CN211014935U

CN211014935U - L ED light source, backlight module, display screen and terminal

Info

Publication number: CN211014935U
Application number: CN201921864725.XU
Authority: CN
Inventors: 古远琴; 陈武
Original assignee: Shenzhen Techaser Technologies Co Ltd
Current assignee: Shenzhen Techaser Technologies Co Ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-07-14
Anticipated expiration: 2029-10-31

Abstract

The embodiment of the utility model provides an L ED light source, backlight module, display screen and terminal, wherein, L ED light source includes circuit board and a plurality of top-lighting's L ED chip, be provided with the hole of making a video recording that runs through the circuit board on the circuit board, backlight module includes main backlight module and vice backlight unit, including the frame in the main backlight module, be provided with the through hole in the bellying on the diapire of frame, vice L ED light source is the aforesaid L ED light source that is provided with the hole of making a video recording in the vice backlight unit, the camera can carry out image acquisition through the hole of making a video recording and through hole under the screen that lies in vice backlight unit, simultaneously, the light-out portion of vice light guide plate stretches into in the through hole in the vice backlight unit, after the light that vice L ED light source sent gets into vice light guide plate, can follow the light-out portion that lies in the through hole and light the whole regions of through hole upper surface, thereby make the region that the camera corresponds under setting up in the screen in the backlight.

Description

L ED light source, backlight module, display screen and terminal

Technical Field

The utility model relates to a show the field, especially relate to an L ED light source, backlight unit, display screen and terminal.

Background

In the process of continuously pursuing the large screen ratio of the terminal, people put forward the concept of 'full screen'. The full screen means that no special space is available on the front face of the terminal for arranging devices such as a front camera, a receiver and the like. Therefore, "camera under screen" arises by oneself, so-called camera under screen just means that leading camera sets up under the screen, but, although the camera can hide under the screen, this also can lead to setting up the regional unable quilt that the camera corresponds on the display screen and being lighted and show, consequently just also can't realize real comprehensive screen yet, has seriously influenced user experience.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an L ED light source, backlight unit, display screen and terminal, the main technical problem who solves is that the region that sets up camera correspondence under the screen in the display screen can't show, restriction terminal screen accounts for the ratio, influences the problem of terminal display effect.

In order to solve the technical problem, the embodiment of the utility model provides an L ED light source, its characterized in that, L ED light source include the circuit board with set up on the circuit board and with a plurality of top-emitting light formula L ED chips of circuit board electric connection, be provided with the camera hole that runs through the upper and lower surface of circuit board on the circuit board, the camera hole is used for being located the screen camera of L ED light source bottom surface and carries out image acquisition.

Optionally, each L ED chip in the L ED light source forms m rings of L ED chips around the camera hole, m being equal to or greater than 1.

Optionally, the value of m is any one of 1, 2, and 3.

The embodiment of the utility model provides a backlight module, a serial communication port, backlight module includes main backlight module and vice backlight module, including the frame in the main backlight module, there is the bellying of upwards bellying on the diapire of frame, be provided with the through hole that runs through bellying upper surface and diapire lower surface in the bellying, vice backlight module includes vice L ED light source and vice light guide plate, vice L ED light source is the L ED light source of above-mentioned arbitrary, the portion of going out of vice light guide plate stretches into in the through hole, and the portion of going out lateral wall and the laminating of through hole inner wall, the portion of going into of vice light guide plate is located under the diapire, it is located the bottom surface of going into light portion to include in the portion of going into light bottom surface in the portion of going into light, the circuit board is located under the portion of going into light, the hole of making a video recording corresponds with the through hole position, the luminous top surface of each L ED chip is gone into light bottom surface towards the light bottom surface.

Optionally, the lower surface of the secondary light guide plate is flush, and the upper surface of the light outlet part is recessed downwards to form a lower groove.

Optionally, the top of the light emergent portion is flush, and the lower surface of the secondary light guide plate is recessed upwards to form an upper groove corresponding to the through hole.

Optionally, the lower surface of the secondary light guide plate is flush, and the upper surface of the light emergent part is flush.

Optionally, the upper surface of the light-emitting portion is recessed downward to form a lower groove, the lower surface of the secondary light guide plate is recessed upward to form an upper groove corresponding to the through hole, and the lower groove is communicated with the upper groove.

The embodiment of the utility model provides a still provide a display screen, a serial communication port, including liquid crystal display panel and as above arbitrary backlight unit, liquid crystal display panel sets up on main backlight unit.

The embodiment of the utility model provides a terminal is still provided, a serial communication port, camera and aforementioned display screen under the screen, the camera sets up under vice backlight unit's the hole of making a video recording under the screen, carries out image acquisition through the hole of making a video recording and through hole.

The utility model has the advantages that:

the embodiment of the utility model provides a L ED light source, backlight module, display screen and terminal, wherein, L ED light source includes the circuit board and set up on the circuit board and with a plurality of L ED chips of circuit board electric connection, be provided with the camera hole that runs through the upper and lower surface of circuit board on the circuit board, each L ED chip is the L ED chip of top-lighting formula, and backlight module includes main backlight module and vice backlight module, including the frame in the main backlight module, there is the bellying of upwards arch on the diapire of frame, be provided with the through hole that runs through bellying upper surface and diapire lower surface in the bellying, vice backlight module includes vice L ED light source and vice light guide plate, vice L ED light source is the aforementioned L ED light source that is provided with the camera hole, this camera hole is used for being located the screen under the vice backlight module jointly with the through hole and carries out image acquisition under the screen, vice light source all is located the area beyond the through hole under the diapire through hole under the light source of vice light guide plate, the light source stretches into in the through hole, the light source of vice light source stretches into the through hole, the through hole is provided with the through light source, the through hole, thereby the through light source is provided the through hole on the light source and the light source is provided with the through hole on the light source of the light source and the light source of.

Other features and corresponding advantages of the invention are set forth in the following part of the specification, and it is to be understood that at least some of the advantages become apparent from the description of the invention.

Drawings

Fig. 1 is a schematic cross-sectional view of a backlight module according to a first embodiment of the present invention;

fig. 2a is a schematic cross-sectional view of a backlight module according to an embodiment 2 of the present invention;

fig. 2b is another schematic cross-sectional view of a backlight module according to an example 2 of the present invention;

fig. 3a is a schematic cross-sectional view of a backlight module according to an embodiment 1 of the present invention;

fig. 3b is another schematic cross-sectional view of a backlight module according to an embodiment 1 of the present invention;

fig. 4 is a schematic cross-sectional view of a sub light guide plate provided in an example 2 of the present invention;

fig. 5a is a schematic cross-sectional view of a backlight module according to an embodiment 3 of the present invention;

fig. 5b is another schematic cross-sectional view of a backlight module according to an embodiment 3 of the present invention;

fig. 6 is a schematic cross-sectional view of a sub light guide plate provided in an example 3 of the present invention;

fig. 7a is a schematic cross-sectional view of a backlight module according to an embodiment 4 of the present invention;

fig. 7b is another schematic cross-sectional view of a backlight module according to an embodiment 4 of the present invention;

fig. 8a is a schematic cross-sectional view of a side-in type sub-backlight module according to a second embodiment of the present invention;

FIG. 8b is a top view of the secondary L ED light source of FIG. 8 a;

fig. 8c is a top view of another L ED light source according to a second embodiment of the present invention;

fig. 8d is a top view of three other pairs L ED light sources provided in the second embodiment of the present invention;

fig. 9a is a schematic cross-sectional view of a secondary backlight module according to a second embodiment of the present invention;

FIG. 9b is a top view of the secondary L ED light source of FIG. 9 a;

fig. 9c is a top view of two other sub L ED light sources provided in the second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

fig. 1 shows a schematic view of an arrangement of an off-screen camera, in fig. 1, a through hole 100 is arranged in a backlight module 10, and the through hole 100 penetrates through an outer frame 101 of the backlight module 10: the bottom wall of the outer frame 101 is provided with a convex portion protruding upward, and the through hole 100 penetrates through the upper surface of the convex portion and the bottom of the outer frame 101. The outer frame 101 further includes a side wall, the side wall and the bottom wall enclose a half-enclosed accommodating chamber, and the accommodating chamber sequentially accommodates the reflective film 102, the light guide plate 103, the diffusion sheet 104, and the brightness enhancement film 105 of the backlight module 10 from bottom to top. In this embodiment, the positions of the reflective film 102, the light guide plate 103, the diffusion sheet 104 and the brightness enhancement film 105 corresponding to the protrusions are all provided with openings, and through the openings, the reflective film 102, the light guide plate 103, the diffusion sheet 104 and the brightness enhancement film 105 can be sequentially sleeved outside the protrusions, so that the reflective film 102 is directly disposed on the bottom wall of the outer frame 101, the light guide plate 103 is disposed on the reflective film 102, and upward naturally and sequentially is the diffusion sheet 104 and the brightness enhancement film 105. The brightness enhancement film 105 may be formed by an upper prism sheet and a lower prism sheet, or a composite film formed by combining the upper prism sheet and the lower prism sheet, or even in some other examples of this embodiment, the brightness enhancement film 105 may be an inverse prism film.

The under-screen camera 12 may be disposed under the outer frame 101 of the backlight module 10, which may perform image capturing through the through-hole 100: external light passes through the through-hole 100 to reach the under-screen camera 12, and forms an image in the under-screen camera 12.

In the backlight module 10, in order to provide a channel for the under-screen camera 12 to let external light enter, no light guide plate is disposed in the through hole 100, and because the protrusion is blocked, the protrusion is not lit by the L ED light source of the backlight module, therefore, in the display screen prepared based on the backlight module 10, the corresponding position of the through hole 100 cannot normally perform image display, so, in the related art, although the camera of the terminal can be hidden under the display screen, the image acquisition of the under-screen camera can be realized only by sacrificing the display area of the display screen, which severely restricts the user experience of the terminal, in order to solve the problem, the embodiment provides a backlight module, please refer to a cross-sectional schematic diagram of the backlight module shown in fig. 2 a:

in order to distinguish from L ED light sources and light guide plates in the sub-backlight module 22, in the present embodiment, L ED light sources in the main backlight module 21 are referred to as "main L ED light sources", light guide plates therein are referred to as "main light guide plates", and L ED light sources and light guide plates in the sub-backlight module 22 are referred to as "sub-L ED light sources" and "sub-light guide plates", respectively.

It is understood that the main L ED light source and the sub L ED light source are not only L ED chips, but also include circuit boards electrically connected to L ED chips to control L ED chips, which may be conventional PCB circuit boards or flexible circuit boards.

The embodiment provides an L ED light source as a sub L ED light source in a sub backlight module, wherein the L ED light source comprises a circuit board and a plurality of top-emitting L ED chips arranged on the circuit board and electrically connected with the circuit board, and a camera hole penetrating through the upper surface and the lower surface of the circuit board is arranged on the circuit board and used for image acquisition of a screen-down camera positioned on the bottom surface of the L ED light source.

In other examples of the present embodiment, the outer frame 211 may also be made of plastic, and certainly, an outer frame formed by combining plastic and metal is also feasible, for example, a plastic-iron integrated frame widely used at present, the outer frame 211 includes a bottom wall and a side wall, a protrusion protruding upward is provided on the bottom wall, and other devices of the main backlight module 21, such as a main L ED light source, a reflective film, a light guide plate, etc., may be disposed in a receiving chamber enclosed by the bottom wall and the side wall, and of course, due to the existence of the protrusion, the reflective film, the light guide plate, etc., in the main backlight module 21 also need to be provided with openings as in the backlight module 10.

Through holes 200 penetrating the upper surface of the boss and the lower surface of the bottom wall of the outer frame 211 are formed in the boss, and external light can pass through the upper surface of the main backlight module 21 through the through holes 200 to reach the back surface of the main backlight module 21.

In order to illuminate the corresponding position of the through hole 200 in the backlight module 20a, the sub backlight module 22 is required, in the embodiment, the sub backlight module 22 includes a sub L ED light source 221 and a sub light guide plate 222, in fig. 2a, the sub backlight module 22 is a side-in type backlight module, but in some examples of the embodiment, the sub backlight module 22 may also be a straight-in type backlight module, the sub light guide plate 222 includes a light inlet portion and a light outlet portion, wherein the light outlet portion extends into the through hole 200 and is attached to the side wall of the through hole 200, the light inlet portion and the sub L ED light source are both located under the bottom wall of the outer frame 211, the light emitted by the sub L ED light source enters the light inlet portion of the sub light guide plate 222 and then exits from the light outlet portion of the light outlet portion, so as to illuminate the whole area of the upper surface of the through hole 200.

It should be understood that the light emitted from the secondary L ED light source 221 is required to illuminate the entire area of the upper surface of the hole 200, and the secondary light guide plate 222 should meet any of the following conditions:

for example, in some examples of the embodiment, the light-emitting portion of the secondary light guide plate 222 has no through hole penetrating through the upper surface of the light-emitting portion and the bottom surface of the secondary light guide plate 222, and the through hole 200 is covered by the secondary light guide plate 222, so that the upper surface of the through hole 200 can be fully illuminated.

Second, although there are through holes penetrating the upper surface of the light emergent portion and the bottom surface of the sub light guide plate 222 in the light emergent portion of the sub light guide plate 222, for example, although there are through holes penetrating the sub light guide plate 222 in the light emergent portion, the light emergent portion in the light emergent portion is disposed toward the light emergent portion, so that the light emitted from the light emergent portion can illuminate the through holes.

The above two cases are explained below:

first, in the case where there is no through hole penetrating the light exit portion of the sub light guide plate 222:

example 1:

in some examples of this embodiment, please refer to the schematic cross-sectional view of the backlight module shown in fig. 3a, in which the backlight module 30a includes a main backlight module 31 and a sub-backlight module 32, the main backlight module includes an outer frame 311, a bottom wall of the outer frame 311 protrudes upwards to form a protrusion, a through hole 300 penetrating an upper surface of the protrusion and a lower surface of the bottom wall of the outer frame is formed in the protrusion, the main backlight module 31 further includes a reflective film, a main light guide plate L ED light source, a main light guide plate, a diffusion sheet and a brightness enhancement film disposed on the bottom wall of the outer frame, the main backlight module 31 is a side-in type backlight module, so that a L ED chip in the main L ED light source has a light emitting side facing a light entering side of the main light guide plate.

In fig. 3a, the sub backlight module 32 is a side-in type backlight module, the light-entering surface of the sub light guide plate 322 is located at the side of the sub L ED light source 321, and the light emitted from the sub L ED light source 321 exits from the light-emitting side and enters the inside of the sub light guide plate 322 from the light-entering side of the sub light guide plate 322, in this embodiment, the lower surface of the sub light guide plate 322 is flush, and the upper surface of the light-exiting part is flush, so in fig. 3a, the middle protruding part of the sub light guide plate 322 in the shape of "convex" is the light-exiting part protruding into the through hole 300 and attached to the side wall of the through hole 300, the top surface of the light-exiting part is the light-exiting surface of the sub light guide plate 322, and the laterally extending part below the "convex" is the bottom wall of the outer frame 311 and is the light-entering part attached to the bottom wall.

It is understood that the light emitting portion of the secondary light guide plate 322 is required to be attached to the sidewall of the through-hole 300 in order to avoid a problem that the light emitting portion on the upper surface of the through-hole 300 is uniform due to a gap between the light emitting portion and the sidewall of the through-hole 300.

In some examples of the embodiment, the top of the light-emitting portion and the top of the protrusion of the outer frame 311 are located on the same horizontal line, so that a partial area of the top of the light-emitting portion and an area of the top of the protrusion of the outer frame can jointly form a supporting surface for disposing a double-sided adhesive tape, thereby fixing the liquid crystal panel on the backlight module 30a by using the double-sided adhesive tape. In order to avoid the influence of the double-sided tape on the display of the liquid crystal panel, in this embodiment, the double-sided tape needs to have light transmittance, and therefore, the double-sided tape used for fixing and adhering the liquid crystal panel is generally white or gray instead of a color with poor light transmittance such as black.

Since the through hole 300 is provided in the protruding portion of the outer frame 311, the area of the protruding portion that can be used for providing the double-sided adhesive tape only remains the hole edge of the through hole 300, and in some examples, the thickness of the hole edge is between 0.05mm and 0.15 mm. And the width of at least 0.4mm is required for providing the supporting surface of the double-sided adhesive tape, and therefore, in this example, the width d of the covering area of the double-sided adhesive tape on the light emergent portion should satisfy 0.25mm < d < 0.35 mm. In one example, the thickness of the rim is 0.1mm, and thus d may take on the value of 0.3 mm.

In fig. 3a, the sub backlight module 32 is a side-in type backlight module, but in other examples of the present embodiment, the sub backlight module may also be a straight-in type backlight module, for example, in fig. 3b, the backlight module 30b is similar to the backlight module 30a in fig. 3a, however, in fig. 3b, the sub L ED light source 381 in the sub backlight module 38 is disposed at the bottom of the sub light guide plate 382, the L ED chip in the sub L ED light source 381 has a top light emitting surface, and the light emitted from the top light emitting surface can directly enter the sub light guide plate 382 from the bottom light entering portion of the sub light guide plate 382 into the sub light guide plate 382 and then be emitted from the light exiting portion of the sub light guide plate 382.

As can be seen from fig. 3a and 3b, in the backlight module shown in fig. 3a and 3b, the middle thickness of the secondary light guide plate is large, which causes the following two problems:

one, because the camera carries out image acquisition under the screen and need pass through the through-hole, consequently, if vice backlight unit is located the light-emitting portion in the through-hole too thick, will influence outside light and get into camera under the screen, reduce the shooting effect of camera under the screen.

And the thicknesses of the middle part and the edge part of the auxiliary light guide plate are uneven, so that the condition that the middle part of the auxiliary light guide plate is sunken inwards in the injection molding stage is easily caused, and the problem of poor quality of the auxiliary light guide plate is caused.

In order to solve these two problems, the present embodiment further provides some other forms of backlight module:

example 2:

with reference to fig. 2a, in the present example, the light exiting portion of the sub-backlight module 22 extends into the through hole 200, and the upper surface is recessed downward to form a downward recessed groove, which is referred to as a "lower groove". Although the light-emitting portion of the sub light guide plate 222 is recessed downward by the lower groove, the recess of the light-emitting portion does not reach the bottom surface of the sub light guide plate 222, that is, the lower groove is not a groove penetrating the sub light guide plate 222. In some examples of the present embodiment, the thickness of the bottom of the lower groove is equal to the thickness of the light incident portion of the secondary light guide plate 222, as shown in fig. 2 a.

In some examples of this embodiment, the top of the sidewall of the lower groove is flush with the top of the protrusion of the outer frame 211, so that the top of the sidewall of the lower groove and the top of the protrusion form a support surface for disposing the double-sided tape, thereby fixing the liquid crystal panel on the backlight module 20 a. Similar to the backlight module 30a, the double-sided tape has a certain light transmittance, and is usually white or gray instead of a color with poor light transmittance such as black.

In the embodiment, assuming that the thickness of the hole edge is 0.05mm to 0.15mm after the through hole 200 is formed in the protrusion, in order to form the double-sided adhesive tape on the top of the protrusion and the top of the sidewall of the lower groove, the thickness d of the top of the sidewall of the lower groove should satisfy that d is greater than or equal to 0.25mm and less than or equal to 0.35mm, and in an example, the thickness of the hole edge is 0.1mm, so the value of d may be 0.3 mm.

It will be appreciated that in figure 2a the thickness of the side walls of the lower groove is uniform, i.e. the thickness of the side walls of the lower groove is uniform everywhere, but in other examples of this embodiment the thickness of the side walls of the lower groove may not be uniform throughout, for example, in figure 4 a secondary light guide plate is shown in which the thickness of the side walls of the lower groove increases progressively from top to bottom, in figure 4 the inner side walls of the lower groove are progressively inclined outwardly from bottom to top, or the area of the groove opening of the lower groove is greater than the area of the groove bottom of the lower groove. Of course, those skilled in the art will appreciate that in other examples, the thickness unevenness of the lower groove sidewall may be thickness unevenness of the lower groove sidewall at different positions on the same horizontal plane.

Referring to fig. 2a, the light incident portion of the sub light guide plate 222 is located below the bottom wall of the outer frame 211, and the upper surface of the light incident portion is attached to the bottom wall of the outer frame 211. since the sub backlight module 22 in fig. 2a is a side-in type backlight module, the light incident portion has a light incident side surface, and the light emitted from the sub L ED light source 221 enters the sub light guide plate 222 through the light incident side surface, and then enters the through hole 200 through the light emergent portion of the sub light guide plate 222 and exits from the light emergent surface of the light emergent portion of the sub light guide plate 222, it can be understood that, in fig. 2a, the light emergent surface of the sub light guide plate 22 is not a single surface, but includes a higher light emergent surface (i.e., the top of the side wall of the lower groove).

It is needless to say that when the sub light guide plate is in the form shown in fig. 2a, the sub backlight module may also be a direct type backlight module, please refer to the backlight module shown in fig. 2 b:

in fig. 2b, the backlight module 20b is similar to the backlight module 20a in fig. 2a, however, in fig. 2b, the sub L ED light source 281 of the sub backlight module 28 is disposed at the bottom of the sub light guide plate 282, and the L ED chips of the sub L ED light source 281 have light emitting top surfaces, and light emitted from the light emitting top surfaces can directly enter the sub light guide plate 282 from the light incident bottom surface of the light incident portion of the sub light guide plate 422 and then be emitted from the light emergent portion of the sub light guide plate 282.

In the backlight module shown in fig. 2a, 2b and 3a, 3b, the lower surface of the secondary light guide plate is flush, however, in some other examples of the present embodiment, the lower surface of the secondary light guide plate may not be flush:

example 3:

referring to fig. 5a, a cross-sectional view of a backlight module is shown, in which a backlight module 50a includes a main backlight module 51 and a sub-backlight module 52, wherein the main backlight module 51 also includes an outer frame 511, and a through hole 500 is disposed in a protrusion on a bottom wall of the outer frame 511, the through hole 500 penetrates through an upper surface of the protrusion and a lower surface of the bottom wall of the outer frame 511. the main backlight module 51 further includes a reflective film, a main L ED light source, a main light guide plate, a diffusion plate and a brightness enhancement film disposed on the bottom wall of the outer frame.

In FIG. 5a, the sub-backlight module 52 is a side-in type backlight module, the light-entering surface of the sub-light guide plate 522 is located at the side of the sub-L ED light sources 521, and the light emitted from the sub-L ED light sources 521 exits from the light-emitting side of the L ED chips and enters the inside of the sub-light guide plate 522 from the light-entering side of the sub-light guide plate 522.

In some examples of the embodiment, the top of the light-emitting portion of the sub light guide plate 522 and the top of the protrusion of the outer frame 511 are located at the same horizontal line, so that a partial area of the top of the light-emitting portion and an area of the top of the protrusion of the outer frame 511 may together form a support surface for disposing a double-sided adhesive tape, thereby fixing the liquid crystal panel on the backlight module 50a by using the double-sided adhesive tape. In order to avoid the influence of the double-sided tape on the display of the liquid crystal panel, in this embodiment, the double-sided tape needs to have light transmittance, and therefore, the double-sided tape used for fixing and adhering the liquid crystal panel is generally white or gray instead of a color with poor light transmittance such as black.

Since the through hole 500 is formed in the protruding portion of the outer frame 511, the area of the protruding portion that can be used for disposing the double-sided adhesive tape only has the hole edge of the through hole 500, and in some examples, the thickness of the hole edge is between 0.05mm and 0.15 mm. And the width of at least 0.4mm is required for providing the supporting surface of the double-sided adhesive tape, and therefore, in this example, the width d of the covering area of the double-sided adhesive tape on the light emergent portion should satisfy 0.25mm < d < 0.35 mm. In one example, the thickness of the rim is 0.1mm, and thus d may take on the value of 0.3 mm.

In some examples of the present embodiment, the inner sidewall of the upper groove may be vertical, for example, in fig. 6, a schematic cross-sectional view of a secondary light guide plate in which an angle between the inner sidewall of the upper groove and a groove bottom thereof is 90 °, which means that the areas of the notch of the upper groove and the groove bottom are uniform. Of course, in other examples of this embodiment, the included angle between the inner sidewall of the upper groove and the groove bottom thereof may be a rounded angle of 90 °.

In fig. 5a, the inner side wall of the upper groove is not vertical, and the included angle between the inner side wall of the upper groove and the groove bottom of the upper groove is larger than 90 degrees, so that the area of the notch of the upper groove is larger than that of the groove bottom of the upper groove. Of course, it will be understood by those skilled in the art that in other examples, the angle between the inner side wall of the upper groove and the groove bottom thereof may be less than 90 °, so that the area from the groove opening of the upper groove to the groove bottom is gradually reduced.

In some examples of this embodiment, the upper groove notch is sized to receive the lower screen camera portion and extends into the upper groove, such that the upper groove provides a receiving space for the lower screen camera, which provides the following advantages:

firstly, the thickness of the light emitting part of the auxiliary light guide plate 722 is reduced, so that the light path of light in the auxiliary light guide plate 722 is shorter, and the imaging effect of the camera under the screen is enhanced.

The thickness of vice light guide plate mid portion has been cut thin, can promote the equal and degree of vice light guide plate whole thickness, has reduced vice light guide plate and has appeared the possibility that mid portion is inwards sunken in the injection moulding stage, is favorable to promoting the yields of vice light guide plate.

In fig. 5a, the sub-backlight module 52 is a side-in type backlight module, but in other examples of the present embodiment, the sub-backlight module may also be a straight-in type backlight module, for example, in fig. 5b, the backlight module 50b is similar to the backlight module 50a in fig. 5a, however, in fig. 5b, the sub-L ED light source 581 in the sub-backlight module 58 is disposed at the bottom of the sub-light guide plate 582, the L ED chips in the sub-L ED light source 581 have light emitting top surfaces, and light emitted from the light emitting top surfaces can directly enter the sub-light guide plate 582 from the light inlet bottom surface of the light inlet portion of the sub-light guide plate 582 and then be emitted from the light outlet portion of the sub-light guide plate 582.

The following description is directed to a backlight module having a through hole on a light-emitting portion of an auxiliary light guide plate:

example 4:

referring to fig. 7a, a cross-sectional view of a backlight module is shown, in which a backlight module 70a includes a main backlight module 71 and a sub-backlight module 72, the main backlight module includes an outer frame 711, a bottom wall of the outer frame 711 protrudes upward to form a protrusion, a through hole 700 is formed in the protrusion to penetrate through an upper surface of the protrusion and a lower surface of the bottom wall of the outer frame, the main backlight module 71 further includes a reflective film disposed on the bottom wall of the outer frame, a main L ED light source, a main light guide plate, a diffusion plate, and a brightness enhancement film, the main backlight module 71 is a side-in type backlight module.

In FIG. 7a, the sub-backlight module 72 is a side-in type backlight module, the light-entering surface of the sub-light guide plate 722 is located at the side of the sub-L ED light source 721, the light emitted from the L ED chips in the sub-L ED light source 721 is emitted from the light-emitting side thereof, and then enters the sub-light guide plate 722 from the light-entering side of the sub-light guide plate 722.

In this embodiment, although the through holes are formed in the light-emitting portion of the secondary light guide plate 722, so that the vertical orthographic projection of the light-emitting surface of the secondary light guide plate 722 cannot completely cover the through-hole 700, because part of the light-emitting surface of the secondary light guide plate 722 is obliquely disposed, the light emitted from the light-emitting surface of the secondary light guide plate 722 can still illuminate the entire area of the upper surface of the through-hole 700:

in some examples of this embodiment, the area of the lower groove opening is greater than the area of the lower groove base, i.e. the cross-sectional area of the lower groove decreases from the lower groove opening to the lower groove base, and correspondingly the angle between the inner side wall of the lower groove and the lower groove base is greater than 90 °. In this case, not only the top surface of the lower groove sidewall but also the inner sidewall of the lower groove may serve as the light emitting surface of the sub light guide plate 722. It should be appreciated that the light rays exiting the secondary light guide plate 722 are not vertical but are angled upward and toward the axis A-A' of the lower groove so that the light rays exiting the inner side wall of the lower groove illuminate the groove opening.

Assuming that the angle between the inner side wall of the lower groove and the vertical line is α with respect to the angle between the vertical line and the inner side wall of the lower groove being complementary to α, α is naturally less than 90 with respect to the angle between the inner side wall of the lower groove and the bottom of the lower groove being complementary to α, in some examples of this embodiment, 25 ° ≦ α ° ≦ 35.

Let the angle between the inner sidewall of the lower groove and the inner sidewall of the upper groove be β, in some examples of the present embodiment, 75 ° ≦ β ≦ 85 °. for example, in some examples of the present embodiment, the angle between the inner sidewall of the lower groove and the inner sidewall of the upper groove is 75 °, in some examples of the present embodiment, the angle between the inner sidewall of the lower groove and the inner sidewall of the upper groove is 85 °.

In some examples of this embodiment, the size of the notch of the upper groove can be passed by the camera part under the screen, so as to extend into the upper groove, which is beneficial to improving the utilization rate of the device setting in the terminal to the internal space of the terminal and reducing the thickness of the terminal. Optionally, the inner side wall of the upper groove is not vertical, and the included angle between the inner side wall of the upper groove and the groove bottom of the upper groove is larger than 90 degrees, so that the area of the notch of the upper groove is larger than that of the groove bottom of the upper groove. Of course, it will be understood by those skilled in the art that in other examples, the angle between the inner side wall of the upper groove and the groove bottom thereof may be less than 90 °, so that the total slot opening area of the upper groove gradually decreases from the groove bottom to the groove bottom.

In some examples of this embodiment, the top of the sidewall of the lower groove is flush with the top of the protrusion of the outer frame 711, so that the top of the sidewall of the lower groove and the top of the protrusion form a support surface for disposing the double-sided adhesive, thereby fixing the liquid crystal panel on the backlight module 70 a. The double-sided tape has a certain light transmittance, and is usually white or gray instead of a color having a poor light transmittance such as black.

In this embodiment, assuming that the thickness of the hole edge is 0.05mm to 0.15mm after the protrusion is provided with the through hole 700, in order to provide the double-sided adhesive tape on the top of the protrusion and the top of the lower groove sidewall, the thickness d of the top of the lower groove sidewall should satisfy that d is greater than or equal to 0.25mm and less than or equal to 0.35mm, and in an example, the thickness of the hole edge is 0.1mm, so the value of d may be 0.3 mm.

In fig. 7a, the sub-backlight module 72 is a side-in type backlight module, but in some other examples of the present embodiment, the sub-backlight module may also be a straight-in type backlight module, for example, in fig. 7b, the backlight module 70b is similar to the backlight module 70a in fig. 7a, however, in fig. 7b, the sub-L ED light source 781 in the sub-backlight module 78 is disposed at the bottom of the sub-light guide plate 782, and the sub-L ED light source 781 has a light emitting top surface, and light emitted from the light emitting top surface can directly enter the sub-light guide plate 782 from the light inlet bottom surface of the light inlet portion of the sub-light guide plate 782 and then be emitted from the light outlet portion of the sub-light guide plate 782.

It should be noted that, in the backlight modules provided in the foregoing examples, except for some differences between the sub-backlight modules, the structure of the main backlight module is basically general, and therefore, the implementation of the devices in the main backlight module in each backlight module can be referred to each other.

In this embodiment, because the under-screen camera needs to be disposed under the sub backlight module, the under-screen camera needs to pass through the through hole on the outer frame to capture an external image, and the sub L ED light source itself is opaque, therefore, the sub L ED light source should not block the viewing range of the under-screen camera, that is, there should be no circuit board or L ED chip in the sub L ED light source in the region corresponding to the through hole on the outer frame, therefore, in the sub L ED light source provided in this embodiment, a camera hole is disposed at a position in the circuit board corresponding to the through hole on the outer frame (i.e., a position corresponding to the light-out portion in the sub light guide plate or a position corresponding to the under-screen camera), and the camera hole penetrates through the upper and lower surfaces of the circuit board, so that the under-screen camera can capture an image through the camera hole and the through hole on the outer frame.

Of course, if the sub L ED light source itself is composed of multiple sets of discrete sub circuit boards and L ED chips, there is no need to specially form a camera hole on the sub circuit board as long as the sub circuit board does not shield the camera under the screen.

The present embodiment further provides a display screen, where the display screen includes any one of the backlight modules provided in the present embodiment, and meanwhile, the display screen further includes a liquid crystal panel, and the liquid crystal panel fully covers the upper side of the light exit surface of the backlight module and is fixedly connected to the backlight module through a double-sided tape. Of course, it is needless to say that other optical devices may be included in the display panel in addition to the liquid crystal panel.

The embodiment further provides a terminal, where the terminal includes any one of the backlight modules provided in the embodiment, or the terminal includes the display screen. Besides, the terminal further comprises a lower screen camera, the lower screen camera is arranged below the backlight module, the position of the lower screen camera corresponds to the position of the light emergent part (or the through hole and the camera hole) of the auxiliary light guide plate, and the lower screen camera and the light emergent part realize external image acquisition through the through hole and the camera hole.

In addition, in the embodiment, the operation of the main backlight module and the sub backlight module in the backlight module can be controlled independently, that is, the main backlight module and the sub backlight module can be controlled to light simultaneously, but the main backlight module can be controlled to light only or the sub backlight module can be controlled to light only separately, so that a main backlight control circuit and a sub backlight control circuit exist in the terminal, wherein the main backlight control circuit is arranged in a circuit board of the main L ED light source and used for controlling the lighting of the main light guide plate, and the sub backlight control circuit is arranged in a circuit board of the sub L ED light source and used for controlling the lighting of the sub light guide plate.

The embodiment of the utility model provides a several kinds of backlight unit, set up the through hole in order to realize on the basis of camera image acquisition under the screen in main backlight unit's the frame, can set up vice backlight unit in the position that the through hole corresponds, utilize vice L ED light source to light vice light guide plate in the through hole among the vice backlight unit, thereby illuminate the whole regions of through hole upper surface, avoid because set up the screen camera down at the backlight unit back and lead to backlight unit upper portion subregion can be because the screen camera can't be lighted down, influence backlight unit and light the problem of area, be favorable to promoting the display screen based on this kind of backlight unit and preparation, the screen at terminal accounts for the ratio, user experience at terminal has been strengthened.

Example two:

the present embodiment mainly briefly describes the sub L ED light source used in the backlight module:

the auxiliary L ED light source comprises a circuit board and a plurality of L ED chips which are fixed on the circuit board and electrically connected with the circuit board, wherein the circuit board is provided with a camera hole penetrating through the upper surface and the lower surface of the circuit board, and the camera hole is used for preventing the auxiliary L ED light source from shielding a screen camera below the auxiliary L ED light source so as to influence the image acquisition of the auxiliary L ED light source.

Since the sub backlight module is divided into two types, namely a side-in type backlight module and a direct-in type backlight module, the L ED light sources used in the two types of sub backlight modules will be described with reference to the accompanying drawings:

if the sub-backlight module is a side-in type backlight module, the light-emitting side of each L ED chip in the sub-backlight module faces the light-entering side of the sub-light guide plate, and the light emitted by each L ED chip is emitted from the light-emitting surface of the light-emitting portion after entering the sub-light guide plate from the light-entering side, and the light emitted by each L ED chip is emitted from the light-emitting surface of the light-emitting portion, so as to illuminate the whole area of the upper surface of the through hole, please refer to a cross-sectional schematic view of a sub-backlight module shown in fig. 8a, where the sub-backlight module 82 includes a sub-light guide plate 822 and a sub-L ED light sources 821, where the sub-L ED light sources 821 includes a circuit board 8210 and L ED chips a1 and a2 disposed on the circuit board, and it is understood by those skilled in the art that the circuit board 8210 may further include other non-illustrated L ED chips.

Meanwhile, please further refer to the top view of the sub L ED light source 821 shown in fig. 8 b:

because the circuit board 821 itself is opaque, therefore, in order to prevent the circuit board 8210 from shielding the under-screen camera, in the sub L ED light source 821 provided in this embodiment, a camera hole 8211 is disposed at a position in the circuit board 8210 corresponding to the through hole in the outer frame (i.e., a position in the sub light guide plate corresponding to the light guide portion or a position in the sub light guide plate corresponding to the under-screen camera), and the camera hole 8211 penetrates through the upper and lower surfaces of the circuit board 8210, so that the under-screen camera can perform image acquisition through the camera hole, or partially protrudes into the sub light guide plate through the camera hole.

It can be seen from fig. 8b that the contour of the image capturing hole 8211 is circular, and the overall contour of the circuit board 8210 is square, it can be understood that the contour of the image capturing hole 8211 is related to the cross-sectional shape of the through hole disposed in the main backlight module frame, and the cross-sectional shape of the through hole may be circular, elliptical, rectangular, parallelogram, regular polygon or other irregular shapes, so that the contour of the image capturing hole 8211 may also be elliptical, rectangular, parallelogram, regular polygon or other irregular shapes, a total of four L ED chips are disposed on the circuit board 8210, and the four L ED chips are equidistant from the axis of the image capturing hole 8211 on the circuit board 8210 and form a square around the contour, and the four L ED chips are uniformly distributed on the four sides of the sub light guide plate having the same contour as a square, it can be understood by those skilled in the art that, as a side-entry backlight module, the size of the contour of the circuit board 8210 in the sub light guide plate 8210 should be at least the size of the contour of the sub light guide plate 82822, and if the size of the sub light guide plate 82822 is only slightly larger than the size of the circuit board 82822, then the sub light guide plate 82822, it is not necessary to be larger than the size of course if the circuit board 82822, that the sub light guide plate 82822, then.

Of course, if the overall profile of the sub light guide plate 822 is different, the four L ED chips may be arranged differently, for example, if the profile of the sub light guide plate 822 is consistent with the profile of the circuit board 8210, and the profile of the circuit board 8210 is as shown in fig. 8c, the four L ED chips may be arranged on the circuit board 8210 in the manner as shown in fig. 8 c.

In some examples of this embodiment, the sub L ED light source includes n L ED chips, the n L ED chips may surround a regular n-polygon, and each of the n L ED chips is at the same distance from the axis of the imaging hole 8211. needless to say, n may be 4, or any of 3, 6, 8, etc., for example, fig. 8d shows a top view of a sub L ED light source with several L ED chips.

If the sub backlight module is a direct-type backlight module, each L ED chip in the sub backlight module is a fixed light emitting L ED chip having a light emitting top surface, the light emitting top surface of the L ED chip faces the light entering bottom surface of the sub light guide plate, and the light emitted by each L ED chip is emitted from the light emitting surface of the light emitting portion after being emitted from the light entering bottom surface into the sub light guide plate, so as to illuminate the whole area of the upper surface of the through hole, please refer to a cross-sectional view of a sub backlight module shown in fig. 9a, the sub backlight module 92 includes a sub light guide plate 922 and a sub L ED light source 921, wherein the sub L ED light source 921 includes a circuit board 9210 and L ED chips a1 and a2 disposed on the circuit board, although it can be understood by those skilled in the art that other non-illustrated L ED chips may be included on the circuit board 9210.

Meanwhile, please further refer to the top view of the sub L ED light source 921 shown in fig. 9 b:

because the circuit board 921 itself is opaque, therefore, in order to avoid the circuit board 9210 from blocking the under-screen camera, in the sub L ED light source 921 provided in this embodiment, a camera hole 9211 is provided at a position in the circuit board 9210 corresponding to the through hole on the outer frame (i.e., a position in the sub light guide plate corresponding to the light guide portion or a position in the sub light guide plate corresponding to the under-screen camera), and the camera hole 9211 penetrates through the upper and lower surfaces of the circuit board 9210, so that the under-screen camera can perform image acquisition through the camera hole, or partially extend into the sub light guide plate through the camera hole.

As can be seen from fig. 9b, the outline of the camera hole 9211 is circular, and the outline of the camera hole 9211 is related to the cross section of the through hole disposed on the outer frame of the main backlight module, and the cross section of the through hole may be elliptical, rectangular, parallelogram, regular polygon or other irregular shapes besides circular, so that the outline of the camera hole 9211 may also be elliptical, rectangular, parallelogram, regular polygon or other irregular shapes, the whole outline of the circuit board 9210 is circular, on which a plurality of L ED chips are disposed, the L ED chips are equidistant from the axis of the camera hole 9211 on the circuit board 9210, and form a chip ring around the camera hole 9211, and the L ED chips may be uniformly distributed around the camera hole 9211.

In other examples of this embodiment, each L ED chip of the sub-L ED light source forms m L ED chip rings around the camera hole, where m is greater than or equal to 1. for example, in FIG. 9c, it is shown that when m takes a value of 2 and 3, respectively, a top view of the sub-L ED light source is shown.

The sub L ED light source provided by the present embodiment can be applied to any backlight module including the sub backlight module in the previous embodiments, regardless of the form of the sub light guide plate in the sub backlight module.

The vice L ED light source that this embodiment provided, through set up the hole of making a video recording on a circuit board, can be so that the screen that is located the circuit board back down the camera accomplish image acquisition through this hole of making a video recording, simultaneously, vice L ED light source can provide light to frame through hole upper surface through vice light guide plate, thereby the problem that the corresponding position of camera can not be lighted under the screen among the backlight unit has been solved, the screen that has improved the terminal accounts for the ratio, user experience has been strengthened.

Example three:

in the present embodiment, a description is continued on the backlight module based on the foregoing embodiments, so that a person skilled in the art can better understand the advantages and the structural details of the backlight module:

no matter the secondary backlight module is a direct-in type backlight module or a side-in type backlight module, no matter the structure of the secondary light guide plate is, in the embodiment, the upper surface of the light inlet part of the secondary light guide plate is attached to the lower surface of the bottom wall of the outer frame of the main backlight module, and the side wall of the light outlet part of the secondary light guide plate is also attached to the inner side wall of the through hole. In other words, the parts of the sub light guide plate corresponding to the outer frame are all attached, so that the problem that the light emitting parts on the upper surface of the through hole are uniform due to the gap between the sub light guide plate and the outer frame can be avoided.

In some examples, the secondary light guide plate is disposed on the outer frame by injection molding, and it should be understood that if the outer frame is an integrated frame made of plastic and iron, the outer frame is originally subjected to one injection molding in the manufacturing process, and when the secondary light guide plate is disposed on the outer frame, the secondary light guide plate is subjected to injection molding again, that is, the iron frame is subjected to two injection molding. It is not obvious to those skilled in the art that the injection molding of the secondary light guide plate may be performed first, and then the injection molding of the glue at the rim of the bezel may be performed.

It should be understood that, if the secondary light guide plate is disposed on the outer frame by integral injection molding, the outer frame is provided with a glue fixing hole for fixing the secondary light guide plate. One outer frame may have only one glue fixing hole for fixing and connecting the sub light guide plate, and in some other examples of this embodiment, two or even a plurality of glue fixing holes for fixing the sub light guide plate may also be present in one outer frame.

Since the glue fixing holes are usually through holes, in order to prevent light of the main backlight module from entering the through holes through the through holes and further from entering the through holes when the sub backlight module should not operate (for example, when the sub-screen camera performs shooting), the shooting effect of the sub-screen camera is affected, in some examples of this embodiment, the glue fixing holes may be considered to be disposed in a region other than the region where the protruding portion is located on the bottom wall of the outer frame. That is, in this embodiment, the glue fixing hole is prevented from being disposed on the sidewall of the through hole as much as possible.

Of course, it can be understood by those skilled in the art that in other examples of the present embodiment, the secondary light guide plate is not integrally molded on the outer frame, but is separately manufactured and then mounted on the outer frame. However, in comparison, in the scheme of separately preparing the sub light guide plate and then installing the sub light guide plate, not only the process is complicated and the production cost is high, but also the sub light guide plate is not large in size, so that the precision requirement is very high when the sub light guide plate is prepared and the sub light guide plate is installed, the production requirement is difficult to achieve, and the problem of high defective rate of the backlight module is easily caused. And vice light guide plate is through the way of integrative moulding plastics setting on the frame, has not only solved the complicated problem of assembly vice light guide plate process on the frame behind the vice light guide plate of independent production, can realize the combination of vice light guide plate and frame high accuracy moreover, is favorable to promoting backlight unit's quality.

Furthermore, because the glue fixing hole of the auxiliary light guide plate is arranged in the region outside the region where the protruding part is arranged on the bottom wall of the outer frame, the problem that the shooting effect of the camera under the screen is influenced due to the fact that light of the main backlight module leaks into the through hole is avoided.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. An L ED light source is characterized in that the L ED light source comprises a circuit board and a plurality of top-emitting L ED chips which are arranged on the circuit board and electrically connected with the circuit board, wherein camera holes penetrating through the upper surface and the lower surface of the circuit board are formed in the circuit board, and the camera holes are used for collecting images through a screen camera positioned on the bottom surface of the L ED light source.

2. The L ED light source of claim 1, wherein each L ED chip in the L ED light source forms m rings of L ED chips around the camera hole, m being equal to or greater than 1.

3. The L ED light source of claim 2 wherein m is any one of 1, 2, and 3.

4. A backlight module is characterized in that the backlight module comprises a main backlight module and an auxiliary backlight module, the main backlight module comprises an outer frame, a protrusion portion protruding upwards is arranged on the bottom wall of the outer frame, a through hole penetrating through the upper surface of the protrusion portion and the lower surface of the bottom wall is formed in the protrusion portion, the auxiliary backlight module comprises an auxiliary L ED light source and an auxiliary light guide plate, the auxiliary L ED light source is the L ED light source according to any one of claims 1-3, a light outlet portion of the auxiliary light guide plate extends into the through hole, the side wall of the light outlet portion is attached to the inner wall of the through hole, a light inlet portion of the auxiliary light guide plate is located below the bottom wall, the light inlet portion comprises a light inlet bottom surface, the light inlet bottom surface is located below the light inlet portion, a circuit board is located below the light inlet portion, a camera hole corresponds to the position of the through hole, the light emitting top surface of each L ED chip faces the light inlet bottom surface, light is emitted from the light outlet surface of the light outlet portion after the light inlet bottom surface is emitted into the auxiliary light guide plate, and all areas.

5. The backlight module according to claim 4, wherein the lower surface of the sub light guide plate is flush, and the upper surface of the light emergent portion is recessed downward to form a lower groove.

6. The backlight module according to claim 4, wherein the light emergent portion has a top flush with the bottom surface of the sub light guide plate, and the lower surface of the sub light guide plate is recessed upward at a position corresponding to the through hole to form an upper groove.

7. The backlight module according to claim 4, wherein the lower surface of the sub light guide plate is flush, and the upper surface of the light emergent portion is flush.

8. The backlight module according to claim 4, wherein the upper surface of the light emitting part is recessed downward to form a lower groove, and the lower surface of the sub light guide plate is recessed upward to form an upper groove corresponding to the through hole, the lower groove communicating with the upper groove.

9. A display screen, comprising a liquid crystal panel and the backlight module as claimed in any one of claims 4 to 8, wherein the liquid crystal panel is disposed on the main backlight module.

10. A terminal, characterized by comprising a lower screen camera and the display screen of claim 9, wherein the lower screen camera is arranged below a camera hole of the auxiliary backlight module, and image acquisition is carried out through the camera hole and the through hole.