CN211161497U - Circuit board radiating block die - Google Patents

Abstract

The utility model discloses a circuit board radiating block mould, including die holder, fixed plate and upper die base, the top of die holder is provided with the upper die base, the lower mould backing plate is installed at the top of die holder, and the intermediate position department at lower mould backing plate top is provided with the mounting groove. The utility model discloses install second screw rod and second nut, through rotating the second screw rod, can take off the second screw rod from the second nut or install the second screw rod on the second nut, make the die head of fixed plate top can change according to the specification of circuit board radiating block, and the device installs first screw rod and first nut cooperation and uses, make the inside punching press module of upper die base plate can change, make the device can adjust according to the production specification of circuit board radiating block through changing punching press module and die head, make the device can be used for processing the circuit board radiating block of different specifications, the controllability of device is stronger, and the suitability is stronger.

Description

Circuit board radiating block die

Technical Field

The utility model relates to a circuit board accessory production mould technical field specifically is a circuit board radiating block mould.

Background

The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the electrical appliance layout, because electronic elements on the circuit board are concentrated, the circuit board can generate a large amount of heat in the using process, the heat dissipation of the circuit board can be rapidly assisted by the heat dissipation of the circuit board, the heat dissipation efficiency is improved, the overheating burnout of the circuit board is avoided, a heat dissipation block of the circuit board needs to be processed and formed by using a die in the production process, when the existing heat dissipation block die of the circuit board is used, a grinding head and a module for stamping on the die are fixed and cannot be adjusted according to the specifications of different heat dissipation blocks, so that the die can only process the heat dissipation block of the circuit board with fixed specifications, the adjustability of the die is poor, the applicability is poor, and meanwhile, in the stamping process of the existing heat dissipation block die of the, a large error is generated to reduce the processing accuracy of the mold.

Disclosure of Invention

An object of the utility model is to provide a circuit board radiating block mould to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board radiating block mould, includes die holder, fixed plate and upper die base, the top of die holder is provided with the upper die base, the lower die backing plate is installed at the top of die holder, and the intermediate position department at lower die backing plate top is provided with the mounting groove, the fixed plate is installed to the inside bottom of mounting groove, the four corners position department of upper die base bottom all is provided with the constant head tank, and the intermediate position department of upper die base bottom installs the upper die backing plate, the bottom of upper die backing plate is provided with the recess, stamping module is evenly installed at the inside top of recess, and stamping module's top all installs first screw rod, stamping module's bottom all is provided with the punching press groove.

Preferably, the four corners position department at lower mould backing plate top all installs the registration arm, buffer spring is all installed to the inside bottom of registration arm, and buffer spring's top all installs the locating lever.

Preferably, the bottom of the upper die base is provided with a through hole opposite to the first screw, and the top of the upper die base is provided with a first nut matched with the first screw opposite to the through hole.

Preferably, the top of the fixing plate is uniformly provided with second nuts, the insides of the second nuts are all provided with second screws in a threaded manner, and the tops of the second screws are all provided with die heads.

Preferably, five groups of supporting plates are installed at the bottom of the lower die base, and a bottom plate is installed at the bottom of each supporting plate.

Preferably, the top of the positioning rod is provided with a rectangular positioning block matched with the positioning groove.

Compared with the prior art, the beneficial effects of the utility model are that: the die for the circuit board radiating block is provided with a second screw and a second nut, the second screw can be taken down from the second nut or arranged on the second nut by rotating the second screw, so that a die head above a fixed plate can be replaced according to the specification of the circuit board radiating block, the die head is arranged on the die for the circuit board radiating block, the die head is provided with a first screw and a first nut which are matched for use, so that a stamping module in an upper die base plate can be replaced, the die head and the stamping module can be replaced, the device can be adjusted according to the production specification of the circuit board radiating block, the device can be used for processing the circuit board radiating blocks with different specifications, the device has strong adjustability and strong applicability, meanwhile, the device is provided with a positioning rod, a rectangular positioning block, a positioning pipe and a buffering spring and is matched for use, and in the processing process, the, the lower die base and the upper die base are prevented from sliding relatively, the punching position is prevented from deviating, the stability of the device is improved, and the processing qualified rate of the device is improved.

Drawings

Fig. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic view of a partial structure of the present invention;

fig. 3 is a schematic front sectional view of the positioning tube of the present invention.

In the figure: 1. a base plate; 2. a lower die holder; 3. a fixing plate; 4. a lower die base plate; 5. positioning a rod; 6. positioning a groove; 7. an upper die holder; 8. an upper die base plate; 9. a stamping module; 10. a groove; 11. a first screw; 12. a through hole; 13. a first nut; 14. a rectangular positioning block; 15. a positioning tube; 16. a buffer spring; 17. a second screw; 18. a second nut; 19. a support plate; 20. punching a groove; 21. mounting grooves; 22. a die head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a circuit board radiating block mould, including die holder 2, fixed plate 3 and upper die base 7, the top of die holder 2 is provided with upper die base 7, lower backing plate 4 is installed at the top of die holder 2, and the intermediate position department at 4 tops of lower backing plate is provided with mounting groove 21, fixed plate 3 is installed to the inside bottom of mounting groove 21, the four corners position department of upper die base 7 bottom all is provided with constant head tank 6, and the intermediate position department of upper die base 7 bottom installs upper backing plate 8, the bottom of upper backing plate 8 is provided with recess 10, stamping module 9 is evenly installed at the inside top of recess 10, and first screw rod 11 is all installed at stamping module 9's top, stamping module 9's bottom all is provided with stamping groove 20.

In this implementation:

further, the four corners position department at 4 tops of lower mould backing plates all installs registration arm 15, and buffer spring 16 is all installed to the inside bottom of registration arm 15, and buffer spring 16's top all installs registration arm 5, and during the punching press, upper die base 7 moves downwards, and 5 compression atress buffer spring 16 of registration arm, buffer spring 16 can cushion the impact force of punching press and reduce impact velocity, avoids impact velocity to cause the damage of circuit board radiating block original paper very fast.

Further, the bottom of the upper die base 7 is provided with a through hole 12 opposite to the position of the first screw rod 11, a first nut 13 matched with the first screw rod 11 is installed at the position of the top of the upper die base 7 opposite to the position of the through hole 12, the first screw rod 11 is rotated out of the first nut 13, the stamping module 9 can be taken out from the inner part of the upper die base plate 8, and the stamping module 9 in the upper die base plate 8 can be replaced.

Further, second nuts 18 are uniformly installed on the top of the fixing plate 3, second screws 17 are installed inside the second nuts 18 in a threaded mode, die heads 22 are installed on the tops of the second screws 17, the second screws 17 can be taken down from the second nuts 18 or the second screws 17 can be installed on the second nuts 18 by rotating the second screws 17, and therefore the die heads 22 above the fixing plate 3 can be replaced according to the specification of the circuit board radiating block.

Further, five groups of supporting plates 19 are installed at the bottom of the lower die holder 2, the bottom plate 1 is installed at the bottom of the supporting plates 19, and the supporting plates 19 and the bottom plate 1 can support the lower die holder 2, so that the overall strength of the device can be improved.

Further, the rectangle locating piece 14 of mutually supporting with constant head tank 6 is all installed at the top of locating lever 5, can fix a position die holder 2 and upper die base 7 in going into constant head tank 6 through going into rectangle locating piece 14 card, prevents to produce relative slip between die holder 2 and the upper die base 7, avoids the punching press position to produce the skew, is favorable to improving the stability of device, improves the processing qualification rate of device.

The working principle is as follows: when in use, according to the production specification of the circuit board radiating block, the second screw 17 can be taken down from the second nut 18 or the second screw 17 is installed on the second nut 18 by rotating the second screw 17, so that the die head 22 fixed above the second nut 18 can be replaced according to the specification of the circuit board radiating block, then a worker can respectively place the stamping modules 9 corresponding to the die heads 22 in the grooves 10, insert the first screw 11 at the top of the stamping module 9 into the through hole 12, then rotate the stamping module 9, so that the stamping module 9 drives the first screw 11 to rotate, so that the first screw 11 is rotated into the first nut 13 through threads, the position of the stamping module 9 can be fixed through the first screw 11 and the first nut 13, the replacement process of the stamping module 9 and the die head 22 is completed according to the production specification of the circuit board radiating block, the upper die base 7 moves downwards during stamping, place the circuit board radiating block original paper in die head 22 top, rectangle locating piece 14 inserts the inside of constant head tank 6 when upper die base 7 downstream, can fix a position lower bolster 2 and upper die base 7 through constant head tank 6 and rectangle locating piece 14, prevent to produce relative slip between lower bolster 2 and the upper die base 7, upper die base 7 lasts the downstream, can accomplish the stamping process to circuit board radiating block original paper application of force through die head 22, in the punching press process, rectangle locating piece 14 atress is and compresses buffer spring 16 through locating lever 5, buffer spring 16 can cushion the impact force of punching press and reduce impact velocity, avoid impact velocity to cause circuit board radiating block original paper to damage very fast.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (6)

1. The utility model provides a circuit board radiating block mould, includes die holder (2), fixed plate (3) and upper die base (7), its characterized in that: the die comprises a die holder (2) and is characterized in that an upper die base (7) is arranged above the die holder (2), a lower die base plate (4) is installed at the top of the die holder (2), a mounting groove (21) is formed in the middle position of the top of the lower die base plate (4), a fixing plate (3) is installed at the bottom of the inside of the mounting groove (21), positioning grooves (6) are formed in the four corners of the bottom of the upper die base (7), an upper die base plate (8) is installed at the middle position of the bottom of the upper die base (7), grooves (10) are formed in the bottom of the upper die base plate (8), stamping modules (9) are evenly installed at the tops of the insides of the grooves (10), first screw rods (11) are installed at the tops of the stamping modules (9), and stamping grooves.

2. The circuit board heat slug die of claim 1 further characterized by: locating tube (15) are all installed to the four corners position department at lower mould backing plate (4) top, buffer spring (16) are all installed to the inside bottom of locating tube (15), and locating lever (5) are all installed at the top of buffer spring (16).

3. The circuit board heat slug die of claim 1 further characterized by: the bottom of the upper die base (7) is provided with a through hole (12) at the position opposite to the first screw (11), and the top of the upper die base (7) is provided with a first nut (13) which is matched with the first screw (11) at the position opposite to the through hole (12).

4. The circuit board heat slug die of claim 1 further characterized by: second nuts (18) are uniformly installed at the top of the fixing plate (3), second screws (17) are installed inside the second nuts (18) in a threaded mode, and die heads (22) are installed at the tops of the second screws (17).

5. The circuit board heat slug die of claim 1 further characterized by: five groups of supporting plates (19) are installed at the bottom of the lower die holder (2), and a bottom plate (1) is installed at the bottom of each supporting plate (19).

6. The circuit board heat slug die of claim 2 further characterized in that: and rectangular positioning blocks (14) matched with the positioning grooves (6) are arranged at the tops of the positioning rods (5).

Images