CN209728654U - Notebook PC radiator based on thermoelectric heat pump - Google Patents

Abstract

Notebook PC radiator based on thermoelectric heat pump is related to one kind for laptop, is different from the radiator of the air-cooled heat exchange of tradition.It is made of radiator shell, airintake wind-tunnel optimization cushion block, heat pump hot end hot-swappable fans, heat pump hot end radiating fin, thermoelectric heat pump, heat pump cold end refrigeration fin, heat pump cold end refrigeration convection fan.Heat pump cold end refrigeration convection fan (7) is connected and fixed with heat pump cold end refrigeration fin (6)；Thermoelectric heat pump (5) is bonded fixation by Heat Conduction Material with heat pump cold end refrigeration fin (6) and heat pump hot end radiating fin (4)；Heat pump hot end hot-swappable fans (3) and heat pump hot end radiating fin (4) are connected and fixed in radiator shell (1) of the merging equipped with airintake wind-tunnel optimization cushion block (2).The temperature of cold end is shifted by thermoelectric heat pump, then convection fan progress forced-convection heat transfer is freezed to play the role of to the enhanced heat exchange in the face notebook D to reach cooling by heat pump cold end.

Description

Laptop Cooler Based on Semiconductor Heat Pump

technical field

The utility model relates to a notebook computer heat sink based on a semiconductor heat pump, in particular for the poor thermal performance of the active fan of the notebook computer itself.

Background technique

Laptops are more and more popular because of their small size and portability, but precisely because of their small size, heat dissipation has become a shortcoming of this type of product. Working for a long time causes high heat-generating components such as CPU and GPU to fail to dissipate heat in time, resulting in overheating and performance degradation.

Starting from the principle and technical defects of most external heat sinks in the market, a new heat dissipation scheme is proposed, and a new type of notebook computer heat sink is innovatively developed.

Contents of the invention

The purpose of the utility model is to use the principle of semiconductor heat pump to transfer heat and refrigerate, so as to cool down the area in a limited space and solve the problem of poor self-radiation effect of notebook computers.

The purpose of this utility model is achieved by the following technical solutions:

A notebook computer radiator based on a semiconductor heat pump, which is characterized by a radiator shell (1), an air intake duct optimization pad (2), a heat exchange fan at the hot end of the heat pump (3), and a cooling fin at the hot end of the heat pump (4) , semiconductor heat pump (5), heat pump cold end cooling fins (6), cold end cooling convection fan (7), the cold end cooling convection fan (7) is connected and fixed with the heat pump cold end cooling fins (6), semiconductor heat pump (5) Fit and fix the cooling fins (6) at the cold end of the heat pump and the cooling fins (4) at the hot end of the heat pump through heat-conducting materials, and the heat exchange fan (3) at the hot end of the heat pump is connected to the cooling fins (4) at the hot end of the heat pump It is fixedly placed in the radiator housing (1) equipped with the air intake duct optimization pad (2).

The semiconductor heat pump-based radiator for notebook computers is characterized in that the temperature at the cold end of the heat pump is transferred to the surface of the hot end of the heat pump through the semiconductor heat pump (5), and the heat exchange fan (3) at the hot end of the heat pump and the cooling fins at the hot end of the heat pump ( 4) Take it away quickly to maintain a stable and long-lasting low-temperature area at the cold end of the heat pump, and then perform forced convection heat exchange through the cooling convection fan (7) at the cold end of the heat pump to enhance heat transfer and cool down the D surface of the notebook. Optimize the pad (2) through the air intake duct to optimize the air intake air field on the D side of the notebook.

Advantage and effect of the present utility model are:

When the laptop is forced to cool down, this patent is different from the traditional solution of only relying on external air cooling to dissipate heat from the computer, and introduces a new type of forced heat exchange scheme that combines low-temperature refrigeration and air-cooled heat exchange; On the basis of combining traditional air-cooled heat exchange, a semiconductor heat pump is used to effectively build a low-temperature area to increase the logarithmic average temperature difference and thereby improve heat dissipation efficiency, and the overall compact structure effectively saves desktop space.

Description of drawings

Fig. 1 is a structural exploded diagram of the utility model; Fig. 2 is a structural assembly diagram of the utility model.

Detailed ways

The utility model is described in detail below in conjunction with the embodiment shown in the accompanying drawings.

The labels in the figure are: 1. Radiator shell 2. Intake air duct optimization pad 3. Heat pump hot end heat exchange fan 4. Heat pump hot end cooling fin 5. Semiconductor heat pump 6. Heat pump cold end cooling fin 7. Cold end cooling convection fan

Its structure and composition: the cold end cooling convection fan (7) is connected and fixed with the heat pump cold end cooling fin (6); the semiconductor heat pump (5) is connected with the heat pump cold end cooling fin (6) and the heat pump hot end cooling fin (4) ) is bonded and fixed by heat-conducting materials; the heat exchange fan (3) at the hot end of the heat pump is connected and fixed with the cooling fins (4) at the hot end of the heat pump and inserted into the radiator shell (1) equipped with an air intake duct optimization pad (2) middle.

The using method of the present utility model is as follows:

The utility model mainly solves a new external heat dissipation scheme for the poor independent heat dissipation of the notebook computer, and constructs a low-temperature area through a device such as a semiconductor heat pump to improve the external heat exchange efficiency of the notebook computer.

The utility model transfers the temperature of the cold end of the heat pump to the surface of the hot end of the heat pump through the semiconductor heat pump, and quickly takes it away through the heat exchange fan at the hot end of the heat pump and the cooling fins at the hot end of the heat pump, thereby maintaining a stable and long-lasting low temperature area at the cold end of the heat pump, and then passing The cooling convection fan at the cold end of the heat pump performs forced convection heat exchange to enhance heat transfer and cool down the D surface of the notebook. Optimize the cushion block through the air intake duct to optimize the air intake air field on the D side of the notebook.

Claims (2)

1. A notebook computer radiator based on a semiconductor heat pump, which is characterized by a radiator shell (1), an air intake duct optimization pad (2), a heat exchange fan at the hot end of the heat pump (3), and a cooling fin at the hot end of the heat pump ( 4), semiconductor heat pump (5), heat pump cold end cooling fins (6), cold end cooling convection fan (7), the cold end cooling convection fan (7) is connected and fixed with the heat pump cold end cooling fins (6), The semiconductor heat pump (5) and the cooling fin (6) at the cold end of the heat pump and the cooling fin (4) at the hot end of the heat pump are bonded and fixed by heat-conducting materials, and the heat exchange fan (3) at the hot end of the heat pump and the cooling fin (4) at the hot end of the heat pump ) is connected and fixed into the radiator shell (1) equipped with the air intake duct optimization pad (2). 2. The notebook computer radiator based on semiconductor heat pump according to claim 1, characterized in that, the temperature of the cold end of the heat pump is transferred to the surface of the hot end of the heat pump through the semiconductor heat pump (5), and the heat exchange fan (3) at the hot end of the heat pump and the heat pump The heat dissipation fins (4) at the hot end are quickly taken away to maintain a stable and long-lasting low temperature area at the cold end of the heat pump, and then the cooling convection fan (7) at the cold end of the heat pump performs forced convection heat exchange to strengthen the D surface of the notebook The effect of heat transfer and cooling is to optimize the pad (2) through the air intake duct to optimize the air intake air field on the D side of the notebook.