CN211389604U - Wafer cutting machine shock-proof base - Google Patents

Abstract

The utility model discloses an anti-vibration base for a wafer cutting machine. A support seat is connected to the lower end of the wafer cutting machine body, and a soft pad is arranged at the connection between the lower end of the support seat and the base body. Two sides of the lower end are respectively connected with support plates, the lower end of the support plate penetrates to the interior of the base body and is connected with a bottom plate, the upper end side of the bottom plate is installed with a first spring, and the upper end side of the bottom plate is also connected with equal distances. Several groups of second springs, the upper ends of the first springs are connected to the inner wall of the base body, and the lower ends of the bottom plate are also connected with several groups of third springs at equal distances; The vibration is transmitted to the base body through the support seat, and the vibration generated by this process is absorbed inside the base body, so that the stability of the body of the wafer cutting machine body during the working process is better, ensuring its work quality and prolonging its service life.

Description

A shock-proof base for a wafer cutting machine

technical field

The utility model relates to the technical field of an anti-vibration base for a wafer cutting machine, in particular to an anti-vibration base for a wafer cutting machine.

Background technique

Wafer cutting machine, also known as dicing machine, is mainly used for cutting silicon wafers and various ceramic materials into small pieces in the semiconductor industry. The wafer cutting machine is equipped with precision components such as base, precision linear guide and high-precision spindle, Guarantee the precision required by the wafer dicing machine in production. The base structure of the existing wafer cutting machine is fixed, and this base has the defect that the shockproof effect is not ideal, so that the vibration of the wafer cutting machine during operation will affect its processing quality, and further improvement is required. Shockproof base for circular cutter.

Utility model content

The purpose of the present invention is to provide an anti-vibration base for a wafer cutting machine to solve the problems raised in the above-mentioned background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an anti-vibration base for a wafer dicing machine, comprising a wafer dicing machine body and a pedestal body, the lower end of the wafer dicing machine body is connected with a support seat, and the support seat The connection between the lower end of the support base and the base body is provided with a soft pad, the two sides of the lower end of the support base are respectively connected with support plates, the lower end of the support plate penetrates to the interior of the base body and is connected to a bottom plate, and one side of the upper end of the bottom plate is connected A first spring is installed, and several groups of second springs are equidistantly connected to one side of the upper end of the base plate. The upper ends of the first springs are connected to the inner wall of the base body, and the lower end of the base plate is also equidistantly connected with Several groups of third springs, the lower ends of the third springs are connected to the base body, a fixing plate is also installed inside the bottom plate, the lower ends of the fixing plates are connected with supporting legs, and the upper ends of the second springs are connected to the base body. The lower end of the support leg, the lower end of the support leg penetrates to the outside of the base body, the lower end of the support leg is provided with a second chute, and the inner lower ends of the second chute are respectively installed with several groups of fourth springs One end of the bottom plate is connected with a slider, the inner two sides of the base body are respectively provided with a first chute, the slider is slidably connected to the inside of the first chute, and the lower end of the slider is connected with a guide The guide rod is arranged in an L-shape, and one end of the guide rod is inserted into the second chute and connected to the upper end of the fourth spring.

As a further optimization of this technical solution, a buffer pad is provided inside the support seat, the buffer pad is a rubber buffer pad, and the outside of the wafer dicing machine body is connected to the support seat by bolts.

As a further optimization of the technical solution, an installation cavity for connecting the support plate, the bottom plate, the first spring, the second spring, the fixing plate, the support leg and the third spring is provided inside the base body.

As a further optimization of the technical solution, the lower ends of the base body are respectively provided with open grooves for penetrating the guide rods.

As a further optimization of the technical solution, the soft pad is a memory foam soft pad, and a nylon cloth wrapping layer is externally connected.

As a further optimization of the technical solution, several groups of fifth springs are respectively installed on both sides of the upper end of the base body, and the upper ends of the fifth springs are connected to the lower end of the support seat.

Compared with the prior art, the beneficial effects of the present utility model are: the present utility model transmits the vibration of the wafer cutting machine body during the working process to the base body through the support seat, and absorbs the vibration generated by this process inside the base body. , the support plate moves up and down in the base body, so that the first spring and the second spring at the upper end of the base plate compress up and down and rebound, and the third spring at the lower end compresses and rebounds up and down, so that the vibration is weakened, and the slider is in the first chute. It slides up and down in the middle to dilute the vibration during operation. The guide rod presses the fourth spring and moves up and down in the second chute. The support legs are stably fixed on the ground and can be fixed by bolts. The fixed plate and the base body are welded by welding. Connection, through the setting of the soft pad, the support seat can be buffered when the upper end of the base body vibrates, reducing vibration and friction, reducing the vibration of the wafer dicing machine body, and thus making the wafer dicing machine body work. The stability of the body It is better to ensure the quality of its work and prolong its service life.

Description of drawings

Fig. 1 is the structural representation of the utility model;

2 is a schematic diagram of the partial internal structure of the base body of the present invention;

Figure 3 is a schematic diagram of the external structure of the utility model.

In the figure: 1. Wafer cutting machine body; 2. Buffer pad; 3. Support seat; 4. Soft pad; 5. Base body; 6. Fifth spring; 7. Support plate; 8. Bottom plate; 9. First Spring; 10, the second spring; 11, the fixed plate; 12, the support leg; 13, the third spring; 14, the first chute; 15, the slider; 16, the guide rod; 17, the fourth spring; 18, the first Two chutes.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

In the description of the present invention, unless otherwise specified, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom" and the like indicate the orientation or The state relationship is based on the orientation or state relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the specific orientation that the referred mechanism or component must have, and is constructed and operated in a specific orientation. , so it cannot be construed as a limitation of the present invention.

1-3, the present utility model provides a technical solution: an anti-vibration base for a wafer dicing machine, comprising a wafer dicing machine body 1 and a base body 5, the lower end of the wafer dicing machine body 1 is connected with a support The seat 3, the connection between the lower end of the support seat 3 and the base body 5 is provided with a cushion 4, the lower end of the support seat 3 is respectively connected with a support plate 7 on both sides, and the lower end of the support plate 7 penetrates to the base body. 5 is internally connected with a bottom plate 8, a first spring 9 is installed on one side of the upper end of the bottom plate 8, and several groups of second springs 10 are also connected at equal distances on one side of the upper end of the bottom plate 8. The upper ends are connected to the inner wall of the base body 5, and the lower end of the bottom plate 8 is also connected with several groups of third springs 13 at equal distances, and the lower ends of the third springs 13 are connected to the base body 5. A fixing plate 11 is also installed, the lower end of the fixing plate 11 is connected with a supporting leg 12 , the upper end of the second spring 10 is connected to the lower end of the supporting leg 12 , and the lower end of the supporting leg 12 penetrates to the outside of the base body 5 The lower end side of the support leg 12 is provided with a second chute 18, the inner lower ends of the second chute 18 are respectively installed with several groups of fourth springs 17, and one end of the bottom plate 8 is connected with a slider 15, The base body 5 is provided with a first chute 14 on both sides of the interior. The slider 15 is slidably connected to the inside of the first chute 14. A guide rod 16 is connected to the lower end of the slider 15. The guide The rod 16 is arranged in an L shape, and one end of the guide rod 16 is inserted into the second chute 18 and connected to the upper end of the fourth spring 17 .

Specifically, the inside of the support seat 3 is provided with a buffer pad 2. The buffer pad 2 is a rubber buffer pad and has the functions of anti-wear and shock absorption. The outside of the wafer dicing machine body 1 is connected to the support seat through bolts. 3 connections for easy installation and removal. Specifically, the interior of the base body 5 is provided with an installation cavity for connecting the support plate 7 , the bottom plate 8 , the first spring 9 , the second spring 10 , the fixing plate 11 , the support leg 12 and the third spring 13 , through the installation cavity Provide space and provide enough room for shock-absorbing movement. Specifically, the lower ends of the base body 5 are respectively provided with open grooves for penetrating the guide rods 16 , so that the guide rods 16 can move up and down in the open grooves. Specifically, the soft pad 4 is a memory foam soft pad, and is connected with a nylon cloth wrapping layer. The setting of the soft pad 4 enables the support seat 3 to be buffered when the upper end of the base body 5 vibrates, reducing vibration and friction. Specifically, several groups of fifth springs 6 are respectively installed on both sides of the upper end of the base body 5 , and the upper ends of the fifth springs 6 are connected to the lower end of the support seat 3 . Buffer with the base body 5 to reduce vibration.

Specifically, during use, the vibration of the working process of the wafer cutting machine body 1 is transmitted to the base body 5 through the support base 3 , and the support plate 7 moves up and down in the base body 5 during this process, so that the first springs 9 and 9 on the upper end of the base plate 8 , The second spring 10 compresses up and down and rebounds, the third spring 13 at the lower end compresses and rebounds up and down, so that the vibration is weakened, and the slider 15 slides up and down in the first chute 14 to dilute the vibration during operation, and the guide rod 16, the fourth spring 17 is pressed down and moves up and down in the second chute 18. The support leg 12 is stably fixed on the ground and can be fixed by bolts. The fixing plate 11 and the base body 5 are connected by welding, and the setting of the soft pad 4 , so that the support seat 3 can be buffered when the upper end of the base body 5 vibrates, reducing vibration and friction, and reducing the vibration of the wafer cutting machine body 1, thereby making the wafer cutting machine body 1 The stability of the body during the working process is better.

Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention , alternatives and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. An anti-vibration base for a wafer cutting machine, comprising a wafer cutting machine body (1) and a base body (5), characterized in that a support seat (3) is connected to the lower end of the wafer cutting machine body (1) , the connection between the lower end of the support seat (3) and the base body (5) is provided with a cushion (4), the lower end of the support seat (3) is respectively connected with support plates (7) on both sides, and the support The lower end of the plate (7) penetrates to the interior of the base body (5) and is connected to a bottom plate (8), a first spring (9) is installed on one side of the upper end of the bottom plate (8), and a first spring (9) is installed on the upper end of the bottom plate (8). There are also several groups of second springs (10) equidistantly connected to the sides, the upper ends of the first springs (9) are connected to the inner wall of the base body (5), and the lower ends of the bottom plate (8) are also equidistantly connected with There are several groups of third springs (13), the lower ends of the third springs (13) are connected to the base body (5), and a fixing plate (11) is also installed inside the bottom plate (8), and the fixing plate ( The lower end of 11) is connected with a support leg (12), the upper end of the second spring (10) is connected to the lower end of the support leg (12), and the lower end of the support leg (12) penetrates to the outside of the base body (5) , a second chute (18) is provided on one side of the lower end of the support leg (12), and several groups of fourth springs (17) are respectively installed at the inner lower ends of the second chute (18), and the bottom plate ( 8) A slider (15) is connected to one end of the base body (5), a first chute (14) is respectively provided on both sides of the interior of the base body (5), and the slider (15) is slidably connected to the first chute (14). ), the lower end of the slider (15) is connected with a guide rod (16), the guide rod (16) is arranged in an L shape, and one end of the guide rod (16) is inserted into the second chute ( 18) is connected to the upper end of the fourth spring (17). 2 . The shock-proof base of a wafer cutting machine according to claim 1 , wherein a buffer pad ( 2 ) is provided inside the support base ( 3 ), and the buffer pad ( 2 ) is a rubber buffer pad. 3 . , the outside of the wafer cutting machine body (1) is connected with the support seat (3) through bolts. 3 . The shock-proof base of a wafer cutting machine according to claim 1 , wherein the base body ( 5 ) is internally provided with a support plate ( 7 ), a bottom plate ( 8 ), a first spring ( 9), the second spring (10), the fixing plate (11), the support leg (12), and the installation cavity of the third spring (13). 4 . The shock-proof base of a wafer cutting machine according to claim 1 , wherein the lower ends of the base body ( 5 ) are respectively provided with opening grooves for penetrating the guide rods ( 16 ). 5 . 5 . The shock-proof base of a wafer dicing machine according to claim 1 , wherein the cushion ( 4 ) is a memory foam cushion, and is externally connected with a nylon cloth wrapping layer. 6 . 6 . The shock-proof base of a wafer cutting machine according to claim 1 , wherein several groups of fifth springs ( 6 ) are respectively installed on both sides of the upper end of the base body ( 5 ). The upper end of (6) is connected to the lower end of the support seat (3).

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