CN211128395U - Heat dissipation type PCB multiply wood - Google Patents
Heat dissipation type PCB multiply wood Download PDFInfo
- Publication number
- CN211128395U CN211128395U CN201922326528.9U CN201922326528U CN211128395U CN 211128395 U CN211128395 U CN 211128395U CN 201922326528 U CN201922326528 U CN 201922326528U CN 211128395 U CN211128395 U CN 211128395U
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- circuit board
- layer
- frame
- heat dissipation
- layer circuit
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Abstract
The utility model discloses a heat dissipation type PCB multilayer board, which comprises a top layer circuit board, a power layer, a grounding layer and a bottom layer circuit board which are connected in sequence, wherein limiting frames are arranged between and on two sides of the top layer circuit board, the power layer, the grounding layer and the bottom layer circuit board, the top layer circuit board, the power layer, the grounding layer, the bottom layer circuit board and five limiting frames are all sleeved in a mounting frame, five limiting frames clamp the top layer circuit board, the power layer, the grounding layer and the bottom layer circuit board in the mounting frame, a mounting box is fixed on the outer wall of one side of the mounting frame with a ventilation port, the top layer circuit board, the power layer, the grounding layer and the bottom layer circuit board are clamped in the mounting frame through five limiting frames to realize fastening, heat generated by the work of each layer circuit board is blown out through the ventilation port arranged on the limiting frame and the ventilation port arranged on the mounting, realize the heat dissipation of each layer circuit board, do benefit to the life who prolongs PCB multiply wood body.
Description
Technical Field
The utility model relates to a PCB multiply wood field, in particular to heat dissipation type PCB multiply wood.
Background
The PCB multilayer board is a multilayer circuit board used in electrical products, the multilayer board uses more single-sided or double-sided wiring boards, uses one printed circuit board with double sides as an inner layer, two single sides as an outer layer, or two printed circuit boards with double sides as an inner layer and two single sides as an outer layer, and the printed circuit boards which are alternately connected together by a positioning system and an insulating adhesive material and have conductive patterns interconnected according to design requirements become four-layer or six-layer printed circuit boards, which are also called multilayer printed circuit boards, but the existing PCB multilayer board has poor heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a heat dissipation type PCB multiply wood can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a heat dissipation type PCB multiply wood, is including the top layer circuit board, power layer, ground plane and the bottom circuit board that connect gradually, between top layer circuit board, power layer, ground plane and the bottom circuit board and both sides all are provided with spacing frame, and top layer circuit board, power layer, ground plane, bottom circuit board and five spacing frames of layer all cup joint in the installing frame, and five sets of spacing frames press from both sides top layer circuit board, power layer, ground plane and bottom circuit board tightly in the installing frame, are fixed with the mounting box on the one side outer wall of ventilative mouthful of area on the installing frame.
Preferably, the limiting frame is a rectangular frame, the two opposite side surfaces of the limiting frame are provided with air guide ports, and the other two opposite side surfaces of the limiting frame are provided with three threaded holes at equal intervals.
Preferably, the mounting frame is set to be a rectangular frame with the top and the bottom communicated, rectangular ventilation openings are formed in two opposite side faces of the mounting frame, five layers of through holes are formed in the other two opposite side faces of the mounting frame, and three through holes are formed in each layer of through holes.
Preferably, the threaded hole on the limiting frame is screwed with the locking screw, and the locking screw penetrates through the through hole on the mounting frame to fixedly connect the limiting frame with the mounting frame.
Preferably, a plurality of air guide holes are uniformly distributed on the mounting box.
Preferably, a fan is fixed on the side wall of the mounting box at the inner side of the air guide hole.
Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses well top layer circuit board, the power supply layer, ground plane and bottom circuit board are pressed from both sides tightly through five sets of spacing frames and are realized the fastening in the installing frame, and realize the interval between each layer circuit board through spacing frame, the top layer circuit board is realized to the ventilative mouth that the symmetry set up on the air guide mouth that the symmetry set up on the spacing frame and the installing frame, the power supply layer, interval and external intercommunication between ground plane and the bottom circuit board, be convenient for dispel the heat, the fan through setting up on the installing box blows off the ventilative mouth that sets up on heat that each layer circuit board work produced through the air guide mouth that sets up on the spacing frame and the installing frame, realize the heat dissipation of each layer circuit board, do benefit to the.
Drawings
Fig. 1 is a schematic front view of a heat dissipation type PCB multi-layer board according to the present invention;
fig. 2 is a schematic side view of a heat dissipation type PCB multi-layer board according to the present invention;
fig. 3 is a schematic structural diagram of a mounting frame in a heat dissipation type PCB multi-layer board according to the present invention;
fig. 4 is a schematic structural diagram of a limiting frame in a heat dissipation type PCB multi-layer board of the present invention.
In the figure: 1. a top layer circuit board; 2. a ground plane; 3. installing a frame; 4. a limiting frame; 5. a bottom layer circuit board; 6. a power layer; 7. locking the nut; 8. mounting a box; 9. a fan; 10. a wind guide hole; 11. a via hole; 12. a ventilation opening; 13. an air guide port; 14. a threaded bore.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-4, a heat dissipation type PCB multi-layer board comprises a top layer circuit board 1, a power layer 6, a ground layer 2 and a bottom layer circuit board 5 which are connected in sequence, wherein limit frames 4 are arranged between and on two sides of the top layer circuit board 1, the power layer 6, the ground layer 2, the bottom layer circuit board 5 and five layers of limit frames 4, the top layer circuit board 1, the power layer 6, the ground layer 2, the bottom layer circuit board 5 and five layers of limit frames 4 are all sleeved in a mounting frame 3, the limit frames 4 are arranged into rectangular frames, air guide ports 13 are arranged on two opposite side surfaces of the limit frames 4, three threaded holes 14 are arranged on the other two opposite side surfaces of the limit frames 4 at equal intervals, the mounting frame 3 is arranged into a rectangular frame with communicated top and bottom, rectangular ventilation ports 12 are arranged on two opposite side surfaces of the mounting frame 3, five layers of via holes 11 are arranged on, screw hole 14 and locking screw 7 on the spacing frame 4 close soon, locking screw 7 passes the via hole 11 on the installing frame 3 with spacing frame 4 and installing frame 3 fixed connection, five sets of spacing frame 4 press from both sides top layer circuit board 1, power layer 6, ground plane 2 and bottom circuit board 5 tightly in installing frame 3, be fixed with mounting box 8 on the one side outer wall of installing frame 3 upper band ventilative mouthful 12, the equipartition has a plurality of wind-guiding hole 10 on the mounting box 8, be fixed with fan 9 on the 8 lateral walls of mounting box of wind-guiding hole 10 inboard.
What need explain, the utility model relates to a heat dissipation type PCB multiply wood, top layer circuit board 1, the power supply layer 6, ground plane 2 and bottom circuit board 5 press from both sides tightly through five sets of spacing frame 4 and realize the fastening in installing frame 3, and realize the interval between each layer circuit board through spacing frame 4, top layer circuit board 1 is realized to ventilative mouthful 12 that the symmetry set up on the air guide port 13 that the symmetry set up on spacing frame 4 and installing frame 3, the power supply layer 6, interval and external intercommunication between ground plane 2 and the bottom circuit board 5, be convenient for dispel the heat, the heat that produces each layer circuit board work through the fan 9 that sets up on the installing box 8 blows off the ventilative mouthful 12 that sets up on air guide port 13 that sets up on spacing frame 4 and the installing frame 3, realize the heat dissipation of each layer circuit board, do benefit to the life of extension PCB multiply wood body.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a heat dissipation type PCB multiply wood, includes top layer circuit board (1), power plane (6), ground plane (2) and bottom circuit board (5) that connect gradually, its characterized in that: spacing frame (4) are all provided with between top layer circuit board (1), power layer (6), ground plane (2) and bottom circuit board (5) and both sides, top layer circuit board (1), power layer (6), ground plane (2), bottom circuit board (5) and five layers of spacing frame (4) all cup joint in installing frame (3), five sets of spacing frame (4) press from both sides top layer circuit board (1), power layer (6), ground plane (2) and bottom circuit board (5) tightly in installing frame (3), be fixed with mounting box (8) on the one side outer wall of installing frame (3) upper band ventilative mouthful (12).
2. The heat dissipation type PCB multi-layer board of claim 1, wherein: the limiting frame (4) is arranged to be a rectangular frame, air guide ports (13) are formed in two opposite side faces of the limiting frame (4), and three threaded holes (14) are formed in the other two opposite side faces of the limiting frame (4) at equal intervals.
3. The heat dissipation type PCB multi-layer board of claim 1, wherein: the mounting frame (3) is set to be a rectangular frame with the top and the bottom communicated, rectangular ventilation openings (12) are formed in two opposite side faces of the mounting frame (3), five layers of through holes (11) are formed in the other two opposite side faces of the mounting frame (3), and three through holes (11) are formed in each layer.
4. The heat dissipation type PCB multi-layer board of claim 2, wherein: threaded hole (14) on spacing frame (4) close with locking screw (7) soon, locking screw (7) pass through via hole (11) on installing frame (3) with spacing frame (4) and installing frame (3) fixed connection.
5. The heat dissipation type PCB multi-layer board of claim 1, wherein: a plurality of air guide holes (10) are uniformly distributed on the mounting box (8).
6. The heat dissipation type PCB multi-layer board of claim 5, wherein: and a fan (9) is fixed on the side wall of the mounting box (8) at the inner side of the air guide hole (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922326528.9U CN211128395U (en) | 2019-12-20 | 2019-12-20 | Heat dissipation type PCB multiply wood |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922326528.9U CN211128395U (en) | 2019-12-20 | 2019-12-20 | Heat dissipation type PCB multiply wood |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211128395U true CN211128395U (en) | 2020-07-28 |
Family
ID=71706178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922326528.9U Expired - Fee Related CN211128395U (en) | 2019-12-20 | 2019-12-20 | Heat dissipation type PCB multiply wood |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211128395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114040562A (en) * | 2021-10-09 | 2022-02-11 | 江西技研新阳电子有限公司 | Composite printed circuit board capable of being externally provided with heat conducting mechanism |
-
2019
- 2019-12-20 CN CN201922326528.9U patent/CN211128395U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114040562A (en) * | 2021-10-09 | 2022-02-11 | 江西技研新阳电子有限公司 | Composite printed circuit board capable of being externally provided with heat conducting mechanism |
| CN114040562B (en) * | 2021-10-09 | 2024-03-08 | 江西技研新阳电子有限公司 | Composite printed circuit board with externally-added heat conducting mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200728 Termination date: 20211220 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |