CN209919089U - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

Info

Publication number
CN209919089U
CN209919089U CN201920208261.0U CN201920208261U CN209919089U CN 209919089 U CN209919089 U CN 209919089U CN 201920208261 U CN201920208261 U CN 201920208261U CN 209919089 U CN209919089 U CN 209919089U
Authority
CN
China
Prior art keywords
workpiece
laser
conveying
laser processing
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920208261.0U
Other languages
Chinese (zh)
Inventor
李健
冯立新
徐发明
张伟
杜平
孙日文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaomi Tongchuang Valve Core Co Ltd
Himile Mechanical Science and Technology Shandong Co Ltd
Original Assignee
Gaomi Tongchuang Valve Core Co Ltd
Himile Mechanical Science and Technology Shandong Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gaomi Tongchuang Valve Core Co Ltd, Himile Mechanical Science and Technology Shandong Co Ltd filed Critical Gaomi Tongchuang Valve Core Co Ltd
Priority to CN201920208261.0U priority Critical patent/CN209919089U/en
Application granted granted Critical
Publication of CN209919089U publication Critical patent/CN209919089U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to a machining technology field aims at improving the problem that laser beam machining efficiency is low among the prior art, provides a laser beam machining device. The utility model provides a laser processing device, it includes laser head and conveying mechanism that sets up along the relative interval of first predetermined direction. The conveying mechanism is provided with a plurality of clamps for clamping workpieces to be processed and is used for driving the workpieces to move along a second preset direction. When the conveying mechanism drives the workpiece to move to the processing position of the laser head, the laser head processes the workpiece at the processing position, and the workpiece to be processed can be clamped and the processed workpiece can be detached while processing is carried out, so that the processing efficiency of the laser processing device can be greatly improved.

Description

Laser processing apparatus
Technical Field
The utility model relates to a machining technology field particularly, relates to a laser processing device.
Background
In the prior art, laser processing equipment, such as a laser engraving machine, a laser marking machine and the like, generally processes a workpiece by manually fixing the workpiece below a laser head; then, starting the laser head to process the workpiece; and after the processing is finished, stopping the machine and manually unloading. The working mode is an intermittent working mode, and a large number of working procedures need manual participation, so that the problem of low processing efficiency is caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a laser beam machining device to improve the problem that machining efficiency among the prior art is low.
The embodiment of the utility model is realized like this:
a laser processing device comprises a laser head and a conveying mechanism; the laser head and the conveying mechanism are oppositely arranged at intervals along a preset direction; the conveying mechanism is provided with a plurality of clamps for clamping workpieces and is used for driving the workpieces to move relative to the laser head; the laser head is used for processing the workpiece.
In an embodiment of the present invention:
the conveying mechanism comprises a conveying piece and a plurality of clamp plates connected to the conveying piece, and the clamp plates can move in the direction opposite to the laser head under the driving of the conveying piece; the clamp plate is provided with a clamp.
In an embodiment of the present invention:
the motion path of the clamp is a closed loop path, and the conveying piece is used for driving the clamp to circularly move along the closed loop path.
In an embodiment of the present invention:
the clamp is a mounting hole which is used for accommodating a workpiece.
In an embodiment of the present invention:
the laser processing device also comprises a collecting mechanism for collecting the processed workpiece;
preferably, the collecting mechanism comprises a collecting groove arranged below the conveying mechanism, and the workpiece in the clamp can be separated from the clamp into the collecting groove under the action of gravity.
In an embodiment of the present invention:
the laser processing device also comprises a feeding channel, wherein the feeding channel is used for enabling the workpiece to enter the clamp through the feeding channel;
preferably, one end of the feeding channel, which is close to the clamp, is further provided with a plurality of mutually communicated shunting branches, and the discharge end of each shunting branch is used for being communicated with the clamp.
In an embodiment of the present invention:
the laser processing device also comprises a feeding mechanism, wherein the feeding mechanism is used for transferring the workpiece into the feeding channel;
preferably, the feeding mechanism comprises a vibrating disc.
In an embodiment of the present invention:
the laser processing device also comprises a sorting mechanism, wherein the sorting mechanism is used for preventing the misplaced workpiece from passing through the feeding channel;
preferably, the sorting mechanism comprises a detector and a sorter electrically connected with the detector; when the detector detects that the workpiece is in a dislocation state, the separator rejects the workpiece;
preferably, the detector comprises a visual detector;
preferably, the classifier includes a hydraulic cylinder, an air cylinder or an air nozzle.
In an embodiment of the present invention:
the laser processing device comprises a plurality of laser heads, and the plurality of laser heads are arranged at intervals along the moving direction of the workpiece.
In an embodiment of the present invention:
the laser processing device also comprises a frame, wherein the laser head and the conveying mechanism are arranged on the frame; the laser head is connected with the machine frame in a sliding mode and used for adjusting the distance between the laser head and the clamp.
The utility model discloses beneficial effect includes:
an embodiment of the utility model provides a laser processing device, it includes laser head and conveying mechanism along the relative interval setting of preset direction. The conveying mechanism is provided with a plurality of clamps for clamping workpieces to be processed and is used for driving the workpieces to move relative to the laser head. When the conveying mechanism drives the workpiece to move to the processing position of the laser head, the laser head processes the workpiece at the processing position, and the workpiece to be processed can be clamped and the processed workpiece can be detached while processing is carried out, so that the processing efficiency of the laser processing device can be greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of an overall structure of a laser processing apparatus provided in embodiment 1 of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at II;
fig. 3 is a schematic partial structural view of a laser processing apparatus provided in embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a feeding mechanism in a laser processing apparatus provided in embodiment 1 of the present invention;
FIG. 5 is an enlarged view of a portion of the structure at V in FIG. 4;
fig. 6 is an enlarged view of a portion of the structure at vi in fig. 1.
Icon: 010-a laser processing device; 100-a frame; 110-a slide rail; 200-a laser head; 300-a conveying mechanism; 310-a clamp plate; 311-mounting holes; 320-a conveyor; 400-a holding tank; 510-a feed channel; 520-split turnouts; 530-a feeding pipe; 600-a feeding mechanism; 610-a body; 621-material guide rail; 622-storage tank; 700-a sorting mechanism; 710-a detector; 720-a sorter; 800-workpiece.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the terms "first", "second", and the like are used for distinguishing the description, and are not to be construed as indicating or implying relative importance.
Example 1
Fig. 1 is a schematic view of an overall structure of the laser processing apparatus 010 provided in this embodiment. Please refer to
In fig. 1, the present embodiment provides a laser processing apparatus 010, which includes a laser head 200 and a conveying mechanism 300, which are oppositely disposed along a predetermined direction at an interval. The conveying mechanism 300 is provided with a plurality of clamps for clamping the workpiece 800 to be processed, and the clamps are used for driving the workpiece 800 to move relative to the laser head 200. When the conveying mechanism 300 drives the workpiece 800 to move to the processing position of the laser head 200, the laser head 200 processes the workpiece 800 at the processing position, and the workpiece 800 to be processed can be clamped and the processed workpiece 800 can be disassembled while processing, so that the processing efficiency of the laser processing device 010 can be greatly improved.
The laser processing apparatus 010 of the present embodiment is further described below:
referring to fig. 1, in the present embodiment, the laser processing apparatus includes a frame 100, a laser head 200 and a conveying mechanism 300 are both disposed on the frame 100, the laser head 200 and the conveying mechanism 300 are disposed at an interval along a preset direction, and the laser head 200 is disposed right above the conveying mechanism 300. The preset direction is a first preset direction, and it should be noted that in this embodiment, the first preset direction is an up-down direction. It should be noted that, in this embodiment, the second preset direction is a horizontal left direction, and the first preset direction and the second preset direction are substantially perpendicular to each other. So at work piece 800 along the second in-process of predetermineeing the direction motion earlier and be close to the processing position of laser head 200 gradually, process the back at the processing position, can keep away from the processing position of laser head 200 gradually under conveying mechanism 300's drive.
It should be noted that, in this embodiment, the position to be processed of the workpiece 800 is an upper end surface of the workpiece 800, and the conveying mechanism 300 and the laser head 200 are arranged at an interval in the vertical direction, it can be understood that, in other embodiments, the positional relationship between the first preset direction and the second preset direction may also be specifically set according to the processing requirement, for example, when the position to be processed is a front side surface of the workpiece 800, the laser head 200 is arranged on the left side of the conveying mechanism 300, that is, the first preset direction and the second preset direction are set to be the same direction.
Fig. 2 is an enlarged view of a portion of the structure at ii in fig. 1. Referring to fig. 2, the conveying mechanism 300 further includes a driving member and a conveying member 320, and the conveying member 320 is driven by the driving member to operate. The conveying member 320 is provided with a plurality of clamp plates 310, the clamps are arranged on the clamp plates 310, and during the operation of the conveying member 320, the clamp plates 310 and the clamps on the clamp plates 310 operate together, so as to drive the workpiece 800 in the clamps to move.
Further, the conveying member 320 is a conveying chain, the plurality of clamp plates 310 are arranged at intervals along the circumference of the conveying chain, so that the conveying chain drives the plurality of clamp plates 310 to circularly move, the moving path of the clamp plates 310 is a closed-loop path, and each clamp plate 310 circularly works according to the sequence of loading, processing and unloading. Preferably, the drive member is a servo motor. It is understood that in other embodiments, the specific type of the conveying member 320 may be set according to the requirement, for example, the conveying member is set as a conveyor belt, etc., and the clamp plate 310 can be driven to reciprocate circularly.
It should be further noted that in the present embodiment, the moving path of the clamping plate 310 is a closed-loop path and is driven by the conveying element 320 to move circularly, and it is understood that in other embodiments, the moving path of the clamping plate 310 may also be an open-loop path, and the conveying element 320 drives the clamping plate 310 to reciprocate along the open-loop path.
Further, a plurality of clamps are arranged on each clamp plate 310, and the plurality of clamps are arranged at intervals along a second preset direction. Preferably, the fixture is a mounting hole 311 opened on the fixture plate 310, and the workpiece 800 is received in the mounting hole 311. It should be noted that, in this embodiment, the workpiece 800 is substantially in a long cylindrical shape, the fixture is set as the mounting hole 311, and the workpiece 800 can be conveniently inserted therein, and the dismounting and mounting are convenient.
It should be further noted that, in this embodiment, each of the fixture plates 310 is provided with three mounting holes 311 along the second preset direction, and it can be understood that, in other specific embodiments, the number of the mounting holes 311 on each of the fixture plates 310 may also be specifically set according to the requirement of a user, for example, the number of the mounting holes 311 on each of the fixture plates 310 is set to be two or four, and the like.
Referring to fig. 2, in the present embodiment, the laser processing apparatus 010 further includes a collecting mechanism for collecting the processed workpiece 800, and the collecting mechanism is disposed downstream of the conveying mechanism 300. Preferably, the collecting mechanism comprises a collecting tank 400 arranged below the conveying mechanism 300, when the processed workpiece 800 moves to the downstream of the conveying mechanism 300 along with the clamp plate 310 and gradually turns over to the position below the conveying chain 320, because the workpiece 800 is embedded in the mounting hole 311, the workpiece 800 naturally breaks away from the mounting hole 311 under the action of gravity and enters the collecting tank 400, and the structure is simple and the operation is convenient. It will be appreciated that when other configurations of clamps, such as pneumatic clamps or robotic arms, are used in other embodiments, the clamps release the workpiece 800 after the workpiece 800 has moved to a position between the conveyor 320 and the collection tank 400 (i.e., the underside of the conveyor 320), and the workpiece 800 can naturally fall into the collection tank 400 under the force of gravity.
It should be noted that the specific structure of the collecting mechanism is not limited herein, and it is understood that in other embodiments, the collection of the processed workpiece 800 may be realized by disposing a robot downstream of the conveying chain 320. Meanwhile, in the present embodiment, in order to enable the workpiece 800 to fall into the collecting tank 400 under the action of gravity to realize the recycling of the workpiece 800, the closed-loop path of the movement of the clamp plate 310 is arranged in a vertical plane, and it can be understood that when the collecting mechanism is arranged as a mechanical arm or the like, and the gravity-assisted disassembly is not required, the closed-loop path of the movement of the clamp plate 310 can also be arranged in a horizontal plane.
Fig. 3 is a schematic partial structure diagram of the laser processing apparatus 010 provided in this embodiment. Referring to fig. 1 and 3, in the present embodiment, the laser processing apparatus 010 further includes a feeding channel 510, the feeding channel 510 is disposed above the upstream of the conveying member 320, the workpiece 800 is transferred to the mounting hole 311 through the feeding channel 510, the feeding process is automated, convenient and fast, and the workpiece 800 is accurately positioned. Furthermore, because each fixture plate 310 is provided with three mounting holes 311, in order to improve the clamping efficiency of the workpiece 800, three feeding pipes 530 are arranged at one end of the feeding channel 510 close to the fixture plate 310, and the three feeding pipes 530 are respectively arranged in one-to-one correspondence with the three mounting holes 311 on the same fixture plate 310, so that the workpiece 800 can be embedded into the plurality of mounting holes 311 on the same fixture plate 310 at the same time, which is beneficial to reducing the time spent on clamping the workpiece 800, and further improves the processing efficiency of the laser processing device 010. Further, since the feeding channel 510 needs to feed a plurality of mounting holes 311 at the same time, a plurality of branch flow paths 520 are further disposed between the feeding channel 510 and the feeding pipe 530, and each branch flow path 520 has two discharging ends. In the present embodiment, since three feeding pipes 530 are provided, the number of the branch switch 520 is two, and the branch switch is a first branch switch and a second branch switch. The feed end of the first branch is communicated with the feed channel 510, one of the discharge ends is communicated with one feeding pipe 530, and the other discharge end is communicated with the feed end of the second branch; two discharge ends of the second branch are respectively communicated with the other two feeding pipes 530. It should be noted that, in other embodiments, when the number of the feeding pipes 530 is N, the number of the branch flow paths 520 is N-1.
Fig. 4 is a schematic structural diagram of a feeding mechanism 600 in the laser processing apparatus 010 provided in this embodiment. Referring to fig. 3 and fig. 4, in the present embodiment, the laser processing apparatus 010 further includes a feeding mechanism 600, and the feeding mechanism 600 is used for conveying the workpiece 800 to the feeding channel 510. Specifically, the feeding mechanism 600 includes a vibrating disk. The vibration plate includes a body 610 and a feeding portion disposed above the body 610, and the body 610 is fixedly coupled to the frame 100. A spirally rising guide rail 621 is provided along the inner peripheral wall of the feeding portion, the guide rail 621 communicates with the feeding passage 510, and a plurality of workpieces 800 are stored in a storage tank 622 at the bottom of the feeding portion. The workpieces 800 are driven to move in a single row along the guide rail 621 by the vibration generated from the body 610, enter the feeding passage 510, and are finally conveyed into the mounting hole 311. It will be appreciated that in other embodiments, the feeding may be performed manually or by a robot.
Fig. 5 is an enlarged view of a portion of the structure at v in fig. 4. Referring to fig. 4 and 5, in the present embodiment, the laser processing apparatus 010 further includes a sorting mechanism 700, and the misaligned workpiece 800 can be prevented from entering the feeding channel 510 by the sorting mechanism 700. In this embodiment, the surface to be processed of the workpiece 800 is an end surface at one axial end thereof, and the surface to be processed is located behind the feeding path thereof during the feeding process, so that after the workpiece 800 enters the mounting hole 311, the surface to be processed of the workpiece 800 faces upward and is opposite to the laser head 200, so that the laser head 200 can process the surface to be processed, and the workpiece 800 is in a normal state; the misalignment is a situation in which the surface to be processed is located in front of the feeding path in the feeding process, so that after the workpiece 800 enters the mounting hole 311, the surface to be processed of the workpiece 800 faces downward, and the laser head 200 cannot process the surface to be processed.
Further, the sorting mechanism 700 comprises a detector 710 and a sorter 720 which are arranged on the material guide rail 621 of the vibrating tray, the detector 710 is electrically connected with the sorter 720, and when the detector 710 detects that a certain workpiece 800 is in a misplaced state, the detector 710 controls the sorter 720 to operate, so that the misplaced workpiece 800 is removed. Preferably, the detector 710 includes a vision detector 710, which determines the state of the workpiece 800 by capturing an image signal of the workpiece 800 and comparing the image signal with a predetermined image, and outputs an electrical signal to control the operation of the sorter 720. Preferably, the separator 720 includes an air cylinder, and after receiving the working signal transmitted from the detector 710, the air cylinder pushes the workpiece 800 away from the material guiding rail 621 and falls into the discharge chute through the driving rod, and the workpiece 800 falling into the discharge chute can continue to enter the material guiding rail 621, so as to implement real-time detection and circular feeding.
It should be noted that the specific structure of the sorter 720 is not limited herein, and it should be understood that in other embodiments, a hydraulic cylinder or an air nozzle may be selected to remove the misaligned workpiece 800 according to the requirement of the user.
Referring to fig. 1, a plurality of laser heads 200 are arranged at intervals along the second predetermined direction, in this embodiment, the number of the laser heads 200 is three, and the three laser heads 200 are respectively used for processing the workpiece 800 in the three mounting holes 311 on different clamp plates 310. It should be noted that the processing method of the laser processing apparatus 010 is not limited herein, and it is to be understood that in other embodiments, the processing method may be specifically set as needed, for example, a method of processing a plurality of workpieces 800 on the same jig plate 310 by using three laser heads 200, or the like.
Fig. 6 is an enlarged view of a portion of the structure at vi in fig. 1. Referring to fig. 6, in the present embodiment, a slide rail 110 is disposed on the frame 100, and the laser head 200 is slidably disposed on the slide rail 110. The slide rail 110 extends along a first preset direction, and the distance between the laser head 200 and the conveying mechanism 300 can be adjusted through the sliding laser head 200, so that when the laser processing device 010 processes workpieces 800 of different types, the focus of laser emitted by the laser head 200 can be ensured to be positioned on a surface to be processed of the workpiece 800 through the sliding laser head 200. It is understood that in other embodiments, the conveying mechanism 300 or the clamp plate 310 thereon may be configured to be slidable along the first predetermined direction according to requirements, so as to adjust the distance between the laser head 200 and the surface of the workpiece 800 to be processed.
In the laser processing apparatus 010 of the embodiment of the present invention, when in use, the conveying member 320 is driven by the servo motor to operate intermittently; when the conveying member 320 runs, the workpiece 800 is driven to move along the second preset direction, and meanwhile, the workpiece 800 which is positioned at the downstream of the conveying chain 320 and is turned over to the clamp plate 310 at the lower side of the conveying member 320 is separated from the mounting hole 311 under the action of gravity and falls into the collecting tank 400, so that the unloading is realized; when the operation of the conveyor chain 320 is temporarily stopped, the laser head 200 performs surface processing on the workpiece 800 located at the processing position below the conveyor chain, and the workpiece 800 conveyed by the feeding mechanism is loaded into the mounting hole 311 sequentially through the feeding passage 510, the diversion branch passage 520, and the feeding pipe 530 to perform loading. The laser processing device 010 can automatically sort, so that the processing correctness is ensured, the staggered workpieces 800 return to the storage tank 622 under the action of the sorter 720, feeding is continued, and the processing process is continuous and smooth and has high quality; the processing efficiency is greatly improved through the cyclic intermittent operation of the conveying mechanism 300; through set up collecting vat 400 below conveying mechanism 300 for work piece 800 has not only been exempted manual operation, has improved machining efficiency through gravity automatic discharge, installs simple structure moreover, can effective reduce cost.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A laser processing apparatus, comprising:
a laser head and a conveying mechanism; the laser head and the conveying mechanism are oppositely arranged at intervals along a preset direction; the conveying mechanism is provided with a plurality of clamps for clamping workpieces and is used for driving the workpieces to move relative to the laser head; the laser head is used for processing the workpiece.
2. The laser processing apparatus according to claim 1, wherein:
the conveying mechanism comprises a conveying part and a plurality of clamp plates connected to the conveying part, and the clamp plates can move relative to the laser heads under the driving of the conveying part; the clamp plate is provided with the clamp.
3. The laser processing apparatus according to claim 2, wherein:
the motion path of the clamp is a closed loop path, and the conveying piece is used for driving the clamp to circularly move along the closed loop path.
4. The laser processing apparatus according to any one of claims 1 to 3, wherein:
the clamp is a mounting hole used for accommodating the workpiece.
5. The laser processing apparatus according to claim 1, wherein:
the laser processing device also comprises a collecting mechanism for collecting the processed workpiece;
preferably, the collecting mechanism comprises a collecting tank arranged below the conveying mechanism, and the workpiece in the clamp can be separated from the clamp into the collecting tank under the action of gravity.
6. The laser processing apparatus according to claim 1, wherein:
the laser processing device also comprises a feeding channel, wherein the feeding channel is used for enabling the workpiece to enter the clamp through the feeding channel;
preferably, one end of the feeding channel, which is close to the clamp, is further provided with a plurality of branch paths which are communicated with each other, and discharge ends of the branch paths are used for being communicated with the clamp.
7. The laser processing apparatus according to claim 6, wherein:
the laser processing device also comprises a feeding mechanism, wherein the feeding mechanism is used for transferring the workpiece into the feeding channel;
preferably, the feeding mechanism comprises a vibrating disc.
8. The laser processing apparatus according to claim 7, wherein:
the laser processing device also comprises a sorting mechanism, wherein the sorting mechanism is used for preventing the misplaced workpiece from entering the feeding channel;
preferably, the sorting mechanism comprises a detector and a sorter electrically connected with the detector; when the detector detects that the workpiece is in a dislocation state, the sorter rejects the workpiece;
preferably, the detector comprises a visual detector;
preferably, the classifier comprises a hydraulic cylinder, an air cylinder or an air nozzle.
9. The laser processing apparatus according to claim 1, wherein:
the laser processing device comprises a plurality of laser heads, and the laser heads are arranged at intervals along the moving direction of the workpiece.
10. The laser processing apparatus according to claim 1, wherein:
the laser processing device also comprises a rack, and the laser head and the conveying mechanism are both arranged on the rack; the laser head is connected with the frame in a sliding mode and used for adjusting the distance between the laser head and the clamp.
CN201920208261.0U 2019-02-18 2019-02-18 Laser processing apparatus Active CN209919089U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920208261.0U CN209919089U (en) 2019-02-18 2019-02-18 Laser processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920208261.0U CN209919089U (en) 2019-02-18 2019-02-18 Laser processing apparatus

Publications (1)

Publication Number Publication Date
CN209919089U true CN209919089U (en) 2020-01-10

Family

ID=69068451

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920208261.0U Active CN209919089U (en) 2019-02-18 2019-02-18 Laser processing apparatus

Country Status (1)

Country Link
CN (1) CN209919089U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111331334A (en) * 2020-03-24 2020-06-26 成都岁生科技有限责任公司 Bogie disassembling and assembling system and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111331334A (en) * 2020-03-24 2020-06-26 成都岁生科技有限责任公司 Bogie disassembling and assembling system and method

Similar Documents

Publication Publication Date Title
CN209919089U (en) Laser processing apparatus
CN107536179A (en) Zipper-cutting head penetrating machine and zipper strip cut-out, the method for penetrator
CN108212828B (en) Full-automatic battery inspection equipment
CN103894629A (en) Bar machining numerical control machine tool capable of automatically feeding and unloading
ES2696233T3 (en) Handling device for wire EDM machines
CN108890460B (en) Double-side grinding processing equipment for crankshaft connecting rod
CN108857791B (en) Bilateral grinding device for automobile part crankshaft connecting rod
CN109663746B (en) Automatic clamping and unloading mechanism of spinning clamp
CN204893369U (en) Diode magnetic ring assembly machine
CN109759814B (en) Spring feeding device, spring mounting equipment and method for assembling optical fiber connector
CN209986499U (en) Front sleeve automatic feeding and riveting device for automatic assembly of drill chuck
CN209834799U (en) Electronic component circulation feeding mechanism
CN109659792B (en) Automatic charging device and method for assembling charging connector metal shell
CN110911235A (en) Circuit breaker magnetic tripping core assembly welding system
CN108356451B (en) full-automatic welding production line based on vision
EP0404577B1 (en) Assembling apparatus using back-up pins for supporting printed circuit board
CN209174681U (en) A kind of intelligent punching pipes machine of pneumatic crawl
CN213887187U (en) Automatic detection device and assembling device for ring-shaped objects
CN211332144U (en) Horizontal drilling beveler
CN213672754U (en) Nut side direction automatic clamping mechanism
CN212402549U (en) Automatic bar feeding and positioning device
CN211072318U (en) Full-automatic jewelry buckle chain welding equipment
CN213034042U (en) Automatic electrode detection device
CN105014467A (en) Discharging mechanism
CN214203642U (en) Automatic chip blanking equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant