CN209763670U - Semiconductor silicon wafer drying device - Google Patents

Semiconductor silicon wafer drying device Download PDF

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Publication number
CN209763670U
CN209763670U CN201920412513.1U CN201920412513U CN209763670U CN 209763670 U CN209763670 U CN 209763670U CN 201920412513 U CN201920412513 U CN 201920412513U CN 209763670 U CN209763670 U CN 209763670U
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CN
China
Prior art keywords
mounting disc
fixedly connected
clamping jaw
box
semiconductor silicon
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920412513.1U
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Chinese (zh)
Inventor
郑森平
江水德
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Quzhou Sansheng Electronics Co Ltd
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Quzhou Sansheng Electronics Co Ltd
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Priority to CN201920412513.1U priority Critical patent/CN209763670U/en
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Publication of CN209763670U publication Critical patent/CN209763670U/en
Expired - Fee Related legal-status Critical Current
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

The utility model discloses a semiconductor silicon wafer drying device relates to silicon chip production and processing technical field. The improved multifunctional pedestal is characterized by comprising a pedestal, the interior top fixedly connected with box of base, the interior bottom fixedly connected with baffle of box, the top both ends fixedly connected with bearing of baffle, and through the bearing from a left side to the right side respectively swing joint have first shaft section of thick bamboo and second shaft section of thick bamboo. This semiconductor silicon chip drying device, through setting up the mounting disc, mounting disc and clamping jaw down, it is convenient to have realized getting and put, fixed firm advantage, correspond the card respectively with the upper and lower both ends of silicon chip and go into supreme mounting disc and down in the clamping jaw that sets up on the mounting disc, it is fixed to carry out the centre gripping to the silicon chip, because of the effect of the flexible loop bar of clamping jaw accessible, interval between the clamping jaw about can adjusting according to the different specification size of silicon chip, and keep the clamping-force between the clamping jaw through expanding spring, get simultaneously and put also convenience more, therefore, the clothes hanger is strong in practicability.

Description

Semiconductor silicon wafer drying device
Technical Field
The utility model relates to a silicon chip production and processing technology field specifically is a semiconductor silicon chip drying device.
Background
The solar cell panel is a device which directly or indirectly converts solar radiation energy into electric energy through photoelectric effect or photochemical effect by absorbing sunlight, the main material of most solar cell panels is silicon, compared with a common battery and a recyclable rechargeable battery, the solar cell panel belongs to a more energy-saving and environment-friendly green product, the service life of the solar cell panel is determined by the materials of a cell piece, toughened glass, EVA (ethylene vinyl acetate), TPT (thermoplastic vulcanizate) and the like, the service life of the solar cell panel made by a manufacturer which generally uses good materials can reach 25 years, but the material of the solar cell panel can age along with the change of time along with the influence of the environment
In the production and processing process of solar silicon wafers, the silicon wafers need to be dried, most silicon wafer drying machines in the prior art use hot air for drying, fine scratches and dents exist on the silicon wafers, residual liquid can be generated, and the surface tension of a liquid water film remained on the surfaces of the silicon wafers to be dried is large.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a semiconductor silicon wafer drying device possesses that drying effect is good, gets to put advantages such as convenient and fixed firm, and it is poor to have solved current drying effect, and is difficult to effectively fixed problem.
(II) technical scheme
For realize above-mentioned drying effect good, get put convenient and fixed firm purpose, the utility model provides a following technical scheme: a semiconductor silicon wafer drying device comprises a base, wherein a box body is fixedly connected to the inner top of the base, a partition plate is fixedly connected to the inner bottom of the box body, bearings are fixedly connected to two ends of the top of the partition plate, a first shaft cylinder and a second shaft cylinder are respectively and movably connected to the first shaft cylinder and the second shaft cylinder through the bearings from left to right, an upper mounting plate and a lower mounting plate are fixedly connected to the middle portions of the first shaft cylinder and the second shaft cylinder from top to bottom, clamping jaws are fixedly connected to the inner sides of the upper mounting plate and the lower mounting plate, ventilation openings are formed in two side walls of the box body, axial flow fans are fixedly connected to two sides of the box body, a box cover is fixedly connected to the top of the box body, a driving motor is fixedly connected to the top of the left end of the box cover, a driving wheel is sleeved on the end portion of an output shaft of the driving motor, the top fixedly connected with centrifugal fan of case lid, centrifugal fan's air-out end fixedly connected with shunt tubes, the lower part both ends of shunt tubes all extend to in first shaft section of thick bamboo and the second shaft section of thick bamboo.
Further optimize this technical scheme, the interior bottom of box is the back taper, the interior top of box is equipped with the through-hole, the middle part of baffle is equipped with the hole that leaks, the section of thick bamboo wall of first axle section of thick bamboo and second axle section of thick bamboo all is equipped with the gas pocket, the gas pocket is irregular form and distributes.
Further optimize this technical scheme, go up the mounting disc and be equidistance evenly distributed on first axle section of thick bamboo and second axle section of thick bamboo with lower mounting disc, and the quantity of going up the mounting disc and mounting disc down all is equipped with 3 pairs at least, the clamping jaw is ring distribution on last mounting disc and lower mounting disc.
This technical scheme is further optimized, the clamping jaw includes flexible loop bar, expanding spring and draw-in groove piece, the one end and the draw-in groove piece fixed connection of flexible loop bar, expanding spring cup joints in flexible loop bar outside, and expanding spring's one end and draw-in groove piece looks fixed connection, the other end all with last mounting disc and the inboard wall fixed connection of mounting disc down.
Further optimize this technical scheme, flexible loop bar includes movable rod and sleeve pipe, and the one end of movable rod is located the intraductal portion of cover, through the pulling movable rod, thereby makes its size constantly change in the intraductal portion of cover realize flexible.
Further optimize this technical scheme, the vent corresponds with axial fan's position, axial fan's outside is equipped with the protection casing, the action wheel is located same water flat line with the synchronizing wheel.
Further optimize this technical scheme, the front both sides of box all articulate there is the side door, the middle part of side door is inlayed and is equipped with the glass window, the one end fixedly connected with door handle lock that the box both sides were kept away from to the side door.
(III) advantageous effects
Compared with the prior art, the utility model provides a semiconductor silicon wafer drying device possesses following beneficial effect:
1. This semiconductor silicon chip drying device, through setting up first bobbin, the second bobbin, axial fan, driving motor, centrifugal fan and shunt tubes, the advantage that drying effect is good has been realized, blow to the box in through the ventilation opening through axial fan, and blow to first bobbin and second bobbin in through centrifugal fan through the shunt tubes, rethread driving motor drives first bobbin and second bobbin rotation through the transmission of action wheel with the synchronizing wheel, make the gas of first bobbin and second bobbin form centrifugal force and through gas pocket blowout gas, make the surface waterlogging of the silicon chip of placing on first bobbin and second bobbin throw away through the effect of centrifugal force, and the air flow rate on silicon chip surface can be accelerated to spun gas, realize dry effect effectively, make the drying more even, it is quick.
2. This semiconductor silicon chip drying device, through setting up the mounting disc, mounting disc and clamping jaw down, it is convenient to have realized getting and put, fixed firm advantage, correspond the card respectively with the upper and lower both ends of silicon chip and go into supreme mounting disc and down in the clamping jaw that sets up on the mounting disc, it is fixed to carry out the centre gripping to the silicon chip, because of the effect of the flexible loop bar of clamping jaw accessible, interval between the clamping jaw about can adjusting according to the different specification size of silicon chip, and keep the clamping-force between the clamping jaw through expanding spring, get simultaneously and put also convenience more, therefore, the clothes hanger is strong in practicability.
drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the present invention;
Fig. 3 is a side view of the clamping jaw of the present invention.
In the figure: 1. a base; 2. a box body; 3. a partition plate; 4. a bearing; 5. a first shaft cylinder; 6. a second shaft barrel; 7. an upper mounting plate; 8. a lower mounting plate; 9. a clamping jaw; 10. a vent; 11. an axial flow fan; 12. a box cover; 13. a drive motor; 14. a driving wheel; 15. a synchronizing wheel; 16. a centrifugal fan; 17. a shunt tube; 18. a through hole; 19. a water leakage hole; 20. air holes; 21. a telescopic loop bar; 22. a tension spring; 23. a slot clamping block; 24. a protective cover; 25. a side door; 26. a glass window; 27. a door handle lock.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the utility model discloses a semiconductor silicon wafer drying device, which comprises a base 1, a box body 2 fixedly connected to the inner top of the base 1, a baffle plate 3 fixedly connected to the inner bottom of the box body 2, bearings 4 fixedly connected to both ends of the top of the baffle plate 3, a first shaft 5 and a second shaft 6 respectively movably connected to the bearings 4 from left to right, an upper mounting plate 7 and a lower mounting plate 8 fixedly connected to the middle parts of the first shaft 5 and the second shaft 6 from top to bottom, a clamping jaw 9 fixedly connected to the inner sides of the upper mounting plate 7 and the lower mounting plate 8, an upper mounting plate 7, a lower mounting plate 8 and a clamping jaw 9, so as to realize the advantages of convenience and firmness, the upper and lower ends of the silicon wafer are respectively correspondingly clamped into the clamping jaw 9 arranged on the upper mounting plate 7 and the lower mounting plate 8 to clamp and fix the silicon wafer, because the clamping jaws 9 can adjust the distance between the upper clamping jaw 9 and the lower clamping jaw 9 according to different specifications of silicon wafers under the action of the telescopic sleeve rods 21, the clamping force between the clamping jaws 9 is kept through the telescopic springs 22, the taking and placing are more convenient, the practicability is high, the two side walls of the box body 2 are provided with the ventilation openings 10, the two sides of the box body 2 are fixedly connected with the axial flow fans 11, the top of the box body 2 is fixedly connected with a box cover 12, the top of the left end of the box cover 12 is fixedly connected with a driving motor 13, the end part of an output shaft of the driving motor 13 is sleeved with a driving wheel 14, the upper ends of the first shaft tube 5 and the second shaft tube 6 are both sleeved with a synchronizing wheel 15, the synchronizing wheel 15 is in transmission connection with the driving wheel 14 through a synchronizing belt, the top of the box cover 12 is fixedly connected with a centrifugal fan 16, the air, The drying device comprises a driving motor 13, a centrifugal fan 16 and a shunt tube 17, and has the advantages of good drying effect, wherein air is blown into a box body 2 through an air opening 10 by an axial fan 11, air is blown into a first shaft tube 5 and a second shaft tube 6 through the centrifugal fan 16 through the shunt tube 17, the first shaft tube 5 and the second shaft tube 6 are driven to rotate by the driving motor 13 through the transmission of a driving wheel 14 and a synchronizing wheel 15, so that the gas of the first shaft tube 5 and the second shaft tube 6 forms centrifugal force and is sprayed out through an air hole 20, the water stains on the surfaces of silicon wafers placed on the first shaft tube 5 and the second shaft tube 6 are thrown away under the action of the centrifugal force, the air flow rate on the surfaces of the silicon wafers can be accelerated by the sprayed gas, the drying effect is effectively realized, the drying is more uniform and rapid, and both ends of the lower part of the.
Specifically, the interior bottom of box 2 is the back taper, the interior top of box 2 is equipped with through-hole 18, the water of being convenient for discharge washs, the middle part of baffle 3 is equipped with the hole 19 that leaks, the messenger washs water and sees through the interior bottom that the hole 19 that leaks flowed to box 2, the section of thick bamboo wall of primary shaft section of thick bamboo 5 and secondary shaft section of thick bamboo 6 all is equipped with gas pocket 20, gas pocket 20 is irregular form and distributes, the messenger carries the gas in primary shaft section of thick bamboo 5 and the secondary shaft section of thick bamboo 6 through gas pocket 20 blowout gas, can accelerate the air flow rate on.
Specifically, go up mounting disc 7 and lower mounting disc 8 and be equidistance evenly distributed on first axle cylinder 5 and second axle cylinder 6, and go up mounting disc 7 and lower mounting disc 8's quantity and all be equipped with 3 pairs at least, clamping jaw 9 is the annular distribution on last mounting disc 7 and lower mounting disc 8, can be according to in service behavior, concrete configuration.
Specifically, clamping jaw 9 includes flexible loop bar 21, expanding spring 22 and draw-in groove piece 23, the one end and the draw-in groove piece 23 fixed connection of flexible loop bar 21, expanding spring 22 cup joints in flexible loop bar 21 outside, and expanding spring 22's one end and draw-in groove piece 23 looks fixed connection, the other end all with last mounting disc 7 and the inboard wall fixed connection of lower mounting disc 8, come to carry out the centre gripping to the silicon chip through clamping jaw 9 and fix, hold the clamping-force between clamping jaw 9 through expanding spring 22.
Specifically, flexible loop bar 21 includes movable rod and sleeve pipe, and the one end of movable rod is located intraductal, through the pulling movable rod, thereby makes its size constantly change in the intraductal portion of cover realize flexible, through the effect of flexible loop bar 21, can come the interval between the different specification sizes of adjustment upper and lower clamping jaw 9 according to the silicon chip.
Specifically, the position of the vent 10 corresponds to that of the axial flow fan 11, the axial flow fan 11 conveys air into the box body 2 through the vent 10, a protective cover 24 is arranged outside the axial flow fan 11, the driving wheel 14 and the synchronizing wheel 15 are located on the same horizontal line to guarantee normal transmission operation, the model of the axial flow fan 11 is FA-40, the model of the driving motor 13 is 3IK15RGN-C, and the model of the centrifugal fan 16 is 130 FLJ.
Specifically, the front both sides of box 2 all articulate there is the side door 25, during drying operation, closes side door 25, ensures drying operation's normal clear, and the middle part of side door 25 is inlayed and is equipped with glass window 26, can observe the drying condition through glass window 26, and the one end fixedly connected with door handle lock 27 that box 2 both sides were kept away from to side door 25.
When in use, the side door 25 is firstly opened, the upper end and the lower end of the silicon wafer are respectively correspondingly clamped into the clamping jaws 9 arranged on the upper mounting disk 7 and the lower mounting disk 8 in sequence, after the silicon wafer is placed, the side door 25 is closed, the axial flow fan 11, the driving motor 13 and the centrifugal fan 16 are sequentially started, the axial flow fan 11 works to blow air into the box body 2 through the air inlet 10, the driving motor 13 works to drive the first shaft tube 5 and the second shaft tube 6 to rotate through the transmission of the driving wheel 14 and the synchronizing wheel 15, meanwhile, the centrifugal fan 16 works to convey air into the first shaft tube 5 and the second shaft tube 6 through the shunt pipe 17, so that the air in the first shaft tube 5 and the second shaft tube 6 forms centrifugal force and is sprayed out through the air holes 20, water stains on the surfaces of the silicon wafer placed on the first shaft tube 5 and the second shaft tube 6 are thrown away through the action of the centrifugal, and finishing the drying operation.
In summary, the semiconductor silicon wafer drying device has the advantages of good drying effect by arranging the first shaft tube 5, the second shaft tube 6, the axial fan 11, the driving motor 13, the centrifugal fan 16 and the shunt tube 17, the axial fan 11 blows air into the box body 2 through the vent 10, the centrifugal fan 16 blows air into the first shaft tube 5 and the second shaft tube 6 through the shunt tube 17, the driving motor 13 drives the first shaft tube 5 and the second shaft tube 6 to rotate through the transmission of the driving wheel 14 and the synchronous wheel 15, so that the air in the first shaft tube 5 and the second shaft tube 6 forms centrifugal force and sprays air through the air holes 20, the surface water stains of the silicon wafers placed on the first shaft tube 5 and the second shaft tube 6 are thrown away under the action of the centrifugal force, the sprayed air can accelerate the air flow rate on the surfaces of the silicon wafers, the drying effect is effectively realized, the drying is more uniform and faster, through setting up mounting disc 7, lower mounting disc 8 and clamping jaw 9, it is convenient to have realized getting and put, fixed firm advantage, correspond the upper and lower both ends of silicon chip respectively and block into supreme mounting disc 7 and the clamping jaw 9 that sets up on the mounting disc 8 down, it is fixed to carry out the centre gripping to the silicon chip, because of the effect of the flexible loop bar 21 of clamping jaw 9 accessible, interval between clamping jaw 9 about can adjusting according to the different specification size of silicon chip, and keep the clamping-force between clamping jaw 9 through expanding spring 22, get simultaneously and put also convenience more, therefore, the clothes hanger is strong in practicability.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a semiconductor silicon chip drying device, includes base (1), its characterized in that: the inner top of the base (1) is fixedly connected with a box body (2), the inner bottom of the box body (2) is fixedly connected with a partition plate (3), two ends of the top of the partition plate (3) are fixedly connected with bearings (4), and are respectively and movably connected with a first shaft tube (5) and a second shaft tube (6) from left to right through the bearings (4), the middle parts of the first shaft tube (5) and the second shaft tube (6) are respectively and fixedly connected with an upper mounting disc (7) and a lower mounting disc (8) from top to bottom, the inner sides of the upper mounting disc (7) and the lower mounting disc (8) are respectively and fixedly connected with a clamping jaw (9), two side walls of the box body (2) are provided with ventilation openings (10), two sides of the box body (2) are fixedly connected with axial flow fans (11), the top of the box body (2) is fixedly connected with a box cover (12), and the top of the left end, the output shaft tip of driving motor (13) has cup jointed action wheel (14), synchronizing wheel (15) have all been cup jointed with the upper end of second bobbin (6) in first bobbin (5), synchronizing wheel (15) are connected with action wheel (14) transmission through the hold-in range, the top fixedly connected with centrifugal fan (16) of case lid (12), the air-out end fixedly connected with shunt tubes (17) of centrifugal fan (16), the lower part both ends of shunt tubes (17) all extend to in first bobbin (5) and second bobbin (6).
2. The semiconductor silicon wafer drying apparatus according to claim 1, wherein: the interior bottom of box (2) is the back taper, the interior top of box (2) is equipped with through-hole (18), the middle part of baffle (3) is equipped with water leakage hole (19), the section of thick bamboo wall of first shaft section of thick bamboo (5) and second shaft section of thick bamboo (6) all is equipped with gas pocket (20), gas pocket (20) are irregular form and distribute.
3. The semiconductor silicon wafer drying apparatus according to claim 1, wherein: go up mounting disc (7) and lower mounting disc (8) and be equidistance evenly distributed on first shaft section of thick bamboo (5) and second shaft section of thick bamboo (6), and go up mounting disc (7) and all be equipped with 3 pairs with the quantity of lower mounting disc (8) at least, clamping jaw (9) are ring distribution on last mounting disc (7) and lower mounting disc (8).
4. The semiconductor silicon wafer drying apparatus according to claim 1, wherein: clamping jaw (9) are including flexible loop bar (21), expanding spring (22) and draw-in groove piece (23), the one end and draw-in groove piece (23) fixed connection of flexible loop bar (21), expanding spring (22) cup joint in flexible loop bar (21) outside, and the one end and the draw-in groove piece (23) looks fixed connection of expanding spring (22), the other end all with last mounting disc (7) and the inboard wall fixed connection of lower mounting disc (8).
5. The semiconductor silicon wafer drying apparatus according to claim 4, wherein: the telescopic sleeve rod (21) comprises a movable rod and a sleeve, one end of the movable rod is located inside the sleeve, and the movable rod is pulled to enable the size of the movable rod inside the sleeve to change continuously so as to achieve telescopic effect.
6. the semiconductor silicon wafer drying apparatus according to claim 1, wherein: the ventilation opening (10) corresponds to the axial flow fan (11), a protective cover (24) is arranged outside the axial flow fan (11), and the driving wheel (14) and the synchronous wheel (15) are located on the same horizontal line.
7. The semiconductor silicon wafer drying apparatus according to claim 1, wherein: the front both sides of box (2) all articulate there are side door (25), the middle part of side door (25) is inlayed and is equipped with glass window (26), one end fixedly connected with door lock (27) of box (2) both sides are kept away from in side door (25).
CN201920412513.1U 2019-03-29 2019-03-29 Semiconductor silicon wafer drying device Expired - Fee Related CN209763670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920412513.1U CN209763670U (en) 2019-03-29 2019-03-29 Semiconductor silicon wafer drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920412513.1U CN209763670U (en) 2019-03-29 2019-03-29 Semiconductor silicon wafer drying device

Publications (1)

Publication Number Publication Date
CN209763670U true CN209763670U (en) 2019-12-10

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Application Number Title Priority Date Filing Date
CN201920412513.1U Expired - Fee Related CN209763670U (en) 2019-03-29 2019-03-29 Semiconductor silicon wafer drying device

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111765745A (en) * 2020-07-10 2020-10-13 李峰 Constant-temperature baking device for chip flip chip
CN115540549A (en) * 2022-09-29 2022-12-30 内蒙古兴固科技有限公司 Drying device is used in crystalline silicon chip processing
CN116026111A (en) * 2023-03-27 2023-04-28 苏州芯海半导体科技有限公司 Chip processing baking equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111765745A (en) * 2020-07-10 2020-10-13 李峰 Constant-temperature baking device for chip flip chip
CN115540549A (en) * 2022-09-29 2022-12-30 内蒙古兴固科技有限公司 Drying device is used in crystalline silicon chip processing
CN115540549B (en) * 2022-09-29 2023-11-28 内蒙古兴固科技有限公司 Drying device is used in crystal silicon wafer processing
CN116026111A (en) * 2023-03-27 2023-04-28 苏州芯海半导体科技有限公司 Chip processing baking equipment

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Granted publication date: 20191210

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