CN210270778U - Heat dissipation device for cloud computing server - Google Patents

Heat dissipation device for cloud computing server Download PDF

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Publication number
CN210270778U
CN210270778U CN201921281971.2U CN201921281971U CN210270778U CN 210270778 U CN210270778 U CN 210270778U CN 201921281971 U CN201921281971 U CN 201921281971U CN 210270778 U CN210270778 U CN 210270778U
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China
Prior art keywords
water
heat dissipation
casing
dust
cloud computing
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Application number
CN201921281971.2U
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Chinese (zh)
Inventor
姜夏祖
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SHENZHEN SUPERELECTRON TECHNOLOGY Co.,Ltd.
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Suzhou Qianhecheng Intelligent Science And Technology Co ltd
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Abstract

The utility model discloses a heat dissipation device for cloud computing server, the heat dissipation part includes flabellum, electric rotating shaft, water-cooling tank and water-cooling pipe, the upper surface center department of casing is fixedly connected with electric rotating shaft, the side surface of electric rotating shaft evenly fixedly connected with flabellum, the outside of flabellum is provided with the fan shell, the fan shell is fixedly connected with the upper surface of casing through screw nut, the inside of casing is provided with the water-cooling pipe, the both ends of water-cooling pipe are fixedly connected with the water-cooling tank; has the advantages that: when the heat was too high, the water-cooled pump machine work lets the inside water-cooling liquid of water-cooling tank circulate in the water-cooled tube, avoids the high temperature to damage the device, and the dust that produces during the heat dissipation passes through the effect of protruding type dustproof hole, guarantees that the dust adheres to the surface in protruding type dustproof hole, is convenient for clear up the dust like this, guarantees that the dust can not enter inside the device.

Description

Heat dissipation device for cloud computing server
Technical Field
The utility model relates to a heat abstractor technical field particularly, relates to a heat abstractor for cloud computing server.
Background
Radiators are important and essential components of hot water (or steam) heating systems. The hot water is cooled in the radiator (or steam is condensed in the radiator) to supply heat to the indoor, thereby achieving the purpose of heating. The metal consumption and the cost of the radiator occupy a considerable proportion in the heating system, so that the correct selection of the radiator relates to the economic index and the operation effect of the system, and a large number of integrated circuits are used in computer components. It is well known that high temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The types of radiators are very many, and CPUs, display cards, mainboard chip sets, hard disks, cases, power supplies and even optical drives and memories all need radiators, and the different radiators cannot be used in a mixed manner, wherein the radiator of the CPU is the most frequently contacted. According to the way of taking away heat from the heat sink, the heat sink of the computer can be divided into active heat dissipation and passive heat dissipation. The former is commonly an air-cooled heat sink, while the latter is commonly a heat sink. The further subdivision heat dissipation mode can be divided into air cooling, heat pipes, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like.
And the common heat dissipation device can cause frost damage in winter, and the common antifreeze can damage the water cooling pipe.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor for cloud computing server to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the heat dissipation device for the cloud computing server comprises a heat dissipation component, an electrostatic eliminator, a convex dustproof hole, a fixed iron block, a dustproof plate, a fixed hole, a hinge, a magnetic block and a casing, wherein the heat dissipation component comprises fan blades, an electric rotating shaft, a water cooling tank and water cooling pipes, the electric rotating shaft is fixedly connected to the center of the upper surface of the casing, the fan blades are uniformly and fixedly connected to the side surface of the electric rotating shaft, a fan shell is arranged on the outer side of each fan blade, the fan shell is fixedly connected with the upper surface of the casing through screws and nuts, the water cooling pipes are arranged inside the casing, the water cooling tanks are fixedly connected to the two ends of each water cooling pipe, a water cooling pump is fixedly connected to one side of each water cooling tank, a refrigeration sheet is fixedly connected to the inner side surface of the casing, and a heating pipe.
Preferably, one side of the casing is fixedly connected with a hinge, and the casing is fixedly connected with a dust guard through the hinge.
Preferably, one side of the dust guard, which is far away from the hinge, is fixedly connected with a fixed iron block.
Preferably, the four corners of the upper surface of the casing are fixedly connected with fixing holes, and one side of the casing, which is far away from the hinge, is fixedly connected with a magnetic block.
Preferably, the surface of one side of the casing is fixedly connected with a static eliminator through a screw nut.
Preferably, the surface of the dust guard is uniformly provided with convex dust-proof holes which are integrally formed.
Preferably, the electric rotating shaft, the water-cooled pump machine, the heating pipe, the refrigerating sheet, the static eliminator and an external controller are electrically connected.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) when the device is installed, the dust guard plate leaks out of the computer, the shell is fixed in the computer, the device is fixed through the fixing holes and the screws and nuts, the electric rotating shaft rotates during heat dissipation, the fan blades are used for dissipating heat of the computer, and static electricity in the device is completely dissipated under the action of the static electricity eliminator, so that static electricity dust absorption is avoided;
(2) when the heat is too high, the water-cooling pump machine works to enable water-cooling liquid in the water-cooling box to circulate in the water-cooling pipe, so that the device is prevented from being damaged due to too high temperature, and dust generated in heat dissipation is enabled to be attached to the surface of the convex dustproof hole under the action of the convex dustproof hole, so that the dust is convenient to clean, and the dust is prevented from entering the device;
(3) when the use temperature is too low, the heating pipe is started, the temperature is increased to ensure the normal operation of the device, and when some data with large operation calculation amount are used, the heat can be rapidly increased, the refrigeration is carried out through the effect of the refrigeration piece, and the normal operation of the device can be ensured through three-section heat dissipation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device for a cloud computing server according to an embodiment of the present invention;
fig. 2 is a schematic view of an internal structure of a housing of a heat dissipation device for a cloud computing server according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a surface structure of a dust guard in a heat dissipation device for a cloud computing server according to an embodiment of the present invention.
Reference numerals: 1. a dust-proof plate; 2. fixing the iron blocks; 3. a hinge; 4. a fixing hole; 5. a fan case; 6. a fan blade; 7. a magnetic block; 8. a housing; 9. a static eliminator; 10. an electric rotating shaft; 11. a water-cooled tube; 12. a refrigeration plate; 13. heating a tube; 14. a water-cooled pump machine; 15. a water cooling tank; 16. convex dustproof hole.
Detailed Description
The following description of the preferred embodiments of the present invention will be made with reference to the accompanying drawings:
referring to fig. 1-3, a heat dissipation apparatus for a cloud computing server according to an embodiment of the present invention includes a heat dissipation component, an electrostatic eliminator 9, a protruding dustproof hole 16, a fixed iron block 2, a dustproof plate 1, a fixed hole 4, a hinge 3, a magnet block 7, and a housing 8, wherein the heat dissipation component includes a fan blade 6, an electric rotating shaft 10, a water cooling tank 15, and a water cooling pipe 11, the electric rotating shaft 10 is fixedly connected to a center of an upper surface of the housing 8, the fan blade 6 is uniformly and fixedly connected to a side surface of the electric rotating shaft 10, a fan housing 5 is disposed outside the fan blade 6, the fan housing 5 is fixedly connected to an upper surface of the housing 8 through a screw nut, the water cooling pipe 11 is disposed inside the housing 8, the water cooling tank 15 is fixedly connected to both ends of the water cooling pipe 11, and a water cooling pump 14 is fixedly connected to one side of the, the inside side surface of the casing 8 is fixedly connected with a refrigeration piece 12, and the other side surface of the inside of the casing 8 is fixedly connected with a heating pipe 13.
By the above scheme of the utility model, when installing, the dust guard 1 is leaked outside the computer, the case 8 is fixed inside the computer, the device is fixed by the fixing hole 4 and the screw nut, when radiating, the electric rotating shaft 10 rotates, the computer is radiated by the fan blade 6, and the static electricity inside the device is completely eliminated by the action of the static electricity eliminator 9, so as to avoid the static electricity from absorbing dust, when the heat is too high, the water-cooling pump 14 works, so that the water-cooling liquid inside the water-cooling tank 15 circulates in the water-cooling pipe 11, thereby avoiding the device from being damaged due to too high temperature, and the dust generated during radiating passes through the action of the convex dust guard 16, so as to ensure that the dust is attached to the surface of the convex dust guard 16, thereby facilitating the dust cleaning, ensuring that the dust can not enter the device, and when the using temperature is too low, the action of the heating pipe 13 is started, the normal operation of the device is ensured by increasing the temperature, and when some data with large operation calculated amount are obtained, the heat can be increased rapidly, the refrigeration is carried out by the effect of the refrigeration piece 12, and the normal operation of the device can be ensured by three-stage heat dissipation.
When specifically using, one side fixedly connected with hinge 3 of casing 8, casing 8 passes through 3 fixedly connected with dust guard 1 of hinge, dust guard 1 is kept away from the fixed iron plate 2 of one side fixedly connected with of hinge 3, the upper surface four corners fixedly connected with fixed orifices 4 of casing 8, casing 8 is kept away from one side fixedly connected with magnetic path 7 of hinge 3, 8 side surfaces of casing pass through screw nut fixedly connected with electrostatic eliminator 9, integrated into one piece's protruding type dust hole 16 has evenly been seted up on the surface of dust guard 1, electric rotating shaft 10 water-cooling pump machine 14 heating pipe 13 refrigeration piece 12 electrostatic eliminator 9 links to each other with the external control ware electrical property.
In conclusion, with the above technical solution of the present invention, when installing, the dust-proof board 1 is exposed outside the computer, the housing 8 is fixed inside the computer, the device is fixed by the fixing hole 4 and the screw nut, and when dissipating heat, the electric rotating shaft 10 rotates, the fan blade 6 dissipates heat to the computer, and the static electricity inside the device is completely dissipated by the action of the static electricity eliminator 9, so as to avoid the static electricity from absorbing dust, and when the heat is too high, the water-cooling pump 14 works to circulate the water-cooling liquid inside the water-cooling tank 15 in the water-cooling pipe 11, so as to avoid damaging the device due to too high temperature, and the dust generated during heat dissipation is attached to the surface of the convex dust-proof hole 16 by the action of the convex dust-proof hole 16, so as to facilitate dust cleaning, ensure that the dust does not enter the inside the device, and when the use temperature is too low, the heating pipe 13 is started to raise the temperature to ensure the normal operation of the device, when some data with large operation calculated amount are obtained, the heat can be rapidly raised, the refrigeration is carried out through the action of the refrigeration piece 12, and the normal operation of the device can be ensured through three-section heat dissipation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The heat dissipation device for the cloud computing server is characterized by comprising a heat dissipation part, a static electricity eliminator (9), a convex dustproof hole (16), a fixed iron block (2), a dustproof plate (1), a fixed hole (4), a hinge (3), a magnetic block (7) and a casing (8), wherein the heat dissipation part comprises fan blades (6), an electric rotating shaft (10), a water cooling tank (15) and a water cooling pipe (11), the electric rotating shaft (10) is fixedly connected at the center of the upper surface of the casing (8), the fan blades (6) are uniformly and fixedly connected on the side surface of the electric rotating shaft (10), a fan shell (5) is arranged on the outer side of each fan blade (6), the fan shell (5) is fixedly connected with the upper surface of the casing (8) through screws and nuts, the water cooling pipe (11) is arranged inside the casing (8), and the water cooling tanks (15) are fixedly connected at two ends of the water cooling pipe (11), one side fixedly connected with water-cooling pump machine (14) of water-cooling case (15), the inside side surface fixedly connected with refrigeration piece (12) of casing (8), the inside opposite side surface fixedly connected with heating pipe (13) of casing (8).
2. The heat dissipation apparatus for a cloud computing server as claimed in claim 1, wherein a hinge (3) is fixedly connected to one side of the housing (8), and the dust-proof plate (1) is fixedly connected to the housing (8) through the hinge (3).
3. The heat dissipation device for the cloud computing server as claimed in claim 1, wherein a fixed iron block (2) is fixedly connected to one side of the dust-proof plate (1) far away from the hinge (3).
4. The heat dissipation device for the cloud computing server as claimed in claim 1, wherein fixing holes (4) are fixedly connected to four corners of the upper surface of the casing (8), and a magnetic block (7) is fixedly connected to one side of the casing (8) far away from the hinge (3).
5. The heat dissipation device for the cloud computing server as claimed in claim 1, wherein a static electricity eliminator (9) is fixedly connected to one side surface of the housing (8) through screws and nuts.
6. The heat dissipation device for the cloud computing server as claimed in claim 1, wherein the dust-proof plate (1) has a surface uniformly provided with integrally formed convex dust-proof holes (16).
7. The heat dissipation device for the cloud computing server as claimed in claim 1, wherein the electric rotating shaft (10), the water-cooled pump unit (14), the heating pipe (13), the refrigeration sheet (12), and the static eliminator (9) are electrically connected to an external controller.
CN201921281971.2U 2019-08-08 2019-08-08 Heat dissipation device for cloud computing server Active CN210270778U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921281971.2U CN210270778U (en) 2019-08-08 2019-08-08 Heat dissipation device for cloud computing server

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921281971.2U CN210270778U (en) 2019-08-08 2019-08-08 Heat dissipation device for cloud computing server

Publications (1)

Publication Number Publication Date
CN210270778U true CN210270778U (en) 2020-04-07

Family

ID=70016566

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921281971.2U Active CN210270778U (en) 2019-08-08 2019-08-08 Heat dissipation device for cloud computing server

Country Status (1)

Country Link
CN (1) CN210270778U (en)

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Effective date of registration: 20210326

Address after: 518000 5th floor, building 7, huidebao Industrial Park, south side of great outer ring road, Baihua community, Guangming Street, Guangming New District, Shenzhen City, Guangdong Province

Patentee after: SHENZHEN SUPERELECTRON TECHNOLOGY Co.,Ltd.

Address before: 215000 rooms 1-121, building 2, shanhefang, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province

Patentee before: SUZHOU QIANHECHENG INTELLIGENT SCIENCE AND TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right