CN209993568U - Silicon chip degumming machine - Google Patents
Silicon chip degumming machine Download PDFInfo
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- CN209993568U CN209993568U CN201920751930.9U CN201920751930U CN209993568U CN 209993568 U CN209993568 U CN 209993568U CN 201920751930 U CN201920751930 U CN 201920751930U CN 209993568 U CN209993568 U CN 209993568U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 73
- 239000010703 silicon Substances 0.000 title claims abstract description 73
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 255
- 238000003860 storage Methods 0.000 claims abstract description 69
- 238000005507 spraying Methods 0.000 claims abstract description 46
- 239000002351 wastewater Substances 0.000 claims abstract description 35
- 238000001914 filtration Methods 0.000 claims abstract description 29
- 239000007921 spray Substances 0.000 claims abstract description 25
- 239000008236 heating water Substances 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 54
- 239000007788 liquid Substances 0.000 claims description 29
- 238000007599 discharging Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 239000011863 silicon-based powder Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 238000011084 recovery Methods 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 8
- 239000002173 cutting fluid Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 241000220317 Rosa Species 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 206010024796 Logorrhoea Diseases 0.000 description 3
- 210000005056 cell body Anatomy 0.000 description 3
- 238000009510 drug design Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000008400 supply water Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003657 drainage water Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a silicon wafer degumming machine, which comprises a primary filter box communicated with a tank and used for recovering wastewater discharged from the tank; the secondary filter tank is communicated with the primary filter tank and is used for filtering water discharged by the primary filter tank; the third filtering tank is respectively communicated with the second filtering tank and the third tank and is used for filtering water discharged by the second filtering tank and recovering wastewater discharged by the third tank; the water storage tank is communicated with the third-stage filter tank and a tank and is used for storing water discharged from the third-stage filter tank and providing spray water for the tank; the heater is arranged between the water storage tank and a groove and is used for heating water discharged from the water storage tank; the pure water source supplies spray water to the water storage tank; the controller detects whether the silicon wafer is sprayed in the spraying groove through the position sensors arranged in the first groove, the second groove and the third groove, and spray water is discharged from the water storage tank and/or the pure water source. The utility model discloses can improve silicon chip surface quality, but shower water cyclic utilization, reduction in production cost improves product quality.
Description
Technical Field
The utility model belongs to the technical field of solar energy level monocrystalline silicon piece comes unstuck, especially, relate to a silicon chip degumming machine.
Background
In the production process of the solar silicon wafer, the requirement on the surface quality of the silicon wafer is high, the degumming process is an auxiliary process of linear cutting and cleaning, and the degumming process directly influences the surface quality of the silicon wafer cleaned by the subsequent silicon wafer. In the existing degumming machine, a silicon wafer unloaded from a cutting machine and a resin plate enter a spraying groove together for spraying and pre-cleaning, so as to remove silicon powder and cutting fluid adhered to the surface of the silicon wafer and soften glue on the resin plate, wherein the cutting fluid is cooling fluid used when a diamond cutting line is used for cutting a silicon rod, and the pure water content is 98-99%. In the whole spraying process, the spraying time cannot be too long, so that the silicon wafer is prevented from being hidden and cracked under the water pressure of a spray gun for a long time, and the fragment quantity of the silicon wafer is increased; but the spraying time is too short, which can lead to the incomplete removal of silicon powder and cutting fluid adhered on the surface of the silicon wafer and lead to the poor quality of subsequent soaking degumming. Because of the silicon chip sprays and sets up for the transfer machine production, spray the groove and set up and can make by the silicon chip of cutting less and pile up, spray the groove and set up a large amount and can prolong the silicon chip and spray time, lead to the silicon chip to fall. Therefore, three spraying grooves are arranged in the prior art, each group of silicon wafers are sequentially sprayed for three times and then soaked for degumming, the spraying liquid is pure water, and the silicon powder contained on the surfaces of the silicon wafers in the first groove is more, so that the initial spraying time is longer than the second and third spraying times, the content of the washed silicon powder is more, the water consumption of the first groove is maximum, and the spraying time of the second groove and the third groove is shorter, and the water consumption is less.
However, in the spraying process, the water pressure is gradually reduced in the later stage of spraying in one groove, so that the water spraying amount is small, the spraying requirement cannot be met, and the water cannot be flushed to the root area where the silicon wafer is connected with the resin plate; meanwhile, in the spraying process, the water temperature of the spraying liquid changes greatly, so that the cleaning effect is poor and speckles appear at a low temperature, and the cleaning effect is good at a high temperature but the cost is high; in addition, the water consumption of the three spraying grooves is large, and the direct discharge not only increases the production cost, but also wastes resources.
Disclosure of Invention
The to-be-solved problem of the utility model is to provide a silicon chip degumming machine, be applicable to especially that the groove process sprays the recovery unit of liquid, it is poor to have solved among the prior art to spray the effect of spraying in the process, can't satisfy current production technical requirement, and the technical problem that the spray water utilization ratio is low, and the purpose is in order to improve silicon chip surface quality, has reduced manufacturing cost, has improved product quality.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the utility model provides a silicon chip degumming machine, includes a groove, two grooves and the trislot that sets gradually, still includes:
a primary filter tank: the primary filter tank is communicated with the first tank and is used for recovering the wastewater discharged by the first tank;
a secondary filter box: the secondary filter tank is communicated with the primary filter tank and is used for filtering water discharged by the primary filter tank;
a third-stage filter box: the third filtering tank is respectively communicated with the second filtering tank and the third tank and is used for filtering water discharged by the second filtering tank and recovering wastewater discharged by the third tank;
a water storage tank: the water storage tank is communicated with the third-stage filter tank and the first tank and is used for storing water discharged from the third-stage filter tank and providing spray water for the first tank;
a heater: the heater is arranged between the water storage tank and the groove and is used for heating water discharged from the water storage tank;
pure water source: the water storage tank is communicated with the second tank, the third tank and the water storage tank and is used for supplying spray water to the second tank and the third tank and replenishing the spray water to the water storage tank;
the primary filter tank, the secondary filter tank, the tertiary filter tank and the water storage tank are all provided with a water pump, a control valve and a liquid level sensor;
a controller: the device is used for controlling the working states of the water pump and the control valve, detecting whether silicon wafers are sprayed in the spraying groove through position sensors arranged in the first groove, the second groove and the third groove, and discharging spraying water from the water storage tank and/or the pure water source.
Further, the second tank is communicated with the second-stage filter tank and/or the third-stage filter tank and is used for discharging wastewater into the second-stage filter tank and/or the third-stage filter tank.
Further, still including setting up the first filter screen of a groove, two grooves with three groove drain outlets department, and set up the primary filter case the secondary filter case with the inside second filter screen of tertiary filter case, the aperture of first filter screen is greater than the aperture of second filter screen.
Furthermore, the primary filter tank, the secondary filter tank and the tertiary filter are all provided with water inlets, and the water inlets are arranged above the second filter screen.
Furthermore, the primary filter box, the secondary filter box and the tertiary filter are all provided with water outlets, and the water outlets are arranged below the second filter screen.
Further, a temperature sensor is arranged at the heater, and the temperature of the heater is 25-45 ℃.
Further, the heater temperature was 30 ℃.
Further, the spraying time of the groove is 800-1000 s; the spraying time of the second groove and the third groove is 500-700 s.
Further, the first groove, the second groove and the third groove are arranged independently.
The utility model has the advantages and positive effects that:
1. compared with the prior art, the utility model provides a silicon wafer degumming machine, which carries out three-stage filtration and recovery on waste water discharged from a tank, carries out at least one-time filtration and recovery on waste water discharged from a second tank and one-time filtration and recovery on waste water discharged from a third tank, and uniformly converges water filtered by the three tanks into a special water storage tank; still be equipped with the supply setting in the water storage tank simultaneously, for satisfying the use of a groove shower water and provide sufficient water source, can solve the not enough technical problem of water pressure among the prior art completely. The recovery unit of rational design makes the shower water after filtering recycle again, can satisfy a groove completely and spray the operation requirement, has reduced the use amount of shower water, and the water economy resource has reduced manufacturing cost.
2. The water in the water storage tank is heated and then is heated to 25-45 ℃ by a tank, and then is sprayed, so that silicon powder and pure water cutting fluid adhered to the surface of the silicon wafer can be better cleaned, the cleaning effect is improved, the spraying time is accelerated, and the surface quality of the silicon wafer is improved.
Drawings
FIG. 1 is a silicon wafer degumming machine according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first filter screen according to a first embodiment of the present invention;
fig. 3 is a partial enlarged view of a according to the first embodiment of the present invention;
fig. 4 is a schematic structural view of a supporting frame according to a first embodiment of the present invention;
fig. 5 is a silicon wafer degumming machine according to the second embodiment of the present invention.
In the figure:
1. first-stage filter tank 101, water pump 2 and second-stage filter tank
201. Water pump 3, three-stage filter tank 301, water pump
4. Storage water tank 401, water pump 5 and heater
501. Temperature sensor 6, pure water source 601, control valve
602. Control valve 603, control valve 7, a tank
702. Control valve 8, two grooves 9 and three grooves
10. First filter 1001, through hole 11, second filter
12. Liquid level sensor 13, silicon chip 14 and position sensor
15. Supporting frame
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The first embodiment is as follows:
a silicon wafer degumming machine is shown in figure 1 and comprises a first tank 7, a second tank 8 and a third tank 9 which are used for spraying silicon wafers, wherein the first tank 7, the second tank 8 and the third tank 9 are sequentially and independently arranged, and the silicon wafer degumming machine also comprises a first-stage filter tank 1, a second-stage filter tank 2, a third-stage filter tank 3, a water storage tank 4, a heater 5, a pure water source 6 and a controller.
Wherein, the primary filter tank 1 is communicated with a water outlet of a tank 7 through a water pipe for recovering waste water discharged from the tank 7. The input port of the second-stage filter tank 2 is respectively communicated with the output port of the first-stage filter tank 1 and the water outlet of the second tank 8 through a water pipe, and the second-stage filter tank 2 is used for filtering water discharged from the first-stage filter tank 1 and recovering waste water discharged from the second tank 8. The input port of the third-stage filter tank 3 is respectively communicated with the output port of the second-stage filter tank 2 and the water outlet of the three-tank 9 through water pipes, and is used for filtering water discharged from the second-stage filter tank 2 and recovering wastewater discharged from the three-tank 9. An input port of the water storage tank 4 is communicated with an output port of the third-stage filter tank 3 through a water pipe, and an output port of the water storage tank 4 is communicated with an input port of a tank 7 through a water pipe and is used for storing water discharged from the third-stage filter tank 3 and supplying spray water to the tank 7; meanwhile, the water storage tank 4 is also provided with make-up water discharged from the pure water source 6, and when the water in the water storage tank 4 is not enough for the tank 7, the pure water source 6 can make up water for the water storage tank 4 in time, so that the tank 7 is ensured to have a sufficient water source, and the technical problem of insufficient water pressure in the prior art is solved. Meanwhile, a water pump and a corresponding control valve are arranged at the water outlet of the first-stage filter tank 1, the second-stage filter tank 2, the third-stage filter tank 3 and the water storage tank 4, and a liquid level sensor 12 is arranged inside the first-stage filter tank 1, the second-stage filter tank 2, the third-stage filter tank 3 and the water storage tank 4 and used for monitoring the liquid level height of the highest position and the lowest position.
In the present embodiment, a heater 5 is provided on an output line of the water storage tank 4 between the water storage tank 4 and a tank 7 for heating water discharged from the water storage tank 4, and a temperature sensor 501 is provided at the heater 5 for monitoring the temperature of the heater 5 and connected to the controller. The pure water source 6 is respectively communicated with the input ports of the second tank 8, the third tank 9 and the water storage tank 4 through water pipes and is used for providing spraying water sources for the second tank 8 and the third tank 9 and supplying spraying water sources for the water storage tank 4. Namely, the first spraying operation is carried out on the silicon wafer 13 by supplying warm water with the temperature of 25-45 ℃ to the spraying first tank 7, and compared with the cold water spraying cleaning, the warm water is easier to remove silicon powder and pure water cutting fluid adhered to the surface of the silicon wafer 13 and is also easier to wash away other impurities, especially when the temperature is 30 ℃, the silicon powder, the pure water cutting fluid and other impurities adhered to the surface of the silicon wafer 13 are easier to clean, the spraying effect is good, the spraying time is accelerated, the technical problem of the silicon wafer 13 speckles can be solved, and the surface quality of the silicon wafer 13 is improved. The type of the heater 5 is not particularly limited, and only the water discharged from the water storage tank 4 needs to be heated. Of course, the heater 5 may be disposed inside the water storage tank 4, in which case the heater 5 is preferably a heating plate or wire, and accordingly the temperature sensor 501 needs to be disposed inside the water storage tank 4, and the water in the water storage tank 4 may be heated to ensure that the water entering a tank 7 is warm water, even if the temperature of the water entering a tank 7 is 25-45 ℃, preferably 30 ℃.
The controller is a PLC controller (omitted in the figure) of the degumming machine, is arranged on a manipulator (omitted in the figure) of the shell wall of the degumming machine, can be used for controlling the working states of a water pump and a control valve which are connected with the first-stage filter tank 1, the second-stage filter tank 2, the third-stage filter tank 3 and the water storage tank 4, can also control the control valves of input and output water pipes of the first tank 7, the second tank 8 and the third tank 9, simultaneously detects whether silicon wafers are sprayed in the spraying tank through position sensors 14 arranged in the first tank 7, the second tank 8 and the third tank 9, and discharges spraying water from the water storage tank 4 and the pure water source 6.
Furthermore, be equipped with position sensor 14 on the inside lateral wall of every cell body for whether the response detects silicon chip in the cell body, position sensor 12 links to each other with the controller, be equipped with the outlet in the cell body bottom of a groove 7, two grooves 8 and three grooves 9, all detachably fixes being equipped with first filter screen 10 on each outlet, as shown in fig. 2, the purpose filters the garrulous silicon chip and the garrulous adhesive tape that drop at the in-process that sprays, first filter screen 10 is formed for the preparation of PVDF material, can not produce secondary pollution to the garrulous silicon chip of collecting, and elastoplasticity is good, and antifriction can relapse repetitious usage. A plurality of through holes 1001 are uniformly distributed on the first filter screen 10, as shown in fig. 3, in this embodiment, the through holes 1101 are hexagonal, and the maximum diameter is 5 mm. Of course, the shape of the through hole 1001 is not limited, and may be other shapes such as an oval shape, a square shape, an oblong shape, or a polygonal shape, and the through hole 1101 may filter the crushed silicon pieces, the crushed rubber pieces, or other foreign materials, as well as the shower water flow and discharge, regardless of the shape.
All be equipped with second filter screen 11 in one-level rose box 1, second grade rose box 2 and tertiary rose box 3 inside, second filter screen 11 sets up the upper portion at each rose box, specifically, second filter screen 11 is located the below of water inlet, the top of outlet. The second filter screen 11 is a nano-scale filter screen, and is mainly used for filtering the silicon powder entering the filter box, and the aperture of the second filter screen is smaller than that of the through hole 1001 in the first filter screen 10. The second filter screen 11 can be fixed on the support frame 15, and the support frame 15 can be dismantled the cooperation with each rose box, is convenient for clear up the silica flour on the second filter screen 11, and the structure of support frame 15 and the structure looks adaptation of each rose box, and in this embodiment, support frame 15 is as shown in fig. 4. As to how the first filter 10 and the second filter 11 are installed is conventional knowledge in the art, it is omitted here.
In this example, the cutting liquid for cutting the silicon wafer 13 is 98 to 99% pure water, so silicon powder and other small impurities mainly adhere to the surface of the silicon wafer 13. With the step-by-step spraying and cleaning of the silicon wafers 13 in the first groove 7, the second groove 8 and the third groove 9, the amount of silicon powder contained on the surfaces of the silicon wafers 13 is gradually reduced, and correspondingly the spraying time is also gradually reduced, specifically, the spraying time of the silicon wafers 13 in the first groove 7 is 800-700 s, and the spraying time of the silicon wafers 13 in the second groove 8 and the third groove 9 is 500-700 s. The waste water in the first tank 7 mainly contains broken silicon wafers, broken rubber strips, a large amount of silicon powder and a small amount of impurities, the broken silicon wafers and the broken rubber strips are filtered by the first filter screen 10, the large amount of silicon powder and the small amount of impurities are discharged into the first-stage filter tank 1 along with the waste water to be filtered, and then are sequentially filtered by the nanoscale second filter screens 11 of the second-stage filter tank 2 and the third-stage filter tank 3, and the filtered water enters the water storage tank 4; the silicon wafer 13 sprayed from the first tank 7 enters the second tank 8 to be sprayed for 500-700s, the sprayed wastewater mainly contains a part of a small amount of silicon powder, the silicon powder is filtered by the first filter screen 10 and then discharged into the second-stage filter tank 2 to be recycled and filtered, the silicon powder is filtered by the third-stage filter screen 3, and the filtered water enters the water storage tank 4; the silicon wafer 13 sprayed from the second tank 8 enters the third tank 9 to be sprayed for 500-700s, the sprayed wastewater only contains a very small amount of silicon powder, the wastewater is filtered by the first filter screen 10 and then discharged into the third-stage filter tank 3 to be filtered, and the filtered water enters the water storage tank 4. So far, the water entering the water storage tank 4 is water without silicon powder, and the water in the water storage tank 4 is heated by the heater 5 and then discharged into a groove 7 for use. The wastewater in the first tank 7 is discharged into the first-stage filter tank 1, and the wastewater in the second tank 8 and the wastewater in the third tank 9 respectively enter the second-stage filter tank 2 and the third-stage filter tank 3, and the processes are circulated. The recovery unit of rational design makes the shower water after filtering recycle again, can satisfy a groove 7 completely and spray the operation requirement of used water, has reduced the use amount of shower water, and the water economy resource has reduced manufacturing cost.
A control method of a silicon wafer degumming machine is used for the silicon wafer degumming machine and comprises the following steps:
s1: the waste water in a tank 7 is discharged into the primary filter tank 1 through a drain pipe.
Specifically, when a silicon wafer 13 in a groove 7 is detected to be sprayed, the position sensor 14 transmits a signal to the controller, and the controller opens the water inlet control valve 702 of the groove 7 and the water discharge control valve in the water storage tank 4; when the liquid level in the water storage tank 4 is above the low liquid level, the water supplementing control valve 603 of the pure water source 6 is closed; when the liquid level in the water storage tank 4 is lowered to a low liquid level, a water supply control valve 603 of the pure water source 6 is opened to supply water; upon detecting that there is no wafer 13 in one tank 7 during a shower, the position sensor 14 transmits a signal to the controller, which closes the inlet control valve 702 of the one tank 7. The waste water in the first tank 7 is filtered by the first filter screen 10 and then enters the second filter screen 11 in the first-stage filter tank 1 through the drain pipe, and then enters the first-stage filter tank 1 after being filtered by the second filter screen 11.
S2: the waste water in the second tank 8 is discharged into the second-stage filter tank 2 through a drain pipe.
Specifically, when the silicon wafers 13 in the second tank 8 are detected to be sprayed, the position sensor 14 transmits a signal to the controller, and the controller opens the water inlet control valve 602 of the second tank 8 to draw spraying water from the pure water source 6; when it is detected that there is no silicon wafer 13 in the second tank 8 during the spraying, the position sensor 14 transmits a signal to the controller, and the controller closes the water inlet control valve 602 of the second tank 8. The waste water in the second groove 8 is filtered by the first filter screen 10 and then enters the second filter screen 11 in the second-stage filter tank 2 through the drain pipe, and then enters the second-stage filter tank 2 after being filtered by the second filter screen 11.
S3: the wastewater in the three-tank 9 is discharged into the three-stage filter tank 3 through a drain pipe.
Specifically, when the silicon wafer 13 in the three-tank 9 is detected to be sprayed, the position sensor 14 transmits a signal to the controller, and the controller opens the water inlet control valve 601 of the three-tank 9 to pump and spray the sprayed water from the pure water source 6; when detecting that there is no silicon wafer 13 in the triple tank 9 during spraying, the position sensor 14 transmits a signal to the controller, and the controller closes the water inlet control valve 601 of the triple tank 9. The wastewater in the three-tank 9 is filtered by the first filter screen 10 and then enters the second filter screen 11 in the three-stage filter tank 3 through the drain pipe, and then enters the three-stage filter tank 3 after being filtered by the second filter screen 11.
S4: the water filtered by the primary filter tank 1 enters the secondary filter tank 2 through a drain pipe;
specifically, when the liquid level in the primary filter tank 1 is detected to rise to the highest liquid level, a drainage control valve of a tank 7 is closed, and meanwhile, a controller controls a water pump 101 in the primary filter tank 1 to start working and drains water from the primary filter tank 1 into a secondary filter tank 2; when the liquid level in the primary filter tank 1 is detected to be reduced to the lowest liquid level, a drainage control valve of the tank 7 is opened, and meanwhile, the controller controls the water pump 101 in the primary filter tank 1 to stop working.
S5: the water filtered by the secondary filter tank 2 enters the tertiary filter tank 3 through a drain pipe;
specifically, when the liquid level in the secondary filter tank 2 is detected to rise to the highest liquid level, the drainage control valve of the primary filter tank 1 is closed and the drainage control valve of the secondary tank 8 is closed, and meanwhile, the controller controls the water pump 201 in the secondary filter tank 2 to start working and drains water from the secondary filter tank 2 into the tertiary filter tank 3; when the liquid level in the secondary filter tank 2 is detected to be reduced to the lowest liquid level, a drainage control valve of the primary filter tank 1 is opened, a drainage control valve of the secondary tank 8 is opened, and meanwhile, a controller controls a water pump 201 in the secondary filter tank 2 to stop working;
s6: the water filtered by the third-stage filter tank 3 enters the water storage tank 4 through a drain pipe; and the pure water source 6 is communicated with the water storage tank 4 and supplies water to the water storage tank 4.
Specifically, when the liquid level in the third-stage filter tank 3 is detected to rise to the highest liquid level, the drainage control valve of the second-stage filter tank 2 is closed, the drainage control valve of the third tank 9 is closed, and meanwhile, the controller controls the water pump 301 in the third-stage filter tank 3 to start working and drains water from the third-stage filter tank 3 into the water storage tank 4; when the liquid level in the third-stage filter tank 3 is detected to be reduced to the lowest liquid level, the drainage control valve of the second-stage filter tank 2 is opened, the drainage control valve of the three-tank 9 is opened, and meanwhile, the controller controls the water pump 301 in the third-stage filter tank 3 to stop working;
s7: the water in the water storage tank 4 is heated by the heater 5 and then enters a groove 7.
Specifically, when the liquid level in the water storage tank 4 is detected to rise to the highest liquid level, the drainage control valve of the three-stage filter tank 3 is closed and the supply control valve 603 of the pure water source 6 is closed, and meanwhile, the controller controls the water pump 401 in the water storage tank 4 to start working, and drainage water from the water storage tank 4 is heated by the water heater 5 and then enters the tank 7 for use; when the liquid level in the water storage tank 4 is detected to be reduced to the lowest liquid level, when a tank 7 needs to supply water, a drainage control valve of the three-stage filter tank 3 can be opened and/or a supply control valve 603 of the pure water source 6 can be opened, and meanwhile, the controller controls the water pump 401 in the water storage tank 4 to work all the time; when the tank 7 does not need water supply, the drain control valve of the third stage filter tank 3 and/or the supply control valve 603 of the pure water source 6 can be opened, and the controller controls the water pump 401 in the water storage tank 4 to stop working.
S8: the pure water source 6 supplies water to the secondary tank 8 and the tertiary tank 9 through the drain pipes, respectively.
Specifically, when it is detected that the second tank 8 needs to supply water, the water inlet control valve 602 is opened to pump shower water from the pure water source 6; when it is detected that the water supply from the two tanks 8 is not necessary, the water inlet control valve 602 is closed, and the pumping of the shower water from the pure water source 6 is stopped. When the water supply requirement of the three tanks 9 is detected, the water inlet control valve 601 is opened, and the spraying water is pumped from the pure water source 6; when it is detected that the triple tank 9 does not require water supply, the water inlet control valve 601 is closed, and the pumping of the shower water from the pure water source 6 is stopped.
Example two:
as shown in fig. 5, compared with the first embodiment, the biggest difference of the present embodiment is that the waste water sprayed from the second tank 8 is filtered by the first filter screen 10, then discharged into the third filter tank 3 together with the waste water sprayed from the third tank 9 for recycling and filtering, and then filtered by the second filter screen 11 arranged in the third filter tank 3, and finally enters the water storage tank 4. That is, the secondary filter tank 2 filters only the water filtered from the primary filter tank 1, and the water filtered by the secondary filter tank 2 enters the tertiary filter tank 3 together with the waste water discharged from the secondary tank 8 and the tertiary tank 9 for filtering. The arrangement of the structure can also realize the recycling of the spray water, the utilization rate is high, the purpose of saving water is realized to the greatest extent, the recycling process is reasonable in design, the saving effect is good, the filtered spray water can completely meet the spraying use requirement of one tank 7, the resources are saved, and the production cost is reduced.
The utility model has the advantages and positive effects that:
1. compared with the prior art, the utility model provides a silicon wafer degumming machine, which carries out three-stage filtration and recovery on waste water discharged from a tank, carries out at least one-time filtration and recovery on waste water discharged from a second tank and one-time filtration and recovery on waste water discharged from a third tank, and uniformly converges water filtered by the three tanks into a special water storage tank; still be equipped with the supply setting in the water storage tank simultaneously, for satisfying the use of a groove shower water and provide sufficient water source, can solve the not enough technical problem of water pressure among the prior art completely. The recovery unit of rational design makes the shower water after filtering recycle again, can satisfy a groove completely and spray the operation requirement, has reduced the use amount of shower water, and the water economy resource has reduced manufacturing cost.
2. The water in the water storage tank is heated and then is heated to 25-45 ℃ by a tank, and then is sprayed, so that silicon powder and pure water cutting fluid adhered to the surface of the silicon wafer can be better cleaned, the cleaning effect is improved, the spraying time is accelerated, and the surface quality of the silicon wafer is improved.
3. Adopt the utility model provides a control method, but the automatic control detects the two-way control of waste water and moisturizing, the purpose of the biggest realization using water wisely, and process design is reasonable, and it is effectual to practice thrift, and degree of automation is high.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (6)
1. The utility model provides a silicon chip degumming machine, is including a groove, two grooves and the trislot that sets gradually, its characterized in that still includes:
a primary filter tank: the primary filter tank is communicated with the first tank and is used for recovering the wastewater discharged by the first tank;
a secondary filter box: the secondary filter tank is communicated with the primary filter tank and is used for filtering water discharged by the primary filter tank;
a third-stage filter box: the third filtering tank is respectively communicated with the second filtering tank and the third tank and is used for filtering water discharged by the second filtering tank and recovering wastewater discharged by the third tank;
a water storage tank: the water storage tank is communicated with the third-stage filter tank and the first tank and is used for storing water discharged from the third-stage filter tank and providing spray water for the first tank;
a heater: the heater is arranged between the water storage tank and the groove and is used for heating water discharged from the water storage tank;
pure water source: the water storage tank is communicated with the second tank, the third tank and the water storage tank and is used for supplying spray water to the second tank and the third tank and replenishing the spray water to the water storage tank;
the primary filter tank, the secondary filter tank, the tertiary filter tank and the water storage tank are all provided with a water pump, a control valve and a liquid level sensor;
a controller: the device is used for controlling the working states of the water pump and the control valve, detecting whether silicon wafers are sprayed in the spraying groove through position sensors arranged in the first groove, the second groove and the third groove, and discharging spraying water from the water storage tank and/or the pure water source.
2. The silicon wafer degumming machine according to claim 1, wherein the two tanks are communicated with the secondary filter tank and/or the tertiary filter tank for discharging wastewater into the secondary filter tank and/or the tertiary filter tank.
3. The silicon wafer degumming machine according to claim 2, further comprising a first filter screen arranged at the drainage outlets of the first tank, the second tank and the third tank, and a second filter screen arranged inside the first-stage filter tank, the second-stage filter tank and the third-stage filter tank, wherein the aperture of the first filter screen is larger than that of the second filter screen.
4. The silicon wafer degumming machine according to claim 3, wherein the primary filter tank, the secondary filter tank and the tertiary filter are provided with water inlets, and the water inlets are arranged above the second filter screen.
5. The silicon wafer degumming machine according to claim 4, wherein the primary filter tank, the secondary filter tank and the tertiary filter are provided with water discharge ports, and the water discharge ports are arranged below the second filter screen.
6. The silicon wafer degumming machine according to any of the claims 1 to 5, characterized in that said one groove, said two grooves and said three grooves are arranged independently of each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920751930.9U CN209993568U (en) | 2019-05-23 | 2019-05-23 | Silicon chip degumming machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920751930.9U CN209993568U (en) | 2019-05-23 | 2019-05-23 | Silicon chip degumming machine |
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| Publication Number | Publication Date |
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| CN209993568U true CN209993568U (en) | 2020-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920751930.9U Withdrawn - After Issue CN209993568U (en) | 2019-05-23 | 2019-05-23 | Silicon chip degumming machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137113A (en) * | 2019-05-23 | 2019-08-16 | 内蒙古中环光伏材料有限公司 | A kind of silicon wafer stripping machine and its control method |
-
2019
- 2019-05-23 CN CN201920751930.9U patent/CN209993568U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137113A (en) * | 2019-05-23 | 2019-08-16 | 内蒙古中环光伏材料有限公司 | A kind of silicon wafer stripping machine and its control method |
| CN110137113B (en) * | 2019-05-23 | 2024-04-12 | 内蒙古中环光伏材料有限公司 | Silicon wafer degumming machine and control method thereof |
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