CN209911918U - Novel radiator structure - Google Patents
Novel radiator structure Download PDFInfo
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- CN209911918U CN209911918U CN201920961497.1U CN201920961497U CN209911918U CN 209911918 U CN209911918 U CN 209911918U CN 201920961497 U CN201920961497 U CN 201920961497U CN 209911918 U CN209911918 U CN 209911918U
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- Prior art keywords
- heat
- radiating
- section
- radiating fins
- heat conducting
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
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Abstract
The utility model discloses a novel radiator structure, which splits an integral radiating fin into two radiating fins arranged in parallel, forms a fan mounting position on the top of the two radiating fins, the middle part of the radiating tube is positioned at the bottom of a heat conducting bottom plate, and two ends of the radiating tube respectively pass through the two radiating fins; when the radiating tube heat dissipation device is used, the radiating tube positioned at the bottom of the heat conduction bottom plate is directly contacted with the GPU for heat exchange to reduce intermediate thermal resistance and improve heat dissipation performance, and meanwhile, the two ends of the radiating tube respectively penetrate through the radiating fins, so that the contact area between the radiating tube and the radiating fins is greatly improved, and efficient heat dissipation can be realized by arranging fewer radiating tubes.
Description
Technical Field
The utility model relates to a display card heat dissipation technical field especially relates to a novel radiator structure.
Background
NV and AMD continue to deliver high-power GPU processors for increasingly clear high-fluency video games. High power GPUs require higher performance heat sinks for their heat removal, and therefore, low cost, high performance heat dissipation solutions are needed. The conventional GPU heat dissipation generally adopts a structure that an integral fin is matched with a plurality of heat dissipation pipes. In the heat conduction process, the GPU transmits heat energy to the bottom plate, the bottom plate transmits the heat energy to the radiating tubes, and finally the radiating tubes transmit the heat energy to the fins.
SUMMERY OF THE UTILITY MODEL
For solving the technical problem who exists among the background art, the utility model provides a novel radiator structure.
The utility model provides a pair of novel radiator structure, include: the heat-conducting base plate, the first radiating fins, the second radiating fins, the radiating pipe and the fan;
the first radiating fins and the second radiating fins are arranged on the top of the heat conducting bottom plate and are arranged in parallel perpendicular to the heat conducting bottom plate, the top of each first radiating fin and the top of each second radiating fin form a fan installation position, the fan is located on the fan installation position, the middle of each first radiating fin is provided with a first through hole extending perpendicular to the direction of the first radiating fin, the middle of each second radiating fin is provided with a second through hole extending perpendicular to the direction of the second radiating fin, each radiating pipe comprises a heat conducting section located in the middle of the radiating pipe and a first radiating section and a second radiating section connected to two ends of the heat conducting section, the heat conducting section is located at the bottom of the heat conducting bottom plate, and the first radiating section and the second radiating section respectively penetrate through the first through hole and the second through.
Preferably, the bottom of the heat conduction bottom plate is provided with a containing groove for containing the heat conduction section.
Preferably, a plurality of radiating pipes are included, and the heat conducting sections of the plurality of radiating pipes are arranged side by side at the bottom of the heat conducting base plate.
Preferably, the heat conducting section is located below the fan.
Preferably, a fan receiving groove is formed on the fan mounting position.
Preferably, the first heat dissipation section, the heat conduction section and the second heat dissipation section form an S-shaped structure.
Preferably, the first heat dissipation section and the second heat dissipation section are symmetrically arranged at two ends of the heat conduction section.
Preferably, the heat conducting bottom plate is made of an aluminum plate.
In the novel radiator structure, the whole radiating fins are split into two radiating fins arranged in parallel, the fan mounting positions are formed at the tops of the two radiating fins, the middle parts of the radiating tubes are positioned at the bottom of the heat conducting bottom plate, and the two ends of the radiating tubes respectively pass through the two radiating fins; when the radiating tube heat dissipation device is used, the radiating tube positioned at the bottom of the heat conduction bottom plate is directly contacted with the GPU for heat exchange to reduce intermediate thermal resistance and improve heat dissipation performance, and meanwhile, the two ends of the radiating tube respectively penetrate through the radiating fins, so that the contact area between the radiating tube and the radiating fins is greatly improved, and efficient heat dissipation can be realized by arranging fewer radiating tubes.
Drawings
Fig. 1 is a schematic structural view of a novel heat sink structure provided by the present invention.
Fig. 2 is a schematic illustration of a partial explosion of fig. 1.
Detailed Description
As shown in fig. 1 and 2, fig. 1 is a schematic structural diagram of a novel heat sink structure according to the present invention, and fig. 2 is a schematic partial explosion diagram of fig. 1.
Referring to fig. 1 and 2, the utility model provides a novel radiator structure: the heat-conducting base plate 1, the first radiating fins 2, the second radiating fins 3, the radiating pipe 4 and the fan 5;
first heat radiation fin 2 and second heat radiation fin 3 set up at heat conduction bottom plate 1 top and the two is perpendicular to heat conduction bottom plate 1 parallel arrangement, and first heat radiation fin 2 and the top of second heat radiation fin 3 form fan installation position, and fan 5 is located on the fan installation position, first heat radiation fin 2 middle part is equipped with the first through-hole that extends perpendicular to its direction, and second heat radiation fin 3 middle part is equipped with the second through-hole that extends perpendicular to its direction, and cooling tube 4 is including being located the heat conduction section 41 at middle part and connecting first heat dissipation section 42 and the second heat dissipation section 43 at heat conduction section 41 both ends, heat conduction section 41 is located heat conduction bottom plate 1 bottom, first heat dissipation section 42 with second heat dissipation section 43 runs through first through-hole and second through-hole respectively.
In the specific working process of the novel radiator structure of this embodiment, the heat conduction bottom plate covers in the GPU top for GPU directly supports the heat conduction section that leans on the cooling tube, and in the heat transfer process, GPU gives the heat conduction section of cooling tube with the heat conduction, then the heat transmits for first heat radiation fin and second heat radiation fin through the heat dissipation section of cooling tube on the one hand, and on the other hand also directly transmits for two heat radiation fin through the heat conduction bottom plate, thereby improves heat conduction efficiency greatly, has improved heat dispersion.
In this embodiment, the proposed novel heat sink structure splits an integral heat sink into two heat sinks arranged in parallel, a fan mounting location is formed on the top of the two heat sinks, the middle of the heat sink is located at the bottom of the heat conducting bottom plate, and two ends of the heat sink respectively pass through the two heat sinks; when the radiating tube heat dissipation device is used, the radiating tube positioned at the bottom of the heat conduction bottom plate is directly contacted with the GPU for heat exchange to reduce intermediate thermal resistance and improve heat dissipation performance, and meanwhile, the two ends of the radiating tube respectively penetrate through the radiating fins, so that the contact area between the radiating tube and the radiating fins is greatly improved, and efficient heat dissipation can be realized by arranging fewer radiating tubes.
In a specific embodiment, the bottom of the heat conducting bottom plate is provided with a receiving groove for receiving the heat conducting section 41; on the one hand, the heat conduction pipe and the heat conduction bottom plate are conveniently matched and arranged, and on the other hand, the direct heat exchange area of the heat conduction pipe and the heat conduction bottom plate is increased.
In the specific arrangement manner of the heat dissipation pipes, a plurality of heat dissipation pipes 4 can be arranged according to the GPU heat dissipation requirement, and the heat conduction sections 41 of the plurality of heat dissipation pipes 4 are arranged side by side at the bottom of the heat conduction base plate 1.
In other embodiments, the heat conducting section 41 is located below the fan 5, so that heat conducted by the heat conducting section through the heat conducting bottom plate can be quickly dissipated.
In a specific arrangement mode of the heat dissipation fins, a fan accommodating groove is formed in the fan installation position, and heat exchange efficiency of the heat dissipation fins is improved when the fan rotates.
In the specific arrangement of the heat dissipation pipe, the first heat dissipation section 42, the heat conduction section 41 and the second heat dissipation section 43 form an S-shaped structure.
In other embodiments, the first heat dissipating section 42 and the second heat dissipating section 43 are symmetrically disposed at both ends of the heat conducting section 41.
In a specific selection manner of the heat conducting base plate, the heat conducting base plate 1 is made of an aluminum plate.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. A novel heat sink structure, comprising: the heat-conducting base plate (1), the first radiating fins (2), the second radiating fins (3), the radiating pipe (4) and the fan (5);
the first radiating fins (2) and the second radiating fins (3) are arranged at the top of the heat conducting base plate (1) and are arranged in parallel perpendicular to the heat conducting base plate (1), the top parts of the first radiating fins (2) and the second radiating fins (3) form a fan mounting position, the fan (5) is positioned on the fan mounting position, the middle parts of the first radiating fins (2) are provided with first through holes extending perpendicular to the direction of the first radiating fins, the middle parts of the second radiating fins (3) are provided with second through holes extending perpendicular to the direction of the second radiating fins, the radiating pipe (4) comprises a heat conducting section (41) positioned at the middle part and a first radiating section (42) and a second radiating section (43) connected to the two ends of the heat conducting section (41), the heat conduction section (41) is located at the bottom of the heat conduction bottom plate (1), and the first heat dissipation section (42) and the second heat dissipation section (43) penetrate through the first through hole and the second through hole respectively.
2. The new heat sink structure as claimed in claim 1, characterized in that the bottom of the heat conducting bottom plate (1) is provided with a receiving groove for receiving the heat conducting section (41).
3. A novel radiator structure according to claim 1, characterized by comprising a plurality of radiating pipes (4), and the heat conducting sections (41) of the plurality of radiating pipes (4) are arranged side by side at the bottom of the heat conducting base plate (1).
4. A new radiator structure according to claim 1, characterised in that said heat conducting section (41) is located below the fan (5).
5. The novel heat sink structure as claimed in claim 1, wherein the fan mounting site is formed with a fan receiving groove.
6. The new heat sink structure as recited in claim 1, characterized in that the first heat dissipating section (42), the heat conducting section (41), and the second heat dissipating section (43) form an S-shaped structure.
7. The new heat sink structure as recited in claim 1, characterised in that the first heat dissipating section (42) and the second heat dissipating section (43) are symmetrically arranged at both ends of the heat conducting section (41).
8. A new heat sink structure according to claim 1, characterized in that the heat conducting bottom plate (1) is made of aluminium plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920961497.1U CN209911918U (en) | 2019-06-24 | 2019-06-24 | Novel radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920961497.1U CN209911918U (en) | 2019-06-24 | 2019-06-24 | Novel radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209911918U true CN209911918U (en) | 2020-01-07 |
Family
ID=69050399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920961497.1U Active CN209911918U (en) | 2019-06-24 | 2019-06-24 | Novel radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209911918U (en) |
-
2019
- 2019-06-24 CN CN201920961497.1U patent/CN209911918U/en active Active
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