21 accounts for 5% to 15% of the area of the cross section of the ceramic cover layer 20 perpendicular to the extending direction of the holes 21. For example, the ratio of the sum of the areas of the openings of the plurality of holes 21 to the area of the cross section of the ceramic covering layer 20 perpendicular to the extending direction of the holes 21 may be 5 to 12%, 5 to 10%, 5 to 8%, 7 to 12%, 7 to 10%, 9 to 12%, 10 to 12%, 7 to 15%, 9 to 15%, 12 to 15%, or 14 to 15%, and the like, and the embodiment of the present invention is not particularly limited.
Specifically, in the present embodiment, as shown in fig. 1, the extending direction of the hole 21 is the axial direction of the circular hole, and the axial direction of the circular hole is parallel to the X direction. Therefore, the cross section of the ceramic cover layer 20 perpendicular to the extending direction of the holes 21 refers to the cross section of the ceramic cover layer 20 perpendicular to the X direction, i.e., the cross section as shown in fig. 2. The sum of the areas of the openings of the plurality of holes 21 is the area of the blank region shown in the figure, and the ratio of the sum of the areas of the openings of the plurality of holes 21 to the area of the cross section of the ceramic cover layer 20 perpendicular to the extending direction of the holes 21 is the ratio of the area of the blank region to the area of the entire cross section in fig. 2.
Further, as shown in fig. 1, a heat generating film 30 is bonded to the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10, the heat generating film 30 being for electrical connection with the electrodes and for generating heat to atomize the liquid smoke.
Alternatively, the thickness of the heat generating film 30 may be 2 to 10 μm. The thickness of the heater film 30 is the length of the heater film 30 in the direction in which the porous ceramic substrate 10 and the ceramic cover layer 20 are stacked. As shown in fig. 1, the thickness of the heat generating film 30 is L, wherein the thickness L may be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm, or 10 μm, and the embodiment of the present invention is not limited thereto.
Alternatively, as shown in fig. 3, fig. 3 is a partially enlarged schematic view of a cross-sectional structure of an atomizing core in another embodiment of the present invention. The heat generating film 30 may include a first cover film 32 and a second cover film 34. The first cover film 32 is laminated on the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10, and the second cover film 34 is laminated on the surface of the first cover film 32 away from the ceramic cover layer 20.
The first cover film 32 may be a metal or an alloy. In order to improve the bonding force between the first cover film 32 and the porous ceramic substrate 10, the material of the first cover film 32 may be selected to have a stable bonding force with the porous ceramic substrate 10. For example, the first cover film 32 may be titanium, zirconium, a titanium-aluminum alloy, a titanium-zirconium alloy, a titanium-molybdenum alloy, a titanium-niobium alloy, an iron-aluminum alloy, a tantalum-aluminum alloy, or the like.
The titanium-zirconium alloy film itself made of titanium-zirconium alloy is a partially dense film, but since the porous ceramic substrate 10 itself is a porous structure, the titanium-zirconium alloy film formed on the surface of the porous ceramic substrate 10 also becomes a porous continuous structure, and the pore size distribution of the titanium-zirconium alloy film is slightly smaller than the pore size of the micropores on the surface of the porous ceramic substrate 10.
Further, because the stability of the titanium and zirconium in the titanium-zirconium alloy film in the air is poor at high temperature, the zirconium is easy to absorb hydrogen, nitrogen and oxygen, and the air-absorbing property of the alloyed zirconium and titanium is better, when an electrode is prepared subsequently, a severe oxidation reaction occurs during high-temperature sintering (above 300 ℃) due to the air-absorbing property of the titanium-zirconium alloy, so that the resistance of the first cover film 32 changes abruptly. In order to avoid the contact between the first cover film 32 and air, a protective layer needs to be formed on the surface of the first cover film 32. The second cover film 34 can be used as a protection layer.
The second cover film 34 may also be a metal or an alloy. In order to prevent the first cover film 32 from being oxidized due to contact with air to cause resistance sudden change, the second cover film 34 should be made of a material with strong oxidation resistance. For example, the second cover film 34 may be platinum, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, palladium-silver alloy, gold-platinum alloy, or the like.
The protective layer formed by silver and platinum is loose and has poor compactness, so that air is difficult to completely isolate. Although gold can protect the titanium zirconium alloy film well, on one hand, because a dense protective layer needs to be formed to have a thickness of about 100nm or more, the resistance of the whole heating element is greatly reduced, and in addition, the cost is high. Therefore, in the embodiment, the gold-silver alloy is adopted, so that the compactness of the gold protective layer is maintained, the cost is reduced, and after the gold-silver alloy is alloyed according to a certain proportion, the resistivity of the gold-silver alloy is improved by ten times, so that the resistance value of the whole heating element is more favorably controlled.
Further, the present invention also provides a method for preparing the atomizing core of the electronic atomizing device, which can be used for preparing and forming the atomizing core 100 in the above embodiments. As shown in fig. 4 and 5, fig. 4 is a schematic flow chart of a method for preparing an atomizing core according to an embodiment of the present invention, and fig. 5 is a schematic flow chart of a processing process corresponding to the manufacturing flow chart in fig. 4. The method of making the atomizing core 100 includes the steps of:
step S101: a porous ceramic substrate 10 is prepared.
First, a raw material for forming the porous ceramic substrate 10, which may be zirconia, silica, alumina, mullite, or the like, is made into a first casting slurry, and at least one of the above raw materials is mixed to form the first casting slurry.
Then, the first casting slurry is cast by a casting process to make the porous ceramic substrate 10. In addition, the casting time can be controlled so that the thickness of the porous ceramic substrate 10 is 1 to 4 mm.
Step S102: preparing a ceramic cover layer 20, and forming a plurality of pores on the ceramic cover layer 20, wherein the porosity of the ceramic cover layer 20 is lower than that of the porous ceramic substrate 10.
First, a raw material for forming the ceramic blanket 20 is made into a second casting slurry. Among them, the material for forming the ceramic covering layer 20 may be zirconia, silica, alumina, silicon carbide, mullite, or the like, and the powder particle size of the material for forming the ceramic covering layer 20 is 0.1 to 5 μm. At least one of the above raw materials is mixed to form a second casting slurry.
Then, in one embodiment, the second casting slurry may be cast into the ceramic blanket 20 by a casting process. In addition, the casting time can be controlled so that the thickness of the ceramic blanket 20 is 0.05 to 0.2 mm.
Alternatively, in another embodiment, the second casting slurry may be pressed to form the ceramic blanket 20 through a dry pressing process, and the embodiment of the present invention is not particularly limited.
After the ceramic coating 20 is formed, a plurality of holes penetrating the ceramic coating 20 need to be formed in the ceramic coating 20. Wherein, the diameter of each hole 21 is 5-50 μm, and the sum of the areas of the holes 21 accounts for 5-15% of the area of the cross section of the ceramic covering layer 20 perpendicular to the extending direction of the holes 21.
Specifically, a plurality of holes 21 penetrating through the ceramic covering layer 20 may be directly formed on the ceramic covering layer 20 by means of laser drilling, CNC (computer Numerical Control) precision drilling, selective etching and pore forming, and the like. By directly forming the through holes penetrating through the ceramic covering layer 20 on the ceramic covering layer 20, the drilling manner is simple, and the depth consistency of the holes 21 on the molded atomizing core 100 is high.
Alternatively, the diameters of the plurality of holes 21 formed in the same ceramic covering layer 20 may be equal or different. The shape of the holes 21 formed on the ceramic covering layer 20 may be circular, rectangular, oval, triangular, rhombic, and regular or irregular polygonal holes, etc., and the embodiment of the present invention is not limited specifically.
In the above embodiment, the porous ceramic substrate 10 is prepared, and then the ceramic cover layer 20 is prepared. It is understood that in another embodiment, the ceramic overlay 20 may be prepared first, and then the porous ceramic substrate 10 may be prepared. Alternatively, in another embodiment, the ceramic cover layer 20 and the porous ceramic substrate 10 may be prepared simultaneously, and the embodiment of the present invention is not particularly limited.
After steps S101 and S102 are performed to obtain the porous ceramic substrate 10 and the ceramic cover layer 20, the following steps are performed:
step S103: the porous ceramic substrate 10 and the ceramic cover layer 20 are stacked and integrated into a single structure.
Specifically, in one embodiment, the ceramic cover layer 20 may be stacked on one side of the porous ceramic substrate 10, and the ceramic cover layer 20 and the porous ceramic substrate 10 may be fixed by adhesion.
In this embodiment, the ceramic cover layer 20 may be stacked on one side of the porous ceramic substrate 10, and the porous ceramic substrate 10 and the ceramic cover layer 20 may be connected by sintering.
Wherein, sintering means that at high temperature (not higher than melting point), the solid particles of the ceramic green body are mutually bonded, crystal grains grow up, gaps (air holes) and grain boundaries gradually decrease, the total volume is shrunk and the density is increased through the transmission of substances, and finally, the ceramic green body becomes a compact polycrystalline sintered body with a certain microstructure. In this embodiment, the ceramic covering layer 20 and the porous ceramic substrate 10 are connected by sintering, and no harmful substance is generated, so that the safety performance of the atomizing core 100 can be improved.
Referring to fig. 4 and fig. 5, in the present embodiment, after step S103 is performed to obtain the porous ceramic substrate 10 and the ceramic cover layer 20 with an integrated structure, the method further includes:
step S104: the heat generating film 30 is formed on the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10.
Wherein, the thickness of the heating film is 2-10 μm. Alternatively, the heat generating film 30 may be formed on the ceramic cover layer 20 by physical vapor deposition, electroplating, electrodeposition, ion plating, spray coating, chemical vapor deposition, or the like. The heating film 30 with the advantages of thin thickness, large area and uniform distribution can be formed by the above modes, so that when the heating film 30 is electrically connected with the electrode, the heating film 30 can generate heat uniformly, the heating area is large, and the heat utilization rate is high; but also can greatly reduce the suction of the heavy metal in the atomizing core 100, thereby improving the safety performance.
Optionally, in an embodiment, as shown in fig. 3 and fig. 6, fig. 6 is a schematic flowchart of step S104 in fig. 4. The step of forming the heat generating film 30 on the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10 includes:
step S201: a first cover film 32 is formed on the surface of the ceramic cover layer 20 remote from the porous ceramic substrate 10.
The first cover film 32 may be a metal or an alloy. The first cover film 32 may be made of a material having a strong bonding force with the porous ceramic substrate 10. For example, the first cover film 32 may be titanium, zirconium, a titanium-aluminum alloy, a titanium-zirconium alloy, a titanium-molybdenum alloy, a titanium-niobium alloy, an iron-aluminum alloy, a tantalum-aluminum alloy, or the like.
Step S202: a second cover film 34 is formed on the surface of the first cover film 32 remote from the ceramic cover layer 20.
The second cover film 34 may also be a metal or an alloy. The second cover film 34 can be made of a material with strong oxidation resistance. For example, the second cover film 34 may be platinum, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, palladium-silver alloy, gold-platinum alloy, or the like.
Alternatively, the first cover film 32 and the second cover film 34 may be formed on the surface of the ceramic covering layer 20 away from the porous ceramic substrate 10 in sequence by PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), electroplating, electrodeposition, ion plating, or spraying. The first cover film 32 and the second cover film 34 formed by the above method have small thickness, large area and uniform distribution, so that when the heating film 30 is electrically connected with the electrode, the heating film 30 can generate heat uniformly, the heating area is large, and the heat utilization rate is high; but also can greatly reduce the suction of the heavy metal in the atomizing core 100, thereby improving the safety performance.
In another embodiment, please refer to fig. 7 and 8, fig. 7 is a schematic flow chart of a method for preparing an atomizing core according to another embodiment of the present invention, and fig. 8 is a schematic flow chart of a processing process corresponding to the manufacturing flow chart of fig. 7. The method of making the atomizing core 100 in this embodiment includes:
step S301: a porous ceramic substrate 10 is prepared.
Step S302: preparing a ceramic cover layer 20, wherein the porosity of the ceramic cover layer 20 is lower than the porosity of the porous ceramic substrate 10.
Step S303: the porous ceramic substrate 10 and the ceramic cover layer 20 are stacked and integrated into a single structure.
Step S304: a plurality of holes 21 are formed in the ceramic blanket 20.
Step S305: the heat generating film 30 is formed on the surface of the ceramic cover layer 20 away from the porous ceramic substrate 10.
Step S301 is substantially the same as step S101 in the above embodiment, step S303 is substantially the same as step S103 in the above embodiment, and step S305 is substantially the same as step S104 in the above embodiment, please refer to the description in the above embodiment, and the description thereof is omitted here. The present embodiment differs from the above embodiments in that: in the present embodiment, the plurality of pores 21 formed in the ceramic cover layer 20 are not formed at the time of preparing the ceramic cover layer 20, but are formed by punching a side of the ceramic cover layer 20 after the porous ceramic substrate 10 and the ceramic cover layer 20 are combined into an integrated structure.
In this embodiment, when the drilling is performed, it is necessary to first set the depth of the drilling to be equal to the thickness of the ceramic cover layer 20, and then drill a hole from the side of the ceramic cover layer 20 to form a plurality of blind holes in the porous ceramic substrate 10 and the ceramic cover layer 20 of the integrated structure. The manner of punching and the size of the holes are the same as those in the above embodiments, please refer to the description in the above embodiments.
The utility model also provides an electronic atomization device, electronic atomization device is including stock solution chamber and the atomizing core that is used for saving the tobacco juice, and the tobacco juice in the stock solution chamber can transmit to ceramic coating through the porous ceramic substrate.
The structure of the atomizing core in this embodiment is the same as that of the atomizing core in the above embodiment, please refer to the description in the above embodiment, and details are not repeated here.
In summary, it is easily understood by those skilled in the art that by combining a ceramic covering layer 20 with a porosity lower than that of the porous ceramic substrate 10 on the surface of the porous ceramic substrate 10 close to the heating element, the ceramic covering layer 20 with a lower porosity has a higher density and does not have a powder falling phenomenon, so that the powder falling phenomenon of the atomizing core 100 can be prevented; moreover, the ceramic covering layer 20 with low porosity can isolate the precipitation of heavy metals in the porous ceramic substrate 10, so that the heavy metals can be prevented from being brought into airflow during suction, and the safety performance of the electronic atomization device is improved.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (7)
1. An atomizing core of an electronic atomizing device, comprising: the heating film is combined on the surface of the ceramic covering layer far away from the porous ceramic substrate, the porosity of the ceramic covering layer is lower than that of the porous ceramic substrate, and a plurality of through holes are formed in the ceramic covering layer.
2. The atomizing core of claim 1, wherein the porous ceramic substrate has a porosity of 40% to 80%; and/or
The average pore diameter of micropores on the porous ceramic substrate is 10-40 μm; and/or
The material for forming the porous ceramic substrate is zirconia, silica, alumina or mullite; and/or
The thickness of the porous ceramic substrate is 1-4 mm.
3. The atomizing core of claim 1, wherein the ceramic cover layer has a porosity of 10% to 20%; and/or
The material for forming the ceramic covering layer is zirconium oxide, silicon oxide, aluminum oxide, silicon carbide or mullite; and/or
The thickness of the ceramic covering layer is 0.05-0.2 mm; and/or
The powder particle size of the material for forming the ceramic coating layer is 0.1 to 5 μm.
4. The atomizing core of any one of claims 1 to 3, wherein each of the holes has a diameter of from 5 to 50 μm.
5. The atomizing core according to claim 4, characterized in that the ratio of the sum of the areas of the openings of the plurality of holes to the area of the cross section of the ceramic covering layer perpendicular to the direction of extension of the holes is 5% to 15%.
6. The atomizing core according to claim 1, wherein the heat generating film is made of metal or alloy; and/or
The thickness of the heating film is 2-10 mu m.
7. An electronic atomization device, which is characterized by comprising a liquid storage cavity for storing smoke liquid and an atomization core according to any one of claims 1-6, wherein the smoke liquid in the liquid storage cavity can be transferred to the ceramic covering layer through the porous ceramic substrate.
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| CN201922140170.0U CN211746958U (en) | 2019-12-02 | 2019-12-02 | Electronic atomization device and atomization core thereof |
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| CN111053291A (en) * | 2019-12-02 | 2020-04-24 | 深圳麦克韦尔科技有限公司 | Electronic atomization device, atomization core and preparation method of atomization core |
| CN114190613A (en) * | 2022-01-04 | 2022-03-18 | 美满芯盛(杭州)微电子有限公司 | MEMS silicon-based atomizing core with micro-channel structure and manufacturing method thereof |
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