CN211656745U - An electronic device cooling base - Google Patents

Abstract

The utility model discloses a heat dissipation base for an electronic device, comprising a heat dissipation structure (10), a heat conduction plate (3) installed on the heat dissipation structure (10), a base plate (2) installed on the heat conduction plate (3), and a connection A heat dissipation component on one end of the heat dissipation structure (10); the upper end of the heat dissipation structure (10) is provided with a number of heat dissipation cavities (13), and the lower end is provided with a number of heat dissipation fins (14), two adjacent heat dissipation fins (14) Air exhaust channels are formed between the fins (14). When the utility model is used, the electronic device is installed on the base plate, the heat generated during the operation of the electronic device is transmitted to the heat dissipation structure through the heat conduction plate, the battery supplies power to the fan, and the fan blows air into the heat dissipation cavity and exhaust of the heat dissipation structure. The air is discharged through the heat dissipation cavity and the air exhaust channel, and the air continuously dissipates the heat transmitted to the heat dissipation structure in the process of flowing, thereby reducing the working temperature of the electronic device.

Description

An electronic device cooling base

technical field

The utility model relates to a heat dissipation base, in particular to a heat dissipation base for electronic devices.

Background technique

With the development of integration technology and microelectronic packaging technology, the total power density of electronic components continues to increase, while the physical size of electronic components and electronic equipment gradually tends to be small and miniaturized, and the generated heat accumulates rapidly, leading to integrated The heat flux density around the device is also increasing, which will inevitably affect the performance of electronic components and equipment in a high temperature environment. Therefore, the heat dissipation of electronic components is a major focus at present.

Utility model content

The purpose of the present invention is to solve the above problems and provide an electronic device heat dissipation base that can accelerate the heat dissipation of the electronic device.

The purpose of the present utility model is achieved through the following technical solutions: a heat dissipation base for an electronic device, comprising a heat dissipation structure, a heat conduction plate installed on the heat dissipation structure, a base plate installed on the heat dissipation plate, and a heat dissipation component connected to one end of the heat dissipation structure The upper end of the heat dissipation structure is provided with several heat dissipation cavities, and the lower end is provided with several heat dissipation fins, and an air exhaust channel is formed between two adjacent heat dissipation fins, and the air exhaust channels are communicated through the communication cavity.

Further, the heat dissipation component includes a fan installation cavity connected to one end of the heat dissipation structure, a battery installation cavity disposed above the fan installation cavity, a battery installed in the battery installation cavity, and a fan installed in the fan installation cavity; The battery is electrically connected to the fan.

The battery installation cavity and the fan installation cavity communicate with each other through ventilation holes.

The air inlet end of the fan installation cavity is provided with a filter screen.

Several connecting plates are arranged on the lower surface of the base plate, and the connecting plates are inserted into the heat conducting plate.

The upper end of the heat dissipation structure is provided with two baffle plates opposite to each other, and the base plate and the heat conduction plate are installed between the two baffle plates.

The base plate and the baffle are fixedly connected by fixing bolts.

The thermally conductive plate is a silica gel plate.

Compared with the prior art, the utility model has the following advantages and beneficial effects: when the utility model is used, the electronic device is installed on the base plate, the heat generated during the operation of the electronic device is transmitted to the heat dissipation structure through the heat conduction plate, and the battery provides The fan is powered, the fan blows the air into the heat dissipation cavity and the exhaust channel on the heat dissipation structure, and then discharges through the heat dissipation cavity and the exhaust channel. Thereby reducing the operating temperature of the electronic device. The heat-conducting plate of the utility model is a silica gel plate, and its heat-conducting performance is better. The battery installation cavity and the fan installation cavity of the present invention are connected by ventilation holes, so the heat generated by the operation of the battery is also expelled by the fan, which can better achieve temperature removal.

Description of drawings

Figure 1 is a cross-sectional view of the utility model.

FIG. 2 is a schematic diagram of the connection between the substrate and the heat-conducting plate of the present invention.

3 is a cross-sectional view of the heat dissipation structure of the present invention.

FIG. 4 is a cross-sectional view at A-A of the present invention.

The reference signs in the above drawings are: 1—electronic device, 2—substrate, 3—heat-conducting plate, 4—battery, 5—battery installation cavity, 6—ventilation hole, 7—filter screen, 8—fan, 9— Fan installation cavity, 10—heat dissipation structure, 11—connecting plate, 12—baffle plate, 13—radiation cavity, 14—radiation fin, 15—communication cavity, 16—fixing bolt.

Detailed ways

The present utility model will be further described in detail below with reference to the examples, but the embodiments of the present utility model are not limited thereto.

Example

As shown in FIG. 1 , the heat dissipation base of the electronic device of the present invention includes a heat dissipation structure 10 , a heat conduction plate 3 , a base plate 2 and a heat dissipation component. Specifically, the heat-conducting plate 3 is installed on the heat-dissipating structure 10 , the substrate 2 is installed on the heat-conducting plate 3 , and the heat-dissipating component is connected to one end of the heat-dissipating structure 10 . When in use, the electronic device 1 is mounted on the substrate 2, and the substrate 2 is an aluminum substrate.

In order to better dissipate the heat generated by the working of the electronic device, as shown in FIG. 3 , the upper end of the heat dissipation structure 10 is provided with a number of heat dissipation cavities 13 , and the lower end thereof is provided with a number of heat dissipation fins 14 . An exhaust channel is formed between two adjacent heat dissipation fins 14 , and the exhaust channels are communicated through a communication cavity 15 . During installation, the heat-conducting plate 3 is installed on the heat-dissipating structure 10 and is in contact with the upper surface of the heat-dissipating structure 10 . Therefore, the heat generated by the electronic device 1 is transferred to the heat-dissipating structure 10 through the substrate 2 and the heat-conducting plate 3 in sequence. In this embodiment, the heat-conducting plate 3 is a silica gel plate, which has good heat-conducting performance and can better transfer heat to the heat-dissipating structure 10 to improve the heat-dissipating effect.

Further, as shown in FIG. 1 , the heat dissipation component includes a fan installation cavity 9 connected to one end of the heat dissipation structure 10 , a battery installation cavity 5 disposed above the fan installation cavity 9 , and a battery 4 installed in the battery installation cavity 5 . , and the fan 8 installed inside the fan installation cavity 9 . The battery 4 is electrically connected to the fan 8 for supplying power to the fan 8; the fan installation cavity 9 is communicated with the heat dissipation structure 10, so the fan 8 can blow air into the heat dissipation cavity 13 and the exhaust passage on the heat dissipation structure 10 when working .

As shown in FIG. 1 , the battery installation cavity 5 is communicated with the fan installation cavity 9 through the ventilation hole 6. When the fan 8 is working, the heat generated by the battery 4 is discharged out of the fan installation cavity 9 through the ventilation hole 6. and be discharged, thereby reducing the operating temperature of the battery 4 .

As shown in FIG. 1 , the air inlet end of the fan installation cavity 9 is provided with a filter screen 7 , and the filter screen 7 can filter the dust in the air to prevent the dust from entering the fan installation cavity 9 . The filter screen 7 is detachably installed on the air inlet end of the fan installation cavity 9, so as to clean the filter screen. The detachable installation method of the filter screen is common in real life, and will not be described in detail here.

As shown in FIG. 2 , several connecting plates 11 are disposed on the lower surface of the base plate 2 , and the connecting plates 11 are inserted into the heat conducting plate 3 . In this way, the contact area between the substrate 2 and the connecting plate 11 can be increased, and the heat transfer efficiency can be improved.

As shown in FIG. 4 , two baffles 12 are oppositely disposed on the upper end of the heat dissipation structure, and the base plate 2 and the heat conducting plate 3 are installed between the two baffles 12 . Specifically, the base plate 2 and the baffle plate 12 are fixedly connected by fixing bolts 16 . In this way, the base plate and the heat conducting plate 3 can be well mounted on the heat dissipation structure.

When in use, the electronic device 1 is installed on the substrate 2, the heat generated during the operation of the electronic device 1 is transmitted to the heat dissipation structure 10 through the heat conduction plate 3, the battery 4 supplies power to the fan 8, and the fan 8 blows air into the heat dissipation structure 10. The heat dissipation cavity 13 and the air exhaust channel are exhausted through the heat dissipation cavity 13 and the exhaust air channel, and the air continuously dissipates the heat transmitted to the heat dissipation structure 10 during the flow process, thereby reducing the working temperature of the electronic device.

As described above, the present invention can be well realized.

Claims (8)

1. A heat-dissipating base for an electronic device, characterized in that it comprises a heat-dissipating structure (10), a heat-conducting plate (3) installed on the heat-dissipating structure (10), a substrate (2) installed on the heat-conducting plate (3), and A heat dissipation component connected to one end of the heat dissipation structure (10); the upper end of the heat dissipation structure (10) is provided with a plurality of heat dissipation cavities (13), and the lower end thereof is provided with a plurality of heat dissipation fins (14), two adjacent fins (14). Air exhaust channels are formed between the radiating fins (14), and the air exhaust channels communicate with each other through a communication cavity (15). 2. An electronic device heat dissipation base according to claim 1, wherein the heat dissipation component comprises a fan installation cavity (9) connected to one end of the heat dissipation structure (10), and is arranged in the fan installation cavity (9) The upper battery installation cavity (5), the battery (4) installed in the battery installation cavity (5), and the fan (8) installed in the fan installation cavity (9); the battery (4) and the fan (8) ) electrical connection. 3 . The heat dissipation base of an electronic device according to claim 2 , wherein the battery installation cavity ( 5 ) and the fan installation cavity ( 9 ) communicate with each other through ventilation holes ( 6 ). 4 . 4. A heat dissipation base for electronic devices according to claim 3, characterized in that, a filter screen (7) is provided at the air inlet end of the fan installation cavity (9). 5. A heat dissipation base for an electronic device according to any one of claims 1 to 4, wherein a plurality of connecting plates (11) are provided on the lower surface of the base plate (2), and the connecting plates ( 11) Insert into the heat conducting plate (3). 6 . The heat dissipation base of an electronic device according to claim 5 , wherein two baffle plates ( 12 ) are oppositely arranged on the upper end of the heat dissipation structure, and the base plate ( 2 ) and the heat conduction plate ( 3 ) are opposite to each other. 7 . Installed between two baffles (12). 7 . The heat dissipation base of an electronic device according to claim 6 , wherein the base plate ( 2 ) and the baffle plate ( 12 ) are fixedly connected by fixing bolts ( 16 ). 8 . 8 . The heat dissipation base of an electronic device according to claim 7 , wherein the heat conducting plate ( 3 ) is a silica gel plate. 9 .

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