CN211378653U - Reinforced liquid cooling module - Google Patents
Reinforced liquid cooling module Download PDFInfo
- Publication number
- CN211378653U CN211378653U CN202020418303.6U CN202020418303U CN211378653U CN 211378653 U CN211378653 U CN 211378653U CN 202020418303 U CN202020418303 U CN 202020418303U CN 211378653 U CN211378653 U CN 211378653U
- Authority
- CN
- China
- Prior art keywords
- liquid cooling
- plate
- cover plate
- main chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 239000007788 liquid Substances 0.000 title claims abstract description 98
- 238000003466 welding Methods 0.000 claims abstract description 24
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 2
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
- 238000010622 cold drawing Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a reinforcement type liquid cooling module, including back shroud, circuit board subassembly and liquid cooling board welding subassembly, circuit board subassembly sets up at the back shroud top, circuit board subassembly includes PCB board, main chip and heat conduction pad, main chip bonding is at PCB board top, the heat conduction pad sets up at main chip top, the PCB board passes through screw and back shroud, liquid cooling board welding subassembly fixed connection, liquid cooling board welding subassembly sets up at circuit board subassembly top, liquid cooling board welding subassembly includes liquid cooling cold plate, liquid cooling runner, radiating fin and liquid cooling board welding apron. The utility model discloses for the radiating fin who mills processing out in the liquid cooling runner, radiating fin is located the position directly over the main chip that generates heat, when liquid flows through radiating fin through the liquid cooling runner, can take away the heat that main chip transmitted radiating fin fast, and has the heat-sinking capability of superelevation, can realize quick plug simultaneously, and maintainability is strong.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field specifically is a reinforcement type liquid cooling module.
Background
Along with the continuous promotion of customer's demand, in order to satisfy the rapid increase of demands such as data acquisition, processing, exchange and parallel computation, the CPU that the integrated circuit board was used for calculation, storage, exchange and relevant chip performance promote by a wide margin, make the chip heat dissipation problem become sharper. Meanwhile, along with the development of the electronic technology towards miniaturization, high power and localization, the required volume of the electronic equipment is smaller and smaller, the number of heating components is increased, the power density and the heat flux density of the electronic equipment are greatly improved, the heat is concentrated, the local temperature is too high, and if the heat is not dissipated in time, the performance of the electronic equipment is reduced or even loses efficacy. At present, the existing electronic equipment generally adopts natural heat dissipation with low power consumption, and generally adopts forced air cooling with high power consumption. However, if forced air cooling is performed, external air is directly blown onto the module, which results in weak three-proofing capability and low heat dissipation capability of the electronic device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a reinforcement type liquid cooling module to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a reinforcement type liquid cooling module, includes back shroud, circuit board subassembly and liquid cooling board welded assembly, circuit board subassembly sets up at the back shroud top, circuit board subassembly includes PCB board, main chip and heat conduction pad, main chip bonding is at PCB board top, the heat conduction pad sets up at main chip top, the PCB board passes through screw and back shroud, liquid cooling board welded assembly fixed connection, liquid cooling board welded assembly sets up at circuit board subassembly top, liquid cooling board welded assembly includes liquid cooling board, liquid cooling runner, radiating fin and liquid cooling board welded cover plate, be provided with the liquid cooling runner on the liquid cooling board, and liquid cooling runner intermediate position is provided with radiating fin, liquid cooling board welded cover plate sets up at liquid cooling board top, and liquid cooling board welded cover plate is as an organic whole with the liquid cooling board through the welding of vacuum brazing technology.
Preferably, two corners of one end of the liquid cooling cold plate are rotatably connected with the pulling aid, the pulling aid is provided with a spring locking device, and the side edge of the liquid cooling cold plate is provided with a locking strip.
Preferably, both ends of the liquid cooling flow channel are both penetrated to the side edge of the liquid cooling plate, and both ends of the liquid cooling flow channel are communicated with the liquid cooling joint.
Preferably, the liquid cooling plate welding cover plate is provided with a small cover plate.
Preferably, the heat conducting pad is made of a carbon fiber material with high heat conductivity coefficient.
Preferably, the side edge of the liquid cooling plate is rotatably connected with a debugging cover plate through a rotating shaft, and one end of the debugging cover plate is provided with a loosening-preventing screw.
Preferably, the radiating fins are located right above the main chip, and the radiating fins and the liquid cooling flow channel are manufactured through milling.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses for the radiating fin who mills processing out in the liquid cooling runner, radiating fin is located the main chip that generates heat and puts directly over, when liquid flows through radiating fin through the liquid cooling runner, can take away main chip transmission radiating fin's heat fast, and has the heat-sinking capability of superelevation, and three proofings ability and anti-vibration impact ability are strong, can realize quick plug simultaneously, and maintainability is strong.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the explosion structure of the present invention;
fig. 3 is the enlarged schematic view of the heat transfer part of the structural liquid cooling module of the present invention.
In the figure: 1 back shroud, 2 PCB boards, 3 main chips, 4 heat conduction pads, 5 help and pull out the ware, 6 debug apron, 7 pine do not take off the screw, 8 liquid cooling cold plates, 9 radiating fin, 10 locking strips, 11 liquid cooling plate welded cover plate, 12 little apron, 13 liquid cooling runners, 14 liquid cooling joint, 15 liquid cooling plate welded assembly, 16 circuit board subassemblies.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a reinforced liquid cooling module comprises a rear cover plate 1, a circuit board assembly 16 and a liquid cooling plate welding assembly 15, wherein the circuit board assembly 16 is arranged at the top of the rear cover plate 1, the circuit board assembly 16 comprises a PCB (printed circuit board) 2, a main chip 3 and a heat conducting pad 4, the heat conducting pad 4 is made of carbon fiber materials with high heat conductivity coefficient, the main chip 3 is welded at the top of the PCB 2, the heat conducting pad 4 is arranged at the top of the main chip 3, the PCB 2 is fixedly connected with the rear cover plate 1 and the liquid cooling plate welding assembly 15 through screws, the liquid cooling plate welding assembly 15 is arranged at the top of the circuit board assembly 16, the liquid cooling plate welding assembly 15 comprises a liquid cooling plate 8, a liquid cooling runner 13, a heat radiating fin 9 and a liquid cooling plate welding cover plate 11, the liquid cooling runner 13 is arranged on the cold plate 8, and the heat radiating fin 9,
radiating fin 9 is located the position directly over main chip 3, and radiating fin 9 and liquid cooling runner 13 all make through milling process, liquid cooling runner 13 both ends all run through to liquid cooling cold drawing 8 sides, and both ends all communicate has liquid cooling joint 14, liquid cooling plate welding apron 11 sets up at liquid cooling cold plate 8 tops, and liquid cooling plate welding apron 11 is as an organic whole through the welding of vacuum brazing technology with liquid cooling cold drawing 8.
Two angles of one end of the liquid cooling cold plate 8 are rotatably connected with a pulling aid 5, the pulling aid is provided with a spring locking device, and the side edge of the liquid cooling cold plate 8 is provided with a locking strip 10. The side of the liquid cooling cold plate 8 is rotatably connected with a debugging cover plate 6 through a rotating shaft, and one end of the debugging cover plate 6 is provided with a loosening-preventing screw 7. The liquid cooling plate welding cover plate 11 is provided with a small cover plate 12.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A reinforced liquid cooling module comprises a rear cover plate (1), a circuit board assembly (16) and a liquid cooling plate welding assembly (15), and is characterized in that the circuit board assembly (16) is arranged at the top of the rear cover plate (1), the circuit board assembly (16) comprises a PCB (2), a main chip (3) and a heat conducting pad (4), the main chip (3) is welded at the top of the PCB (2), the heat conducting pad (4) is arranged at the top of the main chip (3), the PCB (2) is fixedly connected with the rear cover plate (1) and the liquid cooling plate welding assembly (15) through screws, the liquid cooling plate welding assembly (15) is arranged at the top of the circuit board assembly (16), the liquid cooling plate welding assembly (15) comprises a liquid cooling plate (8), a liquid cooling runner (13), a heat radiating fin (9) and a liquid cooling plate welding cover plate (11), and the liquid cooling plate (8) is provided with the liquid cooling runner (13), and the middle position of the liquid cooling runner (13) is provided with a radiating fin (9), the liquid cooling plate welding cover plate (11) is arranged at the top of the liquid cooling plate (8), and the liquid cooling plate welding cover plate (11) and the liquid cooling plate (8) are welded into a whole through a vacuum brazing process.
2. The reinforced liquid cooling module of claim 1, wherein: two angles of one end of the liquid cooling cold plate (8) are rotatably connected with a pulling aid (5), the pulling aid is provided with a spring locking device, and the side edge of the liquid cooling cold plate (8) is provided with a locking strip (10).
3. The reinforced liquid cooling module of claim 1, wherein: both ends of the liquid cooling runner (13) are all penetrated to the side edge of the liquid cooling cold plate (8), and both ends are communicated with liquid cooling joints (14).
4. The reinforced liquid cooling module of claim 1, wherein: the liquid cooling plate welding cover plate (11) is provided with a small cover plate (12).
5. The reinforced liquid cooling module of claim 1, wherein: the heat conducting pad (4) is made of carbon fiber materials with high heat conductivity coefficient.
6. The reinforced liquid cooling module of claim 1, wherein: the side of the liquid cooling cold plate (8) is rotatably connected with a debugging cover plate (6) through a rotating shaft, and one end of the debugging cover plate (6) is provided with a non-releasing screw (7).
7. The reinforced liquid cooling module of claim 1, wherein: the radiating fins (9) are located right above the main chip (3), and the radiating fins (9) and the liquid cooling flow channels (13) are all manufactured through milling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020418303.6U CN211378653U (en) | 2020-03-27 | 2020-03-27 | Reinforced liquid cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020418303.6U CN211378653U (en) | 2020-03-27 | 2020-03-27 | Reinforced liquid cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211378653U true CN211378653U (en) | 2020-08-28 |
Family
ID=72156041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020418303.6U Active CN211378653U (en) | 2020-03-27 | 2020-03-27 | Reinforced liquid cooling module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211378653U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112469242A (en) * | 2020-11-11 | 2021-03-09 | 中国第一汽车股份有限公司 | Liquid-cooled vehicle-mounted power supply |
| CN113840526A (en) * | 2021-10-28 | 2021-12-24 | 贵州航天南海科技有限责任公司 | A quick-install plug-in module with fast heat conduction function |
| CN114599210A (en) * | 2022-03-16 | 2022-06-07 | 南京天朗防务科技有限公司 | Double-sided liquid cooling heat dissipation multichannel comprehensive assembly |
| CN115460870A (en) * | 2022-08-29 | 2022-12-09 | 西安超越申泰信息科技有限公司 | A kind of LRM module heat dissipation management control method and liquid-cooled LRM module |
| EP4543154A4 (en) * | 2022-07-15 | 2025-11-05 | Huawei Tech Co Ltd | Electronic assembly and electronic device |
-
2020
- 2020-03-27 CN CN202020418303.6U patent/CN211378653U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112469242A (en) * | 2020-11-11 | 2021-03-09 | 中国第一汽车股份有限公司 | Liquid-cooled vehicle-mounted power supply |
| CN112469242B (en) * | 2020-11-11 | 2023-02-21 | 中国第一汽车股份有限公司 | Liquid-cooled vehicle-mounted power supply |
| CN113840526A (en) * | 2021-10-28 | 2021-12-24 | 贵州航天南海科技有限责任公司 | A quick-install plug-in module with fast heat conduction function |
| CN114599210A (en) * | 2022-03-16 | 2022-06-07 | 南京天朗防务科技有限公司 | Double-sided liquid cooling heat dissipation multichannel comprehensive assembly |
| EP4543154A4 (en) * | 2022-07-15 | 2025-11-05 | Huawei Tech Co Ltd | Electronic assembly and electronic device |
| CN115460870A (en) * | 2022-08-29 | 2022-12-09 | 西安超越申泰信息科技有限公司 | A kind of LRM module heat dissipation management control method and liquid-cooled LRM module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211378653U (en) | Reinforced liquid cooling module | |
| US6377453B1 (en) | Field replaceable module with enhanced thermal interface | |
| CN210610200U (en) | Quick radiating optical module casing | |
| CN108153401A (en) | A kind of computer server radiator | |
| WO2025039711A1 (en) | Heat dissipation device and server | |
| CN216313680U (en) | Liquid cooling plate assembly for server CPU | |
| CN202306432U (en) | Heat dissipation cold plate for mainboard of compact peripheral component interconnect (CPCI) server | |
| CN221827276U (en) | A server chip heat dissipation cold plate and heat dissipation system | |
| CN219165024U (en) | Wind-liquid mixed type heat radiation module structure | |
| CN209747503U (en) | An integrated power module radiator | |
| CN215219620U (en) | Water-cooling calculating board heat abstractor | |
| CN214278878U (en) | Water-cooling heat dissipation device for array server computing board | |
| CN116761396A (en) | A liquid-cooled server and its cold plate integrated network card module | |
| CN116643633A (en) | A chip heat dissipation structure | |
| CN208188773U (en) | A kind of computer housing water-cooled radiator | |
| CN221707996U (en) | Heat pipe heat dissipation formula machine case | |
| CN215340995U (en) | Indoor constant temperature collection system chipset | |
| CN219497025U (en) | Liquid cooling heat radiation structure of server hard disk | |
| CN221807512U (en) | Driver cooling fin fixed on substrate | |
| CN216310468U (en) | Magnetic control linkage module of small liquid crystal blackboard | |
| CN223390550U (en) | Chip double-sided liquid cooling heat dissipation system | |
| CN223488588U (en) | Cooling device and heat sink assembly | |
| CN222980601U (en) | A high-efficiency liquid-cooled heat exchanger with a fin heat exchange structure in the channel | |
| CN223626203U (en) | Adopt cold heat dissipation area of pure water to press easy plug-in subrack | |
| CN221762279U (en) | A magnetic pump with cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |