CN210136471U

CN210136471U - A quick heat abstractor for thing networking computer

Info

Publication number: CN210136471U
Application number: CN201920916012.7U
Authority: CN
Inventors: 刘毅文; 舒甲; 黄显宁
Original assignee: Huaihua University
Current assignee: Huaihua University
Priority date: 2019-06-18
Filing date: 2019-06-18
Publication date: 2020-03-10
Anticipated expiration: 2029-06-18

Abstract

The utility model provides a quick heat abstractor for thing networking computer, the computer motherboard sets up CPU's one side up, and the cover has a square rand on CPU, CPU is hugged closely to the rand bottom, the upper edge is then upwards vertical extension, the refrigeration face in close contact with of CPU surface through heat dissipation silica gel and semiconductor refrigeration piece, be provided with the round drier bag of placing in the rand opening between semiconductor refrigeration piece lower surface and the CPU, the cooling face of semiconductor refrigeration piece is then through heat dissipation silica gel and aluminum alloy blank box in close contact with, the feed liquor end of aluminum alloy blank box passes through the liquid outlet end intercommunication of pipeline and liquid pump, the liquid outlet end of aluminum alloy blank box then passes through the radiator feed liquor end intercommunication that pipeline and quick-witted case top supported, the radiator liquid outlet end then passes through pipeline and liquid pump feed liquor end intercommunication, the radiator below is fixed with the heat. The utility model discloses the radiating effect is stronger more rapid, the high-efficient operation of better guarantee thing networking computer.

Description

A quick heat abstractor for thing networking computer

Technical Field

The utility model relates to a heat abstractor, a quick heat abstractor for thing networking computer specifically says so.

Background

The internet of things is that any object is connected with a network through information sensing equipment according to an agreed protocol, and the object performs information exchange and communication through an information transmission medium so as to realize functions of intelligent identification, positioning, tracking, supervision and the like. The internet of things computer is an important internet of things information processing terminal, the processing information is huge, and a high-performance computer is generally adopted, so that the heat generated by the computer is also large, and although a water-cooling heat dissipation case is arranged at present, the heat dissipation effect still needs to be improved so as to adapt to the efficient operation of the internet of things computer.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model aims at providing a quick heat abstractor for thing networking computer.

In order to achieve the above purpose, the technical scheme of the utility model is that: a quick heat dissipation device for an Internet of things computer comprises a horizontal case and a computer mainboard installed in the case, wherein the upper surface of the case is a case cover, the side of the computer mainboard, which is provided with a CPU, faces upwards, a square clamping ring is sleeved on the CPU, the bottom of the clamping ring is tightly attached to the CPU, the upper edge of the clamping ring extends upwards and vertically, the surface of the CPU is in close contact with a refrigerating surface of a semiconductor refrigerating sheet through heat dissipation silica gel, a circle of drying agent bag is arranged between the lower surface of the semiconductor refrigerating sheet and the CPU and is placed in an opening of the clamping ring, drying agents such as common drying agents in current food are filled in the drying agent bag, the lower surface of the semiconductor refrigerating sheet is wrapped by a plurality of drying agent bags, the heat dissipation surface of the semiconductor refrigerating sheet is in close contact with an aluminum alloy empty box through the heat dissipation silica gel, the liquid inlet end of the aluminum alloy empty box is communicated with the liquid outlet, the liquid outlet end of the radiator is communicated with the liquid inlet end of the liquid pump through a pipeline, and a radiating fan blowing air to the radiator main body is fixed below the radiator.

The utility model discloses a semiconductor refrigeration piece with refrigeration function cools down, and the radiating effect is stronger more rapid, and the another side can produce a large amount of heats when the semiconductor refrigeration piece refrigerates, and this part heat can distribute to the external world through the water-cooling circulation system that aluminum alloy empty box, liquid pump, radiator and each pipeline formed, and the heat dissipation fan blows to the radiator main part, and blows upwards, can distribute the heat upwards and not pass through quick-witted case, therefore more is favorable to the whole heat dissipation of quick-witted incasement portion; various interfaces on the machine case, such as USB interface, the audio interface, display card interface etc., lead to quick-witted case difficult airtight, well moisture of air is very easily condensed at colder semiconductor refrigeration piece refrigeration face and produces the drop of water, and these drops of water will flow down and cause faults such as CPU short circuit if the gathering, be provided with between semiconductor refrigeration piece lower surface and the CPU and place in the intraoral round drier bag of rand, make a plurality of drier bags wrap up semiconductor refrigeration piece lower surface, moisture in the air can fully be absorbed like this, and even produce a small amount of drop of water and also can be absorbed by drier bag all around, when guaranteeing the heat dissipation, can guarantee CPU normal work again.

Drawings

Fig. 1 is a schematic view of the structure of the present invention;

fig. 2 is a schematic top view of the heat sink of the present invention.

Detailed Description

As shown in figure 1 and figure 2, the quick heat dissipation device for the Internet of things computer comprises a horizontal case 1 and a computer mainboard 2 arranged in the case, wherein the computer mainboard 2 is provided with a CPU (central processing unit) with one side facing upwards, a square clamping ring 3 is sleeved on the CPU, the bottom of the clamping ring 3 is tightly attached to the CPU, the upper edge of the clamping ring 3 extends upwards and vertically, the surface of the CPU is tightly contacted with the refrigerating surface of a semiconductor refrigerating sheet 4 through heat dissipation silica gel, a circle of desiccant bags 5 placed in an opening of the clamping ring 3 are arranged between the lower surface of the semiconductor refrigerating sheet 4 and the CPU, so that a plurality of desiccant bags 5 wrap the lower surface of the semiconductor refrigerating sheet 4, the heat dissipation surface of the semiconductor refrigerating sheet 4 is tightly contacted with an aluminum alloy empty box 6 through the heat dissipation silica gel, the liquid inlet end of the aluminum alloy empty box 6 is communicated with the liquid outlet end of a liquid pump 8 through a pipeline 7, the liquid outlet end of the, the liquid outlet end of the radiator 9 is communicated with the liquid inlet end of the liquid pump 8 through a pipeline 7, a radiating fan 10 for blowing air to the main body of the radiator 9 is fixed below the radiator 9, and the aluminum alloy empty box 6, the liquid pump 8, the radiator 9 and each pipeline 7 are filled with water cooling liquid.

In order to facilitate the air inlet around the heat dissipation fan 10, the heat dissipation fan 10 is fixed on the conical seat 11 on the upper surface of the case 1, the lower part of the radiator 9 is supported on the case 1 through a plurality of support columns, and enough space is reserved to ensure that the air inflow is enough, and the conical seat 11 also has a good flow guide function, so that the air is more concentrated on the heat dissipation fan 10, and the air quantity of the heat dissipation fan 10 is improved.

In order to reduce the vibration of the case 1 caused by the rotation of the heat dissipating fan 10, the conical seat 11 is located on the case 1 through a cushion rubber pad 12.

Radiator 9 comprises the hollow square pipe of left and right parts, the hollow square pipe of left and right sides just is located the hollow pipe intercommunication of heat dissipation fan 10 top through many intervals, be similar to present radiator structure, the liquid pump during operation, the water-cooling night is flowed into left hollow square pipe by every round hollow pipe by the hollow square pipe on right side, in this process, the wind that heat dissipation fan 10 blew off is through every round hollow pipe, thereby take away a large amount of heats, make the water-cooling night obtain the cooling, the water-cooling night of being convenient for flows through the aluminum alloy empty box 6 with 4 in close contact with of semiconductor refrigeration piece once more, realize the continuous heat dissipation of the heating surface of semiconductor refrigeration piece 4, guarantee that semiconductor refrigeration piece 4 lasts effectual refrigeration.

The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, does not detailed here again.

Of course, the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art should be able to make changes, alterations, additions or substitutions within the scope of the present invention.

Claims

1. The utility model provides a quick heat abstractor for thing networking computer which characterized in that: the refrigerating device comprises a horizontal case (1) and a computer mainboard (2) installed in the case, wherein the side, provided with a CPU, of the computer mainboard (2) faces upwards, a square clamping ring (3) is sleeved on the CPU, the bottom of the clamping ring (3) is tightly attached to the CPU, the upper edge of the clamping ring extends upwards and vertically, the surface of the CPU is in close contact with the refrigerating surface of a semiconductor refrigerating sheet (4) through heat-radiating silica gel, a circle of drying agent bag (5) placed in an opening of the clamping ring (3) is arranged between the lower surface of the semiconductor refrigerating sheet (4) and the CPU, a plurality of drying agent bags (5) wrap the lower surface of the semiconductor refrigerating sheet (4), the heat-radiating surface of the semiconductor refrigerating sheet (4) is in close contact with an aluminum alloy empty case (6) through the heat-radiating silica gel, the liquid inlet end of the aluminum alloy empty case (6) is communicated with the liquid outlet end of a liquid pump (8) through a pipeline (7), and the liquid outlet end of the The liquid inlet end is communicated, the liquid outlet end of the radiator (9) is communicated with the liquid inlet end of the liquid pump (8) through a pipeline (7), a heat dissipation fan (10) for blowing air to the main body of the radiator (9) is fixed below the radiator (9), and the aluminum alloy empty box (6), the liquid pump (8), the radiator (9) and each pipeline (7) are filled with water cooling liquid.

2. The quick heat dissipation device for computers of the internet of things according to claim 1, wherein: the heat dissipation fan (10) is fixed on the conical seat (11) on the upper surface of the case (1).

3. The quick heat dissipation device for computers of the internet of things as claimed in claim 2, wherein: the conical seat (11) is positioned on the case (1) through a shock-absorbing rubber pad (12).

4. The quick heat dissipation device for computers of the internet of things according to claim 1, wherein: the radiator (9) comprises the hollow square tube of left and right parts, and the hollow square tube about, just is located the hollow pipe intercommunication of heat dissipation fan (10) top through many intervals.