CN210412939U - Automatic welding device for glass packaging temperature sensor chip - Google Patents

Automatic welding device for glass packaging temperature sensor chip Download PDF

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CN210412939U
CN210412939U CN201920973515.8U CN201920973515U CN210412939U CN 210412939 U CN210412939 U CN 210412939U CN 201920973515 U CN201920973515 U CN 201920973515U CN 210412939 U CN210412939 U CN 210412939U
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bearing jig
temperature sensor
dumet
lifting
vacuum suction
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CN201920973515.8U
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隋中華
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Thinking Yichang Electronic Co ltd
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Thinking Yichang Electronic Co ltd
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Abstract

An automatic welding device for glass packaging temperature sensor chips comprises a bearing jig, wherein the bearing jig is arranged on a conveying workbench and is shifted at intervals and equidistantly through a shifting mechanism; a vibration disc is arranged on one side of the bearing jig, a positioning groove is connected to one side of the vibration disc, and the Dumet wires on the positioning groove bearing jig are spaced and are opposite to each other; a lifting mechanism is arranged below the bearing jig, a supporting plate is arranged on the lifting mechanism, and the supporting plate is opposite to the Dumet wires; the other side of the bearing jig is provided with a three-axis adjusting mechanism, the top end of the three-axis adjusting mechanism is provided with a vacuum suction plate, and the vacuum suction plate is connected with a vacuum pump in an air-tight mode. The utility model provides a pair of glass encapsulation temperature sensor chip automatic welder can accomplish the weldment work of chip.

Description

Automatic welding device for glass packaging temperature sensor chip
Technical Field
The utility model relates to a glass encapsulation temperature sensor production facility, especially a glass encapsulation temperature sensor chip automatic welder.
Background
The following processes are required in the production process of the NTC thermistor: the method comprises the steps of straightening wires, straightening, clamping and pulling wires, cutting, transferring a jig, cutting, silver dipping, adhering sheets, preheating, silver drying, inserting glass tubes, preheating, high-temperature forming, overturning, preheating, high-temperature forming and collecting.
After the front end of the Dumet wire is adhered with the silver paste, the Dumet wire needs to be adhered to the chip, and the Dumet wire is ensured to be adhered to the upper part and the lower part of the chip.
Disclosure of Invention
The utility model aims to solve the technical problem that a glass encapsulation temperature sensor chip automatic welder is provided, can be fast effectively glue the dumet silk thread that moves and glue into whole and guarantee that the dumet silk thread divides two upper and lower arranges on the chip with the chip.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
an automatic welding device for glass packaging temperature sensor chips comprises a bearing jig, wherein the bearing jig is arranged on a conveying workbench and is shifted at intervals and equidistantly through a shifting mechanism; a vibration disc is arranged on one side of the bearing jig, a positioning groove is connected to one side of the vibration disc, and the Dumet wires on the positioning groove bearing jig are spaced and are opposite to each other; a lifting mechanism is arranged below the bearing jig, a supporting plate is arranged on the lifting mechanism, and the supporting plate is opposite to the Dumet wires; the other side of the bearing jig is provided with a three-axis adjusting mechanism, the top end of the three-axis adjusting mechanism is provided with a vacuum suction plate, and the vacuum suction plate is connected with a vacuum pump in an air-tight mode.
The bearing jig comprises a jig body, a plurality of grooves for placing Dumet wires are arranged at the upper end of the jig body side by side, and poking teeth are arranged between the grooves.
The shifting mechanism comprises a two-axis adjusting mechanism, the two-axis adjusting mechanism is connected with the shifting rod through a connecting frame, a tooth groove is formed in the bottom end of the shifting rod, and when the shifting rod is pressed downwards, the tooth groove and the shifting teeth are meshed and clamped tightly.
The lifting mechanism comprises a first lifting cylinder, the top end of the first lifting cylinder is connected with a mounting seat, two groups of supporting plates are arranged on the left and right sides of the mounting seat, and each group of supporting plates are respectively arranged on the left and right sides of the Dumet wire; and the supporting plate is provided with a wire rod groove, and the wire rod groove is adapted to the diameter of the Dumet wire.
The three-axis adjusting mechanism comprises a front sliding seat and a rear sliding seat which are fixedly connected with the vacuum pump, and the front sliding seat and the rear sliding seat are arranged on the left sliding seat and the right sliding seat in a sliding manner and are driven by a front-back moving cylinder on the left sliding seat and the right sliding seat; the left and right sliding seats are arranged on the lifting seat in a sliding manner and driven by a left and right moving cylinder on the lifting seat; the lifting seat is arranged in the base in a sliding mode and driven by a lifting cylinder on the base.
The bottom end of the vacuum suction plate is provided with a groove matched with the Dumet wire.
The utility model relates to an automatic welding device for glass packaged temperature sensor chips, which can move at equal intervals by arranging a toggle mechanism and transmit Dumet wires dipped with silver paste to a chip feeding part; utilize triaxial adjustment mechanism, absorb the dumet silk thread that bears on the tool through vacuum adsorption, cooperate triaxial adjustment mechanism to shift to the discharge gate department of constant head tank. The chips are adhered by silver paste adhered to the wire ends like fishing, and then the chips are moved back to the upper part of the jig and placed on another Dumet wire on the jig. In the process, the three-axis linkage of the vacuum suction plate is matched with the lifting of the supporting plate, so that the single Dumet wires are sucked from the row of Dumet wires on the bearing jig 1 to remove the sticky pieces and then return to the bearing jig 1, the single Dumet wires with the chips are placed on the double Dumet wires, and the attached silver paste is used as a conducting medium for combining the two surfaces of the chips, so that the welding of the two Dumet wires and the chips is completed.
Drawings
The invention will be further explained with reference to the following figures and examples:
fig. 1 is an overall schematic view of the present invention (some parts are not shown in the figure).
Fig. 2 is a schematic structural view of the middle bearing jig of the present invention.
Fig. 3 is a schematic structural view of the middle toggle mechanism of the present invention.
Fig. 4 is a schematic structural diagram of the middle lifting mechanism of the present invention.
Fig. 5 is a schematic structural diagram of the middle triaxial adjusting mechanism of the present invention.
Fig. 6 is a partial schematic view of fig. 1 at a.
Fig. 7 is a partial schematic view of fig. 1 at B.
Fig. 8 is a schematic view of the state of the dumet wire in operation.
Fig. 9 is an enlarged schematic view of the movement locus of the vacuum suction plate.
In the figure: bear tool 1, carry workstation 2, toggle mechanism 3, vibrations dish 4, constant head tank 5, dumet silk thread 6, elevating system 7, layer board 8, triaxial adjustment mechanism 9, vacuum suction plate 10, vacuum pump 11, tool body 12, recess 13, dial tooth 14, two-axis adjustment mechanism 15, link 16, driving lever 17, tooth's socket 18, first lift cylinder 19, mount pad 20, wire rod recess 21, front and back slide 22, left and right slide 23, back-and-forth movement cylinder 24, lift seat 25, control and move cylinder 26, base 27, lift cylinder 28.
Detailed Description
As shown in fig. 1-4, an automatic soldering apparatus for a glass-encapsulated temperature sensor chip mainly comprises several major parts: dumet wire transmission part, chip transmission part, wire clamping and pasting part.
As shown in fig. 2, specifically, the dumet wire transmission part includes a bearing jig 1, the bearing jig 1 includes a jig body 12, a plurality of grooves 13 for placing the dumet wires 6 are opened on the upper end of the jig body 12 side by side, and a poking tooth 14 is disposed between the grooves 13. The front straightening and shearing mechanism cuts the Dumet wire 6 at a fixed length and then falls into the groove 13, and two end parts of the Dumet wire 6 extend out of the groove 13.
As shown in fig. 1, the carrying fixture 1 is placed on the conveying workbench 2, a plurality of toggle mechanisms 3 are arranged on one side of the conveying workbench 2 along the length direction, each toggle mechanism 3 comprises a two-axis adjusting mechanism 15, and the two-axis adjusting mechanism 15 is similar to the three-axis adjusting mechanism 9 in structure and is only a combination of left-right movement and lifting movement. Specifically, the two-axis adjusting mechanism 15 comprises a left-right moving slide block which is arranged on the lifting seat in a sliding manner and is driven by a left-right moving cylinder on the lifting seat; the lifting seat is arranged in the base in a sliding mode and driven by a lifting cylinder on the base. The left and right sliding blocks are provided with connecting frames 16, the connecting frames 16 are provided with a plurality of paired shifting rods 17 through two cross rods, the bottom ends of the shifting rods 17 are provided with tooth sockets 18, and the tooth sockets 18 can be meshed with the shifting teeth 14 on the bearing jig 1.
When the carrying jig 1 needs to be conveyed forwards at intervals. First, the lifting cylinder and the right moving cylinder operate simultaneously to move and lift the shift lever 17 in the opposite direction of conveyance. The distance of movement in the direction of the carrier jig 1 is here four groove 13 pitches. When the shifting rod moves to the right position, the lifting cylinder drives the shifting rod 17 to move downwards, and the tooth groove 18 is pressed on the shifting tooth 14. Then, after the left-right moving cylinder moves the distance between the four grooves 13 in the conveying direction, the lifting cylinder contracts again, and the deflector rod 17 is lifted. Thus, by moving the carrying jig 1, the dumet wire 6 stuck with the silver paste can be conveyed forward 4 at a time.
As shown in fig. 1, the chip conveying part includes two vibration discs 4, one side of each vibration disc 4 is connected with a positioning groove 5, the two positioning grooves 5 are separated by a certain distance and close to the bearing jig 1, and the discharge end of each positioning groove 5 is separated from and opposite to a dumet wire 6 on the bearing jig 1.
The vibration disc 4 is internally provided with a spiral channel, and the motor drives the internal rotary disc to rotate, so that the square chip gradually moves upwards along the spiral channel. And enters the positioning groove 5 after passing through the U-shaped groove at the top end of the vibration disc 4, and the U-shaped groove is arranged at the transition position of the top end of the spiral channel and the positioning groove 5, so that the width of the U-shaped groove is only used for a single square chip to pass through. The square chips thus arranged in order can enter the positioning slot 5 through the U-shaped slot, while the square chips arranged in disorder fall back into the vibration plate 4 again. And one side of the positioning groove 5 is provided with a corresponding vibrating motor, and the discharging and feeding of the square chips can be promoted through the vibrating motor.
Here the vibration plate 4 feeds at the same time interval as the toggle mechanism 3. When the bearing jig 1 is moved, the vibration disc 4 feeds materials into the positioning groove 5, and when the bearing jig 1 stops, the vibration disc 4 stops feeding materials.
The silk thread clamping and pasting part comprises a Dumet silk thread lifting mechanism and a Dumet silk thread adsorption moving mechanism. Specifically, as shown in fig. 4, the dumet wire lifting mechanism is disposed below the carrying fixture 1, and includes a first lifting cylinder 19, a mounting base 20 is connected to a top end of the first lifting cylinder 19, two sets of supporting plates 8 are disposed on the mounting base 20 on the left and right sides, the number of each set of supporting plates 8 is 2, and the 2 supporting plates 8 are respectively disposed on the left and right sides below the carrying fixture 1. When the first lifting cylinder 19 is lifted, the two groups of supporting plates 8 can be lifted simultaneously, and the left group of supporting plates 8 and the right group of supporting plates 8 respectively lift one dumet wire coated with silver paste.
As shown in fig. 5, the dumet wire adsorption moving mechanism includes a three-axis adjusting mechanism 9, two vacuum pumps 11 are mounted on the top end of the three-axis adjusting mechanism 9, a vacuum suction plate 10 is connected to a mounting frame at the front end of each vacuum pump 11, and the vacuum suction plate 10 is connected to the vacuum pumps 11 through an air pipe with a solenoid valve. The vacuum suction plates 10 are located at proper positions above the carrying fixture 1, and the positions of the two vacuum suction plates 10 correspond to the positions of the two groups of support plates 8 respectively. The bottom end of the vacuum suction plate 10 is provided with a groove which is matched with the Dumet wire 6, and the groove is communicated with the hollow space inside the vacuum suction plate 10. The inner hollow space is connected to a vacuum pump 11 via a pipe. The air in the vacuum suction plate 10 can be pumped away through the action of the vacuum pump 11, so that a negative pressure area is formed in the inner cavity of the vacuum suction plate 10, the Dumet wire can be sucked, and when the vacuum pump 11 stops, the inner pressure of the vacuum suction plate 10 is normal, so that the Dumet wire can be put down.
The three-axis adjusting mechanism 9 comprises a front sliding seat 22 and a rear sliding seat 22 which are fixedly connected with the vacuum pump 11, wherein the front sliding seat 22 and the rear sliding seat 22 are arranged on a left sliding seat 23 and a right sliding seat 23 in a sliding manner and are driven by a front-back moving air cylinder 24 on the left sliding seat 23 and the right sliding seat 23; the left and right sliding seats 23 are arranged on the lifting seat 25 in a sliding manner and driven by a left and right moving cylinder 26 on the lifting seat 25; the lifting seat 25 is slidably disposed in the base 27 and driven by a lifting cylinder 28 on the base 27. The lifting cylinder 28 can drive the lifting base 25 and the upper part to move up and down integrally, the left and right slide base 23 and the upper part to move left and right integrally by the left and right moving cylinder 26, and the front and back moving cylinder 24 can directly drive the vacuum suction plate 10 to move forward and backward. Since the three-axis adjusting mechanism 9 can move left and right, up and down, and back and forth, the vacuum suction plate 10 can complete the movement in any position in a certain space.
Here, the left group of vacuum suction plates 10 and the support plate 8 and the right group of vacuum suction plates 10 and the support plate 8 are respectively in one group, and the chip welding is completed synchronously.
Specifically, as shown in fig. 6, there is a left set of operating state diagrams. Three points a, b and c in the figure respectively show the positions where the vacuum suction plate 10 passes. The working process is as follows:
1) after normal work, when the bearing jig 1 moves the distance between the four grooves 13, the bearing jig stops moving, the supporting plate 8 is lifted, and the station a and the station b on the supporting plate 8 respectively lift the Dumet wire e and the Dumet wire f. At this time, a dumet wire d to which the chip is just stuck is adsorbed on the vacuum suction plate 10, and the dumet wire d is aligned with the dumet wire e below (the vacuum suction plate 10 corresponds to the position IIII in fig. 9). The controller controls and drives the three-axis adjusting mechanism 9 so that the vacuum suction plate 10 releases the dumet wire d (the vacuum suction plate 10 corresponds to the position I in fig. 9) after the vacuum suction plate 10 moves down a certain distance. And the Dumet wire d with the chip is superposed on the Dumet wire e, and the Dumet wire e is adhered with silver paste, so that the chip on the Dumet wire d and the Dumet wire e are also adhered together, and the welding of the two Dumet wires and the chip is completed.
2) After the vacuum suction plate 10 is released, the Dumet wire f at the position b is horizontally moved to the position b, and then the Dumet wire f is downwards moved to complete suction (the vacuum suction plate 10 corresponds to the position II in the figure 9), and after the action is completed, the Dumet wire f is lifted and vertically moves forwards, and moves to the end of the positioning groove 5 to bond the chip (the vacuum suction plate 10 corresponds to the position III in the figure 9). Meanwhile, the supporting plate 8 moves downwards and falls below the bearing jig 1.
3) The bearing jig 1 moves forwards at the intervals of the four grooves 13 and stops, and the supporting plate 8 is lifted. Meanwhile, the vacuum suction plate 10 sucks a dumet wire stuck with a chip to move back to the position a in an inclined mode (the vacuum suction plate 10 corresponds to the position IIII in the figure 9), then the vacuum suction plate moves downwards to place the dumet wire stuck with the chip on the dumet wire of the position a again (the vacuum suction plate 10 corresponds to the position I in the figure 9), and the two dumet wires are bonded with the chip. Then the Dumet wire is translated to a station b (the vacuum suction plate 10 corresponds to a position II in the figure 9), the Dumet wire absorbing the station b moves upwards to continuously remove the chips at the ends of the positioning grooves 5 (the chip interval is conveyed forwards) (the vacuum suction plate 10 corresponds to a position III in the figure 9). Meanwhile, the supporting plate 8 moves downwards and falls below the bearing jig 1.
4) And repeating the steps 1) to 3) circularly to form the situation of the section C in the figure 8.
As shown in fig. 7, there is a right set of operating state diagrams. Three points a, b and c in the figure respectively show the positions where the vacuum suction plate 10 passes. And synchronously acting with the left side to finish the welding of other products. The specific working process is as follows:
1) after normal work, when the bearing jig 1 moves the distance between the four grooves 13, the bearing jig stops moving, the supporting plate 8 is lifted, and the station a and the station b on the supporting plate 8 respectively lift the Dumet wire e and the Dumet wire f. At this time, a dumet wire d which is just adhered with a chip is adsorbed on the vacuum suction plate 10, the dumet wire d is opposite to a dumet wire e which is not adhered with the chip below, and the controller controls and drives the three-axis adjusting mechanism 9, so that the vacuum suction plate 10 releases the dumet wire d after the vacuum suction plate 10 moves downwards for a certain distance, and at this time. And the Dumet wire d with the chip is superposed on the Dumet wire e, and the Dumet wire e is adhered with silver paste, so that the chip on the Dumet wire d and the Dumet wire e are also adhered together, and the welding of the two Dumet wires and the chip is completed.
2) After the vacuum suction plate 10 is released, the vacuum suction plate is translated to the station b, then moves downwards to finish sucking the Dumet wire f at the position b, lifts up and moves forwards vertically after finishing the action, and moves to the end of the positioning groove 5 to glue the chip. Meanwhile, the supporting plate 8 moves downwards and falls below the bearing jig 1.
3) The bearing jig 1 moves forwards at the intervals of the four grooves 13 and stops, and the supporting plate 8 is lifted. Meanwhile, the vacuum suction plate 10 sucks a dumet wire stuck with a chip to move back to the a station in an inclined and horizontal mode, then the dumet wire stuck with the chip is moved downwards to be placed on the dumet wire of the a station again, and the two dumet wires are bonded with the chip in an adhering mode. Then the Dumet wire is translated to a station b, and the Dumet wire at the station b is adsorbed, then the Dumet wire moves upwards to continuously remove and glue the chip at the end of the positioning groove 5 (the chip is conveyed forwards at intervals). Meanwhile, the supporting plate 8 moves downwards and falls below the bearing jig 1.
4) And repeating the steps 1) to 3) circularly to form the situation of D section in figure 8.

Claims (6)

1. The utility model provides a glass encapsulation temperature sensor chip automatic welder which characterized in that: the device comprises a bearing jig (1), wherein the bearing jig (1) is arranged on a conveying workbench (2) and is shifted at intervals and equidistantly through a shifting mechanism (3); a vibration disc (4) is arranged on one side of the bearing jig (1), a positioning groove (5) is connected to one side of the vibration disc (4), and the Dumet wires (6) on the bearing jig (1) of the positioning groove (5) are spaced and are opposite to each other; a lifting mechanism (7) is arranged below the bearing jig (1), a supporting plate (8) is arranged on the lifting mechanism (7), and the supporting plate (8) is opposite to the Dumet wire (6); bear tool (1) opposite side and be equipped with triaxial adjustment mechanism (9), vacuum suction plate (10) are installed on triaxial adjustment mechanism (9) top, and vacuum suction plate (10) are connected with vacuum pump (11) gas.
2. The automatic bonding device for glass-encapsulated temperature sensor chips of claim 1, wherein: the bearing jig (1) comprises a jig body (12), a plurality of grooves (13) for placing the Dumet wires (6) are formed in the upper end of the jig body (12) side by side, and shifting teeth (14) are arranged between the grooves (13).
3. The automatic bonding device for glass-encapsulated temperature sensor chips of claim 2, wherein: the poking mechanism (3) comprises a two-axis adjusting mechanism (15), the two-axis adjusting mechanism (15) is connected with a poking rod (17) through a connecting frame (16), a tooth groove (18) is formed in the bottom end of the poking rod (17), and when the poking rod (17) is pressed down, the tooth groove (18) and the poking teeth (14) are meshed and clamped tightly.
4. The automatic bonding device for glass-encapsulated temperature sensor chips of claim 1, wherein: the lifting mechanism (7) comprises a first lifting cylinder (19), the top end of the first lifting cylinder (19) is connected with a mounting seat (20), two groups of supporting plates (8) are arranged on the left side and the right side of the mounting seat (20), and each group of supporting plates (8) are respectively arranged on the left side and the right side of the Dumet wire (6); the wire rod groove (21) is arranged on the supporting plate (8), and the diameter of the wire rod groove (21) is matched with that of the Dumet wire (6).
5. The automatic bonding device for glass-encapsulated temperature sensor chips of claim 1, wherein: the three-axis adjusting mechanism (9) comprises a front sliding seat (22) and a rear sliding seat (22) which are fixedly connected with the vacuum pump (11), wherein the front sliding seat (22) and the rear sliding seat (22) are arranged on a left sliding seat (23) and a right sliding seat (23) in a sliding manner and are driven by a front-back moving cylinder (24) on the left sliding seat (23) and the right sliding seat; the left and right sliding seats (23) are arranged on the lifting seat (25) in a sliding manner and driven by a left and right moving cylinder (26) on the lifting seat (25); the lifting seat (25) is arranged in the base (27) in a sliding mode and driven by a lifting cylinder (28) on the base (27).
6. The automatic bonding device for glass-encapsulated temperature sensor chips of claim 1, wherein: the bottom end of the vacuum suction plate (10) is provided with a groove which is adaptive to the Dumet wire (6).
CN201920973515.8U 2019-06-26 2019-06-26 Automatic welding device for glass packaging temperature sensor chip Active CN210412939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920973515.8U CN210412939U (en) 2019-06-26 2019-06-26 Automatic welding device for glass packaging temperature sensor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920973515.8U CN210412939U (en) 2019-06-26 2019-06-26 Automatic welding device for glass packaging temperature sensor chip

Publications (1)

Publication Number Publication Date
CN210412939U true CN210412939U (en) 2020-04-28

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Application Number Title Priority Date Filing Date
CN201920973515.8U Active CN210412939U (en) 2019-06-26 2019-06-26 Automatic welding device for glass packaging temperature sensor chip

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111673225A (en) * 2020-05-06 2020-09-18 肇庆市新昊通自动化设备有限公司 NTC temperature sensor rubber-insulated-wire upper-piece welding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111673225A (en) * 2020-05-06 2020-09-18 肇庆市新昊通自动化设备有限公司 NTC temperature sensor rubber-insulated-wire upper-piece welding machine
CN111673225B (en) * 2020-05-06 2021-12-28 肇庆市新昊通自动化设备有限公司 NTC temperature sensor rubber-insulated-wire upper-piece welding machine

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