CN210640216U - Thimble device of semiconductor packaging machine - Google Patents
Thimble device of semiconductor packaging machine Download PDFInfo
- Publication number
- CN210640216U CN210640216U CN201922159080.6U CN201922159080U CN210640216U CN 210640216 U CN210640216 U CN 210640216U CN 201922159080 U CN201922159080 U CN 201922159080U CN 210640216 U CN210640216 U CN 210640216U
- Authority
- CN
- China
- Prior art keywords
- unit
- support
- sliding
- axis moving
- thimble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本实用新型提供了一种半导体封装机的顶针装置，包括支架，滑动设置于支架的滑板件及顶针单元，安装于支架并用于驱动滑板件来回移动的驱动单元，移动的滑板件驱动顶针单元相对支架移动；滑板件水平滑动设置在支架上，顶针单元竖直滑动设置在支架上；滑板件设有倾斜面，顶针单元的上端设有针体，顶针单元的下端设有转动的滚动轴承，滚动轴承的转动轴线与针体的滑动方向垂直设置，倾斜面用于抵触滚动轴承，倾斜面与水平面之间的夹角为锐角；在使用过程中，驱动单元驱动滑板件水平移动，经由倾斜面与滚动轴承的配合，移动的滑板件驱动顶针单元升起，经由滑板件水平移动行程实现对针体移动行程的准确控制，不会出现刺伤晶片的情况，方便调试机器。
The utility model provides a thimble device of a semiconductor packaging machine, which comprises a bracket, a sliding plate member and a thimble unit slidably arranged on the bracket, a driving unit installed on the bracket and used for driving the sliding plate member to move back and forth, and the moving sliding plate member drives the thimble unit relative to the The support moves; the slide piece is horizontally slid on the support, and the thimble unit is vertically slid on the support; the slide piece is provided with an inclined surface, the upper end of the thimble unit is provided with a needle body, and the lower end of the The axis of rotation is perpendicular to the sliding direction of the needle body, the inclined surface is used to interfere with the rolling bearing, and the angle between the inclined surface and the horizontal surface is an acute angle; during use, the drive unit drives the sliding piece to move horizontally, through the cooperation between the inclined surface and the rolling bearing , the moving slide piece drives the thimble unit to rise, and the needle body movement stroke is accurately controlled through the horizontal movement stroke of the slide piece, so that the wafer will not be stabbed, which is convenient for debugging the machine.
Description
Technical Field
The utility model relates to a thimble stroke control device when semiconductor package wafer jack-up especially discloses a semiconductor package machine's thimble device.
Background
In the semiconductor packaging process, the wafer needs to be jacked up from the blue film by the thimble, so that the wafer is separated from the blue film for convenient absorption, and the movement structure of the thimble in the prior art is unreasonable, so that the movement stroke of the thimble is not accurately controlled, the wafer is further stabbed, the reject ratio is higher, and the debugging machine is difficult.
SUMMERY OF THE UTILITY MODEL
In order to overcome the shortcoming and the deficiency that exist among the prior art, the utility model aims to provide a semiconductor packaging machine's thimble device through utilizing drive unit drive slide spare horizontal migration, via the cooperation of inclined plane with antifriction bearing, the slide spare drive thimble unit of removal rises, realizes the accurate control to the needle body removal stroke via slide spare horizontal migration stroke.
In order to achieve the above object, the present invention provides a thimble device of a semiconductor packaging machine, which comprises a support, a slide plate member and a thimble unit slidably disposed on the support, and a driving unit mounted on the support and used for driving the slide plate member to move back and forth, wherein the moving slide plate member drives the thimble unit to move relative to the support; the sliding plate part is horizontally arranged on the bracket in a sliding manner, and the thimble unit is vertically arranged on the bracket in a sliding manner; the sliding plate part is provided with an inclined plane, the upper end of the ejector pin unit is provided with a needle body, the lower end of the ejector pin unit is provided with a rotating rolling bearing, the rotating axis of the rolling bearing is perpendicular to the sliding direction of the needle body, the inclined plane is used for abutting against the rolling bearing, and the included angle between the inclined plane and the horizontal plane is an acute angle.
The thimble unit is provided with a sliding rod arranged in a sliding mode with the support, the needle body is arranged at the upper end of the sliding rod, the spring is sleeved on the outer side of the sliding rod, the sliding rod is connected with a stop block, the rolling bearing is rotatably arranged on the stop block, two ends of the spring respectively abut against the support and the stop block, and the spring abuts against the inclined plane through the rolling bearing driven by the sliding rod.
Furthermore, the check block is connected with a protruding column which is arranged in a sliding manner with the support, the protruding column is arranged in parallel with the sliding rod, the support is provided with two sliding holes, and the sliding rod and the protruding column are respectively arranged in the two sliding holes in a sliding manner.
The bracket is rotatably provided with a screw rod, the sliding plate piece is provided with a nut piece sleeved on the outer side of the screw rod in a threaded manner, the driving unit is a motor, and the motor is used for driving the screw rod to rotate; the slide piece can be dismantled and be connected with the wedge, and the inclined plane setting is on the wedge.
Furthermore, the thimble device of the semiconductor packaging machine further comprises a horizontal moving platform, the horizontal moving platform is provided with an X-axis moving unit and a Y-axis moving unit connected with the X-axis moving unit, the support is installed on the X-axis moving unit or the Y-axis moving unit, and the horizontal moving platform is used for driving the support to move horizontally.
The X-axis moving unit and the Y-axis moving unit are identical in structure, the X-axis moving unit and the Y-axis moving unit respectively comprise a horizontally moving carrier plate and a driving piece for driving the carrier plate to move back and forth, and the moving direction of the carrier plate of the X-axis moving unit is perpendicular to the moving direction of the carrier plate of the Y-axis moving unit.
Furthermore, the X-axis moving unit and the Y-axis moving unit both comprise tension springs, the driving part comprises a motor, a threaded rod which is connected with an output shaft of the motor and is rotatably arranged, and a nut block which is connected with the support plate and is sleeved outside the threaded rod in a threaded manner, and the tension springs pull the support plate to eliminate gap errors between the nut block and the threaded rod.
Has the advantages that: in the use, drive unit drive slide spare horizontal migration, via the cooperation of inclined plane and antifriction bearing, the slide spare drive thimble unit that removes rises, realizes the accurate control to the needle body movement stroke via slide spare horizontal migration stroke, the condition of stabbing the wafer can not appear, conveniently debugs the machine.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an exploded view of the present invention.
The reference numerals include:
1-support 2-slide plate 3-thimble unit
4-drive unit 5-inclined plane 6-needle body
7-rolling bearing 8-sliding rod 9-spring
11-stop block 12-projecting column 13-wedge block
14-horizontal moving platform 15-X-axis moving unit 16-Y-axis moving unit
17-a carrier plate.
Detailed Description
For the convenience of those skilled in the art, the embodiments are not mentioned in any way as limiting the invention.
Referring to fig. 1 and 2, the present invention provides a thimble device of semiconductor packaging machine, including support 1, slide plate member 2 and thimble unit 3 that slide respectively and set up on support 1, install on support 1 and be used for driving slide plate member 2 round trip movement's drive unit 4, slide plate member 2 that moves drives thimble unit 3 and moves relative to support 1.
The slide plate member 2 is horizontally arranged on the support 1 in a sliding manner, namely the slide plate member 2 moves back and forth parallel to the horizontal plane, and the thimble unit 3 is vertically arranged on the support 1 in a sliding manner, namely the thimble unit 3 moves up and down along the vertical direction. The sliding plate part 2 is provided with an inclined plane 5, the upper end of the thimble unit 3 is provided with a needle body 6, the lower end of the thimble unit 3 is provided with a rotating rolling bearing 7, the rotating axis of the rolling bearing 7 is perpendicular to the sliding direction of the needle body 6, the rotating axis of the rolling bearing 7 is parallel to the horizontal plane, the inclined plane 5 is used for abutting against the outer ring of the rolling bearing 7, and the included angle between the inclined plane 5 and the horizontal plane is an acute angle. The angle between the inclined surface 5 and the horizontal plane may be 20 °, 30 ° or 45 ° according to actual requirements.
In the using process, the driving unit 4 drives the sliding plate part 2 to move horizontally, the movable sliding plate part 2 drives the thimble unit 3 to lift through the interference fit of the inclined surface 5 and the rolling bearing 7, and the accurate control of the moving stroke of the needle body 6 is realized through the horizontal moving stroke of the sliding plate part 2.
The thimble unit 3 is provided with a slide rod 8 which is arranged in a sliding way with the bracket 1, the slide rod 8 is approximately in a straight cylindrical shape, the needle body 6 is arranged on the upper end of the slide rod 8, the outer side of the slide rod 8 is sleeved with a spring 9, the lower end of the slide rod 8 is provided with a stop block 11 in an installing way, the rolling bearing 7 is arranged on the stop block 11 in a rotating way, two ends of the spring 9 respectively abut against the bracket 1 and the stop block 11, and the spring 9 drives the rolling bearing 7 to abut against the inclined surface 5 through the slide rod 8 under the action of elastic force.
Through the setting of spring 9 for inclined plane 5 contradicts together with antifriction bearing 7 all the time, avoids having the clearance between inclined plane 5 and the antifriction bearing 7 and leads to the movement stroke of needle body 6 not accurate, further assists the accuracy that promotes needle body 6 and move the stroke.
The stopper 11 is connected with a protruding column 12 which is arranged in a sliding manner with the support 1, the protruding column 12 is arranged in parallel with the sliding rod 8, the support 1 is provided with two sliding holes which extend in the vertical direction, and the sliding rod 8 and the protruding column 12 are respectively arranged in the two sliding holes in a sliding manner. Through the arrangement of the protruding column 12, the inclined surface 5 can be prevented from abutting against the rolling bearing 7 due to the rotation of the slide rod 8 relative to the bracket 1, and the slide plate component 2 can accurately drive the thimble unit 3 to move.
A screw rod is rotatably arranged on the bracket 1, a nut piece which is sleeved outside the screw rod in a threaded manner is arranged on the sliding plate piece 2, and the driving unit 4 is a motor which is used for driving the screw rod to rotate; when the ejector pin unit is used, the motor drives the nut piece and the sliding plate piece 2 to horizontally slide relative to the support 1 through the screw rod, and the horizontally sliding plate piece 2 can drive the ejector pin unit 3 to move.
The sliding plate component 2 is detachably connected with a wedge block 13, and the inclined surface 5 is arranged on the wedge block 13. According to the required actual stroke size of the needle body 6, different wedge blocks 13 can be replaced, and the included angles between the inclined planes 5 of the different wedge blocks 13 and the horizontal plane are different, so that the thimble device of the semiconductor packaging machine can ensure that the needle body 6 has various strokes.
The thimble device of the semiconductor packaging machine further comprises a horizontal moving platform 14, the horizontal moving platform 14 is provided with an X-axis moving unit 15 and a Y-axis moving unit 16 connected with the X-axis moving unit 15, the support 1 is installed on the X-axis moving unit 15 or the Y-axis moving unit 16, and the horizontal moving platform 14 is used for driving the support 1 to move horizontally so that the needle body 6 moves to a required position.
The X-axis moving unit 15 and the Y-axis moving unit 16 have the same structure, the X-axis moving unit 15 and the Y-axis moving unit 16 each include a horizontally moving carrier plate 17 and a driving member for driving the carrier plate 17 to move back and forth, the moving direction of the carrier plate 17 of the X-axis moving unit 15 is perpendicular to the moving direction of the carrier plate 17 of the Y-axis moving unit 16, and the support 1 is mounted on the carrier plate 17 of the X-axis moving unit 15 or the carrier plate 17 of the Y-axis moving unit 16.
The X-axis moving unit 15 and the Y-axis moving unit 16 both comprise tension springs, the driving piece comprises a motor, a threaded rod which is connected with an output shaft of the motor and is rotatably arranged, and a nut block which is connected with the support plate 17 and is sleeved outside the threaded rod in a threaded manner, and the tension springs pull the support plate 17 to eliminate clearance errors between the nut block and the threaded rod. Through the arrangement of the tension spring, the accuracy of the moving stroke of the horizontal moving platform 14 is ensured.
The above description is only for the preferred embodiment of the present invention, and the present specification should not be construed as limiting the present invention.
Claims (7)
1. A thimble device of a semiconductor packaging machine comprises a support, a sliding plate piece and a thimble unit which are arranged on the support in a sliding way, and a driving unit which is arranged on the support and used for driving the sliding plate piece to move back and forth, wherein the moving sliding plate piece drives the thimble unit to move relative to the support; the method is characterized in that: the sliding plate part is horizontally arranged on the bracket in a sliding manner, and the thimble unit is vertically arranged on the bracket in a sliding manner; the sliding plate part is provided with an inclined plane, the upper end of the ejector pin unit is provided with a needle body, the lower end of the ejector pin unit is provided with a rotating rolling bearing, the rotating axis of the rolling bearing is perpendicular to the sliding direction of the needle body, the inclined plane is used for abutting against the rolling bearing, and the included angle between the inclined plane and the horizontal plane is an acute angle.
2. The ejector device of the semiconductor packaging machine according to claim 1, wherein: the thimble unit has the litter with support slip setting, and the needle body sets up in the upper end of litter, and the outside cover of litter is equipped with the spring, and the litter is connected with the dog, and antifriction bearing rotates and sets up on the dog, and support and dog are contradicted respectively at the both ends of spring, and the spring is contradicted on the inclined plane via litter drive antifriction bearing.
3. The ejector device of the semiconductor packaging machine according to claim 2, wherein: the stop block is connected with a protruding column which is arranged in a sliding mode with the support, the protruding column is arranged in parallel with the sliding rod, the support is provided with two sliding holes, and the sliding rod and the protruding column are respectively arranged in the two sliding holes in a sliding mode.
4. The ejector device of the semiconductor packaging machine according to claim 1, wherein: the bracket is rotatably provided with a screw rod, the sliding plate piece is provided with a nut piece sleeved on the outer side of the screw rod in a threaded manner, the driving unit is a motor, and the motor is used for driving the screw rod to rotate; the slide piece can be dismantled and be connected with the wedge, and the inclined plane setting is on the wedge.
5. The ejector device of the semiconductor packaging machine according to claim 1, wherein: the thimble device of the semiconductor packaging machine further comprises a horizontal moving platform, the horizontal moving platform is provided with an X-axis moving unit and a Y-axis moving unit connected with the X-axis moving unit, the support is installed on the X-axis moving unit or the Y-axis moving unit, and the horizontal moving platform is used for driving the support to move horizontally.
6. The ejector device of a semiconductor packaging machine according to claim 5, wherein: the X-axis moving unit and the Y-axis moving unit are identical in structure, the X-axis moving unit and the Y-axis moving unit respectively comprise a horizontally moving carrier plate and a driving piece for driving the carrier plate to move back and forth, and the moving direction of the carrier plate of the X-axis moving unit is perpendicular to the moving direction of the carrier plate of the Y-axis moving unit.
7. The ejector device of the semiconductor packaging machine according to claim 6, wherein: the X-axis moving unit and the Y-axis moving unit respectively comprise tension springs, the driving piece comprises a motor, a threaded rod and a nut block, the threaded rod is connected with an output shaft of the motor and is rotatably arranged, the nut block is connected with the support plate and is sleeved on the outer side of the threaded rod in a threaded mode, and the tension springs pull the support plate to eliminate gap errors between the nut block and the threaded rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922159080.6U CN210640216U (en) | 2019-12-05 | 2019-12-05 | Thimble device of semiconductor packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922159080.6U CN210640216U (en) | 2019-12-05 | 2019-12-05 | Thimble device of semiconductor packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210640216U true CN210640216U (en) | 2020-05-29 |
Family
ID=70797897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922159080.6U Expired - Fee Related CN210640216U (en) | 2019-12-05 | 2019-12-05 | Thimble device of semiconductor packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210640216U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112477024A (en) * | 2020-11-30 | 2021-03-12 | 长园半导体设备(珠海)有限公司 | Thimble moving structure |
| CN112497681A (en) * | 2020-11-30 | 2021-03-16 | 长园半导体设备(珠海)有限公司 | Round shaft moving rotation-preventing mechanism |
-
2019
- 2019-12-05 CN CN201922159080.6U patent/CN210640216U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112477024A (en) * | 2020-11-30 | 2021-03-12 | 长园半导体设备(珠海)有限公司 | Thimble moving structure |
| CN112497681A (en) * | 2020-11-30 | 2021-03-16 | 长园半导体设备(珠海)有限公司 | Round shaft moving rotation-preventing mechanism |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102837200B (en) | Automatic turning device based on workpiece positioning | |
| CN206200530U (en) | An automatic bolt tightening machine | |
| CN210640216U (en) | Thimble device of semiconductor packaging machine | |
| CN204819563U (en) | Multidirectional arm | |
| CN205254759U (en) | Glass substrate grinds switching -over adjusting device of machine | |
| CN106249179A (en) | Automatically multiple degrees of freedom measurement of magnetic field laboratory table | |
| CN212004835U (en) | A monitoring device for smart parks | |
| CN106141615B (en) | The rubber ring loading assemblies of valve body and rubber ring assemble mechanism | |
| CN209394313U (en) | Turn round pallet changer | |
| CN205538146U (en) | Both arms drop test machine | |
| CN108500607B (en) | A centering adjustment device and method for a large cylinder | |
| CN209311255U (en) | A guide rail friction and wear testing machine | |
| CN208051105U (en) | A kind of brazing tooling clamping overturning | |
| CN204847211U (en) | High -speed conveying goes up and down to roll bed | |
| CN104897398A (en) | Scalable gear fatigue testbed and stress cycle number calculation method thereof | |
| CN105834745B (en) | A kind of printing machine cylinder fills silently machine and silently mounting process automatically | |
| CN203849020U (en) | Performance detecting and testing device for seat height adjuster | |
| CN211189865U (en) | A mix device of dissolving for pharmacy is experimental | |
| CN211014383U (en) | Positioning device for detecting roller shutter door motor | |
| CN115371862A (en) | A stress detection device for aero-engine rotating parts | |
| CN205852173U (en) | A kind of operating mechanism spring feeding mechanism | |
| CN220153467U (en) | Gear detection device | |
| CN222345399U (en) | Fixing device for assembling tablet computer | |
| CN111272408A (en) | Ladder fatigue strength test machine | |
| CN211540144U (en) | A wire sleeve assembly device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200529 |