CN209680610U - A kind of wafer selecting jig suitable for 1210 package dimensions - Google Patents
A kind of wafer selecting jig suitable for 1210 package dimensions Download PDFInfo
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- CN209680610U CN209680610U CN201920205545.4U CN201920205545U CN209680610U CN 209680610 U CN209680610 U CN 209680610U CN 201920205545 U CN201920205545 U CN 201920205545U CN 209680610 U CN209680610 U CN 209680610U
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- strip groove
- groove
- wafer
- mask plate
- strip
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of wafer selecting jigs suitable for 1210 package dimensions, including cover board, first mask plate, second mask plate and pedestal for placing wafer, first mask plate is Nian Jie with the bottom surface of the cover board, uniform intervals are provided with multiple first strip grooves in the pedestal, second strip groove and third strip groove, the equal length of first strip groove and third strip groove and the length for being greater than second strip groove, the both ends of second strip groove are respectively arranged with the first frame groove and the second frame groove, second mask plate and first strip groove, second strip groove and third strip groove are bonded respectively.The utility model can be avoided chip and generate displacement in election process, while carrying out precise positioning to chip and providing reliable support protection structure, and can greatly reduce a possibility that destroying wafer during extracing unqualified chip manually.
Description
Technical field
The utility model belongs to wafer selecting jig technical field, more particularly, to a kind of suitable for 1210 package dimensions
Wafer selecting jig.
Background technique
In recent years, the quartz crystal product sales volume annual in the whole world is increased with 15% or so speed.With letter
The high speed development of breath industry, quartz oscillator is because of its small in size, light-weight, high reliablity and the high spy of frequency stability
Point is widely used in various smart machines, such as: communication equipment, industrial equipment, game station and housed device etc..In stone
In the production process of English crystal, it is often necessary to be extractd to the undesirable chip of appearance.Wherein, the crystalline substance of a piece of 33mm*25.1mm
Hundreds of chips are usually contained on circle.
In the prior art, the chip that link needs to extract bad order by micro- sem observation and manually is selected in appearance,
But the thickness of wafer is very thin, thickness is about 20-80 microns, and slight external force can lead to wafer breakage, therefore extract manually
Shi Jiyi damages wafer, carrys out heavy losses to actual production active belt.In addition, often generating one in the election process of chip
Fixed displacement, to be difficult to realize the precise positioning to chip.
Utility model content
The purpose of this utility model is to provide a kind of wafer selecting jigs suitable for 1210 package dimensions, can be avoided
Chip generates displacement in election process, while carrying out precise positioning to chip and providing reliable support protection structure, and
A possibility that wafer is destroyed during extracing unqualified chip manually can be greatly reduced.
The utility model embodiment provides a kind of wafer selecting jig suitable for 1210 package dimensions, including cover board,
First mask plate, the second mask plate and the pedestal for placing wafer, first mask plate is Nian Jie with the bottom surface of the cover board,
The bottom surface lid of the cover board closes on the base, and uniform intervals are provided with multiple first strip grooves, second in the pedestal
Strip groove and third strip groove, first strip groove, the second strip groove and third strip groove is successively adjacent sets
It sets, wherein the equal length of first strip groove and third strip groove and the length for being greater than second strip groove,
The both ends of second strip groove are respectively arranged with the first frame groove and the second frame groove, second mask plate and institute
It states the first strip groove, the second strip groove and third strip groove to be bonded respectively, multiple chips, institute is carried on the wafer
It states to extend through on the first mask plate and the second mask plate and is provided with multiple through-holes corresponding with the multiple chip, it is the multiple
Through-hole is for highlighting exposed the multiple chip.
Further, the edge top of the pedestal is additionally provided with the card slot for positioning the wafer, the crystalline substance
Circle is placed in the pedestal by the card slot.
Further, the opposite sides of first mask plate and the second mask plate be provided with respectively with first side
Corresponding first groove of frame groove and the second groove corresponding with the second frame groove.
Further, first mask plate is Nian Jie with the bottom surface of the cover board by anaerobic adhesive.
Further, second mask plate passes through anaerobic adhesive and first strip groove, the second strip groove and the
Three strip grooves are bonded respectively.
Further, the through-hole is rectangular through-hole, and the multiple through-hole is in rectanglar arrangement.
Further, the through-hole is made of corrosion processing technology.
Further, the wafer selecting jig is metal material, and is made of anode oxidation process.
Further, the package dimension of the wafer selecting jig is 1.2mm*1.0mm.
In conclusion the utility model is Nian Jie with the bottom surface of the cover board by first mask plate, the bottom of the cover board
Cover closes on the base, and uniform intervals are provided with multiple first strip grooves, the second strip groove and the in the pedestal
Three strip grooves, first strip groove, the second strip groove and third strip groove are successively disposed adjacent.Wherein, described
The equal length of first strip groove and third strip groove and the length for being greater than second strip groove, second bar shaped
The both ends of groove are respectively arranged with the first frame groove and the second frame groove, and second mask plate and first bar shaped are recessed
Slot, the second strip groove and third strip groove are bonded respectively.Multiple chips, first mask plate are carried on the wafer
Multiple through-holes corresponding with the multiple chip are provided with extending through on the second mask plate, the multiple through-hole is for highlighting
Exposed the multiple chip.It so, it is possible that chip is avoided to generate displacement in election process, while precise positioning carried out to chip
And reliable support protection structure is provided, and can greatly reduce and destroy wafer during extracing unqualified chip manually
A possibility that.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
Attached drawing be briefly described, it should be understood that the following drawings illustrates only some embodiments of the utility model, therefore should not
Regard the restriction to range as, for those of ordinary skill in the art, without creative efforts, may be used also
To obtain other relevant attached drawings according to these attached drawings.
Fig. 1 is pedestal a kind of wafer selecting jig suitable for 1210 package dimensions provided by the embodiment of the utility model
Schematic perspective view.
Fig. 2 is pedestal a kind of wafer selecting jig suitable for 1210 package dimensions provided by the embodiment of the utility model
Planar structure schematic diagram.
Fig. 3 is a kind of wafer selecting jig cover plate suitable for 1210 package dimensions provided by the embodiment of the utility model
Structural schematic diagram.
Fig. 4 is first a kind of wafer selecting jig suitable for 1210 package dimensions provided by the embodiment of the utility model
The structural schematic diagram of mask plate.
Fig. 5 is second a kind of wafer selecting jig suitable for 1210 package dimensions provided by the embodiment of the utility model
The structural schematic diagram of mask plate.
Icon:
Cover board 100；First mask plate 200；Second mask plate 300；Pedestal 400；First strip groove 101；
Second strip groove 102；Third strip groove 103；First frame groove 104；Second frame groove 105；
Through-hole 106；Card slot 201；First groove 202；Second groove 203.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.Based on the reality in the utility model
Apply example, those of ordinary skill in the art's every other embodiment obtained without creative labor, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile it is practical new at this
In the description of type, term " first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relatively important
Property.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
Mechanical connection, is also possible to be electrically connected；It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
As Figure 1-Figure 5, a kind of wafer selecting suitable for 1210 package dimensions provided by the embodiment of the utility model
Jig may include cover board 100, the first mask plate 200, the second mask plate 300 and pedestal 400.Wherein, the bottom of the cover board 100
Cover closes on the pedestal 400, and first mask plate 200 is Nian Jie with the bottom surface of the cover board 100, by described first
Mask plate 200 is fixed on the cover board 100.The pedestal 400 carries multiple chips for placing wafer on the wafer.
In addition, the package dimension of the wafer selecting jig can be 1.2mm*1.0mm.Preferably, first mask plate 200 passes through
Anaerobic adhesive is Nian Jie with the bottom surface of the cover board 100.
In the present embodiment, it is recessed to be provided with multiple first strip grooves 101, the second bar shaped for uniform intervals in the pedestal 400
Slot 102 and third strip groove 103.First strip groove 101, the second strip groove 102 and third strip groove 103 according to
It is secondary to be disposed adjacent.
Specifically, the equal length of first strip groove 101 and third strip groove 103 and be greater than the Article 2
The length of connected in star 102, the both ends of second strip groove 102 are respectively arranged with the first frame groove 104 and the second frame
Groove 105.In order to which second mask plate 300 is fixed, second mask plate 300 and first strip groove
101, the second strip groove 102 and third strip groove 103 are bonded respectively.Preferably, second mask plate 300 passes through anaerobism
Glue and first strip groove 101, the second strip groove 102 and third strip groove 103 are be bonded respectively.
When implementation, the wafer selecting jig is placed under microscope, extracts underproof chip with syringe needle.In this way, energy
Reliable support protection structure enough is provided for the wafer, moves and observes under the microscope convenient for chip；And it can be significantly
Reduce a possibility that wafer is destroyed during extracing unqualified chip manually.
In order to highlight exposed the multiple chip, it is provided through on first mask plate 200 and the multiple chip
Corresponding multiple through-holes 106 also extend through on second mask plate 300 and are provided with multiple through-holes corresponding with the multiple chip
106.Wherein, the through-hole 106 can be rectangular through-hole 106, and the multiple through-hole 106 is in rectanglar arrangement.It is described when implementation
Through-hole 106 is preferably made of corrosion processing technology.
Further, the edge top of the pedestal 400 is additionally provided with the card slot 201 for positioning the wafer,
The wafer is placed in the pedestal 400 by the card slot 201, to prevent from making institute during selecting the chip
It states wafer to be subjected to displacement, so as to carry out precise positioning to chip.
The opposite sides of first mask plate 200 and the second mask plate 300 be provided with respectively with first frame
Corresponding first groove 202 of groove 104 and second groove 203 corresponding with the second frame groove 105.First frame
The mutual cooperation of groove 104, the first groove 202, the second frame groove 105 and the second groove 203 can be convenient for clamping the crystalline substance
Round edge facilitates operation.
Preferably, the wafer selecting jig is mainly fabricated using metal material, to have intensity greatly and can weigh
The characteristics of utilizing again.The wafer selecting jig is also made of anode oxidation process, to prevent from causing the multiple chip
Secondary damage etc..
In conclusion the utility model is Nian Jie with the bottom surface of the cover board 100 by first mask plate 200, the lid
The bottom surface lid of plate 100 closes on the pedestal 400, and uniform intervals are provided with multiple first strip grooves in the pedestal 400
101, the second strip groove 102 and third strip groove 103, first strip groove 101, the second strip groove 102 and
Three strip grooves 103 are successively disposed adjacent.Wherein, the equal length of first strip groove 101 and third strip groove 103
And it is greater than the length of second strip groove 102, it is recessed that the both ends of second strip groove 102 are respectively arranged with the first frame
Slot 104 and the second frame groove 105, second mask plate 300 and first strip groove 101, the second strip groove 102
It is bonded respectively with third strip groove 103.Multiple chips are carried on the wafer, first mask plate 200 and second are covered
It is extended through on diaphragm plate 300 and is provided with multiple through-holes 106 corresponding with the multiple chip, the multiple through-hole 106 is for dashing forward
Show exposed the multiple chip.It so, it is possible that chip is avoided to generate displacement in election process, while chip precisely determine
Simultaneously structure is protected in the reliable support of offer for position, and can be greatly reduced and be destroyed crystalline substance during extracing unqualified chip manually
A possibility that circle.
Above description is merely a prefered embodiment of the utility model, is not intended to limit the utility model, for
For those skilled in the art, various modifications and changes may be made to the present invention.All spirit and original in the utility model
Within then, any modification, equivalent replacement, improvement and so on be should be included within the scope of protection of this utility model.
Claims (9)
1. a kind of wafer selecting jig suitable for 1210 package dimensions, which is characterized in that including cover board, the first mask plate,
Two mask plates and pedestal for placing wafer, first mask plate is Nian Jie with the bottom surface of the cover board, the bottom of the cover board
Cover closes on the base, and uniform intervals are provided with multiple first strip grooves, the second strip groove and the in the pedestal
Three strip grooves, first strip groove, the second strip groove and third strip groove are successively disposed adjacent, wherein described
The equal length of first strip groove and third strip groove and the length for being greater than second strip groove, second bar shaped
The both ends of groove are respectively arranged with the first frame groove and the second frame groove, and second mask plate and first bar shaped are recessed
Slot, the second strip groove and third strip groove are bonded respectively, and multiple chips, first mask plate are carried on the wafer
Multiple through-holes corresponding with the multiple chip are provided with extending through on the second mask plate, the multiple through-hole is for highlighting
Exposed the multiple chip.
2. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that the pedestal
Edge top be additionally provided with the card slot for positioning the wafer, the wafer is placed in the bottom by the card slot
In seat.
3. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that described first
The opposite sides of mask plate and the second mask plate be provided with the first groove corresponding with the first frame groove respectively and with
Corresponding second groove of the second frame groove.
4. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that described first
Mask plate is Nian Jie with the bottom surface of the cover board by anaerobic adhesive.
5. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that described second
Mask plate is be bonded respectively by anaerobic adhesive and first strip groove, the second strip groove and third strip groove.
6. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that the through-hole
For rectangular through-hole, and the multiple through-hole is in rectanglar arrangement.
7. the wafer selecting jig according to claim 6 for being suitable for 1210 package dimensions, which is characterized in that the through-hole
It is made of corrosion processing technology.
8. the wafer selecting jig according to claim 1 for being suitable for 1210 package dimensions, which is characterized in that the chip
Selecting jig is metal material, and is made of anode oxidation process.
9. the wafer selecting jig according to claim 1-8 for being suitable for 1210 package dimensions, which is characterized in that
The package dimension of the wafer selecting jig is 1.2mm*1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920205545.4U CN209680610U (en) | 2019-02-18 | 2019-02-18 | A kind of wafer selecting jig suitable for 1210 package dimensions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920205545.4U CN209680610U (en) | 2019-02-18 | 2019-02-18 | A kind of wafer selecting jig suitable for 1210 package dimensions |
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| Publication Number | Publication Date |
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| CN209680610U true CN209680610U (en) | 2019-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920205545.4U Expired - Fee Related CN209680610U (en) | 2019-02-18 | 2019-02-18 | A kind of wafer selecting jig suitable for 1210 package dimensions |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109692828A (en) * | 2019-02-18 | 2019-04-30 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1210 package dimensions |
-
2019
- 2019-02-18 CN CN201920205545.4U patent/CN209680610U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109692828A (en) * | 2019-02-18 | 2019-04-30 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1210 package dimensions |
| CN109692828B (en) * | 2019-02-18 | 2024-01-23 | 成都泰美克晶体技术有限公司 | Wafer selection jig suitable for 1210 encapsulation size |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191126 |
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| CF01 | Termination of patent right due to non-payment of annual fee |