CN209842539U - Cooling device for mainframe computer - Google Patents

Abstract

The utility model discloses a computer mainframe cooling device in the technical field of computer mainframe heat dissipation, comprising a case, the inner side wall of the case is installed with a main board, the side wall of the case is equipped with a dust removal device, and the side wall of the case is provided with a There is an air inlet corresponding to the dust removal device, a cooling device corresponding to the dust removal device is installed on the inner side wall of the cabinet, an air outlet fan is installed on the top wall of the cabinet, and the dust removal device includes a slot, and the inside of the slot is A dust filter plate is slidingly inserted, and the dust filter plate is provided with a dust filter net corresponding to the air inlet. By adding structures such as slots, plate brushes and dust filter plates, the air that is about to enter the chassis can be filtered to prevent dust from entering the chassis. , to prevent the impact of dust on the circuit board, by adding liquid pumps, liquid outlet pipes and cooling fins, and combining liquid cooling and air cooling, the heat dissipation efficiency of the computer host is greatly improved, reaching Better cooling effect.

Description

Cooling device for mainframe computer

technical field

The utility model relates to the technical field of cooling of a computer mainframe, in particular to a cooling device for a computer mainframe.

Background technique

The computer host refers to the main body part of the computer except the input and output devices. It is also a control box for placing the main board and other main components. Usually includes CPU, memory, motherboard, optical drive, power supply, and other input and output controllers and interfaces. Such as USB controller, graphics card, network card, sound card and so on. Those located inside the main chassis are usually called internal devices, while those located outside the main chassis are usually called peripherals.

Typically, a host is a general purpose electronic computer with internal memory and peripherals. Internal memory is used to store programs, raw data and intermediate results of data processing. Peripheral devices include external memory and input and output devices. Commonly used disk storage and tape drives are used as external storage. The former is used to store operating systems, system files, batch-processed data, and establish databases; the latter is mainly used to record information received and sent for long-term archiving, and is also used for programs Debugging and failure testing. Input and output devices include keyboard monitors, line printers, X-Y plotters, and graphics terminals. According to the scale of the system, the host computer should have sufficient data processing capacity to efficiently process random data information.

When the computer mainframe performs a large amount of data calculation and processing, it often generates a large amount of heat. Most of the heat comes from the main board and auxiliary structures in the mainframe box. Therefore, in order to achieve a higher cooling effect of the mainframe Starting with the heat dissipation of the main board, a computer host cooling device is proposed for this purpose.

Utility model content

The purpose of this utility model is to provide a computer mainframe cooling and cooling device to solve the problems raised in the above-mentioned background technology.

In order to achieve the above object, the utility model provides the following technical solutions: a computer host cooling device, including a chassis, the inner side wall of the chassis is installed with a main board, the side wall of the chassis is equipped with a dust removal device, the side of the chassis is The wall is provided with an air inlet corresponding to the dust removal device, the inner wall of the case is equipped with a heat dissipation device corresponding to the dust removal device, the top wall of the case is equipped with an air outlet fan, the dust removal device includes a slot, and the insertion A dust filter plate is slidingly inserted into the slot, and the dust filter plate is provided with a dust filter net corresponding to the air inlet, and a through hole corresponding to the air inlet is opened on the slot, and a plate brush is fixedly connected to the side wall of the through hole. , the bristles of the scrub brush conflict with the dust filter, and the inner side wall of the chassis is fixedly connected with a dust cover corresponding to the air inlet.

Preferably, the heat dissipation device includes a coolant tank, the outer wall of the coolant tank is fixedly connected to the inner wall of the chassis, the coolant tank is connected to the inner side of the dust cover through an air duct, and the coolant tank A liquid pump is fixedly connected to the inner wall of the liquid pump, and the output end of the liquid pump is connected with a liquid outlet pipe. After the liquid outlet pipe is connected to the main board, it returns to the coolant tank through the liquid inlet pipe. An exhaust fan is installed on the wall, and the liquid pump, the exhaust fan, the air outlet fan, the switch and the external power supply together form a series circuit through wires.

Preferably, the position of the exhaust fan corresponds to that of the exhaust fan.

Preferably, one end of the air duct in the coolant tank is lower than the liquid level of the coolant.

Preferably, a sponge block is fixedly connected to the underside of the exhaust fan.

Preferably, the liquid inlet pipe is fixedly connected with cooling fins arranged equidistantly.

Compared with the prior art, the beneficial effects of the utility model are:

1. By adding structures such as slots, board brushes and dust filter plates, the air that will enter the chassis can be filtered to prevent dust from entering the chassis and prevent dust from affecting the circuit board;

2. By adding structures such as liquid pumps, liquid outlet pipes, and heat dissipation fins, the heat dissipation efficiency of the main computer is greatly improved by combining liquid cooling and air cooling, and a good cooling effect is achieved.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a structural representation of the utility model;

Fig. 2 is the enlarged schematic diagram of part of the structure of the utility model;

Fig. 3 is an enlarged schematic diagram of the structure of the dust removal device of the present invention.

In the accompanying drawings, the list of parts represented by each label is as follows:

1-chassis, 2-main board, 3-dust removal device, 31-slot, 32-board brush, 33-dust filter plate, 34-dust cover, 35-dust filter, 4-radiating device, 41-coolant tank, 42 -liquid pump, 43-air duct, 44-exhaust fan, 45-sponge block, 46-liquid outlet pipe, 47-liquid inlet pipe, 48-radiating fins, 5-air outlet fan.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

Please refer to Fig. 1-3, the utility model provides a kind of technical solution: a kind of computer host computer cooling cooling device, comprises chassis 1, and the inner side wall of chassis 1 is installed with motherboard 2, and the side wall of chassis 1 is installed with dust removal device 3, chassis The side wall of 1 is provided with an air inlet corresponding to the dust removal device 3, the inner wall of the cabinet 1 is installed with a heat sink 4 corresponding to the dust removal device 3, the top wall of the cabinet 1 is installed with an air outlet fan 5, and the dust removal device 3 includes a slot 31, a dust filter plate 33 is slidingly inserted in the slot 31, the dust filter plate 33 is provided with a dust filter net 35 corresponding to the air inlet, the slot 31 is provided with a through hole corresponding to the air inlet, and the side wall of the through hole A scrub brush 32 is fixedly connected, and the bristles of the scrub brush 32 conflict with the dust filter 35. The inner wall of the cabinet 1 is fixedly connected with a dust cover 34 corresponding to the air inlet. This structure can filter the air that will enter the cabinet 1. Prevent dust from entering the chassis 1, and prevent dust from affecting the circuit board.

The cooling device 4 includes a coolant tank 41, the outer wall of the coolant tank 41 is fixedly connected to the inner wall of the cabinet 1, the coolant tank 41 is connected through the inner side of the dust cover 34 through the air duct 43, and the inner side wall of the coolant tank 41 A liquid pump 42 is fixedly connected, and the output end of the liquid pump 42 is connected with a liquid outlet pipe 46. After the liquid outlet pipe 46 is connected to the main board 2, it returns to the coolant tank 41 through the liquid inlet pipe 47. The top wall of the coolant tank 41 An air extraction fan 44, a liquid pump 42, an air extraction fan 44, an air outlet fan 5, a switch and an external power supply are installed to form a series circuit through wires. This structure combines liquid cooling and air cooling for heat dissipation. The heat dissipation efficiency of the computer mainframe is improved, and a better cooling effect is achieved.

Wherein, the air exhaust fan 44 is corresponding to the position of the air outlet fan 5, and one end of the air duct 43 in the coolant tank 41 is lower than the liquid level of the coolant, and the lower side of the air exhaust fan 44 is fixedly connected with a sponge block 45, and the liquid enters Radiating fins 48 arranged equidistantly are fixedly connected to the tube 47 .

A specific application of this embodiment is: connect the series circuit, the liquid pump 42, the exhaust fan 44 and the air outlet fan 5 start to run, the liquid pump 42 pumps the cooling liquid into the liquid outlet pipe 46, and after flowing through the main board 2, the main board 2 The heat on the air is taken away and enters the liquid inlet pipe 47, and the running exhaust fan 44 draws the outside air into the coolant tank 41 through the dust filter 35, and then continues to be pumped to the inside of the chassis 1, and the outside air passes through the dust filter 35 At this time, the dust in the air is filtered by the dust filter, and the air drawn in enters the coolant tank 41 through the air duct 43. The sponge block 45 also has a certain dust filtering effect, which improves the dust filtering effect. The air drawn in passes through the cooling fins. At 48 o'clock, the heat on the cooling fins 48 is taken away, discharged through the air outlet fan 5, and the whole cooling process is completed. The dust filter plate 33 is a sliding plug-in type. Second, at this time, the scrub brush 32 can brush the dust on the dust filter net 35, which is more convenient and practical.

In the description of this specification, descriptions referring to the terms "one embodiment", "example", "specific example" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in the description of the present invention. In at least one embodiment or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not exhaust all details, nor do they limit the utility model to the specific implementations described. Obviously, many modifications and variations can be made based on the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the utility model, so that those skilled in the art can well understand and utilize the utility model. The invention is to be limited only by the claims and their full scope and equivalents.

Claims (6)

1. A computer mainframe cooling device, comprising a chassis (1), characterized in that: the inner wall of the chassis (1) is equipped with a main board (2), and the side wall of the chassis (1) is equipped with a dust removal device ( 3), the side wall of the chassis (1) is provided with an air inlet corresponding to the dust removal device (3), and the inner wall of the chassis (1) is installed with a heat dissipation device (4) corresponding to the dust removal device (3) , the top wall of the chassis (1) is equipped with an air outlet fan (5), the dust removal device (3) includes a slot (31), and a dust filter plate (33) is slidably inserted into the slot (31), The dust filter plate (33) is provided with a dust filter net (35) corresponding to the air inlet, and the slot (31) is provided with a through hole corresponding to the air inlet, and a plate brush is fixedly connected to the side wall of the through hole (32), the bristles of the brush (32) conflict with the dust filter (35), and the inner wall of the chassis (1) is fixedly connected with a dust cover (34) corresponding to the air inlet. 2. A computer mainframe cooling and cooling device according to claim 1, characterized in that: the heat dissipation device (4) includes a coolant tank (41), and the outer wall of the coolant tank (41) is in contact with the chassis ( 1) is fixedly connected to the inner side wall, the coolant tank (41) is connected through the inner side of the dust cover (34) through the air duct (43), and the inner side wall of the coolant tank (41) is fixedly connected to a liquid pump (42), the output end of the liquid pump (42) is connected with a liquid outlet pipe (46), and the liquid outlet pipe (46) is connected to the main board (2) and returns to the coolant through the liquid inlet pipe (47). In the tank (41), an exhaust fan (44) is installed on the top wall of the coolant tank (41), the liquid pump (42), the exhaust fan (44), the air outlet fan (5), the switch and the external The power supplies together form a series circuit through wires. 3. The computer mainframe cooling device according to claim 2, characterized in that: the position of the exhaust fan (44) corresponds to that of the air outlet fan (5). 4. The computer mainframe cooling device according to claim 2, characterized in that: one end of the air guide pipe (43) in the coolant tank (41) is lower than the liquid level of the coolant. 5. The computer mainframe cooling device according to claim 2, characterized in that: a sponge block (45) is fixedly connected to the lower side of the exhaust fan (44). 6 . The computer mainframe cooling device according to claim 2 , characterized in that: the liquid inlet pipe ( 47 ) is fixedly connected with cooling fins ( 48 ) arranged equidistantly. 7 .