CN210529980U - Anti-aging polymerized polyphenyl thermal insulation board - Google Patents
Anti-aging polymerized polyphenyl thermal insulation board Download PDFInfo
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- CN210529980U CN210529980U CN201921185197.5U CN201921185197U CN210529980U CN 210529980 U CN210529980 U CN 210529980U CN 201921185197 U CN201921185197 U CN 201921185197U CN 210529980 U CN210529980 U CN 210529980U
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- polyphenyl
- polymerized
- thermal insulation
- polymerized polyphenyl
- main board
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- 229920006389 polyphenyl polymer Polymers 0.000 title claims abstract description 97
- 238000009413 insulation Methods 0.000 title claims abstract description 33
- 230000003712 anti-aging effect Effects 0.000 title claims abstract description 11
- 238000004321 preservation Methods 0.000 claims abstract description 26
- 238000006116 polymerization reaction Methods 0.000 claims description 18
- 230000032683 aging Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 abstract 2
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an anti-aging polyphenyl thermal insulation board, which comprises a polyphenyl thermal insulation main board, wherein a polyphenyl positioning groove is arranged on the surface of the polyphenyl thermal insulation main board, polyphenyl positioning blocks are arranged on two sides of the surface of the polyphenyl thermal insulation main board, polyphenyl positioning bulges are arranged on the inner sides of the polyphenyl positioning blocks, and polyphenyl positioning blocks are symmetrically arranged on two sides of the surface of the polyphenyl thermal insulation main board; this heat preservation heat insulating board is when the installation is used, the adhesion is in the wall body outside usually, plate body group establishes when attached for bilayer structure, inlay each other between the bilayer structure plate body and establish, it is big partially to appear the gap when preventing that the veneer from laying, lead to the inboard of moisture infiltration plate body, lead to the plate body to drop, the installation stability of this plate body has been improved, there is one deck structural reinforcement in the inside embedding of this plate body, the structural strength of plate body can be improved through the effect of structural reinforcement, improve the structural strength of whole wall body simultaneously, reduce building envelope thickness outside.
Description
Technical Field
The utility model belongs to the technical field of the heated board, concretely relates to polymerization polyphenyl heat preservation heat insulating board of ageing resistance.
Background
The popular and easy to understand of the heat insulation plate is the plate for heat insulation of the building. The fireproof polymer polystyrene board has the advantages that the fireproof polymer polystyrene board has the moistureproof and waterproof properties, the thickness of an outer enclosure structure of a building can be reduced, the indoor use area is increased, the fireproof grade of the polymer polystyrene board is A grade, and each organic polymer forms a relative independent unit by adopting a honeycomb fireproof isolation bin structure. Therefore, the heat energy conduction and the fire spread are effectively prevented, the national highest fire prevention level is achieved, the polymer polystyrene board can be used as an outer wall heat-insulation board, a building fire-prevention isolation belt, a basement ceiling heat-insulation board, a building curtain wall composite, a real stone paint composite and a stone composite dry-hanging heat-insulation construction; a fire barrier; the interior of public facilities such as automobiles, airplanes, ships and the like is heat-insulated and fireproof; high-temperature production equipment is heat-insulating and fireproof, and is used for heat insulation and energy conservation of furnace bodies such as steel plants, aluminum plants, large-scale high-heat boiler users and the like; indoor energy-saving fire prevention in public places, such as various partition construction applications in the public places; various sound insulation construction applications in high-noise public places and the like.
The existing anti-aging polyphenyl thermal insulation board is good in fireproof and flame retardant performance when in use, the polymer polyphenyl board is made of inorganic materials and has high isolation strength, the service life of the board is the same as that of a building, the board is environment-friendly and non-toxic, and the board has good operability on the premise of high hydrophobicity.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a polymerization polyphenyl heat preservation heat insulating board of ageing resistance, with the polymerization polyphenyl heat preservation heat insulating board of the current ageing resistance that proposes in solving above-mentioned background art, generally when using, fire prevention flame retardant property is good, the isolation strength that polymer polyphenyl board adopted inorganic material to form is big, with this same life-span of building, the environmental protection is nonhazardous, possess good maneuverability under the prerequisite of high hydrophobicity, usually this panel adhesion is in the wall body outside, if it is big partially to install the installation gap when using, the adhesive material of moisture soaked panel, lead to the problem that panel drops easily.
In order to achieve the above object, the utility model provides a following technical scheme: the anti-aging polyphenyl thermal insulation board comprises a polyphenyl thermal insulation main board, wherein polyphenyl positioning grooves are formed in the surface of the polyphenyl thermal insulation main board, polyphenyl positioning blocks are formed in two sides of the surface of the polyphenyl thermal insulation main board, polyphenyl positioning protrusions are formed in the inner sides of the polyphenyl positioning blocks, the polyphenyl positioning blocks are symmetrically formed in two sides of the surface of the polyphenyl thermal insulation main board, and the polyphenyl positioning protrusions are formed in the inner sides of the polyphenyl positioning blocks.
Preferably, the polymerized polyphenyl heat preservation main board is embedded with structural ribs.
Preferably, the structural ribs are rectangular grid structures.
Preferably, the four sides of the rectangular structural ribs are forty centimeters in length.
Preferably, the polymerized polyphenyl thermal insulation main board is laid into a double-layer symmetrical structure.
Preferably, the polymerized polyphenyl positioning block on the upper polymerized polyphenyl thermal insulation main board is embedded in the polymerized polyphenyl positioning groove on the bottom polymerized polyphenyl thermal insulation main board.
Preferably, the volume of the polymerized polyphenyl positioning block is one half of that of the polymerized polyphenyl positioning groove.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) this heat preservation heat insulating board when installation use, the adhesion is in the wall body outside usually, and plate body group sets up when attached for bilayer structure, inlays each other between the bilayer structure plate body and establishes, appears the gap when preventing that the veneer from laying on the large side, leads to moisture to dip in the inboard of plate body, soaks the adhesion material for a long time, leads to the plate body to drop, has improved the installation stability of this plate body.
(2) The structure ribs are embedded into the plate body, so that when the heat-insulating plate is laid, the structural strength of the plate body can be improved under the action of the structure ribs, the structural strength of the whole wall body is improved, the thickness of an outer enclosing structure of a building is reduced, and the indoor use area is increased.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of the embedding structure of the structural ribs of the present invention;
in the figure: 1. polymerizing a polyphenyl positioning block; 2. a structural rib; 3. a polymerized polyphenyl heat preservation main board; 4. polymerizing the polyphenyl positioning bulges; 5. polymerized polyphenyl locating slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: the utility model provides a polymerization polyphenyl heat preservation heat insulating board of ageing resistance, including polymerization polyphenyl heat preservation mainboard 3, polymerization polyphenyl constant head tank 5 has been seted up on polymerization polyphenyl heat preservation mainboard 3's surface, polymerization polyphenyl locating piece 1 has been seted up to polymerization polyphenyl heat preservation mainboard 3's surface both sides, polymerization polyphenyl locating protrusion 4 has been seted up to polymerization polyphenyl locating piece 1's inboard, polymerization polyphenyl locating piece 1 has been seted up to polymerization polyphenyl heat preservation mainboard 3's surface bilateral symmetry, and polymerization polyphenyl locating protrusion 4 has all been seted up to polymerization polyphenyl locating piece 1's inboard, be bilayer structure when polymerization polyphenyl locating piece 1 group is established attachedly, it is big partially to appear the gap when avoiding the veneer to lay, lead to the inboard of moisture to soak the plate body, soak the adhesion material for a long time, lead.
In order to better improve the structural strength of the plate body, in this embodiment, preferably, the structural ribs 2 are embedded inside the polymerized polyphenyl thermal insulation main plate 3, so as to improve the structural strength of the whole wall body after being laid, in order to better embed the structural ribs 2, in this embodiment, preferably, the structural ribs 2 are rectangular grid structures, in order to better embed in the polymerized polyphenyl positioning blocks 1, in this embodiment, preferably, the four sides of the rectangular structural ribs 2 are forty centimeters long, so as to improve the structural strength of the polymerized polyphenyl positioning blocks 1, in order to better lay, in this embodiment, preferably, the polymerized polyphenyl thermal insulation main plate 3 is laid as a double-layer symmetrical structure, so as to improve the practicability of the polymerized polyphenyl positioning blocks 1, in order to better lay and install, in this embodiment, preferably, the polymerized polyphenyl positioning blocks 1 on the upper polymerized polyphenyl thermal insulation main plate 3 are embedded in polymerized polyphenyl positioning grooves 5 on the bottom polymerized polyphenyl thermal insulation main plate 3, in this embodiment, the volume of the poly-phenylene positioning block 1 is preferably one half of the volume of the poly-phenylene positioning groove 5 to prevent the poly-phenylene positioning block 1 from falling off.
The utility model discloses a theory of operation and use flow: when the device is used, a single-layer polyphenyl polymer heat-preservation main board 3 can be paved on the outer side of a wall body, the boards are fixed by adhesion materials, after a first layer of boards are paved, a second layer polyphenyl polymer heat-preservation main board 3 is additionally arranged, the polyphenyl polymer heat-preservation main board 3 is paved in a polyphenyl polymer positioning groove 5 of the first layer of boards in a contraposition mode through a polyphenyl polymer positioning block 1, the boards are fixed by the adhesion materials, the double-layer polyphenyl polymer heat-preservation main boards 3 are mutually embedded, the phenomenon that gaps are large when the single boards are paved, moisture penetrates and is soaked into the inner sides of the boards, the adhesion materials are soaked for a long time, the boards fall off is caused, the installation stability of the boards is improved, structural ribs 2 are arranged in the boards, when the polyphenyl polymer heat-preservation main boards 3 are paved, the structural strength of the boards can be improved through the effect of the, meanwhile, the structural strength of the whole wall body is improved, the thickness of an outer enclosure structure of a building is reduced, and the indoor use area is increased.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an ageing resistance's polymerization polyphenyl heat preservation heat insulating board, includes polymerization polyphenyl heat preservation mainboard (3), its characterized in that: the surface of the polymerized polyphenyl heat-preservation main board (3) is provided with polymerized polyphenyl positioning grooves (5), polymerized polyphenyl positioning blocks (1) are arranged on two sides of the surface of the polymerized polyphenyl heat-preservation main board (3), polymerized polyphenyl positioning protrusions (4) are arranged on the inner sides of the polymerized polyphenyl positioning blocks (1), the polymerized polyphenyl positioning blocks (1) are symmetrically arranged on two sides of the surface of the polymerized polyphenyl heat-preservation main board (3), and the polymerized polyphenyl positioning protrusions (4) are arranged on the inner sides of the polymerized polyphenyl positioning blocks (1).
2. The anti-aging polymerized polyphenyl thermal insulation board according to claim 1, characterized in that: the polymerized polyphenyl heat preservation main board (3) is embedded with structural ribs (2).
3. The anti-aging polymerized polyphenyl thermal insulation board according to claim 2, characterized in that: the structural ribs (2) are of rectangular grid structures.
4. The anti-aging polymerized polyphenyl thermal insulation board according to claim 3, characterized in that: the length of four sides of each rectangular structural rib (2) is forty centimeters.
5. The anti-aging polymerized polyphenyl thermal insulation board according to claim 1, characterized in that: the polymerized polyphenyl heat preservation main board (3) is laid into a double-layer symmetrical structure.
6. The anti-aging polymerized polyphenyl thermal insulation board according to claim 5, characterized in that: the polymerized polyphenyl locating block (1) on the upper polymerized polyphenyl heat preservation main board (3) is embedded in the polymerized polyphenyl locating groove (5) on the bottom polymerized polyphenyl heat preservation main board (3).
7. The anti-aging polymerized polyphenyl thermal insulation board according to claim 6, characterized in that: the volume of the polymerized polyphenyl positioning block (1) is one half of that of the polymerized polyphenyl positioning groove (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921185197.5U CN210529980U (en) | 2019-07-26 | 2019-07-26 | Anti-aging polymerized polyphenyl thermal insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921185197.5U CN210529980U (en) | 2019-07-26 | 2019-07-26 | Anti-aging polymerized polyphenyl thermal insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210529980U true CN210529980U (en) | 2020-05-15 |
Family
ID=70599026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921185197.5U Active CN210529980U (en) | 2019-07-26 | 2019-07-26 | Anti-aging polymerized polyphenyl thermal insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210529980U (en) |
-
2019
- 2019-07-26 CN CN201921185197.5U patent/CN210529980U/en active Active
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