CN209763534U - Semiconductor refrigeration plant's intelligent warning heat-insulating assembly - Google Patents
Semiconductor refrigeration plant's intelligent warning heat-insulating assembly Download PDFInfo
- Publication number
- CN209763534U CN209763534U CN201920417667.XU CN201920417667U CN209763534U CN 209763534 U CN209763534 U CN 209763534U CN 201920417667 U CN201920417667 U CN 201920417667U CN 209763534 U CN209763534 U CN 209763534U
- Authority
- CN
- China
- Prior art keywords
- insulated
- thermal
- heat insulation
- semiconductor refrigeration
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The embodiment of the utility model discloses an intelligent alarm heat insulation assembly of semiconductor refrigeration equipment, including thermal-insulated casket, and install the intelligent temperature alarm in thermal-insulated casket inside, thermal-insulated casket separates semiconductor refrigeration equipment's heating end and refrigeration end simultaneously, thermal-insulated casket's shell includes thermal-insulated dustcoat, center support heat insulating board and interior heat conduction bottom plate from outside to inside, be equipped with a plurality of honeycomb core boards of closely arranging between thermal-insulated dustcoat and the center support heat insulating board, be fixed with a plurality of layers of polyurethane foam boards in each honeycomb core board, the inside and outside surface of honeycomb core board all is equipped with the heat conduction silicon film, be equipped with a plurality of evenly distributed ventilative lattice fences between interior heat conduction bottom plate and the center support heat insulating board, ventilative lattice fences are filled with the water gel piece inside; this scheme application temperature detect assembly carries out real-time temperature detection and intelligent warning, improves semiconductor refrigeration plant's safety in utilization, and temperature detect assembly carries out outer thermal-insulated interior heat conduction processing in addition, avoids ambient temperature to influence the effective stability that temperature detected.
Description
Technical Field
The embodiment of the utility model provides a temperature detection alarm technical field, concretely relates to semiconductor refrigeration plant's intelligent warning heat-insulating assembly.
Background
Semiconductor refrigeration piece, also called thermoelectric refrigeration piece, its concrete theory of operation is the Peltier effect that utilizes semiconductor material, when the galvanic couple that the direct current established ties through two kinds of different semiconductor materials, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize refrigerated purpose, because semiconductor refrigeration piece has two kinds of functions of refrigeration and heating, and heating power is very high, consequently in semiconductor refrigeration equipment's course of operation, the fault rate of heating end is high, prior art center generally can set up an intelligent temperature alarm at the heating end and to its temperature real-time supervision, avoid heating end temperature to appear unusually and cause equipment trouble, bring for the maintenance.
although the intelligent temperature alarm can play a role in monitoring the heating end in real time, the temperature of the heating end is in a high state for a long time, so that electronic devices such as a circuit board of the intelligent alarm are easily affected, and the intelligent temperature alarm breaks down, and therefore, certain heat insulation measures are very necessary for the circuit board part of the intelligent alarm.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a semiconductor refrigeration plant's thermal-insulated subassembly of intelligence warning adopts the heat-conduction mode of heat conduction in the outer thermal-insulated to because thermal-insulated effect is poor with self-conductance nature ability is poor among the solution prior art, arouse the poor problem of the safety in utilization of intelligence warning subassembly.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions: the utility model provides a semiconductor refrigeration plant's intelligent warning heat-insulating assembly, is including being used for carrying out the thermal-insulated casket of thermal-insulated protection to the intelligent temperature alarm at semiconductor refrigeration plant system hot junction, thermal-insulated casket sets up between semiconductor refrigeration plant's refrigeration end and heating end, thermal-insulated casket's shell comprises thermal-insulated dustcoat, center-support heat insulating board and the interior heat conduction bottom plate that sets gradually from outside to inside, be equipped with a plurality of closely arranged's honeycomb core board between thermal-insulated dustcoat and the center-support heat insulating board, every the honeycomb core internal fixation is equipped with a plurality of layers of polyurethane foam boards, the interior surface of honeycomb core board all is equipped with heat conduction silica gel piece, be equipped with a plurality of evenly distributed's ventilative web grid between interior heat conduction bottom plate and the center-support heat insulating board, ventilative web grid internal filling.
As an optimized scheme of the utility model, be equipped with the sensing probe loading port between thermal-insulated dustcoat and the interior heat conduction bottom plate, install the double-deck thermal-insulated glass section of thick bamboo that is used for fixed temperature monitoring sensor probe in the sensing probe loading port, double-deck thermal-insulated glass section of thick bamboo both ends opening part is equipped with sealed adiabatic rubber head.
As an optimized proposal of the utility model, the double-layer crack of the double-layer heat insulation glass cylinder is in a vacuum state.
As a preferred scheme of the utility model, the space intussuseption of polyurethane foam board is filled with thermal-insulated gravel.
The utility model discloses an embodiment has following advantage:
(1) The utility model discloses set up one at the heating end of semiconductor refrigeration plant and refrigeration end and be used for carrying out the thermal-insulated casket of thermal-insulated protection to intelligent temperature alarm, install the sensing probe of intelligent temperature alarm on the lateral wall that thermal-insulated casket is close to the heating end, place its circuit board subassembly in the thermal-insulated casket inside, thermal-insulated casket both can separate heating end and refrigeration end, reduce the thermal transmission between heating end and the refrigeration end, thereby reduce the cold volume loss of refrigeration end, and can effectively carry out the isolation protection with the circuit board of intelligent temperature alarm, reduce the fault probability of intelligent temperature alarm;
(2) The utility model discloses a thermal-insulated casket outside is through the combined use of multistage thermal-insulated subassembly, effectively improves thermal-insulated effect, and the honeycomb core carrier can reduce whole weight, improves thermal-insulated structural stability, and increase of service life reduces thermal-insulated subassembly cost to utilize the thermal-insulated subassembly of honeycomb core structure to closely contact, disperse the heat and insulate against heat, reduce the working strength of the thermal insulation material in every honeycomb core, guarantee the best thermal-insulated effect;
(3) the utility model discloses an inside heat-absorbing component that uses of thermal-insulated casket utilizes the net fence to bear the heat-absorbing component, guarantees that the heat that intelligent alarm work produced in time is absorbed through the net gap, avoids the long-time work back of intelligent alarm, and the inside high temperature of the thermal-insulated casket that causes further improves intelligent alarm's safety in utilization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
FIG. 1 is a schematic view of an overall structure of a thermal insulation box according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a heat insulation box according to an embodiment of the present invention;
Fig. 3 is a structural block diagram of an intelligent temperature alarm in an embodiment of the present invention.
In the figure:
1-a heat insulation box; 2-intelligent temperature alarm; 3-a sensing probe loading port; 4-double-layer heat-insulating glass cylinder; 5-sealing a heat-insulating rubber head; 6-insulating gravel;
101-a thermally insulating enclosure; 102-central support insulation board; 103-inner heat conducting bottom plate; 104-a cellular core board; 105-polyurethane foam board; 106-heat conducting silica gel sheet; 107-breathable lattice bars; 108-hydrogel tablets;
201-a power supply; 202-control circuit board; 203-temperature monitoring sensor; 204-alarm light; 205-buzzer.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 3, the utility model provides an intelligence warning heat-insulating assembly of semiconductor refrigeration plant, including the thermal-insulated casket 1 that is used for carrying out thermal-insulated protection to the intelligent temperature alarm in semiconductor refrigeration plant system hot junction, thermal-insulated casket 1 sets up between semiconductor refrigeration plant's refrigeration end and system hot junction.
Semiconductor refrigeration plant has two kinds of functions, can refrigerate, can heat again, and refrigeration efficiency is generally not high, but heats efficiency very high, when avoiding semiconductor refrigeration plant's working strength increase, leads to the high potential safety hazard that arouses in the temperature in heating end, consequently needs intelligent temperature alarm 2 to carry out real-time temperature monitoring to refrigeration plant's heating end.
The heating end of the semiconductor refrigeration equipment is in a high-temperature state for a long time, the fault probability is high, and the normal work of the intelligent temperature alarm is very important to the heating end of the refrigeration equipment.
Meanwhile, in order to protect the intelligent temperature alarm 2 from being affected by external temperature, the working stability of temperature monitoring is improved, and system components are prevented from being damaged by heat, so that the intelligent temperature alarm 2 is placed in the heat insulation box 1 for heat insulation treatment, and the stability of the internal temperature of the heat insulation box 1 is ensured.
the casing of the heat insulation box 1 is composed of a heat insulation outer cover 101, a central support heat insulation plate 102 and an inner heat conduction bottom plate 103 which are arranged from outside to inside in sequence.
The heat insulation outer cover 101 and the central supporting heat insulation plate 102 both have a heat insulation function, the heat insulation effect is improved through double heat insulation treatment, the heat insulation outer cover 101 and the central supporting heat insulation plate 102 can be glass fiber cotton plates, polyurethane foam plates or micro-nano heat insulation plates, gaps of the fiber plates or the foam plates are small, and therefore the air heat conductivity coefficient is very low, so that the heat conduction efficiency is reduced, and heat insulation is realized.
The outer surface of the heat insulation outer cover 101 is further wrapped with aluminum foil paper, the aluminum foil paper is made of heat reflection materials, has a high reflection coefficient, and can reflect heat out, so that the heat insulation effect is achieved.
The inner heat conducting bottom plate 103 is a metal plate, and can conduct heat generated by the operation of the intelligent temperature alarm 2 to the space between the central support heat insulation plate 102 and the inner heat conducting bottom plate 103, so that the problem that the temperature inside the heat insulation box 1 cannot be reduced to influence the working efficiency of the intelligent temperature alarm 2 is avoided.
A plurality of honeycomb core plates 104 which are closely arranged are arranged between the heat insulation cover 101 and the central support heat insulation plate 102, a plurality of layers of polyurethane foam plates 105 are fixedly arranged in each honeycomb core plate 104, heat conduction silica gel sheets 106 are arranged on the inner surface and the outer surface of each honeycomb core plate 104, and heat insulation gravel 6 is filled in gaps of the polyurethane foam plates 105.
In order to improve the overall heat insulation efficiency, the honeycomb core plate 104 is arranged between the heat insulation cover 101 and the central support heat insulation plate 102, so that the cost of heat insulation materials is reduced, the overall weight is reduced, the overall stability of the heat insulation assembly can be improved due to the special honeycomb core structure, and the strength and the rigidity of the heat insulation cover 101 body are improved.
In the present embodiment, the temperature flow is realized in the honeycomb core plate 104 by the heat conductive silicone sheet 106, so that the temperature of the entire honeycomb core plate 104 can be uniformized, thereby reducing the heat insulation strength of each polyurethane foam plate 105, preventing the temperature of the heating end from reaching the maximum heat insulation threshold of the heat insulation material, and further improving the heat insulation effect.
Thermal-insulated gravel 6 is high temperature resistant, improves thermal-insulated effect, avoids heat to enter interior heat conduction bottom plate 103, and influences intelligent temperature alarm 2's normal use.
In summary, the heat insulation box 1 of the present embodiment effectively improves the heat insulation effect by combining the multi-stage heat insulation assemblies, the honeycomb core carrier can reduce the overall weight, improve the stability of the heat insulation structure, prolong the service life, reduce the cost of the heat insulation assemblies, and utilize the close contact of the heat insulation assemblies of the honeycomb core structure to disperse and insulate heat, reduce the working strength of the heat insulation material inside each honeycomb core, and ensure the best heat insulation effect.
A plurality of uniformly distributed air-permeable lattice bars 107 are arranged between the inner heat-conducting bottom plate 103 and the central supporting heat-insulating plate 102, and hydrogel sheets 108 are filled in the air-permeable lattice bars 107.
Because intelligent temperature alarm 2 is after long-time work, the heat that control mainboard and sensor can produce, if only carry out thermal-insulated processing to thermal-insulated casket 1, then the heat that intelligent temperature alarm 2 produced can not reduce, when the surface temperature and the power of intelligent temperature alarm 2 surpassed normal operating value, alarm system's normal work will receive the influence, and the interior heat conduction bottom plate 103 of this embodiment can derive the heat that intelligent monitoring system 2 work produced, the evaporation of the moisture adsorption heat of hydrogel piece 108, thereby maintain intelligent monitoring system 2's temperature environment stable, improve intelligent monitoring system 2's life.
the polymer hydrogel sheet 108 is a three-dimensional network or interpenetrating network system formed by cross-linking and polymerizing molecular chains and a solvent (usually water), and is similar to biological tissues. The cross-linked structure makes it insoluble and keeps a certain shape; the existence of osmotic pressure enables the polymer gel to swell to reach volume balance, the polymer gel can generate volume change due to different types of solvents, salt concentration, PH and temperature, and different electric stimulation and light irradiation, phase transition sometimes occurs, meshes are enlarged, the network loses elasticity, a gel phase region does not exist, the volume is rapidly swelled, and the change is reversible and discontinuous.
In particular to gel taking water as a dispersion medium. The water-soluble polymer with a reticular cross-linked structure is a cross-linked polymer which is formed by introducing a part of hydrophobic groups and hydrophilic residues into the water-soluble polymer, wherein the hydrophilic residues are combined with water molecules to connect the water molecules in the reticular structure, and the hydrophobic residues swell when meeting water. Is a polymer network system, and the nature is soft, can keep certain shape, can absorb a large amount of water, consequently is in the utility model discloses well moisture in the main polymer hydrogel piece of utilizing absorbs the heat and carries out the cooling of intelligent temperature alarm 2.
it should be noted that, in the present embodiment, the intelligent temperature alarm 2 is installed inside the heat insulation box 1, and the heat insulation component and the heat conduction component inside the heat insulation box 1 are distributed in the same manner at the heating end and the heating end, that is, the present embodiment not only isolates the heating end and the cooling end of the semiconductor refrigeration device, but also adds the intelligent temperature alarm 2 in the heat insulation assembly to detect the heating end temperature.
the intelligent temperature alarm 2 is general including power supply 201 to and the control circuit board 202 of being connected with power supply 201, the input of control circuit board 202 is connected with two temperature monitoring sensor 203, the output of control circuit board 202 is equipped with alarm lamp 204 and bee calling organ 205, two temperature monitoring sensor 203 is used for detecting semiconductor refrigeration plant's heating end surface temperature and ambient temperature respectively, and thermal-insulated casket 1 also carries out thermal-insulated protection to intelligent temperature alarm 2's internal device when keeping apart semiconductor refrigeration plant's heating end and refrigeration end.
The following describes an alarm implementation of the intelligent temperature alarm 2 according to the present embodiment:
when the temperature monitoring sensor 203 detects that the heating temperature reaches a threshold value, the control circuit board 202 controls the alarm lamp 204 and the buzzer 205 to work, and prompts a worker to control the power of the semiconductor refrigeration equipment, so that intelligent monitoring and automatic alarm operation of the temperature are realized.
The alarm lamp 204 and the buzzer 205 in the embodiment are installed outside the semiconductor refrigeration equipment, and the control circuit board 202 controls the alarm lamp 204 and the buzzer 205 to alarm through wireless communication, so that the temperature of the heating end of the semiconductor refrigeration equipment can be conveniently and visually checked by a worker.
be equipped with sensing probe loading port 3 between thermal-insulated dustcoat 101 and the interior heat conduction bottom plate 103, install double-deck thermal-insulated glass section of thick bamboo 4 that is used for fixed temperature monitoring sensor 203 probe in the sensing probe loading port 3, be vacuum state in the crack of double-deck thermal-insulated glass section of thick bamboo 4, the opening part at 4 both ends of double-deck thermal-insulated glass section of thick bamboo is equipped with sealed adiabatic rubber head 5, and the normal use that prevents ambient temperature influence sensor that double-deck thermal-insulated glass section of thick bamboo 4 can be further guarantees that the inside data line of double-deck thermal-insulated glass section of thick bamboo 4 does not receive the temperature influence, keeps normal work.
Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (4)
1. The utility model provides a semiconductor refrigeration plant's thermal-insulated subassembly of intelligence warning, is including being used for carrying out thermal-insulated casket (1) of protecting to the intelligence temperature alarm (2) in semiconductor refrigeration plant system hot junction, thermal-insulated casket (1) sets up between semiconductor refrigeration plant's refrigeration end and heating end, its characterized in that: the shell of the heat insulation box (1) is composed of a heat insulation outer cover (101), a center support heat insulation plate (102) and an inner heat conduction bottom plate (103), wherein the heat insulation outer cover (101), the center support heat insulation plate (102) and the inner heat conduction bottom plate (103) are sequentially arranged from outside to inside, a plurality of layers of closely-arranged honeycomb core plates (104) are arranged between the heat insulation outer cover (101) and the center support heat insulation plate (102), each honeycomb core plate (104) is internally and fixedly provided with a plurality of layers of polyurethane foam plates (105), the inner surface and the outer surface of the honeycomb core plate (104) are respectively provided with a heat conduction silica gel sheet (106), a plurality of uniformly-distributed ventilation lattice columns (107) are arranged between the inner heat conduction bottom plate (103) and the center support.
2. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 1, wherein: be equipped with sensing probe loading opening (3) between thermal-insulated dustcoat (101) and interior heat conduction bottom plate (103), install double-deck thermal-insulated glass section of thick bamboo (4) that are used for fixed intelligent temperature alarm's sensing probe in sensing probe loading opening (3), double-deck thermal-insulated glass section of thick bamboo (4) both ends opening part is equipped with sealed adiabatic rubber head (5).
3. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 2, wherein: the double-layer crack of the double-layer heat-insulation glass cylinder (4) is in a vacuum state.
4. The intelligent alarm heat insulation assembly of the semiconductor refrigeration equipment as claimed in claim 1, wherein: the voids between adjacent layers of the polyurethane foam board (105) are filled with insulating gravel (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417667.XU CN209763534U (en) | 2019-03-29 | 2019-03-29 | Semiconductor refrigeration plant's intelligent warning heat-insulating assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920417667.XU CN209763534U (en) | 2019-03-29 | 2019-03-29 | Semiconductor refrigeration plant's intelligent warning heat-insulating assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209763534U true CN209763534U (en) | 2019-12-10 |
Family
ID=68757062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920417667.XU Active CN209763534U (en) | 2019-03-29 | 2019-03-29 | Semiconductor refrigeration plant's intelligent warning heat-insulating assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209763534U (en) |
-
2019
- 2019-03-29 CN CN201920417667.XU patent/CN209763534U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105206895B (en) | The cooling means of battery pack and the battery pack with cooling device | |
| CN108612220B (en) | Building heat preservation wall | |
| CN205335394U (en) | Group battery with cooling device | |
| CN209763534U (en) | Semiconductor refrigeration plant's intelligent warning heat-insulating assembly | |
| US20100242951A1 (en) | Apparatus for inhibiting pressure fluctuations and moisture contamination within solar collectors and multi-glazed windows | |
| CN203467479U (en) | Solar refrigeration fishing heat-preserving box | |
| CN210143200U (en) | Computer network equipment cabinet | |
| CN210897547U (en) | Safe and energy-saving vertical lithium battery pack dual-mode thermal management system | |
| CN110137407A (en) | A kind of the air-cooled type lithium battery pack heat management system and method for high-protection level | |
| CN207426083U (en) | PTC cell heaters | |
| CN213093284U (en) | Lithium battery heat dissipation box with multiple cooling structures | |
| CN214100576U (en) | Energy-saving box-type fixed alternating-current metal closed ring network switch equipment | |
| CN215956781U (en) | Be adapted to outdoor good system rack of radiating water-proof effects | |
| CN114543211A (en) | Double-effect energy storage type air treatment equipment | |
| CN209588501U (en) | A kind of protective device of outdoor heat pump unit | |
| CN209416434U (en) | A kind of novel hydro-thermal anti-freezing water gauge box | |
| CN202871881U (en) | Heat conduction material temperature control battery box | |
| CN207869414U (en) | A kind of metal bucket heating tape with heat insulation function | |
| CN206059525U (en) | Set of cells with temp. control function | |
| CN218038858U (en) | Dry capacitor with moisture-proof assembly | |
| CN205510126U (en) | Heat dissipation cell phone case | |
| CN216017515U (en) | Heat abstractor for big data rack | |
| CN215630379U (en) | Frost-proof water supply installation | |
| CN219286630U (en) | Waterproof coaxial attenuator | |
| CN221236886U (en) | Single-stage double-screw air compressor for simulating plant processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 230000, floor 2, building A3, Zhongan chuanggu science and Technology Park, high tech Zone, Hefei, Anhui Province Patentee after: Anhui Zhongke Xinyuan Semiconductor Technology Co.,Ltd. Address before: 226000 East Road No. 3, Chengnan Street Telecom, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU ZHONGKE XINYUAN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |