CN210181166U - Testing device of wafer probe station - Google Patents

Testing device of wafer probe station Download PDF

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Publication number
CN210181166U
CN210181166U CN201920421960.3U CN201920421960U CN210181166U CN 210181166 U CN210181166 U CN 210181166U CN 201920421960 U CN201920421960 U CN 201920421960U CN 210181166 U CN210181166 U CN 210181166U
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China
Prior art keywords
circular
plate
welded
wafer
disc
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CN201920421960.3U
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Chinese (zh)
Inventor
曹晖
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Yangzhou Billion Core Microelectronics Co Ltd
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Yangzhou Billion Core Microelectronics Co Ltd
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Priority to CN201920421960.3U priority Critical patent/CN210181166U/en
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Abstract

The utility model discloses a testing arrangement of wafer probe station, including loading board and the carousel portion of setting on loading board upper portion, the loading board is circular and its top is located the avris welding and has the backup pad of vertical form, backup pad one side is close to the frame plate that the top welding was arranged to the level, the relative loading board of frame plate is centripetal distribution, the one end welding of keeping away from the backup pad on the frame plate has the vertical uide bushing of arranging, the uide bushing endotheca is equipped with the traveller, the bottom of traveller is equipped with the probe card that the level was arranged. The utility model discloses in, be provided with six circular heavy grooves that can place the wafer on the disc in the carousel portion, the motor rotation can drive the carousel rotatory, and every circular heavy groove is rotatable to the lower part of probe card from this, and the probe card reciprocates and can tests the wafer of circular heavy inslot, and this kind is when detecting, and wafer can be deposited to other circular heavy grooves, keeps continuously detecting, and is efficient.

Description

Testing device of wafer probe station
Technical Field
The utility model relates to a wafer probe detects technical field, especially relates to a testing arrangement of wafer probe platform.
Background
The integrated circuits are arranged on the wafer, and after production is carried out offline, the integrated circuits in the wafer need to be subjected to probe detection to screen the wafer.
According to the existing detection method, a wafer with an integrated circuit is placed in a positioning groove, the wafer is in butt joint with a movable probe plate, then a circuit is tested by using probes on the probe plate, the wafer is detected one by one in the existing detection mode, namely, the wafer needs to be placed for detection of one wafer, then the wafer is detected, finally the detected wafer is taken down, the actions are repeated, a large amount of time is wasted due to the taking and placing of the wafer, meanwhile, the wafer is taken and placed in a buckling mode, the taking and placing are difficult, and the hidden danger of damaging the circuit of the wafer easily occurs.
Therefore, the utility model provides a testing arrangement of wafer probe station.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the testing device of the wafer probe station is provided for solving the problems of low efficiency and difficult wafer placement caused by a large amount of time occupied by frequently placing and taking down wafers.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a testing device of a wafer probe station comprises a bearing plate and a turntable part arranged on the upper part of the bearing plate, the bearing plate is circular, a vertical supporting plate is welded at the side of the top of the bearing plate, a horizontally arranged frame plate is welded at one side of the supporting plate close to the top, the frame plate is distributed centripetally relative to the bearing plate, one end of the frame plate far away from the supporting plate is welded with a vertically arranged guide sleeve, a slide column is sleeved in the guide sleeve, a probe plate which is horizontally arranged is arranged at the bottom of the slide column, a disc is arranged on the turntable part, six circular sinking grooves are uniformly arranged at the edge of the upper end surface of the disc, a motor is arranged at the central position of the lower end surface of the bearing plate through a bolt, the bearing plate is penetrated through the gap of the rotating shaft of the motor and fixedly connected with the central position of the lower end face of the disc, and the circular sinking groove is matched with the probe plate for use.
As a further description of the above technical solution:
the upper end face of the disc is welded with a positioning sleeve coaxial with the circular sinking groove, and the inner diameter of the positioning sleeve is the same as that of the circular sinking groove in size.
As a further description of the above technical solution:
an upper annular limiting table is welded at the opening of the positioning sleeve.
As a further description of the above technical solution:
the outer side of the disc is provided with a square sliding hole penetrating through the circular sinking groove, a push-pull plate is sleeved in the square sliding hole, the upper end face of the push-pull plate is provided with a placing round hole penetrating through the square sliding hole and matched with the circular sinking groove, and the bottom of the placing round hole is welded with a lower annular limiting table.
As a further description of the above technical solution:
the bottom of disc is installed the cylinder through the bolt, the lower terminal surface that pushes away the axle clearance run through the disc of cylinder extends to circular heavy inslot, the one end welding of pushing away the axle has circular tray, the external diameter of circular tray is less than the internal diameter of lower annular spacing platform.
As a further description of the above technical solution:
and a handle is welded at one side of the push-pull plate.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, be provided with six circular heavy grooves that can place the wafer on the disc in the carousel portion, the motor rotation can drive the carousel rotatory, and every circular heavy groove is rotatable to the lower part of probe card from this, and the probe card reciprocates and can tests the wafer of circular heavy inslot, and this kind is when detecting, and wafer can be deposited to other circular heavy grooves, keeps continuously detecting, and is efficient.
2. The utility model discloses in, the outside side of carousel is equipped with the push-and-pull board of drawer form, is equipped with on the push-and-pull board and places the round hole, puts into the wafer and places the round hole after, resets the push-and-pull board, and circular tray on the cylinder can push away the wafer to the top of position sleeve and carry on spacingly through the spacing platform of last annular, and it is simple, convenient to have put through operation process.
Drawings
Fig. 1 is a schematic structural diagram of a testing apparatus of a wafer probe station according to the present invention;
fig. 2 is a schematic structural diagram of a top view of a turntable of a testing apparatus of a wafer probe station according to the present invention;
FIG. 3 is a schematic structural diagram of a partial sectional view of a front view of a turntable of a testing apparatus for a wafer probe station according to the present invention
Fig. 4 is a schematic structural diagram of a push-pull plate of a testing apparatus of a wafer probe station according to the present invention.
Illustration of the drawings:
1. a carrier plate; 2. a turntable part; 3. a handle; 4. a support plate; 5. a guide sleeve; 6. a traveler; 7. a probe card; 8. a disc; 9. a circular sink; 10. a motor; 11. a positioning sleeve; 12. an upper annular limiting table; 13. a square slide hole; 14. a push-pull plate; 15. placing the round hole; 16. a cylinder; 17. a lower annular limiting table; 18. a frame plate; 19. a circular tray.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a testing device of a wafer probe station comprises a bearing plate 1 and a turntable part 2 arranged on the upper part of the bearing plate 1, wherein the bearing plate 1 is circular, the top of the bearing plate 1 is positioned at the side and welded with a vertical supporting plate 4, one side of the supporting plate 4 is welded with a frame plate 18 which is horizontally arranged near the top, the frame plate 18 is distributed centripetally relative to the bearing plate 1, one end of the frame plate 18 which is far away from the supporting plate 4 is welded with a guide sleeve 5 which is vertically arranged, a slide column 6 is sleeved in the guide sleeve 5, the bottom of the slide column 6 is provided with a probe plate 7 which is horizontally arranged, the turntable part 2 is provided with a disk 8, the upper end surface of the disk 8 is positioned at the edge and evenly provided with six circular sinking grooves 9, the lower end surface of the bearing plate 1 is positioned at the center and provided with a motor 10 through bolts, and the rotating shaft gap, the circular sinking groove 9 is matched with the probe card 7 for use.
Specifically, as shown in fig. 3, a positioning sleeve 11 coaxial with the circular sinking groove 9 is welded on the upper end surface of the disc 8, and the inner diameter of the positioning sleeve 11 is the same as the inner diameter of the circular sinking groove 9.
Specifically, as shown in fig. 3, an upper annular limit table 12 is welded to a mouth portion of the positioning sleeve 11.
Specifically, as shown in fig. 3, a square slide hole 13 penetrating through the circular sinking groove 9 is formed in the outer side of the disc 8, a push-pull plate 14 is sleeved in the square slide hole 13, a placing circular hole 15 used in cooperation with the circular sinking groove 9 is formed in the upper end face of the push-pull plate 14 in a penetrating manner, and a lower annular limiting table 17 is welded at the bottom of the placing circular hole 15.
Specifically, as shown in fig. 3, a cylinder 16 is installed at the bottom of the disc 8 through a bolt, a pushing shaft gap of the cylinder 16 penetrates through the lower end face of the disc 8 and extends into the circular sinking groove 9, a circular tray 19 is welded at one end of the pushing shaft, and the outer diameter of the circular tray 19 is smaller than the inner diameter of the lower annular limiting table 17.
Specifically, as shown in fig. 4, the handle 3 is welded to one side of the push-pull plate 14.
The working principle is as follows: when the device is used, the handle 3 is manually held to pull the push-pull plate 14 outwards, then a wafer is placed in the placing circular hole 15 and lifted by the lower annular limiting table 17, the wafer is placed in the six push-pull plates 14 in this way, then the push-pull plates 14 are reset, the air cylinder 16 is pushed to move forwards, the circular tray 19 pushes the wafer to rise to the top of the positioning sleeve 11 in the circular sinking groove 9 and be limited by the upper annular limiting table 12, the motor 10 can drive the disk 8 to rotate, when one positioning sleeve 11 carrying the wafer on the disk 8 is coaxial with the probe plate 7, the sliding column 6 is driven to move downwards in the guide sleeve through the external guide mechanism, the probe plate 7 performs circuit detection on the wafer by utilizing a plurality of probes at the bottom of the probe plate, after the detection is finished, the probe plate 7 returns, the air cylinder 16 returns, the motor 10 continues to rotate to drive the other positioning sleeve 11 to a detection position, and at the same time of the detection, the handle 3 can be held by hand to pull the push-pull plate 14 open for taking and placing materials, and the efficiency is high.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. The testing device of the wafer probe station comprises a bearing plate (1) and a turntable part (2) arranged on the upper part of the bearing plate (1), and is characterized in that the bearing plate (1) is circular, the top of the bearing plate (1) is located at the side of a supporting plate (4) welded with a vertical shape, one side of the supporting plate (4) is close to a frame plate (18) welded with a horizontal arrangement at the top, the frame plate (18) is distributed centripetally relative to the bearing plate (1), one end of the frame plate (18) far away from the supporting plate (4) is welded with a guide sleeve (5) arranged vertically, a sliding column (6) is sleeved in the guide sleeve (5), a probe plate (7) arranged horizontally is arranged at the bottom of the sliding column (6), a disk (8) is arranged on the turntable part (2), six circular sinking grooves (9) are uniformly formed in the edge of the upper end face of the disk (8), a motor (10) is installed at the central position of, the gap of a rotating shaft of the motor (10) penetrates through the bearing plate (1) and is fixedly connected with the central position of the lower end face of the disc (8), and the circular sinking groove (9) is matched with the probe board (7) for use.
2. The wafer probe station testing device as set forth in claim 1, wherein a positioning sleeve (11) coaxial with the circular sinking groove (9) is welded on the upper end face of the disc (8), and the inner diameter of the positioning sleeve (11) is the same as the inner diameter of the circular sinking groove (9).
3. The wafer probe station testing device as set forth in claim 2, characterized in that an upper annular limiting table (12) is welded at the mouth position of the positioning sleeve (11).
4. The wafer probe station testing device as recited in claim 1, wherein a square slide hole (13) penetrating through a circular sinking groove (9) is formed in the outer side of the disc (8), a push-pull plate (14) is sleeved in the square slide hole (13), a placing round hole (15) matched with the circular sinking groove (9) is formed in the upper end face of the push-pull plate (14) in a penetrating manner, and a lower annular limiting table (17) is welded at the bottom of the placing round hole (15).
5. The wafer probe station testing device as claimed in claim 1 or 4, wherein a cylinder (16) is mounted at the bottom of the disc (8) through a bolt, a pushing shaft gap of the cylinder (16) penetrates through the lower end face of the disc (8) and extends into the circular sinking groove (9), a circular tray (19) is welded at one end of the pushing shaft, and the outer diameter of the circular tray (19) is smaller than the inner diameter of the lower annular limiting table (17).
6. The wafer probe station testing device as set forth in claim 4, characterized in that a handle (3) is welded to one side of the push-pull plate (14).
CN201920421960.3U 2019-03-30 2019-03-30 Testing device of wafer probe station Active CN210181166U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920421960.3U CN210181166U (en) 2019-03-30 2019-03-30 Testing device of wafer probe station

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920421960.3U CN210181166U (en) 2019-03-30 2019-03-30 Testing device of wafer probe station

Publications (1)

Publication Number Publication Date
CN210181166U true CN210181166U (en) 2020-03-24

Family

ID=69830195

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920421960.3U Active CN210181166U (en) 2019-03-30 2019-03-30 Testing device of wafer probe station

Country Status (1)

Country Link
CN (1) CN210181166U (en)

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