CN210466442U - Packaged data storage - Google Patents

Packaged data storage Download PDF

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Publication number
CN210466442U
CN210466442U CN201921543600.7U CN201921543600U CN210466442U CN 210466442 U CN210466442 U CN 210466442U CN 201921543600 U CN201921543600 U CN 201921543600U CN 210466442 U CN210466442 U CN 210466442U
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China
Prior art keywords
data storage
pcb
pcb board
main control
control chip
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CN201921543600.7U
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Chinese (zh)
Inventor
孙成思
孙日欣
李振华
刘小刚
覃云珍
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Biwin Storage Technology Co Ltd
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Biwin Storage Technology Co Ltd
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Priority to CN201921543600.7U priority Critical patent/CN210466442U/en
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Abstract

The utility model discloses a packaged data storage ware, this packaged data storage ware include PCB board, main control chip, FLASH chip and data interface, wherein, the FLASH chip with the main control chip electricity is connected and all is set up the front of PCB board, data interface with the main control chip electricity is connected and is set up the one end of the reverse side of PCB board, packaged data storage ware is still including setting up the front of PCB board, be used for the encapsulation to be located the electronic component's of PCB board front packaging layer. The utility model discloses an encapsulated data storage adopts the modularized design, possesses protection function such as shock resistance, waterproof, dustproof, and is not fragile.

Description

Packaged data storage
Technical Field
The utility model relates to a data storage technical field, in particular to encapsulation formula data memory.
Background
As is well known, a USB flash disk (USB flash disk) is a micro mobile storage device, and is widely used due to its advantages of large storage capacity, small size, portability, reliable performance, low price, etc.
Current USB flash disk mainly comprises shell and core, and the core includes the PCB board, main control chip, memory chip, USB interface and other supporting electronic component, and wherein, the USB interface passes through the circuit on the PCB board to be connected with memory chip, and the core mainly protects through the shell, and the USB interface can be through the cap protection supporting with the shell, but current shell structure does not possess shock resistance, waterproof, protection functions such as dustproof, and the USB flash disk has higher impaired risk during the use.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a packaged data storage ware aims at solving the problem that adopts shell structure's USB flash disk damaged easily at present.
In order to achieve the above object, the utility model provides a packaged data storage device, this data storage device include PCB board, main control chip, FLASH chip and data interface, wherein, the FLASH chip with the main control chip electricity is connected and all is set up the front of PCB board, data interface with the main control chip electricity is connected and is set up the one end of the reverse side of PCB board, packaged data storage device is still including setting up the front of PCB board, be used for the encapsulation to be located the electronic component's of PCB board front side packaging layer.
Preferably, the data interface includes a USB2.0 conductive contact set, the USB2.0 conductive contact set includes conductive contacts arranged on the reverse side of the PCB according to the USB2.0 pin standard, and the conductive contacts are attached to the PCB.
Preferably, the data interface further includes a USB3.0 metal elastic sheet set, and with respect to the insertion direction of the data interface, the USB3.0 metal elastic sheet set is located behind the USB2.0 conductive contact sheet set, and the USB3.0 metal elastic sheet set includes metal elastic sheets arranged on the reverse side of the PCB according to the USB3.0 pin standard, and the metal elastic sheets include a connecting portion attached to the PCB and an elastic portion far away from the PCB.
Preferably, the connecting portions are respectively disposed at opposite ends of the elastic portion, and the elastic portion is arched.
Preferably, the main control chip and the FLASH chip are both close to one end of the data interface on the PCB.
Preferably, the encapsulation layer is made of epoxy resin material.
Preferably, the PCB further comprises an indicator light which is arranged on the reverse side of the PCB and electrically connected with the main control chip.
Preferably, the indicator light is one or more.
Preferably, the PCB further comprises a through hole arranged through the PCB.
The utility model discloses technical scheme's beneficial effect lies in: the PCB is provided with a packaging layer for packaging electronic elements such as a main control chip, a FLASH chip and the like so as to protect the electronic elements and a connecting circuit on the PCB. The packaging type data memory adopts a modular design, has the protection functions of impact resistance, water resistance, dust resistance and the like, and is not easy to damage.
Drawings
Fig. 1 is a schematic structural diagram of a packaged data storage according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the packaged data storage device of FIG. 1 from another perspective.
Detailed Description
In the following, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a packaged data storage, refer to fig. 1 and fig. 2, this packaged data storage includes PCB board 100, main control chip, FLASH chip and data interface, wherein, FLASH chip and main control chip electricity are connected and all are set up in the front of PCB board 100, and data interface is connected with the main control chip electricity and is set up the one end at the reverse side of PCB board 100, and packaged data storage is still including setting up in the front of PCB board 100, be used for the encapsulation to be located the positive electronic component's of PCB board 100 encapsulated layer 200.
The utility model provides a packaged data storage ware is as removing storage device, and mainly used storage data material can insert the interface of other equipment through its data interface, realizes plug-and-play. Referring to fig. 1, the packaged data storage is designed in a card type, and is rectangular as a whole, and the data storage includes a PCB board 100, a main control chip, a FLASH chip and a data interface. It can be understood that the PCB 100 has a front side and a back side, wherein the main control chip and the FLASH chip are attached to the front side of the PCB 100, and the data interface is disposed on the back side of the PCB 100 and located at one end of the PCB 100. In addition, the encapsulation layer 200 is disposed on the front surface of the PCB 100, and is attached to the PCB 100 to form a double-layer structure. The packaging layer 200 is directly in contact fit with the PCB 100 and the electronic components on the front side of the PCB 100 without any gap, wraps the electronic components including the main control chip and the FLASH chip, and can dissipate heat and conduct the electronic components.
The PCB 100 is provided with a package layer 200 for packaging electronic components such as a main control chip and a FLASH chip, so as to protect the electronic components and a connection circuit on the PCB 100. The packaging type data memory adopts a modular design, has the protection functions of impact resistance, water resistance, dust resistance and the like, and is not easy to damage. Compared with a USB flash disk adopting a shell structure, the packaging type data memory also has the advantages of strong product reliability, strong working performance, low production cost and the like.
In a preferred embodiment of the present invention, referring to fig. 1 and 2, the data interface comprises a USB2.0 conductive contact set 300, the USB2.0 conductive contact set 300 comprises conductive contacts 310 arranged on the reverse side of the PCB 100 according to USB2.0 pin standard, and the conductive contacts 310 are attached to the PCB 100. The data interface adopts USB2.0, the transmission rate can reach 480Mpbs, and the data interface can be matched with the equipment interface of the USB 2.0. The present packaged data storage device having a USB2.0 data interface is suitable for use as a system boot disk.
Further, referring to fig. 1 and 2, the data interface further includes a USB3.0 metal spring assembly 400, with respect to the plugging direction of the data interface, the USB3.0 metal spring assembly 400 is located behind the USB2.0 conductive contact assembly 300, the USB3.0 metal spring assembly 400 includes a metal spring 410 arranged on the reverse side of the PCB 100 according to the USB3.0 pin standard, and the metal spring 410 includes a connecting portion 411 attached to the PCB 100 and an elastic portion 412 far away from the PCB 100. Specifically, referring to fig. 1, on the reverse side of the PCB 100, the USB2.0 conductive contact set 300 and the USB3.0 metal spring set 400 are arranged back and forth along the plugging direction of the data interface, and the metal springs 410 of the USB3.0 metal spring set 400 are sequentially arranged at intervals according to the USB3.0 pin standard. The metal dome 410 includes a connecting portion 411 and an elastic portion 412, the connecting portion 411 is attached to the PCB 100 and electrically connected to the main control chip through a connecting circuit, the elastic portion 412 is connected to the connecting portion 411 and away from the PCB 100, the elastic portion 412 is used for elastically abutting against an interface of the device, so as to electrically connect the data interface to the device interface, and assist the packaged data storage device to be stably inserted and not fall off. The theoretical transmission rate of the USB3.0 is as high as 4.8Gpbs (600MB/s), which is about ten times of the transmission rate of the USB2.0, the USB3.0 is added on the basis that the data interface adopts the USB2.0, the transmission rate is improved, the waiting time of transmission, sharing and storage of large files is reduced, and the working efficiency is improved; and compatibility is improved, so that the packaged data storage is suitable for equipment with interfaces of USB2.0 and USB 3.0.
In a preferred embodiment of the present invention, referring to fig. 2, the connecting portions 411 are respectively disposed at two opposite ends of the elastic portion 412, and the elastic portion 412 is in an arch shape. The two ends of the elastic part 412 are respectively provided with a connecting part 411, and the two ends of the elastic part 412 are fixedly connected with the connecting parts 411. The flexible portion 412 is designed to be arched, so that the data interface can be guided into the flexible portion quickly. It can be understood that the elastic portion 412 is compressed when contacting the host interface, and the data interface and the device interface are well contacted by the elastic force of the elastic portion 412, and the data reading and writing are stable.
In a preferred embodiment of the present invention, the main control chip and the FLASH chip are both close to one end of the data interface on the PCB board 100, so as to shorten the signal transmission route, thereby reducing the signal loss and speeding up the signal transmission speed and the data read/write speed.
In a preferred embodiment of the present invention, the package layer 200 is made of epoxy resin material. Epoxy is preferred as a material for the encapsulation layer 200 because of its numerous advantages. For example, the material has excellent mechanical property and can prevent collision; the sealing performance is strong, and the PCB board 100 can be matched with the sealing performance, so that the sealing performance is waterproof and leakage-proof; the insulation property is strong, and static electricity can be prevented; the heat resistance is strong, and the heat conduction can be carried out on the electronic components on the PCB board 100.
In a preferred embodiment of the present invention, referring to fig. 1, the present invention further includes an indicator light 10 disposed on the reverse side of the PCB 100 and electrically connected to the main control chip. The indicator light 10 is used for indicating the working state of the packaged data storage, and the indicator light 10 may be a surface mount LED light. Specifically, the indicator light 10 is disposed at an end opposite to an end of the PCB 100 where the data interface is located, i.e. the tail end of the packaged data storage device, so that when the packaged data storage device is inserted into the host interface, it is convenient for a user to check.
Further, when the packaged data storage device is plugged into the device interface, the indicator light 10 is on to indicate that the power is turned on, and the indicator light 10 flashes to indicate that data is being read or written. Alternatively, when the indicator lamp 10 is provided in plural, the plural indicator lamps 10 are displayed in plural different colors, respectively, and indicate different functional states of the packaged data storage. For example, there are two indicator lights 10, one of the indicator lights 10 is used to be turned on when the power is turned on, and the other indicator light 10 is used to be turned on when data is read or written.
In a preferred embodiment of the present invention, referring to fig. 1, the PCB board 100 further includes a through hole 20 disposed therethrough. The through hole 20 is used for hanging a rope, is convenient for a user to carry and avoids loss. The through holes 20 are disposed at the free positions of the PCB board 100 to avoid affecting the circuits and electronic components on the PCB board 100. Preferably, the through hole 20 is provided at an end opposite to an end of the PCB board 100 where the data interface is located.
The above is only the part or the preferred embodiment of the present invention, no matter the characters or the drawings can not limit the protection scope of the present invention, all under the whole concept of the present invention, the equivalent structure transformation performed by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the protection scope of the present invention.

Claims (9)

1. The utility model provides a packaged data storage ware, includes PCB board, main control chip, FLASH chip and data interface, its characterized in that, the FLASH chip with the main control chip electricity is connected and all is set up the front of PCB board, data interface with the main control chip electricity is connected and is set up the one end of the reverse side of PCB board, packaged data storage ware is still including setting up the front of PCB board, be used for the encapsulation to be located the electronic component's of PCB board front side encapsulation layer.
2. The packaged data storage device of claim 1, wherein the data interface comprises a USB2.0 set of conductive contacts, the USB2.0 set of conductive contacts comprising conductive contacts arranged on a reverse side of the PCB according to the USB2.0 pin standard, the conductive contacts attached to the PCB.
3. The encapsulated data storage device of claim 2, wherein the data interface further comprises a USB3.0 metal spring set, and with respect to the plugging direction of the data interface, the USB3.0 metal spring set is located behind the USB2.0 conductive contact set, the USB3.0 metal spring set comprises metal springs arranged on the reverse side of the PCB according to the USB3.0 pin standard, and the metal springs comprise a connecting portion attached to the PCB and an elastic portion far away from the PCB.
4. The encapsulated data storage device of claim 3, wherein the connection portions are disposed at opposite ends of the elastic portion, and the elastic portion is arched.
5. The packaged data storage device of claim 1, wherein the main control chip and the FLASH chip are both near an end of the data interface on the PCB board.
6. The encapsulated data storage device of claim 1 wherein said encapsulation layer is formed of an epoxy material.
7. The packaged data storage device of claim 1, further comprising an indicator light disposed on a reverse side of the PCB and electrically connected to the main control chip.
8. The packaged data storage unit of claim 7, wherein the indicator light is one or more.
9. The packaged data storage device of claim 1, further comprising a through hole disposed through the PCB board.
CN201921543600.7U 2019-09-17 2019-09-17 Packaged data storage Active CN210466442U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921543600.7U CN210466442U (en) 2019-09-17 2019-09-17 Packaged data storage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921543600.7U CN210466442U (en) 2019-09-17 2019-09-17 Packaged data storage

Publications (1)

Publication Number Publication Date
CN210466442U true CN210466442U (en) 2020-05-05

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CN201921543600.7U Active CN210466442U (en) 2019-09-17 2019-09-17 Packaged data storage

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110443341A (en) * 2019-09-17 2019-11-12 深圳佰维存储科技股份有限公司 Packaged data storage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110443341A (en) * 2019-09-17 2019-11-12 深圳佰维存储科技股份有限公司 Packaged data storage

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Address after: 518000 floors 1-3 and 4 of buildings 4 and 8, zone 2, Zhongguan honghualing Industrial South Zone, No. 1213 Liuxian Avenue, Pingshan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong

Patentee after: BIWIN STORAGE TECHNOLOGY Co.,Ltd.

Address before: 518000 1st, 2nd, 4th and 5th floors of No.4 factory building, tongfuyu industrial town, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province

Patentee before: BIWIN STORAGE TECHNOLOGY Co.,Ltd.

CP02 Change in the address of a patent holder