CN210137489U - Blind buried hole multilayer flexible circuit board - Google Patents
Blind buried hole multilayer flexible circuit board Download PDFInfo
- Publication number
- CN210137489U CN210137489U CN201920596031.6U CN201920596031U CN210137489U CN 210137489 U CN210137489 U CN 210137489U CN 201920596031 U CN201920596031 U CN 201920596031U CN 210137489 U CN210137489 U CN 210137489U
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- China
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- circuit board
- layer
- flexible
- flexible circuit
- plate body
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- Expired - Fee Related
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Abstract
The utility model discloses a blind buried via hole multilayer flexible circuit board, which comprises a flexible plate body, the positive surface and the back of the body of flexible plate all are provided with the electrically conductive region of circuit board, the electrically conductive piece is advanced to the left center department fixedly connected with in the positive surface of flexible plate, the electrically conductive piece is gone out to the center department fixedly connected with on the positive surface right side of flexible plate, the flexible plate body includes the transparent connection glue film, flexible insulation substrate layer has all been pasted to the top and the bottom of transparent connection glue film. The utility model discloses a set up the blind hole, can carry out the circular telegram connection between each layer of multilayer flexible circuit board, multilayer flexible circuit board's result of use is better like this, has solved multilayer flexible circuit board when using, because of can not effectively be connected between each layer, causes unable circular telegram between each layer to lead to multilayer flexible circuit board inconvenient problem to appear, made things convenient for multilayer flexible circuit board's use greatly.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is blind buried via hole multilayer flexible circuit board.
Background
Along with the development of modern science and technology and the improvement of industry level, the circuit board has obtained the wide use, and the kind of circuit board is more, and multilayer flexible circuit board is just one of them, and current multilayer flexible circuit board lacks the blind hole, can not make and connect the circular telegram between each conducting layer to lead to multilayer flexible circuit board to appear awkward problem, greatly reduced multilayer flexible circuit board's practicality.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a blind buried via hole multilayer flexible circuit board possesses the advantage of carrying out the circular telegram connection between each layer, has solved multilayer flexible circuit board and has appeared awkward problem.
In order to achieve the above object, the utility model provides a following technical scheme: blind hole multilayer flexible circuit board that buries, including the flexbile plate body, the positive surface and the back of the body of flexbile plate all are provided with the electrically conductive region of circuit board, fixedly connected with electricity conducting block is located at the left center in the positive surface of flexbile plate body, fixedly connected with electricity conducting block is located at the center on the positive surface right side of flexbile plate body, the flexbile plate body includes the transparent connection glue film, flexible insulating substrate layer has all been pasted to the top and the bottom of transparent connection glue film, one side printing that transparent connection glue film was kept away from on flexible insulating substrate layer has the conducting layer, one side that flexible insulating substrate layer was kept away from to the conducting layer covers has the PE membrane, and two corresponding one sides on flexible insulating substrate layer run through and have seted.
Preferably, four corners of the front surface of the flexible plate body are provided with mounting holes in a penetrating manner.
Preferably, the position of the conductive area of the circuit board on the flexible board body is an area covered by the two conductive layers.
Preferably, the conductive layer comprises a silver wire base layer, the silver wire base layer covers the flexible insulating substrate layer, and a copper wire layer covers one side of the silver wire base layer, which is far away from the flexible insulating substrate layer.
Preferably, the output end of the electricity inlet conducting block is connected with the conducting layer on the front surface of the flexible plate body, and the input end of the electricity outlet conducting block is connected with the conducting layer on the front surface of the flexible plate body.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up the blind hole, can carry out the circular telegram connection between each layer of multilayer flexible circuit board, multilayer flexible circuit board's result of use is better like this, has solved multilayer flexible circuit board when using, because of can not effectively be connected between each layer, causes unable circular telegram between each layer to lead to multilayer flexible circuit board inconvenient problem to appear, made things convenient for multilayer flexible circuit board's use greatly, be worth promoting.
2. The utility model discloses a PE membrane can cover the protection to the conducting layer, through the mounting hole, has made things convenient for the location of multilayer flexible circuit board to connect.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a front sectional view of the flexible plate structure of the present invention;
fig. 3 is a front cross-sectional view of the conductive layer structure of the present invention.
In the figure: the flexible printed circuit board comprises a flexible board body 1, an 11PE film, a 12 blind hole, a 13 flexible insulating substrate layer, a 14 buried hole, a 15 conductive layer, a 151 silver wire base layer, a 152 copper wire layer, a 16 transparent connecting glue layer, a 2 circuit board conductive area, a 3-in conductive block, a 4-mounting hole and a 5-out conductive block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a blind buried via multi-layer flexible circuit board comprises a flexible board body 1, four corners of a front surface of the flexible board body 1 are all penetrated with mounting holes 4, positioning connection of the multi-layer flexible circuit board is facilitated through the mounting holes 4, circuit board conductive areas 2 are arranged on the front surface and a back surface of the flexible board body 1, a power-in conductive block 3 is fixedly connected at the center of the left side of the front surface of the flexible board body 1, a power-out conductive block 5 is fixedly connected at the center of the right side of the front surface of the flexible board body 1, the flexible board body 1 comprises a transparent connecting glue layer 16, flexible insulating substrate layers 13 are respectively adhered at the top and the bottom of the transparent connecting glue layer 16, a conductive layer 15 is printed at one side of the flexible insulating substrate layer 13 far away from the transparent connecting glue layer 16, the positions of the circuit board conductive areas 2 on the flexible board, the silver wire substrate layer 151 covers on the flexible insulating substrate layer 13, one side of the silver wire substrate layer 151, which is far away from the flexible insulating substrate layer 13, is covered with a copper wire layer 152, the output end of the electricity inlet conducting block 3 is connected with the conducting layer 15 on the front surface of the flexible plate body 1, the input end of the electricity outlet conducting block 5 is connected with the conducting layer 15 on the front surface of the flexible plate body 1, one side of the conducting layer 15, which is far away from the flexible insulating substrate layer 13, is covered with a PE film 11, the conducting layer 15 can be covered and protected through the PE film 11, one side, which corresponds to the two flexible insulating substrate layers 13, is penetrated and provided with a buried hole 14, one side, which corresponds to the two conducting layers 15, is penetrated and provided with a blind hole 12, through the blind hole 12, the electric connection can be carried out among the layers of the multilayer flexible circuit, cause unable circular telegram between each layer to lead to multilayer flexible circuit board to appear awkward problem, made things convenient for multilayer flexible circuit board's use greatly, be worth promoting.
When the multilayer flexible circuit board is used, the blind holes 12 are arranged, so that the layers of the multilayer flexible circuit board can be connected in an electrified mode, the using effect of the multilayer flexible circuit board is better, the problem that the multilayer flexible circuit board is inconvenient to use due to the fact that the layers cannot be connected effectively when the multilayer flexible circuit board is used is solved, and the multilayer flexible circuit board is greatly convenient to use; a conductive wire is installed in the blind hole 12, and the two conductive layers 15 are electrically connected.
In summary, the following steps: this blind buried via hole multilayer flexible circuit board through setting up blind hole 12, has solved multilayer flexible circuit board and has appeared awkward problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. Blind buried hole multilayer flexible circuit board, including flexible plate body (1), its characterized in that: the front surface and the back surface of the flexible plate body (1) are both provided with circuit board conductive areas (2), the center of the left side of the front surface of the flexible plate body (1) is fixedly connected with an electricity-feeding conductive block (3), the center of the right side of the front surface of the flexible plate body (1) is fixedly connected with an electric conducting block (5), the flexible plate body (1) comprises a transparent connecting glue layer (16), flexible insulating substrate layers (13) are pasted on the top and the bottom of the transparent connecting glue layer (16), a conductive layer (15) is printed on one side of the flexible insulating substrate layer (13) far away from the transparent connecting glue layer (16), one side of each conducting layer (15) far away from the flexible insulating substrate layer (13) is covered with a PE film (11), one side corresponding to the two flexible insulating substrate layers (13) is provided with a buried hole (14) in a penetrating mode, and one side corresponding to the two conducting layers (15) is provided with a blind hole (12) in a penetrating mode.
2. The blind buried via multilayer flexible circuit board of claim 1, wherein: four corners of the front surface of the flexible plate body (1) are provided with mounting holes (4) in a penetrating way.
3. The blind buried via multilayer flexible circuit board of claim 1, wherein: the position of the circuit board conductive area (2) on the flexible board body (1) is an area covered by the two conductive layers (15).
4. The blind buried via multilayer flexible circuit board of claim 1, wherein: the conductive layer (15) comprises a silver wire base layer (151), the silver wire base layer (151) covers on the flexible insulating substrate layer (13), and a copper wire layer (152) covers one side, away from the flexible insulating substrate layer (13), of the silver wire base layer (151).
5. The blind buried via multilayer flexible circuit board of claim 1, wherein: the output end of the electricity inlet conducting block (3) is connected with the conducting layer (15) on the front surface of the flexible plate body (1), and the input end of the electricity outlet conducting block (5) is connected with the conducting layer (15) on the front surface of the flexible plate body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920596031.6U CN210137489U (en) | 2019-04-28 | 2019-04-28 | Blind buried hole multilayer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920596031.6U CN210137489U (en) | 2019-04-28 | 2019-04-28 | Blind buried hole multilayer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210137489U true CN210137489U (en) | 2020-03-10 |
Family
ID=69703948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920596031.6U Expired - Fee Related CN210137489U (en) | 2019-04-28 | 2019-04-28 | Blind buried hole multilayer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210137489U (en) |
-
2019
- 2019-04-28 CN CN201920596031.6U patent/CN210137489U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211019 Address after: 629000 4th floor, east of Quhe Road, south of Airport South Road, Suining economic and Technological Development Zone, Sichuan Province Patentee after: Sichuan meijiesen Circuit Technology Co.,Ltd. Address before: 629000 airport Middle Road, South District, Suining economic and Technological Development Zone, Sichuan Province Patentee before: Suining meichuang Electronics Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200310 Termination date: 20210428 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |