CN210272313U

CN210272313U - Semiconductor ceramic packaging shell

Info

Publication number: CN210272313U
Application number: CN201921619768.1U
Authority: CN
Inventors: 李建中; 夏中宇; 徐雪舟
Original assignee: Miracle Power Semiconductor Co ltd
Current assignee: Miracle Power Semiconductor Co ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2020-04-07
Anticipated expiration: 2029-09-27

Abstract

The utility model discloses a semiconductor ceramic packaging shell, which comprises a ceramic bottom plate, a metal packaging shell is arranged in the middle of the top of the ceramic bottom plate, a sealing cover body is arranged on the top of the metal packaging shell, positioning mounting holes are respectively arranged on the front and back ends of the left side of the top of the ceramic bottom plate and the front and back ends of the right side of the top, cross-groove pan head screws are arranged on the top of the inner cavity of the positioning mounting holes, ceramic strip blocks are respectively embedded and mounted on the left and right side walls of the metal packaging shell, metal pins are symmetrically arranged on one side where two groups of ceramic strip blocks are away from each other, one end of each metal pin close to the ceramic strip block extends into the inner cavity of the metal packaging shell, a semiconductor is arranged at the joint of each metal pin and the ceramic strip block, a ring bulge is arranged on the bottom of the, the mutual interference of signal transmission is reduced, and the stable transmission of the connection signals of the internal chip and the external circuit is facilitated.

Description

Semiconductor ceramic packaging shell

Technical Field

The utility model relates to an integrated circuit board technical field, concretely relates to semiconductor ceramic encapsulates shell.

Background

The semiconductor is a material with electric conductivity between conductor and insulator at normal temperature, and has wide application in the fields of consumer electronics, communication system, medical instrument, etc., all the two kinds of clay with different properties, i.e. pottery clay and porcelain clay, are used as raw materials, and the ware made by the technological processes of proportioning, forming, drying, roasting, etc. can be called ceramic, and the package also can be called a shell for mounting semiconductor integrated circuit chip, and can play the roles of mounting, fixing, sealing, protecting chip and enhancing electric heating property, etc.

The conventional packaging shell is usually a metal shell or a plastic shell, and the strength of the plastic shell sometimes cannot meet the use requirement, so that the metal shell is used for packaging the chip under most conditions.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the above-mentioned problem that exists among the prior art, provide a semiconductor ceramic encapsulates shell, reduce signal transmission's mutual interference, be convenient for to the stable transmission of inside chip and external circuit connection signal.

In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:

a semiconductor ceramic packaging shell comprises a ceramic base plate, wherein a metal packaging shell is arranged in the middle of the top of the ceramic base plate, a sealing cover body is arranged at the top of the metal packaging shell, positioning mounting holes are formed in the front end and the rear end of the left side of the top of the ceramic base plate and the front end and the rear end of the right side of the top of the ceramic base plate, the bottom of an inner cavity of each positioning mounting hole penetrates through the bottom of the ceramic base plate, and a cross-groove pan head screw is arranged at the top of the inner cavity;

the utility model discloses a metal package casing, including metal encapsulation casing, ceramic bar piece, two sets of the equal gomphosis of the left and right sides wall of metal package casing is installed ceramic bar piece, and is two sets of the one side symmetry that ceramic bar piece kept away from each other is provided with metal pin, and metal pin presses close to the inner chamber that ceramic bar piece's one end stretched into the metal package casing, metal pin is provided with the semiconductor with the junction of ceramic bar piece, the bottom of metal package casing is provided with the ring arch, ceramic bottom plate's top seted up with the protruding matched with ring.

Preferably, in the semiconductor ceramic package case, the bottom of the ceramic base plate is provided with an insulating anti-slip cushion layer, the bottom of the cross recessed pan head screw penetrates through the bottom of the insulating anti-slip cushion layer, the thickness of the insulating anti-slip cushion layer is 0.5-1 mm, the stability of the ceramic base plate during installation on a counterpart is improved, and sliding deviation is reduced.

Preferably, in the semiconductor ceramic package housing, the top of the inner cavity of the positioning and mounting hole is provided with a subsider matched with the top end of the cross recessed pan head screw, so that the cross recessed pan head screw can be conveniently accommodated after being mounted and fixed, and the protrusion interference of the cross recessed pan head screw is reduced.

Preferably, the sealing cover body is used in the semiconductor ceramic package shell, the top of the inner cavity of the metal package shell is provided with a limit carrying edge platform, the bottom of the sealing cover body is provided with a sealing bulge matched with the limit carrying edge platform, and the sealing bulge is inserted into the limit carrying edge platform to facilitate the limit of the sealing cover body on the metal package shell.

Preferably, the sealing structure is used in the semiconductor ceramic package shell, transition fit is formed between the ring protrusion and the ring groove and between the sealing protrusion and the limiting carrying edge platform, tightness of joints of the ring protrusion and the ring groove and tightness of joints of the sealing protrusion and the limiting carrying edge platform are improved, and welding is facilitated.

Preferably, the semiconductor ceramic package shell is used, the semiconductors are horizontally arranged on the ceramic bar block from front to back at equal intervals, and the connection between the internal chip and the external circuit of a plurality of groups of metal pins is convenient.

Preferably, in the semiconductor ceramic package case, the metal package case is respectively connected with the ceramic bottom plate, the sealing cover body and the ceramic bar block by soldering, so that the metal package case is suitable for welding different metals or different materials and is fixedly mounted.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model has the advantages of reasonable design, on one hand through the cooperation of ring bulge and ring groove, through the cooperation of spacing carrying edge platform and sealing bulge, be convenient for spacing each other between metal packaging shell and the sealing cover body and between ceramic bottom plate, further be convenient for braze welding and connect, the moving deviation of spare part when reducing braze welding and connecting, improve the stability when brazing; on the other hand, through the matching of the ceramic bar block on the side wall of the metal packaging shell and the semiconductor, the stable transmission of the connection signals of the internal chip and the external circuit by the metal pins is facilitated, and the possibility of mutual interference of signal transmission is reduced.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the structure of the utility model in use;

fig. 2 is a schematic left-side view of the structure of the usage state of fig. 1 according to the present invention;

in the drawings, the components represented by the respective reference numerals are listed below:

the method comprises the following steps of 1-a ceramic bottom plate, 2-a metal packaging shell, 3-a sealing cover body, 4-a positioning mounting hole, 5-a cross-recessed pan head screw, 6-a ceramic bar, 7-a metal pin, 8-a semiconductor, 9-a ring bulge, 10-a ring groove, 11-a limiting carrying edge platform and 12-a sealing bulge.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-2, a semiconductor ceramic package casing comprises a ceramic base plate 1, a metal package casing 2 is disposed in the middle of the top of the ceramic base plate 1, a ring protrusion 9 is disposed at the bottom of the metal package casing 2, a ring groove 10 matched with the ring protrusion 9 is disposed at the top of the ceramic base plate 1, a sealing cover 3 is disposed at the top of the metal package casing 2, a position-limiting carrying edge 11 is disposed at the top of an inner cavity of the metal package casing 2, a sealing protrusion 12 matched with the position-limiting carrying edge 11 is disposed at the bottom of the sealing cover 3, the sealing protrusion 12 is inserted into the position-limiting carrying edge 11 to facilitate the position limitation of the sealing cover 3 on the metal package casing 2, the ring protrusion 9 and the ring groove 10 and the sealing protrusion 12 and the position-limiting carrying edge 11 are in transition fit, so as to improve the tightness between the connection between the ring protrusion 9 and the ring groove 10 and between the connection between the sealing protrusion 12, the ceramic bottom plate is convenient to weld, positioning mounting holes 4 are formed in the front end and the rear end of the left side of the top of the ceramic bottom plate 1 and the front end and the rear end of the right side of the top, the bottom of an inner cavity of each positioning mounting hole 4 penetrates through the bottom of the ceramic bottom plate 1, cross-slot pan head screws 5 are arranged at the tops of the inner cavities of the positioning mounting holes 4, subsiders matched with the top ends of the cross-slot pan head screws 5 are formed in the tops of the inner cavities of the positioning mounting holes 4, the cross-slot pan head screws 5 can be conveniently stored and fixed, the protrusion interference of the cross-slot pan head screws 5 is reduced, an insulating anti-slip cushion layer is arranged at the bottom of the ceramic bottom plate 1, the bottom of the cross-slot pan head screws 5 penetrates through the bottom of the insulating anti-slip cushion layer, the thickness of the insulating anti-slip cushion layer is 0.5-1 mm, the stability of the ceramic bottom plate 1 during installation on, and metal pin 7 is close to the one end of ceramic bar 6 and stretches into the inner chamber of metal package casing 2, the junction of metal pin 7 and ceramic bar 6 is provided with semiconductor 8, semiconductor 8 is from arranging from the front to back equidistant on ceramic bar 6 horizontally, be convenient for carry out the connection use of internal chip and external circuit to multiunit metal pin 7, metal package casing 2 is connected with ceramic bottom plate 1, the junction of sealed lid 3 and ceramic bar 6 and the junction of semiconductor 8 and ceramic bar 6 are all brazed connection respectively, be convenient for be suitable for the welding process of different metals or dissimilar material, carry out fixed mounting.

One specific application of this embodiment is: the utility model has the advantages of reasonable design, insert in ring recess 10 through ring arch 9, install and fix metal package casing 2 on ceramic bottom plate 1 through the mode of brazing, insert in spacing carrying platform 11 through sealing arch 12, install and fix seal cover body 3 on metal package casing 2 through the mode of brazing, thereby be convenient for to spacing each other metal package casing 2 and seal cover body 3 and with ceramic bottom plate 1, further be convenient for braze joint, reduce the displacement deviation of each spare part when braze joint, improve the stability when braze joint, form the encapsulation district through ceramic bottom plate 1, metal package casing 2 and seal cover body 3, be convenient for to the seal installation of chip in metal package casing 2, through separating on ceramic strip 6 equidistantly to the multiunit metal pin 7 that uses, through the insulating properties of ceramic strip 6 self, the metal pins 7 are not directly contacted with the metal packaging shell 2, and the metal pins 7 and the chip are protected through the unidirectional conductive effect of the semiconductor 8, so that the metal pins 7 can stably transmit connection signals of the internal chip and an external circuit, and the possibility of mutual interference of signal transmission is reduced.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor ceramic package shell comprises a ceramic base plate (1), and is characterized in that: a metal packaging shell (2) is arranged in the middle of the top of the ceramic bottom plate (1), a sealing cover body (3) is arranged on the top of the metal packaging shell (2), positioning mounting holes (4) are formed in the front end and the rear end of the left side of the top of the ceramic bottom plate (1) and the front end and the rear end of the right side of the top, the bottoms of inner cavities of the positioning mounting holes (4) penetrate through the bottom of the ceramic bottom plate (1), and cross-groove pan head screws (5) are arranged on the tops of the inner cavities of the positioning mounting holes (4);

ceramic strip piece (6) are installed to the equal gomphosis of the left and right sides wall of metal package casing (2), and are two sets of the one side symmetry that ceramic strip piece (6) kept away from each other is provided with metal pin (7), and metal pin (7) press close to the inner chamber that ceramic strip piece (6) one end stretched into metal package casing (2), metal pin (7) are provided with semiconductor (8) with the junction of ceramic strip piece (6), the bottom of metal package casing (2) is provided with and encircles arch (9), ceramic bottom plate (1) the top seted up with encircle arch (9) matched with ring recess (10).

2. The semiconductor ceramic package housing of claim 1, wherein: the bottom of ceramic bottom plate (1) is provided with insulating anti-skidding bed course, the bottom of cross recess pan head screw (5) runs through the bottom of insulating anti-skidding bed course, the thickness of insulating anti-skidding bed course is 0.5 ~ 1 mm.

3. The semiconductor ceramic package housing of claim 1, wherein: and a settling tank matched with the top end of the cross-recessed pan head screw (5) is formed in the top of the inner cavity of the positioning mounting hole (4).

4. The semiconductor ceramic package housing of claim 1, wherein: the top of the inner cavity of the metal packaging shell (2) is provided with a limiting carrying edge platform (11), and the bottom of the sealing cover body (3) is provided with a sealing bulge (12) matched with the limiting carrying edge platform (11).

5. The semiconductor ceramic package housing of claim 4, wherein: transition fit is respectively formed between the ring bulge (9) and the ring groove (10) and between the sealing bulge (12) and the limiting carrying edge platform (11).

6. The semiconductor ceramic package housing of claim 1, wherein: the semiconductors (8) are arranged on the ceramic bar block (6) at equal intervals from front to back horizontally.

7. The semiconductor ceramic package housing of claim 1, wherein: the metal packaging shell (2) is respectively in braze welding connection with the connection parts of the ceramic bottom plate (1), the sealing cover body (3) and the ceramic bar block (6) and the connection parts of the semiconductor (8) and the ceramic bar block (6).