CN210573546U - Solid State Drive Expansion Card - Google Patents
Solid State Drive Expansion Card Download PDFInfo
- Publication number
- CN210573546U CN210573546U CN201921404461.XU CN201921404461U CN210573546U CN 210573546 U CN210573546 U CN 210573546U CN 201921404461 U CN201921404461 U CN 201921404461U CN 210573546 U CN210573546 U CN 210573546U
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- Prior art keywords
- heat dissipation
- solid state
- base plate
- solid
- cover plate
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- Expired - Fee Related
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- 239000007787 solid Substances 0.000 title claims description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 95
- 238000009434 installation Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种固态硬盘扩充卡，包括卡体，该卡体上设置有至少一低底座与至少一高底座，使该低底座与高底座分别插置有第一M.2固态硬盘与第二M.2固态硬盘；该第一M.2固态硬盘、第二M.2固态硬盘之间设置有散热底板，该散热底板于其超过该第二M.2固态硬盘长度的一端设置有散热鳍片，该散热鳍片上设置有风扇，该第二M.2固态硬盘外侧并锁固在该散热底板上设置有散热盖板，该散热盖板上也设置有散热鳍片；通过上述结构，可在该卡体上装置多个M.2固态硬盘，增加使用容量并维持工作的稳定性。
A solid-state hard disk expansion card comprises a card body, on which at least one low base and at least one high base are arranged, so that a first M.2 solid-state hard disk and a second M.2 solid-state hard disk are inserted into the low base and the high base respectively; a heat dissipation base plate is arranged between the first M.2 solid-state hard disk and the second M.2 solid-state hard disk, and the heat dissipation base plate is provided with heat dissipation fins at one end thereof exceeding the length of the second M.2 solid-state hard disk, and a fan is arranged on the heat dissipation fins; a heat dissipation cover plate is arranged on the outer side of the second M.2 solid-state hard disk and locked on the heat dissipation base plate, and the heat dissipation cover plate is also provided with heat dissipation fins; through the above structure, multiple M.2 solid-state hard disks can be installed on the card body to increase the use capacity and maintain the working stability.
Description
Technical Field
The utility model belongs to solid state hard drives expansion card especially indicates an expansion card that can install a plurality of M.2 solid state hard drives.
Background
The m.2-sized Solid State Disk (SSD) has the advantages of fast speed, small size, and gradually decreasing price, and thus has become a priority for many people to buy or upgrade computers.
However, due to the spatial configuration, the conventional computer motherboard only provides a small number of bases for m.2 interfaces, which greatly limits the number of m.2 solid state disks installed, and thus the performance of the computer cannot be effectively improved.
Therefore, the industry has provided a solid state disk expansion card in the form of an adapter card, and an m.2 solid state disk can be additionally installed in an adapter card slot, so that the storage capacity is greatly improved, and the requirements of users are met.
However, in consideration of heat dissipation, the number of m.2 solid state disks that can be installed in the existing hard disk expansion card is limited, and only two m.2 solid state disks can be installed in a half-Height (Low Profile) hard disk expansion card, and only four m.2 solid state disks can be installed in a Full-Height (Full Height) hard disk expansion card, otherwise, heat is difficult to be removed, which easily interferes with the operation of the m.2 solid state disks and causes errors.
Therefore, the defects of the prior art are considered, that is, how to strengthen the heat dissipation function on the limited space of the hard disk expansion card is researched, and the solid state disk expansion card is obtained.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at improves the heat-sinking capability on the solid state hard drives expansion card to increase the M.2 solid state hard drives quantity that can install, satisfy a large amount of data's storage demand.
Another object of the present invention is to provide a solid state disk expansion card with smooth appearance and stable structure, which is convenient for being installed in a computer and maintaining a long-term stable operation.
In order to achieve the above object, the present invention provides a solid state disk expansion card, including: the card body, low base, high base, heat dissipation bottom plate and heat dissipation apron.
The bottom of the card body is provided with a terminal connected with an adaptive card slot, the low base is arranged on the card body and provided with a first notch for inserting a first M.2 solid state disk, the high base is arranged on the card body in the direction opposite to the first notch of the low base and provided with a second notch higher than the low base for inserting a second M.2 solid state disk, the radiating bottom plate is arranged between the first M.2 solid state disk and the second M.2 solid state disk and locked on the card body, the radiating bottom plate is provided with radiating fins at one end exceeding the length of the second M.2 solid state disk, the radiating fins are provided with fans, the radiating cover plate is arranged at the outer side of the second M.2 solid state disk and locked on the radiating bottom plate, and the radiating cover plate is provided with radiating fins.
Through the structure, a plurality of M.2 solid state disks can be arranged on the card body, so that the use capacity is increased and the stability of work is maintained.
Furthermore, the heat dissipation fins of the heat dissipation cover plate are arranged in the same manner as the heat dissipation fins of the heat dissipation base plate, and when the heat dissipation cover plate is fastened to the heat dissipation base plate, the heat dissipation fins of the heat dissipation cover plate are completely connected with the heat dissipation fins of the heat dissipation base plate so as to facilitate heat dissipation.
Furthermore, the height of the heat dissipation fins of the heat dissipation cover plate is lower than that of the heat dissipation fins of the heat dissipation base plate, and when the heat dissipation cover plate is locked to the heat dissipation base plate, the tops of the heat dissipation fins of the heat dissipation cover plate are flush with the tops of the heat dissipation fins of the heat dissipation base plate.
Furthermore, the fan is arranged to align with the heat generating components such as the chip or the circuit on the card body.
Furthermore, the heat dissipation fins of the heat dissipation bottom plate are provided with notches, and the fan is embedded in the notches.
Furthermore, the low base, the high base, the heat dissipation bottom plate, the heat dissipation cover plate, the first m.2 solid state disk and the second m.2 solid state disk are arranged on two sides of the card body at the same time;
and at least one screw rod penetrates through two sides of the clamping body to fix the heat dissipation bottom plate and the heat dissipation cover plate.
Drawings
Fig. 1 is an exploded perspective view of the present invention;
fig. 2 is a schematic configuration diagram of the low base, the first m.2 solid-state hard disk, and the heat dissipation bottom plate of the present invention;
fig. 3 is a schematic configuration diagram of the high-bottom base, the second m.2 solid-state hard disk and the heat dissipation cover plate of the present invention;
FIG. 4 is a perspective view of the present invention;
FIG. 5 is a schematic diagram of the present invention applied to Full Height (Full Height) specifications for mounting a plurality of solid state drives; and
fig. 6 is a schematic diagram of the present invention for assembling two side structures simultaneously.
Description of reference numerals:
100 card body 110 terminal
120 chip 200 low base
210 first notch 300 high base
310 second notch 400 heat sink base plate
410 heat dissipation fin 420 fan
430 notch 500 heat radiation cover plate
510 heat dissipation fins 610 first m.2 solid state disk
620 second m.2 solid state drive 700 screw
710 screw 720 pipe column
Detailed Description
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings, so as to fully understand the objects, the features and the effects of the present invention.
Referring to fig. 1 to 4, the present invention provides a solid state disk expansion card, including: the card body 100, the lower base 200, the upper base 300, the heat-dissipating base plate 400, and the heat-dissipating cover plate 500.
The card body 100 provides an installation space, and has a terminal 110 connected to an adapter card slot at the bottom thereof;
the lower base 200 is disposed on the card body 100, and has a first slot 210 for inserting a first m.2 solid state disk 610;
the high base 300 is disposed on the card body 100 opposite to the first slot 210 of the low base 200, the high base 300 has a second slot 310 higher than the low base 200 for inserting a second m.2 solid state disk 620;
the heat dissipation base plate 400 is disposed between the first m.2 solid state disk 610 and the second m.2 solid state disk 620 and is locked on the card body 100, the heat dissipation base plate 400 is provided with heat dissipation fins 410 at one end exceeding the length of the second m.2 solid state disk 620, and the heat dissipation fins 410 are provided with fans 420; and
the heat-dissipating cover 500 is disposed outside the second m.2 solid-state hard disk 620 and is fastened to the heat-dissipating base 400, and the heat-dissipating cover 500 is provided with heat-dissipating fins 510.
The heat of the first m.2 solid state disk 610 and the second m.2 solid state disk 620 can be guided and dissipated by the heat dissipating fins 410 on the heat dissipating bottom plate 400 and the heat dissipating fins 510 on the heat dissipating cover plate 500, respectively, so as to maintain the stability of the operation; therefore, more M.2 solid state disks can be installed, and more disk use capacity is provided.
The card body 100 according to the foregoing embodiment is of a half-height (Low Profile) specification, and can be installed with at least four m.2 solid-state hard disks; alternatively, as shown in fig. 5, if the card body 100 is Full-Height (Full Height), more than eight m.2 solid-state hard disks may be mounted at a time (four second m.2 solid-state hard disks 620 are shown in the figure).
The locking method of the card body 100, the heat-dissipating bottom plate 400 and the heat-dissipating cover plate 500 is mainly screws 710, and the pipe column 720 is added in the gap for support, which are common applications and will not be described herein.
In order to maintain the heat dissipation effect, the heat dissipation fins 410 of the heat dissipation cover plate 500 and the heat dissipation fins 510 of the heat dissipation base plate 400 are arranged in the same manner, and when the heat dissipation cover plate 500 is fastened to the heat dissipation base plate 400, the heat dissipation fins 410 of the heat dissipation cover plate 500 are completely connected with the heat dissipation fins 510 of the heat dissipation base plate 400;
alternatively, the height of the heat sink fins 510 of the heat sink cover 500 is lower than the height of the heat sink fins 410 of the heat sink base 400, and when the heat sink cover 500 is fastened to the heat sink base 400, the tops of the heat sink fins 410 of the heat sink cover 500 are flush with the tops of the heat sink fins 510 of the heat sink base 400;
with the above structure, the heat-dissipating cover 500 and the heat-dissipating base 400 have only one integral heat-dissipating fin from the appearance, which is favorable for heat conduction and heat dissipation.
Also for increasing heat dissipation, the fan 420 is disposed to align with the heat generating components such as the chip 120 or the circuit on the card body 100;
in fact, the heat sink fins 410 of the heat sink base plate 400 are provided with the notches 430, and the fan is embedded in the notches 430, so that heat transferred from the heat sink fins 410 directly enters the working area of the fan 420, thereby improving the heat dissipation function.
Referring to fig. 6, the present invention can be further extended to arrange the low base 200, the high base 300, the heat dissipation bottom plate 400, the heat dissipation cover plate 500, the first m.2 solid state disk 610, and the second m.2 solid state disk 620 on two sides of the card body 100 at the same time.
In order to maintain the convenience and stability of the assembly on both sides, at least one screw 700 is inserted through both sides of the card body 100 to fix the heat-dissipating base plate 400 and the heat-dissipating cover plate 500.
The above detailed description is specific to one possible embodiment of the present invention, but the embodiment is not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921404461.XU CN210573546U (en) | 2019-08-27 | 2019-08-27 | Solid State Drive Expansion Card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921404461.XU CN210573546U (en) | 2019-08-27 | 2019-08-27 | Solid State Drive Expansion Card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210573546U true CN210573546U (en) | 2020-05-19 |
Family
ID=70636505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921404461.XU Expired - Fee Related CN210573546U (en) | 2019-08-27 | 2019-08-27 | Solid State Drive Expansion Card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210573546U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12609139B2 (en) | 2023-03-07 | 2026-04-21 | Pegatron Corporation | Electronic module and heat dissipation assembly |
-
2019
- 2019-08-27 CN CN201921404461.XU patent/CN210573546U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12609139B2 (en) | 2023-03-07 | 2026-04-21 | Pegatron Corporation | Electronic module and heat dissipation assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200519 Termination date: 20210827 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |