CN210604727U

CN210604727U - Probe card for wafer multi-point test

Info

Publication number: CN210604727U
Application number: CN201921018563.8U
Authority: CN
Inventors: 刘家铭; 张孝仁; 苏华庭
Original assignee: Yuandingfeng Investment Co Ltd
Current assignee: Hefei Core Semiconductor Co Ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-05-22
Anticipated expiration: 2029-07-02

Abstract

The utility model discloses a probe card for wafer multiple spot test relates to the probe card field, including the PCB board, the leading flank middle part fixedly connected with probe base of PCB board, a plurality of probes of leading flank fixedly connected with of probe base, the probe includes a probe section of thick bamboo and probe post, and the probe post sets up in the top of a probe section of thick bamboo, and the top of probe post sets up to semi-circular, and a probe section of thick bamboo is inserted to the bottom of probe post, and the bottom fixedly connected with of probe post keeps off the dish, and the diameter that keeps off the dish is greater than the internal diameter of a probe section of thick bamboo nozzle, and the lower surface that keeps off the dish is equipped. The utility model discloses a probe section of thick bamboo, probe post, fender dish, spout and probe spring's cooperation is used, can cushion the pressure that produces when testing, avoids too big pressure to cause the damage to the probe post, can guarantee probe post and chip contact simultaneously, sets up to semi-circular through the top with the probe post, can prolong the life of probe post, and simple structure is practical.

Description

Probe card for wafer multi-point test

Technical Field

The utility model relates to a probe card field, in particular to probe card for wafer multiple spot test.

Background

The probe card is a test interface, mainly tests the wafer, leads out the chip signal by directly contacting the probe on the probe card with the bonding pad or the bump on the chip, and tests the chip parameter by matching with the peripheral test instrument and software control.

Because it is difficult to make all the needles be in the same horizontal plane when a plurality of probes are installed, when the probe card is used for carrying out multipoint simultaneous test (multipoint simultaneous test), pressure needs to be slightly applied to all the probes so as to ensure that all the probes can reliably contact with the welding pads or the bumps on the chip. However, the probe tip of the conventional probe card is in a round tip shape, and the probe tip is easily damaged after being stressed for many times for testing, so that the service life is short.

Therefore, it is desirable to provide a probe card for multi-point testing of a wafer to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a probe card for wafer multiple spot test to the probe tip of solving the current probe card that proposes among the above-mentioned background art is the round point form, is exerted pressure many times and takes place the needle point easily after testing and damages, the not permanent problem of life.

In order to achieve the above object, the utility model provides a following technical scheme: a probe card for wafer multi-point testing comprises a PCB, wherein the middle part of the front side surface of the PCB is fixedly connected with a probe base, and the front side surface of the probe base is fixedly connected with a plurality of probes;

the probe comprises a probe cylinder and a probe column, the probe column is arranged on the top end of the probe cylinder, the top end of the probe column is semicircular, the probe cylinder is inserted into the bottom end of the probe column, a blocking disc is fixedly connected to the bottom end of the probe column, the diameter of the blocking disc is larger than the inner diameter of a cylinder opening of the probe cylinder, and a probe spring is arranged on the lower surface of the blocking disc.

Optionally, a plurality of the probes are provided with a plurality of rows, and a plurality of the probes in each row are distributed at equal intervals.

Optionally, the PCB board is circular, a plurality of constant head tanks have been seted up to the circumference of PCB board, and is a plurality of the constant head tank is annular array distribution around the centre of a circle of PCB board.

Optionally, a sliding groove matched with the blocking disc is formed in the probe cylinder, and the blocking disc is connected with the sliding groove in a sliding mode.

Optionally, the top end of the probe spring is attached to the blocking disc, and the bottom end of the probe spring is attached to the inner bottom wall of the probe cylinder.

The utility model discloses a technological effect and advantage:

the utility model discloses a probe section of thick bamboo, probe post, fender dish, spout and probe spring's cooperation is used, can cushion the pressure that produces when testing, avoids too big pressure to cause the damage to the probe post, can guarantee probe post and chip contact simultaneously, sets up to semi-circular through the top with the probe post, can prolong the life of probe post, and simple structure is practical.

Drawings

Fig. 1 is a schematic view of the structure of the present invention.

Fig. 2 is a bottom view of the probe base structure of the present invention.

Fig. 3 is a schematic cross-sectional view of the probe structure of the present invention.

In the figure: 1. a PCB board; 2. a probe base; 3. a probe; 4. positioning a groove; 5. a probe barrel; 6. a probe pin; 7. a catch tray; 8. a chute; 9. a probe spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; may be a mechanical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The utility model provides a probe card for wafer multi-point test as shown in figures 1-3, which comprises a PCB board 1;

shown by figure 1 and figure 2, fixedly connected with probe base 2 in the middle part of the leading flank of PCB board 1, a plurality of probes 3 of the leading flank fixedly connected with of probe base 2, a plurality of probes 3 are provided with the multirow, every row of a plurality of probes 3 are equidistant, rational in infrastructure, PCB board 1 is circular, a plurality of constant head tanks 4 have been seted up to PCB board 1's circumference, a plurality of constant head tanks 4 are annular array distribution around PCB board 1's the centre of a circle, facilitate location installation.

Shown by fig. 3, probe 3 includes a probe section of thick bamboo 5 and probe post 6, probe post 6 sets up in the top of a probe section of thick bamboo 5, the top of probe post 6 sets up to semi-circular, can prolong the life of probe post 6, simple structure is practical, probe post 6's bottom is inserted probe section of thick bamboo 5, the bottom fixedly connected with of probe post 6 keeps off dish 7, set up in the probe section of thick bamboo 5 with the spout 8 that keeps off dish 7 adaptation, keep off dish 7 and spout 8 sliding connection, rational in infrastructure, the diameter of keeping off dish 7 is greater than the internal diameter of probe section of thick bamboo 5 nozzle, avoid probe post 6 to break away from probe section of thick bamboo 5, the lower surface that keeps off dish 7 is equipped with probe spring 9, the top and the laminating of keeping off dish 7 of probe spring 9, the bottom of probe spring 9 and the laminating of the inner diapire of a probe section of thick bamboo 5, can cushion the pressure that produces when testing, avoid too big pressure to cause the damage to probe post.

This practical theory of operation:

when carrying out wafer multiple spot test, weld pad or lug on the probe post 6 extrusion chip, probe post 6 drives and keeps off 7 extrusion probe springs 9 of dish, keeps off that dish 7 slides in spout 8, can reduce too much pressure and cause the damage to probe post 6, can guarantee probe post 6 and chip contact simultaneously, sets up to semi-circular through the top with probe post 6, can prolong probe post 6's life.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A probe card for multi-point testing of wafers, comprising a PCB board (1), characterized in that: the middle part of the front side surface of the PCB (1) is fixedly connected with a probe base (2), and the front side surface of the probe base (2) is fixedly connected with a plurality of probes (3);

the probe (3) comprises a probe cylinder (5) and a probe column (6), the probe column (6) is arranged on the top end of the probe cylinder (5), the top end of the probe column (6) is arranged to be semicircular, the probe cylinder (5) is inserted into the bottom end of the probe column (6), a baffle disc (7) is fixedly connected to the bottom end of the probe column (6), the diameter of the baffle disc (7) is larger than the inner diameter of a cylinder opening of the probe cylinder (5), and a probe spring (9) is arranged on the lower surface of the baffle disc (7).

2. The probe card for multi-point testing of wafers according to claim 1, wherein:

the probes (3) are arranged in multiple rows, and the probes (3) in each row are distributed at equal intervals.

3. The probe card for multi-point testing of wafers according to claim 1, wherein:

PCB board (1) is circular, a plurality of constant head tanks (4) have been seted up to the circumference of PCB board (1), and is a plurality of constant head tank (4) are the annular array around the centre of a circle of PCB board (1) and distribute.

4. The probe card for multi-point testing of wafers according to claim 1, wherein:

a sliding groove (8) matched with the blocking disc (7) is formed in the probe cylinder (5), and the blocking disc (7) is connected with the sliding groove (8) in a sliding mode.

5. The probe card for multi-point testing of wafers according to claim 1, wherein:

the top of probe spring (9) with keep off the laminating of dish (7), the bottom of probe spring (9) and the interior diapire laminating of probe section of thick bamboo (5).