CN211404485U - Semiconductor heat dissipation circuit - Google Patents
Semiconductor heat dissipation circuit Download PDFInfo
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- CN211404485U CN211404485U CN201922279813.XU CN201922279813U CN211404485U CN 211404485 U CN211404485 U CN 211404485U CN 201922279813 U CN201922279813 U CN 201922279813U CN 211404485 U CN211404485 U CN 211404485U
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Abstract
The utility model discloses a semiconductor heat dissipation circuit, including temperature detect circuit, temperature regulating circuit, control circuit, transistor switch circuit, filter circuit, system wind device, semiconductor temperature regulating circuit and indicating circuit, temperature detect circuit with the control circuit electricity is connected, temperature regulating circuit with the temperature detect circuit electricity is connected, transistor switch circuit with the control circuit electricity is connected, filter circuit, system wind device and semiconductor temperature regulating circuit all with transistor switch circuit electricity is connected, indicating circuit with semiconductor temperature regulating circuit electricity is connected. The utility model has the advantages of can improve the radiating efficiency.
Description
Technical Field
The utility model relates to a computer technology field, in particular to semiconductor heat dissipation circuit.
Background
The notebook computer is gradually pursuing lightness and thinness for portability, the cost of the lightness and thinness of the body type is very hard to dissipate heat, the game book mostly dissipates the heat of the CPU and the display card through the combination of the heat pipe and the fan, however, the increasingly strong CPU and the display card make the heat dissipation of the notebook computer more hard, so that a lot of people can choose to purchase the traditional fan-shaped heat dissipation bottom plate to increase the air output at the bottom to increase the heat dissipation efficiency, but the effect is still not obvious enough.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem be, provide a semiconductor heat dissipation circuit that can improve the radiating efficiency.
The utility model provides a semiconductor heat dissipation circuit, including temperature detect circuit, temperature regulating circuit, control circuit, transistor switch circuit, filter circuit, system wind device, semiconductor temperature regulating circuit and indicating circuit, temperature detect circuit with the control circuit electricity is connected, temperature regulating circuit with the temperature detect circuit electricity is connected, transistor switch circuit with the control circuit electricity is connected, filter circuit, system wind device and semiconductor temperature regulating circuit all with transistor switch circuit electricity is connected, indicating circuit with semiconductor temperature regulating circuit electricity is connected.
Preferably, the temperature detection circuit comprises a first resistor, a second resistor, a third resistor and a thermistor, wherein a first end of the first resistor is electrically connected with the power supply, and a second end of the first resistor is electrically connected with a first end of the second resistor and the control circuit; the second end of the second resistor is grounded; the first end of the thermistor is electrically connected with a power supply, and the second end of the thermistor is electrically connected with the first end of the third resistor and the control circuit; and the second end of the third resistor is electrically connected with the temperature regulating circuit.
Preferably, the temperature adjusting circuit comprises a sliding rheostat, a first end of the sliding rheostat is electrically connected with a second end of the third resistor, and a second end of the sliding rheostat is grounded.
Preferably, the control circuit includes a fourth resistor, a fifth resistor, a first operational amplifier, and a second operational amplifier, a first end of the fourth resistor is electrically connected to the first operational amplifier and the second operational amplifier, and a second end of the fourth resistor is electrically connected to the transistor switch circuit through a first switch; the first end of the fifth resistor is electrically connected with the second operational amplifier, and the second end of the fifth resistor is electrically connected with the transistor switch circuit through the first switch.
Preferably, the transistor switch circuit comprises a first triode and a second triode, wherein a collector of the first triode is electrically connected with a power supply, a base of the first triode is electrically connected with the first switch, and an emitter of the first triode is electrically connected with a base of the second triode; and the collector electrode of the second triode is electrically connected with a power supply, and the emitter electrode of the second triode is electrically connected with the filter circuit.
Preferably, the filter circuit includes a first capacitor, a first end of the first capacitor is electrically connected to the emitter of the second triode, and a second end of the first capacitor is grounded.
Preferably, the wind generating means comprises an electric fan, a first end of the electric fan is electrically connected with a power supply, and a second end of the electric fan is grounded.
Preferably, the semiconductor temperature regulating circuit comprises a second switch, a third switch and a semiconductor refrigerating piece, wherein a first end of the second switch is electrically connected with the air producing device, and a second end of the second switch is electrically connected with a first pin of the semiconductor refrigerating piece; the first end of the third switch is electrically connected with the second pin of the semiconductor refrigerating piece, and the second end of the third switch is grounded.
Preferably, the indication circuit comprises a sixth resistor, a first diode and a second diode, a first end of the sixth resistor is electrically connected with the second switch, and a second end of the sixth resistor is electrically connected with a first end of the first diode and a first end of the second diode; a second terminal of the first diode is electrically connected with a second terminal of the second diode; and the second end of the second diode is electrically connected with the second pin of the semiconductor refrigerating piece and the third switch.
The utility model discloses following beneficial effect has: the utility model discloses a cooperation between temperature detection circuit, temperature regulation circuit, control circuit, transistor switch circuit, filter circuit, system wind device, semiconductor temperature regulation circuit and the indicating circuit, the during operation, through the semiconductor refrigeration piece, thereby it makes the heat transfer of mainboard, CPU and display card to the cold junction of the semiconductor refrigeration piece of bottom to directly cool down notebook computer bottom through heat-conducting mode, the supplementary heat dissipation of fan simultaneously, increase air flow flux, the utility model discloses with great increase notebook computer's radiating efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the semiconductor heat dissipation circuit of the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples. It should be noted that, if there is no conflict, the embodiments and various features in the embodiments of the present invention may be combined with each other, and all are within the scope of the present invention.
Referring to fig. 1, the present invention provides a semiconductor heat dissipation circuit, which includes a temperature detection circuit 1, a temperature adjustment circuit 2, a control circuit 3, a transistor switch circuit 4, a filter circuit 5, a wind making device 6, a semiconductor temperature adjustment circuit 7 and an indication circuit 8, wherein the temperature detection circuit 1 is electrically connected to the control circuit 3. The temperature adjusting circuit 2 is electrically connected with the temperature detecting circuit 1, the transistor switch circuit 4 is electrically connected with the control circuit 3, the filter circuit 5, the air making device 6 and the semiconductor temperature adjusting circuit 7 are electrically connected with the transistor switch circuit 4, and the indicating circuit 8 is electrically connected with the semiconductor temperature adjusting circuit 7.
The temperature detection circuit 1 comprises a first resistor R1, a second resistor R2, a third resistor R3 and a thermistor RT, wherein the first end of the first resistor R1 is electrically connected with a power supply, and the second end of the first resistor R1 is electrically connected with the first end of the second resistor R2 and the control circuit 3. The second end of the second resistor R2 is grounded. A first end of the thermistor RT is electrically connected to a power supply Vcc, and a second end of the thermistor RT is electrically connected to a first end of the third resistor R3 and the control circuit 3. A second end of the third resistor R3 is electrically connected to the temperature adjustment circuit 2.
The temperature regulating circuit 2 comprises a sliding rheostat RP, a first end of the sliding rheostat RP is electrically connected with a second end of the third resistor R3, and a second end of the sliding rheostat RP is grounded. By setting the temperature adjusting circuit 2, the refrigeration temperature starting point in the semiconductor temperature adjusting circuit 7 can be adjusted, and therefore the setting can be performed according to different application scenes, and the semiconductor temperature adjusting circuit can be adapted to various application scenes.
The control circuit 3 includes a fourth resistor R4, a fifth resistor R5, a first operational amplifier a, and a second operational amplifier B, wherein a first end of the fourth resistor R4 is electrically connected to the first operational amplifier a and the second operational amplifier B, and a second end of the fourth resistor R4 is electrically connected to the transistor switch circuit 4 through a first switch. A first terminal of the fifth resistor R5 is electrically connected to the second operational amplifier B, and a second terminal of the fifth resistor R5 is electrically connected to the transistor switch circuit 4 through the first switch.
The transistor switch circuit 4 comprises a first triode Q1 and a second triode Q2, wherein a collector of the first triode Q1 is electrically connected with a power supply, a base of the first triode Q1 is electrically connected with the first switch, and an emitter of the first triode Q1 is electrically connected with a base of the second triode Q2. The collector of the second transistor Q2 is electrically connected to a power supply, and the emitter of the second transistor Q2 is electrically connected to the filter circuit 5.
The filter circuit 5 comprises a first capacitor C1, a first end of the first capacitor C1 is electrically connected with the emitter of the second triode, and a second end of the first capacitor C1 is grounded. The wind generating device 6 includes an electric fan M having a first end electrically connected to a power source and a second end grounded. The semiconductor temperature adjusting circuit 7 comprises a second switch K2, a third switch K3 and a semiconductor refrigerating piece P, wherein a first end of the second switch K2 is electrically connected with the air producing device 6, and a second end of the second switch K2 is electrically connected with a first pin of the semiconductor refrigerating piece P. The first end of the third switch K3 is electrically connected with the second pin of the semiconductor refrigerating element P, and the second end of the third switch K3 is grounded.
The indication circuit 8 comprises a sixth resistor R5, a first diode D1 and a second diode D2, wherein a first end of the sixth resistor R5 is electrically connected with the second switch K2, and a second end of the sixth resistor R5 is electrically connected with a first end of the first diode D1 and a first end of the second diode D2. A second terminal of the first diode D1 is electrically connected with a second terminal of the second diode D2. A second end of the second diode D2 is electrically connected to the second pin of the semiconductor cooling device P and the third switch K3.
In the working process, when the temperature is higher than the set temperature, the resistance value of the thermistor RT is reduced, the first operational amplifier A outputs a low level, the second operational amplifier B outputs a high level, and the first triode Q1 and the second triode Q2 are conducted, so that the semiconductor refrigerating element P is refrigerated. Similarly, when the temperature reaches below the set temperature, the refrigeration is stopped, thereby saving energy.
To sum up, the utility model discloses a cooperation between temperature detection circuit 1, temperature regulation circuit 2, control circuit 3, transistor switch circuit 4, filter circuit 5, system wind device 6, semiconductor temperature regulating circuit 7 and the indicating circuit 8, the during operation, through the semiconductor refrigeration piece, thereby directly make the cold junction of the semiconductor refrigeration piece of bottom to the heat transfer of notebook computer bottom cooling through heat-conducting mode, the supplementary heat dissipation of fan simultaneously, increase air current flux, this utility model discloses with great increase notebook computer's radiating efficiency.
The semiconductor heat dissipation circuit provided by the present invention is introduced in detail, and the principle and the implementation of the present invention are explained by using specific examples, and the explanation of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the concrete implementation and the application scope. To sum up, this description content only does the embodiment of the utility model, not therefore the restriction the patent scope of the utility model, all utilize the equivalent structure or the equivalent flow transform that the content of the description and the attached drawing was done, or directly or indirectly use in other relevant technical field, all the same reason is included in the patent protection scope of the utility model, should not be understood as right the utility model discloses a restriction.
Claims (9)
1. The utility model provides a semiconductor heat dissipation circuit, its characterized in that, includes temperature detect circuit, temperature regulating circuit, control circuit, transistor switch circuit, filter circuit, system wind device, semiconductor temperature regulating circuit and indicating circuit, temperature detect circuit with the control circuit electricity is connected, temperature regulating circuit with temperature detect circuit electricity is connected, transistor switch circuit with the control circuit electricity is connected, filter circuit, system wind device and semiconductor temperature regulating circuit all with transistor switch circuit electricity is connected, indicating circuit with semiconductor temperature regulating circuit electricity is connected.
2. The semiconductor heat dissipation circuit of claim 1, wherein the temperature detection circuit comprises a first resistor, a second resistor, a third resistor, and a thermistor, wherein a first end of the first resistor is electrically connected to a power source, and a second end of the first resistor is electrically connected to a first end of the second resistor and a control circuit; the second end of the second resistor is grounded; the first end of the thermistor is electrically connected with a power supply, and the second end of the thermistor is electrically connected with the first end of the third resistor and the control circuit; and the second end of the third resistor is electrically connected with the temperature regulating circuit.
3. The semiconductor heat dissipating circuit of claim 2, wherein the temperature regulating circuit comprises a sliding varistor, a first end of the sliding varistor being electrically connected to a second end of the third resistor, a second end of the sliding varistor being connected to ground.
4. The semiconductor heat dissipation circuit of claim 3, wherein the control circuit comprises a fourth resistor, a fifth resistor, a first operational amplifier, and a second operational amplifier, wherein a first end of the fourth resistor is electrically connected to the first operational amplifier and the second operational amplifier, and a second end of the fourth resistor is electrically connected to the transistor switch circuit through a first switch; the first end of the fifth resistor is electrically connected with the second operational amplifier, and the second end of the fifth resistor is electrically connected with the transistor switch circuit through the first switch.
5. The semiconductor heat sink circuit according to claim 4, wherein the transistor switch circuit comprises a first transistor and a second transistor, wherein a collector of the first transistor is electrically connected to a power source, a base of the first transistor is electrically connected to the first switch, and an emitter of the first transistor is electrically connected to a base of the second transistor; and the collector electrode of the second triode is electrically connected with a power supply, and the emitter electrode of the second triode is electrically connected with the filter circuit.
6. The semiconductor heat dissipation circuit of claim 5, wherein the filter circuit comprises a first capacitor, a first terminal of the first capacitor is electrically connected to the emitter of the second transistor, and a second terminal of the first capacitor is grounded.
7. The semiconductor heat dissipating circuit of claim 6, wherein the wind generating device comprises an electric fan, a first end of the electric fan being electrically connected to a power source, a second end of the electric fan being grounded.
8. The semiconductor heat dissipation circuit of claim 7, wherein the semiconductor temperature regulation circuit comprises a second switch, a third switch, and a semiconductor cooling element, wherein a first end of the second switch is electrically connected to the air producing element, and a second end of the second switch is electrically connected to a first pin of the semiconductor cooling element; the first end of the third switch is electrically connected with the second pin of the semiconductor refrigerating piece, and the second end of the third switch is grounded.
9. The semiconductor heat sink circuit as recited in claim 8 wherein the indication circuit comprises a sixth resistor, a first diode, a second diode, a first end of the sixth resistor electrically connected to the second switch, a second end of the sixth resistor electrically connected to the first end of the first diode and the first end of the second diode; a second terminal of the first diode is electrically connected with a second terminal of the second diode; and the second end of the second diode is electrically connected with the second pin of the semiconductor refrigerating piece and the third switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279813.XU CN211404485U (en) | 2019-12-18 | 2019-12-18 | Semiconductor heat dissipation circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279813.XU CN211404485U (en) | 2019-12-18 | 2019-12-18 | Semiconductor heat dissipation circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211404485U true CN211404485U (en) | 2020-09-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922279813.XU Active CN211404485U (en) | 2019-12-18 | 2019-12-18 | Semiconductor heat dissipation circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211404485U (en) |
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2019
- 2019-12-18 CN CN201922279813.XU patent/CN211404485U/en active Active
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