CN211632034U - Metal reflective hollowed-out mosaic structure ornament of crystal diamond, crystal bead or crystal pendant - Google Patents

Abstract

The utility model discloses a crystal diamond or crystal bead or crystal pendant metal reflection hollow-out embedded structure ornament, which comprises a crystal diamond, wherein a bottoming reflection conductive layer and a metal outer layer are sequentially attached to the outer surface of the crystal diamond to form a semi-finished product, and the semi-finished product is provided with a plurality of hollow-out pattern structures aiming at an embedded carrier consisting of the bottoming reflection conductive layer and the metal outer layer, so that part of the surface of the crystal diamond is exposed through the hollow-out pattern structures to form the ornament with metal level texture; the advantage is because every layer of inlaying the carrier is set up by the parcel type, therefore will not damage the surface of the rhinestone; because all layers of the inlaid carrier are sequentially and closely arranged, clothes and the like cannot be hooked, and skin cannot be scratched; the rhinestone is fixed by the embedded carrier and cannot fall off; no gap is reserved between the embedding carrier and the rhinestone, so that dirt and dirt can not be hidden; the arrangement of each layer of the embedded carrier does not need a mould and is not influenced by the appearance of the rhinestone; and the metal outer layer does not need polishing and grinding treatment, so that the production cost is low.

Description

A rhinestone or crystal bead or crystal pendant metal reflective openwork inlay structure ornament

technical field

The utility model relates to an ornament, in particular to a metal reflective hollow inlay structure ornament of a rhinestone or a crystal bead or a crystal pendant.

Background technique

Various shapes of rhinestones, crystal beads, and crystal pendants have basically the same composition and production method. Most of them are pressed and ground to produce diamond facets or smooth surfaces. At the same time, they can also be used as accessories for accessories. Rhinestones, also known as crystal diamonds and rhinestones, are mainly composed of crystal glass, which is an accessory accessory obtained by cutting artificial crystal glass into diamond facets. This material is more economical and has a diamond-like visual effect. dazzling feeling, so very popular.

Rhinestones are generally not used alone. They are often used after processing metal decoration or in combination after welding required metal accessories. They are usually fixed on metal brackets or in metal edging to form rhinestone ornaments, which are applied to various products. Such as clothing, hairpins, necklaces, etc., rhinestone setting methods include claw setting, bezel setting, channel setting, track setting, card setting and so on. Rhinestone ornaments applied to clothing and hairpins usually include metal brackets and rhinestones. The metal bracket has a concave cavity that matches the bottom of the rhinestones. A plurality of claw buckles are evenly arranged around the metal bracket, and the bottom surface of the rhinestones is plated with rhinestones. There is a silver layer, an aluminum layer or a titanium layer as a reflective layer to increase the visual effect of the rhinestone. When installing, insert the bottom of the rhinestone into the cavity, and press the claws to fasten the front of the rhinestone. However, this rhinestone jewelry has the following problems: 1) the front of the rhinestone may be damaged when the claw buckle is pressed by an external force, making the rhinestone jewelry scrap; 2) the free end of the claw buckle is easy to hook clothes, etc., which will not only lift the claw buckle , the rhinestone will shake, and it will damage the clothes, and even hurt the user's skin; 3) Since the claw buckle is too large, the rhinestone cannot be embedded, so the claw buckle is generally designed to be thinner or smaller to leave enough space. It is used to embed the rhinestone, which will lead to insufficient grip of the claw buckle. In this case, the rhinestone is easily separated from the metal bracket; 4) There is a gap between the cavity of the cavity and the rhinestone, which is easy to hide Dirt, thus affecting the beauty of rhinestone jewelry. The rhinestone ornaments used in necklaces usually include metal edging and rhinestones. The rhinestones are inlaid in the metal edging, and there is a ring on the metal edging, that is, the rhinestone jewelry is inlaid in a bezel setting. However, this rhinestone jewelry has the following problems: 1) In the Applying external force to insert the rhinestone into the metal edging may damage the two surfaces of the rhinestone, making the rhinestone jewelry scrap; 2) There is a gap between the metal edging and the edge of the rhinestone, and this gap is easy to hide dirt, which affects the The beauty of rhinestone jewelry. In addition, no matter what kind of rhinestone inlay method is used for rhinestone jewelry, it will be limited by the shape of the rhinestone, and the shape of the metal bracket or metal edging will change with the shape of the rhinestone, resulting in a large number of metal brackets and metal cladding. Edge mold cost.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present utility model is to provide a metal reflective hollow inlay structure ornament of rhinestones, crystal beads or crystal pendants, which will not damage the two parts of the rhinestones, crystal beads or crystal pendants during the inlaying process of the rhinestones, crystal beads or crystal pendants. There is no gap between the rhinestones or crystal beads or crystal pendants and the inlaid carrier that is easy to store dirt, the inlaid carrier will not lift up, the rhinestones or crystal beads or crystal pendants will not fall off, and the production cost is low.

The technical solution adopted by the utility model to solve the above technical problems is: a metal reflective hollow inlay structure ornament of a rhinestone or a crystal bead or a crystal pendant, comprising a rhinestone or a crystal bead or a crystal pendant, characterized in that: the rhinestone or the crystal pendant is characterized in that: The outer surface of the crystal beads or the crystal pendant is provided with a bottomed light-reflecting conductive layer and a metal outer layer in order to form a semi-finished product, and the semi-finished product is directed against the bottomed light-reflecting conductive layer and the metal The inlaid carrier formed by the outer layer is provided with a number of hollow pattern structures, so that part of the surface of the rhinestones or the crystal beads or the crystal pendant is exposed through the hollow pattern structures to form a metal with a metallic texture. Openwork inlay structure ornament.

The primer reflective conductive layer is composed of a primer layer, a silver reflective layer and a copper conductive layer sequentially arranged from the inside to the outside, and the primer layer is formed on the rhinestone or the crystal bead or the crystal. The outer surface of the pendant is formed by vacuum electroplating a layer of titanium or vacuum electroplating a layer of silicon or vacuum electroplating a layer of chromium, and the silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer. The copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Here, you can choose to vacuum electroplate a layer of titanium or silicon or chrome or other materials combined with glass on the outer surface of the rhinestone to form a bottom layer. In practical applications, because chrome is not environmentally friendly enough to be used in jewelry, you can Titanium or silicon is preferred; since the titanium base layer formed by vacuum electroplating titanium has good bonding with glass rhinestones, the titanium layer is selected as the base layer; silver has a good reflective effect, so the silver layer is selected as the reflective layer; copper has good Therefore, the copper layer is selected as the conductive layer; since the titanium primer layer, the silver reflective layer and the copper conductive layer are all formed by vacuum electroplating, the thickness of the titanium primer layer, the silver reflective layer and the copper conductive layer formed by vacuum plating is only It can reach the micron level, and the rhinestone jewelry usually needs to be used after welding various accessories. Therefore, in order to be able to weld various accessories, a metal outer layer (micron level to millimeter level) is electrodeposited on the copper conductive layer, and the thicker metal outer layer is used. The layer can highlight the metallic texture of the rhinestone jewelry; in addition, the outer metal layer can be easily electrodeposited onto the copper conductive layer. Here, the thickness of the titanium base layer can be set to nanometer level, and it should not be too thick, because if it is too thick, it will affect the silver reflective layer; the thickness of the silver reflective layer and the copper conductive layer can be set to micrometer level; the thickness of the metal outer layer can be set to Micron to millimeter scale.

The primer reflective conductive layer is composed of a titanium primer reflective layer and a copper conductive layer sequentially arranged from the inside out, and the titanium primer reflective layer is formed on the rhinestones or the crystal beads or the The outer surface of the crystal pendant is formed by vacuum electroplating a layer of titanium, the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the titanium primer reflective layer, and the metal outer layer is formed on the outer surface of the titanium reflective layer. The copper conductive layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Since the vacuum-plated titanium layer has a good combination with glass rhinestones, and the titanium layer can be made into a variety of different colors to reflect light, a vacuum-plated titanium layer takes into account both the functions of primer and reflection, so titanium is selected. As the bottoming reflective layer; copper has good electrical conductivity, so the copper layer is selected as the conductive layer; since the titanium bottoming reflective layer and the copper conductive layer are both formed by vacuum electroplating, the titanium bottoming reflective layer formed by vacuum electroplating and copper The thickness of the conductive layer can only reach the micron level at most, and the rhinestone jewelry usually needs to be welded with various accessories. And the thicker metal outer layer can highlight the metallic texture of the rhinestone jewelry; in addition, the metal outer layer can be easily electrodeposited on the copper conductive layer. Here, the titanium primer reflective layer plays the dual role of primer and reflection, so the thickness can be set to micrometer level; the thickness of copper conductive layer can be set to micrometer level; the thickness of metal outer layer can be set to micrometer level to millimeter level .

The primer reflective conductive layer is composed of a primer layer and a silver reflective conductive layer that are sequentially arranged from the inside out, and the primer layer is outside the rhinestone or the crystal bead or the crystal pendant. The surface is formed by vacuum electroplating a layer of titanium, vacuum electroplating a layer of silicon or vacuum electroplating a layer of chromium, the silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer, and the metal The outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver light-reflecting conductive layer. Here, you can choose to vacuum electroplate a layer of titanium or silicon or chrome or other materials combined with glass on the outer surface of the rhinestone to form a bottom layer. In practical applications, because chrome is not environmentally friendly enough to be used in jewelry, you can Titanium or silicon is preferred; since the titanium base layer formed by vacuum electroplating titanium has good bonding with glass rhinestones, the titanium layer is selected as the base layer; silver has a good reflective effect, and silver has a good electrical conductivity, so choose silver layer as a light-reflecting conductive layer; since the titanium bottom layer and silver light-reflecting conductive layer are formed by vacuum electroplating, the thickness of the titanium bottom layer and silver light-reflecting conductive layer formed by vacuum plating can only reach the micron level at most, and the rhinestone jewelry usually needs to be welded. Therefore, in order to be able to weld various accessories, a metal outer layer (micron level to millimeter level) is electrodeposited outside the silver reflective conductive layer, and the thicker metal outer layer can highlight the metal texture of the rhinestone jewelry; In addition, the metallic outer layer can be easily electrodeposited onto the silver light-reflecting conductive layer. Here, the thickness of the titanium base layer can be set to nanometer level, and it should not be too thick, because if it is too thick, it will affect the silver reflective conductive layer; the thickness of the silver light reflective conductive layer can be set to micrometer level; the thickness of the metal outer layer can be set to micrometers to the millimeter level.

The primer reflective conductive layer is composed of a primer layer and a silver reflective conductive layer that are sequentially arranged from the inside out, and the primer layer is a layer of vacuum electroplating on the outer surface of the rhinestone or the crystal fitting. Titanium or vacuum electroplating a layer of silicon or vacuum electroplating a layer of chromium, the silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer, and the metal outer layer is formed on the outer surface of the primer layer. The silver light-reflecting conductive layer is formed by electrodepositing a layer of silver on the outer surface.

Before electrodeposition of the metal outer layer, a layer of alkali copper or copper pyrophosphate is electroplated as a transition layer. Since alkali copper contains cyanide, it can be omitted.

The hollow pattern structure is formed by spraying etching protection ink or electrophoretic etching protection paint on the mosaic carrier and then etching. For inlaid carriers of different structures, the etching process is slightly different: the inlaid carrier composed of titanium bottom layer, silver reflective layer, copper conductive layer and metal outer layer is first etched with hydrochloric acid plus ferric chloride or commercially available copper. The metal outer layer and the copper conductive layer are etched with the solution, and then the silver reflective layer is etched with silver etching solution or dilute nitric acid solution. Hydrogen peroxide, adding about 15% by weight of hydrogen peroxide to aqueous sodium hydroxide solution to form an etching solution to etch the titanium base layer; a mosaic carrier composed of a titanium base reflective layer, a copper conductive layer and a metal outer layer , first use hydrochloric acid plus ferric chloride or use commercially available copper etching solution to etch the metal outer layer and copper conductive layer, remove the protective layer and then use sodium hydroxide aqueous solution with a concentration of about 3% to add a concentration of about 30% The hydrogen peroxide of about 15% by weight is added to the sodium hydroxide aqueous solution to form an etching solution to etch the titanium primer reflective layer; the mosaic consists of the titanium primer layer, the silver reflective conductive layer and the metal outer layer. Carrier, if the metal outer layer is made of copper, first use hydrochloric acid plus ferric chloride or use commercially available copper etching solution to etch the metal outer layer, and then use silver etching solution or dilute nitric acid solution to etch the silver reflective conductive layer, After removing the protective layer, use sodium hydroxide aqueous solution with a concentration of about 3% and hydrogen peroxide with a concentration of about 30%, and add hydrogen peroxide with a weight percentage of about 15% into the sodium hydroxide aqueous solution to form an etching solution to attack the titanium. The bottom layer is etched; if the metal outer layer is silver, there is no need to use hydrochloric acid plus ferric chloride or commercially available copper etching solution to etch the metal outer layer, and directly use silver etching solution or dilute nitric acid solution to etch the metal outer layer and silver. The light-reflecting conductive layer is etched.

The hollow pattern structure is in the same shape as the surface of the rhinestone or the crystal bead or the crystal pendant. The hollow pattern structure can be designed according to the rhinestone ornaments to be obtained, and can be patterns of various shapes. For example, if only a hollow pattern structure with the same shape as the surface of the rhinestone is provided on one surface of the rhinestone, a mosaic carrier with a hollow pattern structure is provided. It has the function of the existing metal bracket; if both surfaces of the rhinestone are provided with a hollow pattern structure of the same shape as the surface of the rhinestone, the mosaic carrier with the hollow pattern structure has the existing metal package. The role of the edge; the hollow pattern structure can also be in various shapes such as lace or flowers and animals.

The periphery of the hollow pattern structure is designed in a lace shape. Lace-like designs around the perimeter of the openwork pattern structure add to the overall aesthetic.

Metal fittings are tin welded or laser welded on the area of the inlaid carrier that is not provided with the hollow pattern structure. Necklaces etc. are made by welding metal fittings.

Decorative plating is provided on the area of the inlaid carrier that is not provided with the hollow pattern structure. Decorative plating can be gold or silver or imitation gold or platinum or imitation platinum.

The metal fittings are glued on the titanium primer reflective layer, and then a layer of copper is vacuum-plated.

The rhinestones or the crystal beads or the crystal pendants are replaced with ornamental gemstones or ornamental zircon.

A rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament, including rhinestone or crystal bead or crystal pendant, characterized in that: after the rhinestone or the crystal bead or the crystal pendant is bombarded by a bombardment power supply The outer surface of the rhinestone or the crystal bead or the crystal pendant is provided with a light-reflecting conductive layer and a metal outer layer in order to form a semi-finished product. The inlaid carrier composed of the metal outer layer is provided with a number of hollow pattern structures, so that part of the surface of the rhinestone or the crystal bead or the crystal pendant is exposed through the hollow pattern structure to form a metal layer. Textured metal openwork inlay structured ornament.

The reflective conductive layer is composed of a silver reflective layer and a copper conductive layer sequentially arranged from the inside to the outside. After the bombardment, a layer of silver is formed by vacuum electroplating on the outer surface, the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer, and the metal outer layer is conductive on the copper. The outer surface of the layer is formed by electrodepositing a layer of copper. Here, the rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that no titanium is used as the bottom layer, and a layer of silver is directly vacuum-plated on the outer surface of the rhinestone to form a silver reflective layer.

The reflective conductive layer is a silver reflective conductive layer, and the silver reflective conductive layer is a layer of silver plated by vacuum on the outer surface of the rhinestone or the crystal bead or the crystal pendant after being bombarded by the bombardment power supply. forming, the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver light-reflecting conductive layer. Here, the rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that no titanium is used for the bottom layer, and a layer of silver is directly vacuum-plated on the outer surface of the rhinestone to form a silver reflective conductive layer; the silver reflective conductive layer can also be composed of a copper layer. Or other single-layer metal layer or alloy layer instead.

Compared with the prior art, the advantages of the present utility model are:

1) A primer reflective conductive layer is closely placed on the outer surface of the rhinestone or crystal bead or crystal pendant, and a metal outer layer is closely arranged on the outer surface of the primer reflective conductive layer, and then the bottom reflective conductive layer and the metal are closely arranged. The inlaid carrier composed of the outer layer is provided with several hollow pattern structures, so that part of the surface of the rhinestone can be exposed through the hollow pattern structure to form a rhinestone ornament. Since the layers of the inlaid carrier are arranged in a wrapping manner, the rhinestone or crystal will not be damaged. The surface of the bead or crystal pendant; since the layers of the inlaid carrier are set closely in sequence, it will not hook clothes, etc., and will not scratch the skin, etc.; rhinestones or crystal beads or crystal pendants are firmly fixed by the inlaid carrier , rhinestones or crystal beads or crystal pendants will not fall off; there is no gap between the inlaid carrier and the rhinestones or crystal beads or crystal pendants, and will not hide dirt.

2) The setting of each layer of the inlaid carrier does not require a mold, and is not affected by the shape of rhinestones, crystal beads or crystal pendants; and the metal outer layer does not need to be polished and polished, and the production cost is low.

Description of drawings

1 is a schematic diagram of the external structure of the rhinestone metal reflective hollow mosaic structure ornament of Embodiment 1;

2 is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow mosaic structure ornament of the first embodiment;

3 is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow mosaic structure ornament of the second embodiment;

FIG. 4 is a partial cross-sectional schematic diagram of the rhinestone metal reflective hollow mosaic structure ornament according to the third embodiment.

Detailed ways

The present utility model will be further described in detail below with reference to the embodiments of the accompanying drawings.

Example 1:

A rhinestone metal reflective hollow mosaic structure ornament proposed in this embodiment, as shown in FIG. 1 and FIG. 2 , includes a pentagonal rhinestone 1 , and the outer surface of the rhinestone 1 is provided with a bottoming reflective conductive layer 2 and The metal outer layer 3 forms a semi-finished product, and the semi-finished product is provided with 8 hollow pattern structures 4 for the mosaic carrier composed of the bottoming light-reflecting conductive layer 2 and the metal outer layer 3, so that part of the surface of the rhinestone 1 is exposed through the hollow pattern structure 4 to form a Metallic textured rhinestone metal cutout inlay structure ornament.

In a preferred solution, the primer reflective conductive layer 2 is composed of a titanium primer layer 21 , a silver reflective layer 22 and a copper conductive layer 23 arranged in sequence from the inside to the outside. The titanium primer layer 21 is a layer of vacuum electroplating on the outer surface of the rhinestone 1 Titanium is formed, the silver reflective layer 22 is formed by vacuum plating a layer of silver on the outer surface of the titanium primer layer 21, the copper conductive layer 23 is formed by vacuum plating a layer of copper on the outer surface of the silver reflective layer 22, and the metal outer layer 3 is formed. A layer of copper is electrodeposited on the outer surface of the copper conductive layer 23 to form. Since the titanium primer layer 21 formed by vacuum electroplating titanium has good bonding with the glass rhinestone 1, the titanium layer is selected as the primer layer; silver has a good light-reflecting effect, so the silver layer is selected as the light-reflecting layer; copper has good electrical conductivity , so choose the copper layer as the conductive layer; because the titanium layer 21, the silver reflective layer 22 and the copper conductive layer 23 are all formed by vacuum electroplating, the titanium layer 21, the silver reflective layer 22 and the copper conductive layer 23 formed by vacuum plating The maximum thickness can only reach the micrometer level, and the rhinestone jewelry usually needs to be used after welding various accessories. Therefore, in order to be able to weld various accessories, a metal outer layer 3 (micrometer level to millimeter level) is electrodeposited outside the copper conductive layer 23, and The thicker metal outer layer 3 can highlight the metallic texture of the rhinestone jewelry; in addition, the metal outer layer 3 can be easily electrodeposited on the copper conductive layer 23 . Here, the thickness of the titanium base layer 21 can be set to nanometer level, and should not be too thick, because if it is too thick, it will affect the silver reflective layer 22; the thickness of the silver reflective layer 22 and the copper conductive layer 23 can be set to micrometer level; the metal outer layer The thickness of 3 can be set from micrometers to millimeters.

In a preferred solution, the hollow pattern structure 4 is formed by spraying etching protection ink or electrophoretic etching protection paint on the mosaic carrier to form a protective layer and then etching it. The outer layer 3 and the copper conductive layer 23 are etched, and then the silver reflective layer 22 is etched with a silver etching solution or a dilute nitric acid solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% is used to add a concentration of about 30%. The hydrogen peroxide of about 15% by weight is added to the aqueous sodium hydroxide solution to form an etching solution to etch the titanium base layer 21.

Preferably, one hollow pattern structure 4 has the same shape as the surface of the rhinestone 1, that is, a five-pointed star shape, so that the middle area of one surface of the rhinestone 1 is exposed; five five-pointed star-shaped hollow pattern structures 4 are distributed in five corners On the rhinestone 1, the partial areas of the 5 corners of the rhinestone 1 are exposed; the two circular-shaped hollow pattern structures 4 are distributed on the sides, so that part of the side area of the rhinestone 1 is exposed; the hollow pattern structure 4 can be obtained according to the rhinestones to be obtained. Ornaments can be designed with patterns of various shapes. For example, if only one surface of the rhinestone 1 is provided with a hollow pattern structure 4 of the same shape as the surface of the rhinestone 1, the inlaid carrier with the hollow pattern structure 4 has the existing The role of the metal bracket; if the two surfaces of the rhinestone 1 are provided with a hollow pattern structure 4 of the same shape as the surface of the rhinestone 1, the mosaic carrier with the hollow pattern structure 4 has the existing metal edging The function of the hollow pattern structure 4 can also be various shapes such as lace or flowers and animals.

In a preferred solution, the periphery of the hollow pattern structure 4 is designed in various lace shapes. Designing the perimeter of the hollow pattern structure 4 into a lace shape can increase the overall aesthetic feeling, for example, designing it into a wavy lace or a flower shape.

Preferably, metal fittings 5 are tin welded or laser welded on the area of the inlaid carrier that is not provided with the hollow pattern structure 4. Necklaces and the like are made by welding metal fittings 5 .

Embodiment 2:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is different from the rhinestone metal reflective hollow inlay structure ornament of the first embodiment only in that the structure of the bottom reflective conductive layer 2 is different, as shown in FIG. 3 . The primer reflective conductive layer 2 is composed of a titanium primer reflective layer 24 and a copper conductive layer 23 that are sequentially arranged from the inside to the outside. The titanium primer reflective layer 24 is formed by vacuum electroplating a layer of titanium on the outer surface of the rhinestone 1, and the copper conducts electricity. The layer 23 is formed by vacuum electroplating a layer of copper on the outer surface of the titanium-based reflective layer 24 , and the metal outer layer 3 is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer 23 . Since the vacuum electroplating titanium layer has a good combination with the glass rhinestone 1, and the titanium layer can be made into a variety of different colors to reflect light, a vacuum electroplating titanium layer takes both the functions of primer and reflection into account, so the choice of The titanium layer is used as the base reflective layer; copper has a good electrical conductivity, so the copper layer is selected as the conductive layer; since the titanium base reflective layer 24 and the copper conductive layer 23 are both formed by vacuum electroplating, the titanium base reflective layer formed by vacuum electroplating The thickness of the layer 24 and the copper conductive layer 23 can only reach the micron level at most, and the rhinestone jewelry usually needs to be used after welding various accessories. Therefore, in order to be able to solder various accessories, a metal outer layer 3 ( Micrometer to millimeter), and the thick metal outer layer 3 can highlight the metallic texture of the rhinestone jewelry; in addition, the metal outer layer 3 can be easily electrodeposited on the copper conductive layer 23 . Here, the titanium primer reflective layer 24 plays a dual role of primer and light reflection, so the thickness can be set to micrometer level; the thickness of copper conductive layer 23 can be set to micrometer level; the thickness of metal outer layer 3 can be set to micrometer level to the millimeter level.

In a preferred solution, the hollow pattern structure 4 is formed by spraying etching protection ink or electrophoretic etching protection paint on the mosaic carrier to form a protective layer and then etching it. The outer layer 3 and the copper conductive layer 23 are etched, and after removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% is used to add hydrogen peroxide with a concentration of about 30%, and the hydrogen peroxide with a weight percentage of about 15% is added. An etching solution is formed in an aqueous sodium hydroxide solution to etch the titanium bottomed reflective layer 24 .

In a preferred solution, the rhinestone metal hollow inlay structure ornament of this embodiment can be similar to the rhinestone metal hollow inlay structure ornament of the first embodiment. The metal fittings 5 are welded or laser welded, and the metal fittings 5 can also be provided during the processing, that is, the metal fittings 5 are glued on the titanium base reflective layer 24, and then a layer of copper is vacuum-plated to form the copper conductive layer 23, which saves the the subsequent welding process.

Embodiment three:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is different from the rhinestone metal reflective hollow inlay structure ornament of the first or second embodiment only in that the structure of the bottom reflective conductive layer 2 is different, as shown in the figure As shown in 4, the primer reflective conductive layer 2 is composed of a titanium primer layer 21 and a silver light reflective conductive layer 25 that are sequentially arranged from the inside out. The titanium primer layer 21 is formed by vacuum plating a layer of titanium on the outer surface of the rhinestone 1. The light-reflecting conductive layer 25 is formed by vacuum electroplating a layer of silver on the outer surface of the titanium base layer 21 , and the metal outer layer 3 is formed by electrodepositing a layer of copper on the outer surface of the silver light-reflecting conductive layer 25 . Since the titanium base layer 21 formed by vacuum electroplating titanium has good bonding with the glass rhinestone 1, the titanium layer is selected as the base layer; silver has a good reflective effect, and silver has a good electrical conductivity, so the silver layer is selected as the reflective layer Conductive layer: Since the titanium base layer 21 and the silver reflective conductive layer 25 are formed by vacuum electroplating, the thickness of the titanium base layer 21 and the silver reflective conductive layer 25 formed by vacuum electroplating can only reach the maximum micron level, and the rhinestone jewelry usually needs to be welded Therefore, in order to be able to solder various accessories, a metal outer layer 3 (micron level to millimeter level) is electrodeposited outside the silver reflective conductive layer 25, and the thicker metal outer layer 3 can highlight the rhinestone jewelry. Metal layer texture; in addition, the metal outer layer 3 can be easily electrodeposited on the silver light-reflecting conductive layer 25. Here, the thickness of the titanium base layer 21 can be set to nanometer level, and it should not be too thick, because if it is too thick, it will affect the silver light-reflecting conductive layer 25; the thickness of the silver light-reflecting conductive layer 25 can be set to the micrometer level; Can be set from micron to millimeter.

In a preferred solution, the hollow pattern structure 4 is formed by spraying etching protection ink or electrophoretic etching protection paint on the mosaic carrier to form a protective layer and then etching it. The outer layer 3 is etched, and then the silver reflective conductive layer 25 is etched by using a silver etching solution or a dilute nitric acid solution. After removing the protective layer, a sodium hydroxide aqueous solution with a concentration of about 3% is used and hydrogen peroxide with a concentration of about 30% is used. , adding hydrogen peroxide with a weight percentage of about 15% into an aqueous sodium hydroxide solution to form an etching solution to etch the titanium base layer 21 .

Embodiment 4:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is different from the rhinestone metal reflective hollow inlay structure ornament of the third embodiment only in that the metal outer layer 3 is electrically conductive on the outer surface of the silver reflective conductive layer 25 A layer of silver is deposited to form.

In a preferred solution, the hollow pattern structure 4 is formed by spraying etching protection ink or electrophoretic etching protection paint to form a protective layer on the mosaic carrier and then etching it, specifically: it is not necessary to use hydrochloric acid plus ferric chloride or use commercially available copper etching solution to etch the metal The outer layer 3 is etched, and the metal outer layer 3 and the silver light-reflecting conductive layer 25 are directly etched with silver etching solution or dilute nitric acid solution.

Embodiment 5:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is made of the rhinestone metal reflective hollow inlay structure ornament proposed in the first embodiment or the second embodiment or the third embodiment by providing through holes to be used for Stringing into a part of a bracelet or necklace, that is, a through hole for lanyards is set through the rhinestone to form crystal beads, and multiple semi-finished products with through holes or multiple rhinestone ornaments with the same hollow pattern structure or multiple Rhinestone ornaments with different hollow pattern structures are strung into bracelets or necklaces, etc.

Embodiment 6:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment, which adds decorative plating on the basis of the rhinestone metal reflective hollow inlay structure ornament proposed in the first embodiment or the second embodiment or the third embodiment or the fourth embodiment, that is, Decorative plating is arranged on the area of the inlaid carrier without the hollow pattern structure. The decorative plating can be gold or silver or imitation gold or platinum or imitation platinum. The specific location and thickness of the decorative plating can be made according to the required rhinestones. The aesthetics or other requirements of the jewelry are determined.

Embodiment 7:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is the same as the other structures of the rhinestone metal reflective hollow inlay structure ornament proposed in the first or third embodiment, and the difference is only the bottom layer. This embodiment The middle bottom layer is a silicon bottom layer, which is formed by vacuum plating a layer of silicon on the outer surface of the rhinestone.

In actual processing, it is not limited to titanium and silicon as primer materials, and other materials with good bonding with glass and environmental protection can also be used as primer materials.

Embodiment 8:

A rhinestone metal reflective hollow inlay structure ornament proposed in this embodiment is based on the rhinestone metal reflective hollow inlay structure ornament proposed in the first embodiment, the second embodiment or the third embodiment, and a transition coating is added, that is, the electrodeposition Before the metal outer layer, a layer of alkali copper or copper pyrophosphate is electroplated as the transition coating. For the structure of Example 1, the transition coating is located between the copper conductive layer and the metal outer layer; for the structure of Example 2, the transition coating is also located on the copper layer. Between the conductive layer and the metal outer layer; for the structure of the third embodiment, the transition coating is located between the silver light-reflecting conductive layer and the metal outer layer.

Embodiment 9:

A rhinestone metal reflective hollow mosaic structure ornament proposed in this embodiment includes a rhinestone. After the rhinestone is bombarded by a bombardment power supply, a reflective conductive layer and a metal outer layer are arranged on the outer surface of the rhinestone in order to form a semi-finished product. The inlay carrier formed by the conductive layer and the metal outer layer is provided with a plurality of hollow pattern structures, so that part of the surface of the rhinestone is exposed through the hollow pattern structure to form a rhinestone metal hollow inlay structure ornament with metal layer texture.

In a preferred solution, the reflective conductive layer is composed of a silver reflective layer and a copper conductive layer sequentially arranged from the inside out. The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the rhinestone after being bombarded by a bombardment power supply, and the copper conductive layer is formed on the outer surface of the rhinestone after being bombarded by a bombardment power supply. The outer surface of the silver reflective layer is formed by vacuum electroplating a layer of copper, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. Here, the rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that no titanium is used as the bottom layer, and a layer of silver is directly vacuum-plated on the outer surface of the rhinestone to form a silver reflective layer.

Embodiment ten:

A rhinestone metal reflective hollow mosaic structure ornament proposed in this embodiment is basically the same in structure as the eighth embodiment, except that the reflective conductive layer in this embodiment is a silver reflective conductive layer, and the silver reflective conductive layer is After being bombarded by the bombardment power supply, the outer surface of the rhinestone is formed by vacuum electroplating a layer of silver, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer. Here, the rhinestone is first bombarded with a bombardment power supply in a vacuum coating machine, so that no titanium is used for the bottom layer, and a layer of silver is directly vacuum-plated on the outer surface of the rhinestone to form a silver reflective conductive layer; the silver reflective conductive layer can also be composed of a copper layer. Or other single-layer metal layer or alloy layer instead.

The metal reflective hollow inlay structure of the rhinestone metal reflective hollow inlay structure ornaments of the above embodiments can also be applied to other ornaments or accessories, such as crystal ornament accessories (crystal beads with or without holes of various shapes and crystal pendants, etc.) , can also be applied to jewelry gemstones or jewelry zircon, jewelry gemstones need to choose acid and alkali resistant gemstones.

Claims (16)

1. A rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament, comprising rhinestone or crystal bead or crystal pendant, it is characterized in that: the outer surface of described rhinestone or described crystal bead or described crystal pendant A bottomed light-reflecting conductive layer and a metal outer layer are arranged in sequence on the top to form a semi-finished product, and the semi-finished product is provided with a number of hollow patterns for the mosaic carrier composed of the bottomed light-reflecting conductive layer and the metal outer layer. structure, so that part of the surface of the rhinestone or the crystal bead or the crystal pendant is exposed through the hollow pattern structure to form a metal hollow inlaid structure ornament with metal layer texture. 2. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 1, characterized in that: the primer reflective conductive layer is sequentially arranged from the inside to the outside of the primer layer, the silver reflective layer layer and copper conductive layer, the bottom layer is vacuum electroplating a layer of titanium or vacuum electroplating a layer of silicon or vacuum electroplating on the outer surface of the rhinestone or the crystal bead or the crystal pendant The silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer, and the copper conductive layer is formed by vacuum electroplating a layer of copper on the outer surface of the silver reflective layer. forming, the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. 3. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 1, characterized in that: the primer reflective conductive layer consists of titanium primer reflective layers arranged sequentially from the inside to the outside It is composed of a copper conductive layer, the titanium bottoming reflective layer is formed by vacuum electroplating a layer of titanium on the outer surface of the rhinestone or the crystal bead or the crystal pendant, and the copper conductive layer is A layer of copper is vacuum electroplated on the outer surface of the titanium-based reflective layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. 4. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 1, characterized in that: the primer reflective conductive layer is sequentially arranged from the inside out to the primer layer and the silver reflective layer. The conductive layer is composed, and the bottom layer is formed by vacuum electroplating a layer of titanium or vacuum electroplating a layer of silicon or vacuum electroplating a layer of chromium on the outer surface of the rhinestone or the crystal bead or the crystal pendant, The silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the silver reflective conductive layer. . 5. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 1, characterized in that: the primer reflective conductive layer is sequentially arranged from the inside to the outside of the primer layer and the silver reflective layer. The conductive layer is composed, and the bottom layer is formed by vacuum electroplating a layer of titanium or vacuum electroplating a layer of silicon or vacuum electroplating a layer of chromium on the outer surface of the rhinestone or the crystal bead or the crystal pendant, The silver reflective conductive layer is formed by vacuum electroplating a layer of silver on the outer surface of the primer layer, and the metal outer layer is formed by electrodepositing a layer of silver on the outer surface of the silver reflective conductive layer. . 6. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to any one of claims 2 to 5, characterized in that: before the metal outer layer is electrodeposited, a layer of alkali is electroplated Copper or copper pyrophosphate as a transition coating. 7. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 6, characterized in that: the hollow pattern structure is to spray etching protection ink or electrophoretic etching protection to the mosaic carrier After the paint is etched to form. 8. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 7, wherein the hollow pattern structure is the same as that of the rhinestone or the crystal bead or the The crystal pendant has the same shape on the surface. 9 . The rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament according to claim 8 , wherein the periphery of the hollow pattern structure is designed in a lace shape. 10 . 10. A rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament according to claim 1, characterized in that: the inlaid carrier is not provided with the hollow pattern structure on the area of tin welding or laser Welded with metal fittings. 11. A rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament according to claim 1, characterized in that: the area of the inlaid carrier without the hollow pattern structure is provided with decorative plating . 12 . The rhinestone or crystal bead or crystal pendant metal reflective hollow inlay structure ornament according to claim 3 , wherein: the titanium bottom reflective layer is glued with metal fittings and then vacuum-plated with a layer of copper. 13 . 13. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 1, characterized in that: the rhinestone or the crystal bead or the crystal pendant is replaced with a jewelry gem or Ornament zircon. 14. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament, comprising rhinestone or crystal bead or crystal pendant, characterized in that: the rhinestone or the crystal bead or the crystal pendant is bombarded with a power supply After the bombardment, the outer surface of the rhinestone or the crystal bead or the crystal pendant is provided with a light-reflecting conductive layer and a metal outer layer in order to form a semi-finished product. The semi-finished product is directed against the light-reflecting conductive layer. The mosaic carrier formed with the metal outer layer is provided with a number of hollow pattern structures, so that part of the surface of the rhinestone or the crystal bead or the crystal pendant is exposed through the hollow pattern structure to form a hollow pattern structure. Metallic openwork inlay structure ornament with metallic texture. 15. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 14, characterized in that: the reflective conductive layer consists of a silver reflective layer and a copper conductive layer sequentially arranged from the inside out Composition, the silver reflective layer is formed by vacuum electroplating a layer of silver on the outer surface of the rhinestone or the crystal bead or the crystal pendant after being bombarded by the bombardment power supply, and the copper conductive layer is formed on the outer surface of the crystal pendant. The outer surface of the silver reflective layer is formed by vacuum electroplating a layer of copper, and the metal outer layer is formed by electrodepositing a layer of copper on the outer surface of the copper conductive layer. 16. A rhinestone or crystal bead or crystal pendant metal reflective hollow mosaic structure ornament according to claim 14, wherein the reflective conductive layer is a silver reflective conductive layer, and the silver reflective conductive layer is The rhinestone or the crystal bead or the crystal pendant is formed by vacuum electroplating a layer of silver on the outer surface after being bombarded by the bombardment power supply, and the metal outer layer is formed on the outer surface of the silver reflective conductive layer. A layer of copper is electrodeposited to form.

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