CN210379045U - Power module - Google Patents

Power module Download PDF

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Publication number
CN210379045U
CN210379045U CN201921037730.3U CN201921037730U CN210379045U CN 210379045 U CN210379045 U CN 210379045U CN 201921037730 U CN201921037730 U CN 201921037730U CN 210379045 U CN210379045 U CN 210379045U
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CN
China
Prior art keywords
electrode conducting
bridge arm
strip
conducting layer
output electrode
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Active
Application number
CN201921037730.3U
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Chinese (zh)
Inventor
徐文辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yitong Power Electronics Co ltd
Original Assignee
Shenzhen Yitong Power Electronics Co ltd
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Priority to CN201910545535X priority Critical
Priority to CN201910545535 priority
Application filed by Shenzhen Yitong Power Electronics Co ltd filed Critical Shenzhen Yitong Power Electronics Co ltd
Application granted granted Critical
Publication of CN210379045U publication Critical patent/CN210379045U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements

Abstract

The utility model provides a power module, include: the power module comprises a plurality of power modules, a first capacitor electrode conducting layer, a second capacitor electrode conducting layer, a filter capacitor and an absorption capacitor. The power module comprises an insulating substrate, first and second bridge arm conducting layers arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conducting layer, a plurality of second bridge arm power chips arranged on the second bridge arm conducting layer, a first bridge arm electrode conducting layer arranged on the insulating substrate, a first electrode conducting strip arranged on the first bridge arm electrode conducting layer, a second electrode conducting strip arranged on the second bridge arm conducting layer, an output electrode conducting layer arranged on the insulating substrate and an output electrode conducting strip arranged on the output electrode conducting layer; the plurality of first bridge arm power chips are respectively and electrically connected with the first bridge arm electrode conducting layer, the first bridge arm conducting layer is electrically connected with the output electrode conducting layer, and the plurality of second bridge arm power chips are respectively and electrically connected with the output electrode conducting layer.

Description

Power module
Technical Field
The utility model relates to an electron electric power technical field, concretely relates to be a power module.
Background
The power module is a power switch module formed by combining and packaging power electronic power devices such as metal oxide semiconductors (power MOS transistors), insulated gate field effect transistors (IGBT) and Fast Recovery Diodes (FRD) according to certain functions, and is mainly used for power conversion of electric vehicles, wind power generation, industrial frequency conversion and other occasions.
The motor driving circuit of the electric vehicle generally includes three sets of power modules, which provide a three-phase ac power supply for the motor. In the working process of the motor, the motor is an inductive load, and the parasitic inductance of the conventional power module generates waveform oscillation in the switching process of the power module, so that the accurate running performance of the motor is influenced.
Disclosure of Invention
The utility model aims at solving the above problem, providing a power module including a plurality of power modules, changing the wiring of power module and arranging, effectively reducing power module's parasitic inductance.
The utility model provides a power module, which comprises a plurality of power modules, a first capacitor electrode conducting layer, a second capacitor electrode conducting layer, a filter capacitor and an absorption capacitor; each power module comprises an insulating substrate, a first bridge arm conducting layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conducting layer, a second bridge arm conducting layer arranged on the insulating substrate, a plurality of second bridge arm power chips arranged on the second bridge arm conducting layer, a first bridge arm electrode conducting layer arranged on the insulating substrate, a first electrode conducting strip arranged on the first bridge arm electrode conducting layer, a second electrode conducting strip arranged on the second bridge arm conducting layer, an output electrode conducting layer arranged on the insulating substrate 1 and an output electrode conducting strip arranged on the output electrode conducting layer; the plurality of first bridge arm power chips are respectively and electrically connected with the first bridge arm electrode conducting layer, the first bridge arm conducting layer is electrically connected with the output electrode conducting layer, and the plurality of second bridge arm power chips are respectively and electrically connected with the output electrode conducting layer; the first electrode conducting strip is arranged adjacent to the plurality of first bridge arm power chips and extends along the arrangement path of the plurality of first bridge arm power chips, and the second electrode conducting strip is arranged adjacent to the plurality of second bridge arm power chips and extends along the arrangement path of the plurality of second bridge arm power chips; the first capacitor electrode conducting layer and the second capacitor electrode conducting layer are arranged in a laminated mode, the filter capacitor is electrically connected between the first capacitor electrode conducting layer and the second capacitor electrode conducting layer, the absorption capacitor is electrically connected between the first capacitor electrode conducting layer and the second capacitor electrode conducting layer, the first capacitor electrode conducting layer is electrically connected with the first electrode conducting strip, and the second capacitor electrode conducting layer is electrically connected with the second electrode conducting strip.
Furthermore, the plurality of second bridge arm power chips are electrically connected with the first bridge arm conducting layer so as to be electrically connected with the output electrode conducting layer.
Furthermore, the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged frame-shaped copper strips with equal height, the opening of the first electrode conductive strip faces the first bridge arm power chip, and the opening of the second electrode conductive strip faces the second bridge arm power chip.
Furthermore, an outer frame is fixedly arranged on the periphery of the insulating substrate, side through holes are formed in the positions, located on the first electrode conductive strips and the second electrode conductive strips, of the sides of the outer frame, the side through holes correspond to the shapes of the first electrode conductive strips and the second electrode conductive strips, the sizes of the side through holes are larger than the sizes of the first electrode conductive strips and the second electrode conductive strips, the first electrode conductive strips and the second electrode conductive strips are respectively arranged in the side through holes, and the top ends of the first electrode conductive strips and the second electrode conductive strips are higher than the upper surface of the outer frame.
Furthermore, the power module further comprises a gate electrode lead-out plate, the gate electrode lead-out plate is arranged between the first bridge arm power chip and the output electrode conducting layer, the output electrode conducting layer is in a frame shape, and the gate electrode lead-out plate is located in a frame-shaped opening of the output electrode conducting layer.
Furthermore, the output electrode conducting bar is in a frame shape and is matched with the shape of the output electrode conducting layer, a front through hole is formed in the position, located at the position of the output electrode conducting bar, of the front end of the outer frame, the front through hole corresponds to the shape of the output electrode conducting bar, the size of the front through hole is larger than that of the output electrode conducting bar, the output electrode conducting bar is arranged in the front through hole, and the top end of the output electrode conducting bar is higher than the upper surface of the outer frame.
Furthermore, the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged straight strip-shaped copper strips with the same height.
Furthermore, the output electrode conducting bar comprises two straight strip-shaped conducting bars, the two straight strip-shaped conducting bars are respectively arranged on two arms of the frame shape of the output electrode conducting layer, two front side through holes are formed in the positions, located on the output electrode conducting bar, of the front end of the outer frame, the front side through holes are straight strip-shaped and larger than the output electrode conducting bar in size, the output electrode conducting bars are arranged in the front side through holes, and the top ends of the output electrode conducting bars are higher than the upper surface of the outer frame.
Furthermore, the output electrode conducting strip comprises two annular column-shaped conducting strips, the two annular column-shaped conducting strips are arranged on two sides of the frame shape of the output electrode conducting layer, two circular through holes are formed in the positions, located on the output electrode conducting strip, of the front end of the outer frame, the size of each circular through hole is larger than that of the corresponding output electrode conducting strip, the output electrode conducting strips are arranged in the circular through holes, and the top ends of the output electrode conducting strips are higher than the upper surface of the outer frame.
Furthermore, the heights of the upper ends of the first electrode conductive strip, the second electrode conductive strip and the output electrode conductive strip are equal.
Furthermore, the first bridge arm power chip and the second bridge arm power chip are single-tube packaged chips, and the first bridge arm power chip and the second bridge arm power chip are respectively provided with a gate pole, a source pole and a heat dissipation drain pole.
Further, the first electrode conductive strip and/or the second electrode conductive strip are continuously extended.
Furthermore, the middle of the first electrode conductive strip and/or the second electrode conductive strip comprises at least one partition.
Further, the middle of the output electrode conducting strip comprises at least one partition.
Furthermore, the power module further comprises a radiator, and the power modules are arranged on the radiator.
Furthermore, the power module further comprises a capacitor plate, and the first capacitor electrode conducting layer and the second capacitor electrode conducting layer are both arranged on the capacitor plate.
Furthermore, the power module further comprises a plurality of pressing plates, and the capacitor plate is fixed with the radiator through the pressing plates.
The power module that the power module group included draw forth as the module electrode through the metal copper bar, or welding or crimping, easy to assemble, and the modular area of busbar is little, can effectively reduce the parasitic inductance of module.
Drawings
Fig. 1 is an exploded view of a power module according to a preferred embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a capacitor plate of the power module in fig. 1.
Fig. 3 is a schematic structural diagram of the power module in fig. 1 after installation.
Fig. 4 is a schematic front view of the first embodiment of the power module in fig. 1.
Fig. 5 is a perspective view of the power module of fig. 4.
Fig. 6 is a perspective view of the power module of fig. 4 after being mounted to the housing.
Fig. 7 is an exploded view of the power module of fig. 6.
Fig. 8 is a schematic perspective view of a second embodiment of the power module in fig. 1.
Fig. 9 is a perspective view of the power module of fig. 8 after being mounted to the housing.
Fig. 10 is an exploded view of the power module of fig. 9.
Fig. 11 is a schematic front view of the third embodiment of the power module in fig. 1.
Fig. 12 is a perspective view of the power module of fig. 11.
Fig. 13 is a schematic perspective view of a fourth embodiment of the power module in fig. 1.
Fig. 14 is a schematic front view of an embodiment five of the power module of fig. 1.
Fig. 15 is a perspective view of the power module of fig. 14.
Fig. 16 is a perspective view of a sixth embodiment of the power module of fig. 1.
Detailed Description
The embodiments of the present invention will be described in detail below with reference to the drawings, and it should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
Referring to fig. 1 and 2, a power module 200 according to the present invention includes a plurality of power modules 100 (for a motor, three-phase ac power is to form a three-phase bridge power module through three power modules, so that only three power modules are shown in fig. 1-2, and other embodiments may also include other numbers of power modules), a first capacitor electrode conductive layer 15, a second capacitor electrode conductive layer 16, a filter capacitor 17, an absorption capacitor 18, a heat sink 14, a capacitor plate 18, and a pressure plate 19. The first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are stacked, the filter capacitor 17 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, the absorption capacitor 18 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, the first capacitor electrode conductive layer 15 is electrically connected to the first electrode conductive strip 7, the second capacitor electrode conductive layer 16 is electrically connected to the second electrode conductive strip 70, and the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are both disposed on the capacitor plate 18.
The plurality of power modules 100 are arranged in parallel on the heat sink 14, and the capacitor plate 18 is fixed to the heat sink 14 by a plurality of pressing plates 19, so that the first capacitor electrode conductive layer 15 is electrically connected to the first electrode conductive strip 7 on the power module, and the second capacitor electrode conductive layer 15 is electrically connected to the second electrode conductive strip 70 on the power module. The number of said first 15 and second 16 capacitive electrode conductive layers corresponds to the number of positions and positions of the first 7 and second 70 electrode conductive strips on the power module.
Specifically, the pressing plate 19 penetrates through the capacitor plate 18 through a plurality of screws to be fastened with screw holes on the heat sink 14, and three power modules of the three-phase power module are firmly fastened through four pressing plates 19.
Please refer to fig. 3, which illustrates the power module 200 after the installation. It can be seen that the power module 200 after installation is compact and can minimize parasitic inductance.
Referring to fig. 4 and 5, the power module 200 includes a power module 100 according to a first preferred embodiment, which includes an insulating substrate 1, a first bridge arm conductive layer 2 disposed on the insulating substrate 1, a plurality of first bridge arm power chips 3 (only 5 first bridge arm power chips are shown in fig. 4 and 5) disposed on the first bridge arm conductive layer 2, a second bridge arm conductive layer 4 disposed on the insulating substrate 1, a plurality of second bridge arm power chips 5 (only 5 second bridge arm power chips are shown in fig. 4 and 5) disposed on the second bridge arm conductive layer 4, a first bridge arm electrode conductive layer 6 disposed on the insulating substrate 1, a first electrode conductive strip 7 disposed on the first bridge arm electrode conductive layer 6, a second electrode conductive strip 70 disposed on the second bridge arm conductive layer 4, an output electrode conductive layer 8 disposed on the insulating substrate 1, and a second bridge arm electrode conductive layer, An output electrode conductive strip 9 disposed on the output electrode conductive layer 8. The plurality of first bridge arm power chips 3 are electrically connected to the first bridge arm electrode conductive layer 6, the first bridge arm conductive layer 2 is electrically connected to the output electrode conductive layer 8 (in this embodiment, the first bridge arm conductive layer 2 and the output electrode conductive layer 8 may be an integral body, and of course, in other embodiments, the first bridge arm conductive layer 2 and the output electrode conductive layer 8 may be separately manufactured), and the plurality of second bridge arm power chips 5 are electrically connected to the output electrode conductive layer 8; the first electrode conductive strip 7 is disposed adjacent to the plurality of first bridge arm power chips 3 and extends along the arrangement path of the plurality of first bridge arm power chips 3, and the second electrode conductive strip 70 is disposed adjacent to the plurality of second bridge arm power chips 5 and extends along the arrangement path of the plurality of second bridge arm power chips 5.
When the bridge power chip works, driving current flows from the second electrode conducting strip 70 to the second bridge arm conducting layer 4, then sequentially flows to the drain electrode and the source electrode of the second bridge arm power chip 5, is transmitted to the first bridge arm conducting layer 2, then flows to the output electrode conducting layer 8, and then is output through the output electrode conducting strip 9. The follow current is input from the first electrode conductive strip 7, flows to the source and the drain of the first bridge arm power chip 3 through the first bridge arm electrode conductive layer 6, then flows to the first bridge arm conductive layer 2 and the output electrode conductive layer 8 in sequence, and finally is output through the output electrode conductive strip 9.
In the present embodiment, the plurality of second bridge arm power chips 5 are electrically connected to the first bridge arm conductive layer 2, and are further electrically connected to the output electrode conductive layer 8.
As shown in fig. 6 and fig. 7, the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically disposed frame-shaped copper strips with equal height, the opening of the first electrode conductive strip 7 faces the first bridge arm power chip 3, and the opening of the second electrode conductive strip 70 faces the second bridge arm power chip 5. An outer frame 10 is fixedly arranged on the periphery of the insulating substrate 1, side through holes 11 are formed in the positions, located on the first electrode conductive strips 7 and the second electrode conductive strips 70, of the side of the outer frame 10, the side through holes 11 correspond to the shapes of the first electrode conductive strips 7 and the second electrode conductive strips 70, the size of each side through hole 11 is larger than that of each first electrode conductive strip and that of each second electrode conductive strip, the first electrode conductive strips and the second electrode conductive strips are respectively arranged in the side through holes 11, and the top ends of the first electrode conductive strips and the second electrode conductive strips are higher than the upper surface of the outer frame 10.
The output electrode conducting bar 9 is in a frame shape and is matched with the shape of the output electrode conducting layer 8, a front through hole 13 is formed in the position, located at the position of the output electrode conducting bar 9, of the front end of the outer frame 10, the front through hole 13 corresponds to the shape of the output electrode conducting bar 9, the size of the front through hole 13 is larger than that of the output electrode conducting bar 9, the output electrode conducting bar 9 is arranged in the front through hole 13, and the top end of the output electrode conducting bar is higher than the upper surface of the outer frame 10.
The power module 100 further includes a gate lead-out plate 12, the gate lead-out plate 12 is disposed between the first and second bridge arm power chips and the output electrode conductive layer 8, the output electrode conductive layer 8 is in a frame shape, and the gate lead-out plate 12 is located in a frame-shaped opening of the output electrode conductive layer 8.
Please refer to fig. 8-10, which are schematic diagrams illustrating a second preferred embodiment of the power module 100, and the difference between the first embodiment and the second embodiment is that the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically disposed straight copper strips with equal height, and the output electrode conductive layer 8 is also a straight copper strip. At this time, the two straight strip-shaped conductive strips are respectively disposed on two frame-shaped arms of the output electrode conductive layer 8, two front side through holes 14 are disposed at positions of the output electrode conductive strips 9 at the front end of the outer frame 10, the front side through holes 14 are straight strips, and have a size larger than that of the output electrode conductive strips 9, the output electrode conductive strips 9 are disposed in the front side through holes 14, and the top ends of the output electrode conductive strips 9 are higher than the upper surface of the outer frame 10.
Please refer to fig. 11 and 12, which are schematic diagrams of a third preferred embodiment of the power module, and the difference between the schematic diagrams and the second preferred embodiment is that the output electrode conductive strip 9 includes two circular-pillar-shaped conductive strips, the two circular-pillar-shaped conductive strips are disposed on two sides of the frame shape of the output electrode conductive layer 8, two circular through holes are formed at positions of the front end of the outer frame 10, where the output electrode conductive strips 9 are located, the size of the circular through holes is larger than that of the output electrode conductive strips 9, the output electrode conductive strips 9 are disposed in the circular through holes, and the top ends of the output electrode conductive strips are higher than the upper surface of the outer frame 10.
In the present invention, the heights of the upper ends of the first electrode conductive strip 7, the second electrode conductive strip 70 and the output electrode conductive strip 9 are equal. In addition, the positive electrode conductive strip 6, the negative electrode conductive strip 7 and the output electrode conductive strip 9 can also adopt other similar shapes, mainly straight strips or columnar structures, for reducing the generation of inductance. Of course, the structure of the outer frame 10 also needs to be changed correspondingly according to the shape change of the conductive strips.
The output electrode conducting strip 9 can also be replaced by a connecting lug and is directly led out from the output electrode conducting layer 8. The connection between the first electrode conductive strip 7, the second electrode conductive strip 70 and the output electrode conductive strip 9 and the conductive layer is mainly achieved by crimping, or by conductive adhesive, or by welding. The outer frame 10 and the insulating substrate 1 are fixed by gluing or joggling.
Referring to fig. 13, it is a schematic diagram of a fourth preferred embodiment of the power module, where the first bridge arm power chip and the second bridge arm power chip are single-tube packaged chips, that is, a layer of resin is wrapped around the first bridge arm power chip and the second bridge arm power chip, and then pins are led out to be electrically connected to an external circuit. Fig. 13 shows a power module packaged with a single-tube packaged chip. After packaging is completed, the bridge arm power chip forms a gate 20, a source 22 and a heat dissipation drain 23 to be electrically connected with other circuits.
Referring to fig. 14 and 15, in a fifth preferred embodiment of the power module of the present invention, the first electrode conductive strip 7 and the second electrode conductive strip 70 are divided into two sections (or into multiple sections in other embodiments), so that the thermal stress between the electrodes and the insulating substrate can be reduced and the thermal deformation of the insulating substrate can be reduced without affecting the conductive capability, and this structure is particularly advantageous for modules with soldered bar electrodes. In other embodiments, the first electrode conductive strip 7 and the second electrode conductive strip 70 may be continuous and include at least one partition therebetween.
With continued reference to fig. 16, in a sixth preferred embodiment of the power module of the present invention, the output electrode conductive strip 9 is divided into two sections (or into multiple sections in other embodiments), so that the thermal stress between the electrode and the insulating substrate can be reduced and the thermal deformation of the insulating substrate can be reduced without affecting the conductive capability, which is particularly advantageous for a module with a welded bar electrode. In other embodiments, the output electrode conductive strip 9 may be continuous and include at least one partition in the middle.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.

Claims (17)

1. A power module, comprising: the circuit comprises a plurality of power modules, a first capacitor electrode conducting layer, a second capacitor electrode conducting layer, a filter capacitor and an absorption capacitor; each power module comprises an insulating substrate, a first bridge arm conducting layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conducting layer, a second bridge arm conducting layer arranged on the insulating substrate, a plurality of second bridge arm power chips arranged on the second bridge arm conducting layer, a first bridge arm electrode conducting layer arranged on the insulating substrate, a first electrode conducting strip arranged on the first bridge arm electrode conducting layer, a second electrode conducting strip arranged on the second bridge arm conducting layer, an output electrode conducting layer arranged on the insulating substrate and an output electrode conducting strip arranged on the output electrode conducting layer; the plurality of first bridge arm power chips are respectively and electrically connected with the first bridge arm electrode conducting layer, the first bridge arm conducting layer is electrically connected with the output electrode conducting layer, and the plurality of second bridge arm power chips are respectively and electrically connected with the output electrode conducting layer; the first electrode conducting strip is arranged adjacent to the plurality of first bridge arm power chips and extends along the arrangement path of the plurality of first bridge arm power chips, and the second electrode conducting strip is arranged adjacent to the plurality of second bridge arm power chips and extends along the arrangement path of the plurality of second bridge arm power chips; the first capacitor electrode conducting layer and the second capacitor electrode conducting layer are arranged in a laminated mode, the filter capacitor is electrically connected between the first capacitor electrode conducting layer and the second capacitor electrode conducting layer, the absorption capacitor is electrically connected between the first capacitor electrode conducting layer and the second capacitor electrode conducting layer, the first capacitor electrode conducting layer is electrically connected with the first electrode conducting strip, and the second capacitor electrode conducting layer is electrically connected with the second electrode conducting strip.
2. The power module of claim 1, wherein: the plurality of second bridge arm power chips are electrically connected with the first bridge arm conducting layer so as to be electrically connected with the output electrode conducting layer.
3. The power module of claim 1, wherein: the first electrode conducting strip and the second electrode conducting strip are symmetrically arranged frame-shaped copper strips with equal heights, the opening of the first electrode conducting strip faces the first bridge arm power chip, and the opening of the second electrode conducting strip faces the second bridge arm power chip.
4. A power module according to any one of claims 1 to 3, characterized in that: the periphery of the insulating substrate is fixedly provided with an outer frame, side through holes are formed in the positions, located on the first electrode conducting strip and the second electrode conducting strip, of the side edge of the outer frame, the side through holes correspond to the shapes of the first electrode conducting strip and the second electrode conducting strip, the size of each side through hole is larger than that of each first electrode conducting strip and that of each second electrode conducting strip, the first electrode conducting strips and the second electrode conducting strips are respectively arranged in the side through holes, and the top ends of the first electrode conducting strips and the second electrode conducting strips are higher than the upper surface of the outer frame.
5. The power module of claim 4, wherein: the power module further comprises a gate electrode lead-out plate, the gate electrode lead-out plate is arranged between the first bridge arm power chip, the second bridge arm power chip and the output electrode conducting layer, the output electrode conducting layer is in a frame shape, and the gate electrode lead-out plate is located in a frame-shaped opening of the output electrode conducting layer.
6. The power module of claim 5, wherein: the output electrode conducting bar is in a frame shape and matched with the shape of the output electrode conducting layer, a front through hole is formed in the position, located at the output electrode conducting bar, of the front end of the outer frame, the front through hole corresponds to the shape of the output electrode conducting bar, the size of the front through hole is larger than that of the output electrode conducting bar, the output electrode conducting bar is arranged in the front through hole, and the top end of the output electrode conducting bar is higher than the upper surface of the outer frame.
7. The power module of claim 4, wherein: the first electrode conducting strip and the second electrode conducting strip are symmetrically arranged straight strip-shaped copper strips with the same height.
8. The power module of claim 7, wherein: the output electrode conducting bar comprises two straight strip-shaped conducting bars, the two straight strip-shaped conducting bars are respectively arranged on two arms of a frame shape of the output electrode conducting layer, two front side through holes are formed in the positions, located on the output electrode conducting bar, of the front end of the outer frame, the front side through holes are straight strip-shaped and larger than the output electrode conducting bar in size, the output electrode conducting bars are arranged in the front side through holes, and the top ends of the output electrode conducting bars are higher than the upper surface of the outer frame.
9. The power module of claim 7, wherein: the output electrode conducting bar comprises two annular cylindrical conducting bars, the two annular cylindrical conducting bars are arranged on two sides of the frame shape of the output electrode conducting layer, two circular through holes are formed in the positions, located on the output electrode conducting bars, of the front end of the outer frame, the size of each circular through hole is larger than that of the output electrode conducting bar, the output electrode conducting bars are arranged in the circular through holes, and the top ends of the output electrode conducting bars are higher than the upper surface of the outer frame.
10. The power module of claim 1, wherein: the upper ends of the first electrode conducting strip, the second electrode conducting strip and the output electrode conducting strip are equal in height.
11. The power module of claim 1, wherein: the first bridge arm power chip and the second bridge arm power chip are single-tube packaged chips, and the first bridge arm power chip and the second bridge arm power chip are respectively provided with a gate pole, a source pole and a heat dissipation drain pole.
12. The power module of claim 1, wherein: the first electrode conductive strip and/or the second electrode conductive strip are continuously extended.
13. The power module of claim 12, wherein: the middle of the first electrode conductive strip and/or the second electrode conductive strip comprises at least one partition.
14. The power module of claim 12, wherein: the middle of the output electrode conducting strip comprises at least one partition.
15. The power module of claim 1, wherein: the power module is characterized by further comprising a radiator, and the power modules are arranged on the radiator.
16. The power module of claim 11, wherein: the capacitor comprises a capacitor plate, and the first capacitor electrode conducting layer and the second capacitor electrode conducting layer are both arranged on the capacitor plate.
17. The power module of claim 16, wherein: the capacitor plate is fixed with the radiator through the pressing plates.
CN201921037730.3U 2019-06-22 2019-07-04 Power module Active CN210379045U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910545535X 2019-06-22
CN201910545535 2019-06-22

Publications (1)

Publication Number Publication Date
CN210379045U true CN210379045U (en) 2020-04-21

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CN201910599763.5A Pending CN110335864A (en) 2019-06-22 2019-07-04 A kind of power modules
CN201921037730.3U Active CN210379045U (en) 2019-06-22 2019-07-04 Power module

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Publication number Priority date Publication date Assignee Title
CN111696976A (en) * 2020-06-22 2020-09-22 臻驱科技(上海)有限公司 Power semiconductor module substrate and electric locomotive applying same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111696976A (en) * 2020-06-22 2020-09-22 臻驱科技(上海)有限公司 Power semiconductor module substrate and electric locomotive applying same

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