CN209947808U - Wafer platform of quick location - Google Patents
Wafer platform of quick location Download PDFInfo
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- CN209947808U CN209947808U CN201921096747.6U CN201921096747U CN209947808U CN 209947808 U CN209947808 U CN 209947808U CN 201921096747 U CN201921096747 U CN 201921096747U CN 209947808 U CN209947808 U CN 209947808U
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Abstract
The utility model relates to a wafer platform of quick location belongs to semiconductor die bonder technical field, its technical scheme main points: including installing at this internal bed plate of wafer platform to and install the abrupt needle mechanism on the bed plate, the sliding connection has the first locating plate of lateral shifting on the bed plate, but sliding connection has vertical removal's second locating plate on the first locating plate, the needle mechanism is fixed on the second locating plate suddenly, all install the drive assembly of drive first locating plate or second locating plate along predetermined direction horizontal migration on first locating plate and the second locating plate, install the locking piece that is used for restricting first locating plate and second locating plate removal on the bed plate. The utility model discloses when using, can fix a position the protruding needle mechanism of wafer bench fast, improve work efficiency to improve the stability of wafer platform.
Description
Technical Field
The utility model relates to a semiconductor die bonder technical field especially relates to a wafer platform of quick location.
Background
In the semiconductor packaging process, a chip bonding process is included, and the purpose is to bond the crystal grains to the substrate by using the viscosity of soft solder, so that the subsequent process operation is facilitated, and the effect of crystal grain bonding can directly influence the subsequent operation.
At present, the existing die bonder mainly comprises a die feeding mechanism, a grabbing welding mechanism and a die table, wherein the die table is used for bearing a wafer and intermittently moving the wafer, so that the grabbing welding mechanism can grab grains on the wafer and then bond a substrate, and the XY die table needs to be positioned before the machine runs, so that the grabbing welding mechanism aligns with a protruding needle below the die table, otherwise, the effect of picking the die is influenced.
However, in actual work, the nut is generally manually rotated by a worker to position the wafer stage, so that the protruding pin on the wafer stage moves, the positioning device needs the nut rotated repeatedly by the worker, the wafer stage can be accurately positioned, time and labor are wasted, the working efficiency is reduced, and the positioning accuracy of the wafer stage is not high due to human factors.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a wafer platform of quick location can use drive assembly to replace manual operation, fixes a position wafer bench needle mechanism fast to can improve work efficiency, and improve the stability of wafer platform.
The above object of the present invention can be achieved by the following technical solutions:
the wafer table capable of being quickly positioned comprises a base plate and a protruding pin mechanism, wherein the base plate is installed in a wafer table body, the protruding pin mechanism is installed on the base plate, the base plate is connected with a first positioning plate capable of moving transversely in a sliding mode, the first positioning plate is connected with a second positioning plate capable of moving vertically in a sliding mode, positioning pins are fixed on the second positioning plate, driving components for driving the first positioning plate or the second positioning plate to move horizontally in a preset direction are installed on the first positioning plate and the second positioning plate, and a locking piece for limiting the first positioning plate and the second positioning plate to move is installed on the base plate.
Adopt above-mentioned technical scheme, through installing first locating plate and the second locating plate that can toward X axle and Y axle horizontal migration on the bed plate, can remove the protruding needle mechanism of fixing on the second locating plate, thereby enable protruding needle mechanism and aim at the wafer, drive assembly on first locating plate and second locating plate can fix a position protruding needle mechanism fast, use mechanical drive to replace the mode of manual location in the past, not only improved work efficiency, still improve the accurate degree of wafer platform at the during operation, and the locking Assembly can improve the stability after the location, thereby reduce the condition of wafer platform displacement.
The utility model discloses further set up the drive assembly includes: the first cylinder is arranged on the bearing surface of the base plate, the piston rod of the first cylinder is connected with the first positioning plate, and the second cylinder is arranged on the first positioning plate, and the piston rod of the second cylinder is connected with the second positioning plate.
By adopting the technical scheme, the driving assembly is pushed by the air cylinder, so that the first positioning plate and the second positioning plate can move along the X axis and the Y axis, the quick positioning of the needle protruding mechanism is realized, and the positioning working efficiency is improved.
The utility model discloses further set up the drive assembly includes: the first nut is fixed on the side face of the first positioning plate, the second nut is fixed on the side face of the second positioning plate, a first screw rod is inserted into the first nut, a second screw rod is inserted into the second nut, a first motor used for driving the first screw rod to rotate is installed on the base plate, and a second motor used for driving the second screw rod to rotate is installed on the first positioning plate.
By adopting the technical scheme, the driving assembly adopts the combination of the screw rod nut to move the projecting needle mechanism, so that the projecting needle mechanism can be quickly and accurately displaced under the driving of the screw rod, thereby realizing the quick positioning of the projecting needle mechanism, improving the product quality, avoiding opening the wafer table in the positioning process, and facilitating the positioning of the working personnel on the projecting needle mechanism.
The utility model discloses further set up, first baffle is installed to both sides on the bed plate loading end, the second baffle is installed to both sides on the first locating plate loading end, the first guide arm of interlude first locating plate is installed to first baffle inboard, the second guide arm of interlude second locating plate is installed to second baffle inboard, the extending direction of first guide arm and second guide arm is mutually perpendicular.
By adopting the technical scheme, the baffle and the guide rod are used to ensure that the first positioning plate and the second positioning plate can only move in the horizontal direction, and the moving directions of the first positioning plate and the second positioning plate are vertical to each other, so that the X-axis and the Y-axis move, and the needle projecting mechanism can move on a plane through combination.
The utility model discloses it is further set up that the locking piece is including installing the micro motor on first locating plate loading end to and the piece that colludes that links to each other with the micro motor output shaft, the piece that colludes can be inconsistent with first guide arm.
By adopting the technical scheme, the hook block can be driven to be fixed with the first guide rod through the driving of the micro motor, so that the first positioning plate is locked to move on the base plate, when the unlocking is needed, the driving motor rotates in the opposite direction to unlock, and therefore the locking piece and the driving assembly are driven by hands of workers, and the automation is greatly improved.
The utility model discloses it is further set up that set up flutedly on the bed plate loading end, first locating plate bottom is installed with the protruding board of recess assorted, the extending direction of recess is the same with first locating plate glide direction.
Adopt above-mentioned technical scheme, through setting up recess and flange for first locating plate can be more firm when sliding on the bed plate, and at equipment during operation, the condition of rocking about reducing improves wafer platform stability, makes the bonded effect of wafer better.
The utility model is further provided with a positioning wheel which is propped against the first positioning plate and the second positioning plate and is arranged on the side wall of the groove.
By adopting the technical scheme, the positioning wheels are arranged, so that the positioning plate can move on the groove more smoothly, the shaking of the positioning plate can be further reduced, and the positioning accuracy and the stability are improved.
The utility model discloses it is further provided that the cover is equipped with the spring on the guide arm, all be equipped with the spring on first guide arm and the second guide arm.
By adopting the technical scheme, the shaking of the equipment in the working process can be buffered through the spring, so that the needle protruding mechanism can be fixed on the second positioning plate more stably, and the situation that the needle needs to be positioned again is reduced.
To sum up, the utility model discloses following beneficial effect has: through drive assembly's drive, can be so that the needle mechanism suddenly fixes a position fast, banned the manual condition of staff, not only fix a position fast, fix a position accurately moreover, have high practical meaning to under the fixing of locking piece, can reduce the gliding condition between the locating plate in the course of the work, make the needle mechanism suddenly can be stable fix on the second locating plate, thereby improve stability.
Drawings
Fig. 1 is a schematic structural view of a wafer stage body according to embodiment 1 of the present invention;
fig. 2 is a schematic view of the overall structure of embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a locking member according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a driving assembly according to embodiment 2 of the present invention.
Reference numerals: 1. a wafer stage body; 11. a base plate; 12. A needle projecting mechanism; 2. a first positioning plate; 3. a second positioning plate; 4. a first cylinder; 41. a second cylinder; 5. a first nut; 51. a second nut; 52. a first screw; 53. a second screw; 54. a first motor; 55. a second motor; 6. a first baffle plate; 61. a second baffle; 62. a first guide bar; 63. a second guide bar; 7. a micro motor; 71. hooking the block; 8. a groove; 81. a convex plate; 82. positioning wheels; 9. a spring.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1: a wafer stage of quick location, as shown in fig. 1, fig. 2, including wafer stage body 1, and install the bed plate 11 in wafer stage body 1, wafer stage body 1 includes the wafer ring who bears the silicon wafer, and install the protruding needle mechanism 12 in wafer stage body 1 holds the cavity, in operation, protruding needle mechanism 12 is inconsistent with the silicon wafer, thereby enable subsequent picking up bonding mechanism and use protruding needle mechanism 12 as the center, make picking up bonding structure can be accurate pick up the crystalline grain on the wafer, make the effect of bonding crystalline grain better, but before silicon wafer work begins, need carry out alignment to protruding needle mechanism 12, in order to ensure to enable protruding needle mechanism 12 to aim at the picking point of picking up bonding structure.
As shown in fig. 2, a first positioning plate 2 is slidably connected to the bearing surface of the base plate 11, the first positioning plate 2 can horizontally move in the X-axis direction on the bearing surface of the base plate 11, a second positioning plate 3 is slidably connected to the bearing surface of the first positioning plate 2, and the second positioning plate 3 can horizontally move in the Y-axis direction with respect to the first positioning plate 2. The first positioning plate 2 and the second positioning plate 3 are both provided with driving components, and the driving components can respectively drive the first positioning plate 2 and the second positioning plate 3 to move in a preset direction.
The second positioning plate 3 on the bearing surface of the first positioning plate 2 can be driven to move in the X-axis direction relative to the base plate 11 by the X-axis movement of the first positioning plate 2, and the second positioning plate 3 can move in the Y-axis direction on the first positioning plate 2, so that the needle protruding mechanism 12 fixed on the second positioning plate 3 can move on the horizontal plane, and the purpose of positioning the needle protruding mechanism 12 is achieved.
Further, locking members for fixing the relative positions of the first positioning plate 2 and the second positioning plate 3 are attached to both the first positioning plate 2 and the second positioning plate 3. The locking member may improve the stability of the spike mechanism 12 during operation.
In the present embodiment, as shown in fig. 2, the driving assembly includes: the first cylinder 4 is mounted on the bearing surface of the base plate 11, and the second cylinder 41 is mounted on the bearing surface of the first positioning plate 2, the first cylinder 4 is mounted on the edge of the bearing surface of the base plate 11, and the output shaft of the first cylinder 4 is connected with the side surface of the first positioning plate 2, similarly, the second cylinder 41 is mounted on the edge of the bearing surface of the first positioning plate 2, and the output shaft of the second cylinder 41 is connected with the side surface of the second positioning plate 3, the first cylinder 4 and the second cylinder 41 respectively drive the first positioning plate 2 to move on the base plate 11 in the X-axis direction, and the second positioning plate 3 moves on the first positioning plate 2 in the Y-axis direction.
First baffles 6 are arranged on the bearing surface of the base plate 11 at two sides close to the first cylinder 4 and far away from the first cylinder 4, and similarly, second baffles 61 are arranged on the bearing surface of the first positioning plate 2 at two sides close to the second cylinder 41 and far away from the second cylinder 41. A set of first guide rods 62 parallel to each other is installed on the first baffle 6, the first guide rods 62 penetrate through the side surface of the first positioning plate 2 to the side surface of the other first baffle 6, similarly, a set of second guide rods 63 parallel to each other is installed on the second baffle 61, and the second guide rods 63 penetrate through the side surface of the second positioning plate 3 to the side surface of the other second baffle 61. The first guide bar 62 and the second guide bar 63 extend in directions perpendicular to each other and are respectively the same as the extension direction of the driving assembly. The first guide rod 62 and the second guide rod 63 are limited, so that the first positioning plate 2 and the second positioning plate 3 can stably move horizontally on the first guide rod 62 and the second guide rod 63 respectively.
In this embodiment, as shown in fig. 2 and 3, the locking member includes: the micro motor 7 is horizontally arranged on the bearing surface of the second positioning plate 3, the hook block 71 is arranged on the output shaft of the micro motor 7, the hook block 71 is a block with an L-shaped section, one end of the hook block 71 is connected with the output shaft of the micro motor 7, the other end of the hook block can be abutted to the bearing surface of the first positioning plate 2 and the second guide rod 63 through the driving of the micro motor 7, the hook block 71 is made of rubber, the friction force between the abutting surface of the hook block 71 and the second guide rod 63 can be increased, the locking is more stable, the movement of the second positioning plate 3 can be limited through the locking piece, the movement of the second positioning plate 3 can be locked, the needle protruding mechanism 12 is stably fixed, when the position of the needle protruding mechanism 12 needs to be adjusted, the micro motor 7 is started, the hook block 71 is far away from the abutting surface, and the purpose of unlocking is achieved.
As shown in fig. 2, the middle part of the bearing surface of the base plate 11 is provided with a groove 8, correspondingly, the bottom of the first positioning plate 2 is provided with a convex plate 81 matched with the groove 8, the extending direction of the groove 8 is the same as the sliding direction of the first positioning plate 2, and the first positioning plate 2 can move more stably in the extending direction of the groove 8 due to the arrangement, so that the situation that the first positioning plate 2 is displaced due to the shaking of the equipment is reduced. Similarly, the bearing surface of the first positioning plate 2 is provided with the same groove 8, and the second positioning plate 3 is provided with a convex plate 81 matched with the groove 8
A plurality of positioning wheels 82 are arranged on the side wall of the groove 8 of the base plate 11, the positioning wheels 82 are abutted against the convex plate 81 of the first positioning plate 2, and a plurality of positioning wheels 82 are also arranged on the corresponding groove 8 on the bearing surface of the first positioning plate 2. Through the setting of locating wheel 82, can make on the one hand first locating plate 2 and the removal of second locating plate 3 more smooth and easy, on the other hand can make first locating plate 2 and second locating plate 3 more firm on corresponding loading surface.
In this embodiment, the first guide rod 62 is sleeved with a spring 9, two springs 9 are respectively provided at both ends of the first guide rod 62, one end of the spring 9 abuts against the side surface of the first baffle 6, and the other end abuts against the side surface of the first positioning plate 2, and similarly, the spring 9 is also provided on the second guide rod 63. Through the arrangement of the spring 9, a part of force from shaking of the equipment can be buffered, so that the situation that the needle projecting mechanism 12 is displaced is reduced.
Example 2: as shown in fig. 4, the difference from embodiment 1 lies in the difference of the driving assembly, in this embodiment, the driving assembly includes a first nut 5 installed on the side surface of the first positioning plate 2, and a second nut 51 fixed on the side surface of the second positioning plate 3, a first screw 52 is inserted into the first nut 5, a second screw 53 is inserted into the second nut, a first motor 54 is installed on the side of the bearing surface of the base plate 11 near the first positioning plate 2, the output shaft of the first motor 54 is connected with the first screw 53, correspondingly, a second motor 55 is installed on the side of the bearing surface of the first positioning plate 2 near the second baffle 61, and the output shaft of the second motor 55 is connected with the second screw 53.
The first motor 54 is turned on to move the first nut 5 in the horizontal direction, thereby moving the first positioning plate 2 in the horizontal direction. The second motor 55 is started to move the second nut 51 in the horizontal direction, so that the second positioning plate 3 moves in the horizontal direction, and the second positioning plate 3 and the second motor are matched with each other, so that the needle protruding mechanism 12 fixed on the second positioning plate 3 can move on a two-dimensional plane, the purpose of quick positioning is achieved, and the manual adjustment condition of workers is reduced.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as required without making a contribution, but all the embodiments are protected by the patent law within the scope of the claims of the present invention.
Claims (8)
1. A fast positioning wafer stage comprising: install bed plate (11) in wafer platform body (1) to and install abrupt needle mechanism (12) on bed plate (11), it has first locating plate (2) of lateral shifting to slide on bed plate (11), but slide on first locating plate (2) and be connected with second locating plate (3) of vertical movement, abrupt needle mechanism (12) are fixed on second locating plate (3), all install drive first locating plate (2) or second locating plate (3) on first locating plate (2) and second locating plate (3) along predetermined direction horizontal migration's drive assembly, install the locking piece that is used for restricting first locating plate (2) and second locating plate (3) removal on bed plate (11).
2. A fast positioning wafer stage as recited in claim 1 wherein said drive assembly comprises: the first cylinder (4) is arranged on the bearing surface of the base plate (11) and the piston rod is connected with the first positioning plate (2), and the second cylinder (41) is arranged on the first positioning plate (2) and the piston rod is connected with the second positioning plate (3).
3. A fast positioning wafer stage as recited in claim 1 wherein said drive assembly comprises: fix first nut (5) on first locating plate (2) side to and fix second nut (51) on second locating plate (3) side, first screw rod (52) have been alternate in first nut (5), second screw rod (53) have been alternate in second nut (51), install on bed plate (11) and be used for driving first screw rod (52) rotatory first motor (54), second motor (55) that are used for driving second screw rod (53) rotation are installed in first locating plate (2).
4. A fast positioning wafer stage according to claim 1, characterized in that the two sides of the bearing surface of the base plate (11) are installed with first baffle plates (6), the two sides of the bearing surface of the first positioning plate (2) are installed with second baffle plates (61), the inner side of the first baffle plates (6) is installed with first guide rods (62) inserted through the first positioning plate (2), the inner side of the second baffle plates (61) is installed with second guide rods (63) inserted through the second positioning plate (3), and the extending directions of the first guide rods (62) and the second guide rods (63) are perpendicular to each other.
5. A rapid positioning wafer stage according to claim 1 wherein the lock comprises: install micro motor (7) on first locating plate (2) loading face to and collude piece (71) that link to each other with micro motor (7) output shaft, collude piece (71) can be inconsistent with first guide arm (62).
6. A fast positioning wafer stage as claimed in claim 1, characterized in that the carrying surface of the base plate (11) is provided with a groove (8), the bottom of the first positioning plate (2) is provided with a protruding plate (81) matching with the groove (8), and the extending direction of the groove (8) is the same as the sliding direction of the first positioning plate (2).
7. A fast positioning wafer stage according to claim 6, characterized in that the side walls of the recess (8) are fitted with positioning wheels (82) which are in abutment with the first positioning plate (2) and the second positioning plate (3).
8. A fast positioning wafer stage according to claim 4, characterized in that the first guide rod (62) and the second guide rod (63) are each provided with a spring (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921096747.6U CN209947808U (en) | 2019-07-13 | 2019-07-13 | Wafer platform of quick location |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921096747.6U CN209947808U (en) | 2019-07-13 | 2019-07-13 | Wafer platform of quick location |
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| Publication Number | Publication Date |
|---|---|
| CN209947808U true CN209947808U (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921096747.6U Active CN209947808U (en) | 2019-07-13 | 2019-07-13 | Wafer platform of quick location |
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| CN (1) | CN209947808U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805451A (en) * | 2020-07-09 | 2020-10-23 | 苏州工业园区欣隆电热仪器有限公司 | Automatic alignment correction device |
| CN112919128A (en) * | 2021-01-22 | 2021-06-08 | 深圳市晶科鑫实业有限公司 | Be applied to burning record device of small-size oscillator |
-
2019
- 2019-07-13 CN CN201921096747.6U patent/CN209947808U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111805451A (en) * | 2020-07-09 | 2020-10-23 | 苏州工业园区欣隆电热仪器有限公司 | Automatic alignment correction device |
| CN112919128A (en) * | 2021-01-22 | 2021-06-08 | 深圳市晶科鑫实业有限公司 | Be applied to burning record device of small-size oscillator |
| CN112919128B (en) * | 2021-01-22 | 2022-06-07 | 深圳市晶科鑫实业有限公司 | Be applied to burning record device of small-size oscillator |
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