CN209663173U - Mixing apparatus is used in a kind of preparation of chip substrate bonded adhesives - Google Patents
Mixing apparatus is used in a kind of preparation of chip substrate bonded adhesives Download PDFInfo
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- CN209663173U CN209663173U CN201822222794.2U CN201822222794U CN209663173U CN 209663173 U CN209663173 U CN 209663173U CN 201822222794 U CN201822222794 U CN 201822222794U CN 209663173 U CN209663173 U CN 209663173U
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- blending tank
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Abstract
Description
技术领域technical field
本实用新型涉及胶水混合领域,尤其涉及一种芯片基板粘接胶制备用混合设备。The utility model relates to the field of glue mixing, in particular to a mixing device for preparing chip substrate adhesive glue.
背景技术Background technique
半导体封装测试企业在芯片基板封装过程中,芯片基板装配过程中需要将粘黏胶涂到基板上,进过涂抹半固化胶水后,再将芯片芯片基板粘合在一起,由胶水作为媒介将芯片与基本进行固定。现有的芯片基板粘接胶制备过程中,通常需要将制备胶水的不同原料添加到混合设备中进行混合,现有的混合设备在对胶水进行混合时存在着:混合设备对胶水混合不均匀,影响胶水的生产质量,进而影响芯片基板的后期加工质量,为此我们设计出一种芯片基板粘接胶制备用混合设备来解决上述问题。Semiconductor packaging and testing companies need to apply adhesive glue to the substrate during the chip substrate packaging process and chip substrate assembly process. After applying semi-cured glue, the chip chip substrate is bonded together, and the chip is glued together by glue as a medium. Fixed with Basic. In the preparation process of the existing chip substrate adhesive glue, it is usually necessary to add different raw materials for the preparation of the glue to the mixing equipment for mixing. When the existing mixing equipment mixes the glue, there are: the mixing equipment does not mix the glue uniformly, It affects the production quality of the glue, and then affects the post-processing quality of the chip substrate. Therefore, we have designed a mixing equipment for the preparation of the chip substrate adhesive glue to solve the above problems.
实用新型内容Utility model content
本实用新型提出的一种芯片基板粘接胶制备用混合设备,解决了胶水混合不均匀的问题。The utility model proposes a mixing device for preparing chip substrate adhesive glue, which solves the problem of uneven glue mixing.
为了实现上述目的,本实用新型采用了如下技术方案:In order to achieve the above object, the utility model adopts the following technical solutions:
一种芯片基板粘接胶制备用混合设备,包括箱体,所述箱体的内部设置有混合罐,所述混合罐的上方连接有进料斗,所述混合罐的一侧底部连接有出料管,所述混合罐的外壁与箱体的内部之间连接有连接弹簧,所述箱体的外部固定有搅拌电机,所述搅拌电机的输出轴上通过联轴器连接有转动杆,所述转动杆远离搅拌电机的一端设置在混合罐的内部,并连接有搅拌扇叶,所述混合罐的底部固定有移动底座,所述移动底座为矩形框结构,所述移动底座的内部设置有驱动半齿轮,所述移动底座的矩形框内部的两组侧壁上连接有驱动齿条,两组所述驱动齿条对称设置在驱动半齿轮的两侧,所述移动底座的底部固定有四组移动轮。A mixing device for chip substrate adhesive preparation, including a box body, a mixing tank is arranged inside the box body, a feeding hopper is connected to the top of the mixing tank, and an outlet is connected to the bottom of one side of the mixing tank. The material pipe, the outer wall of the mixing tank and the inside of the box are connected with a connecting spring, the outside of the box is fixed with a stirring motor, and the output shaft of the stirring motor is connected with a rotating rod through a coupling. The end of the rotating rod away from the stirring motor is arranged inside the mixing tank, and is connected with a stirring fan blade. The bottom of the mixing tank is fixed with a moving base, and the moving base is a rectangular frame structure. The inside of the moving base is provided with Drive the half gear, the two groups of side walls inside the rectangular frame of the mobile base are connected with driving racks, the two groups of driving racks are symmetrically arranged on both sides of the driving half gear, and the bottom of the mobile base is fixed with four Set of mobile wheels.
优选的,所述箱体的上方设置为开口,且箱体的一组侧壁上开设有圆孔,圆孔中设置有密封套,所述出料管远离混合罐的一端穿过圆孔设置在箱体的外部。Preferably, the top of the box is provided with an opening, and a set of side walls of the box is provided with a round hole, and a sealing sleeve is arranged in the round hole, and the end of the discharge pipe away from the mixing tank is set through the round hole on the outside of the box.
优选的,所述箱体的外部一侧焊接有固定板,固定板上通过螺钉固定有搅拌电机。Preferably, a fixing plate is welded on the outer side of the box, and a stirring motor is fixed on the fixing plate by screws.
优选的,所述驱动齿条与驱动半齿轮相互啮合。Preferably, the drive rack and the drive half gear are in mesh with each other.
优选的,四组所述移动轮的结构相同,分别相互对称固定在移动底座的底部四角。Preferably, the four sets of moving wheels have the same structure, and are respectively symmetrically fixed on the bottom four corners of the moving base.
本实用新型中,通过搅拌扇叶对混合罐中的胶水进行搅拌,并通过驱动半齿轮带动移动底座左右往返移动,进而带动混合罐的左右往返移动,通过搅拌扇叶的搅拌与混合罐的的配合,使胶水的搅拌更均匀,进而使胶水的混合更充分。In the utility model, the glue in the mixing tank is stirred by the stirring fan blade, and the moving base is driven to and fro by driving the half gear, and then the left and right reciprocating movement of the mixing tank is driven. Cooperate to make the mixing of the glue more uniform, and then make the mixing of the glue more complete.
本实用新型,结构合理,设计新颖,可快速简便的的将胶水搅拌混合,胶水混合较为均匀,有效的提高胶水的质量。The utility model has a reasonable structure and a novel design, and can quickly and easily stir and mix the glue, the glue is mixed more uniformly, and the quality of the glue can be effectively improved.
附图说明Description of drawings
图1为本实用新型的结构示意图。Fig. 1 is the structural representation of the utility model.
图2为图1中的A处放大图。Figure 2 is an enlarged view of A in Figure 1 .
图中标号:1箱体、2混合罐、3进料斗、4出料管、5连接弹簧、6搅拌电机、7转动杆、8搅拌扇叶、9移动底座、10驱动半齿轮、11驱动齿条、12移动轮。Labels in the figure: 1 box body, 2 mixing tank, 3 feed hopper, 4 discharge pipe, 5 connecting spring, 6 stirring motor, 7 rotating rod, 8 stirring fan blade, 9 moving base, 10 driving half gear, 11 driving Rack, 12 moving wheels.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example.
参照图1-2,一种芯片基板粘接胶制备用混合设备,包括箱体1,箱体1的内部设置有混合罐2,混合罐2的上方连接有进料斗3,混合罐2的一侧底部连接有出料管4,箱体1的上方设置为开口,且箱体1的一组侧壁上开设有圆孔,圆孔中设置有密封套,出料管4远离混合罐2的一端穿过圆孔设置在箱体1的外部,混合罐2的外壁与箱体1的内部之间连接有连接弹簧5,箱体1的外部固定有搅拌电机6,箱体1的外部一侧焊接有固定板,固定板上通过螺钉固定有搅拌电机6,搅拌电机6的输出轴上通过联轴器连接有转动杆7,转动杆7远离搅拌电机6的一端设置在混合罐2的内部,并连接有搅拌扇叶8,混合罐2的底部固定有移动底座9,移动底座9为矩形框结构,移动底座9的内部设置有驱动半齿轮10,移动底座9的矩形框内部的两组侧壁上连接有驱动齿条11,两组驱动齿条11对称设置在驱动半齿轮10的两侧,驱动齿条11与驱动半齿轮10相互啮合,移动底座9的底部固定有四组移动轮12,四组移动轮12的结构相同,分别相互对称固定在移动底座9的底部四角,本实用新型,通过搅拌扇叶8对混合罐2中的胶水进行搅拌,并通过驱动半齿轮11带动移动底座9左右往返移动,进而带动混合罐2的左右往返移动,通过搅拌扇叶8的搅拌与混合罐2的的配合,使胶水的搅拌更均匀,进而使胶水的混合更充分。Referring to Figure 1-2, a kind of mixing equipment for chip substrate adhesive preparation, including a box body 1, a mixing tank 2 is arranged inside the box body 1, a feeding hopper 3 is connected above the mixing tank 2, and the mixing tank 2 A discharge pipe 4 is connected to the bottom of one side, and the top of the box body 1 is set as an opening, and a group of side walls of the box body 1 is provided with a round hole, and a sealing sleeve is arranged in the round hole, and the discharge pipe 4 is far away from the mixing tank 2 One end of the tank is set outside the box body 1 through a round hole, a connecting spring 5 is connected between the outer wall of the mixing tank 2 and the inside of the box body 1, a stirring motor 6 is fixed on the outside of the box body 1, and a stirring motor 6 is fixed outside the box body 1. The side is welded with a fixed plate, the fixed plate is fixed with a stirring motor 6 by screws, the output shaft of the stirring motor 6 is connected with a rotating rod 7 through a coupling, and the end of the rotating rod 7 away from the stirring motor 6 is set inside the mixing tank 2 , and is connected with stirring blade 8, the bottom of the mixing tank 2 is fixed with a mobile base 9, the mobile base 9 is a rectangular frame structure, the inside of the mobile base 9 is provided with a drive half gear 10, two groups of rectangular frames inside the mobile base 9 The side wall is connected with a driving rack 11, and two sets of driving racks 11 are arranged symmetrically on both sides of the driving half gear 10, and the driving rack 11 and the driving half gear 10 mesh with each other, and four sets of moving wheels are fixed on the bottom of the mobile base 9 12. The four sets of moving wheels 12 have the same structure, and they are symmetrically fixed on the four corners of the bottom of the moving base 9. In this utility model, the glue in the mixing tank 2 is stirred by the stirring blade 8, and the driving half gear 11 drives the movement The base 9 moves back and forth from side to side, and then drives the mixing tank 2 to move back and forth. Through the stirring of the stirring blade 8 and the cooperation of the mixing tank 2, the glue is stirred more evenly, and the glue is mixed more fully.
在本实用新型的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的设备或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", Orientation indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operation, and therefore cannot be construed as a limitation of the utility model.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本实用新型的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present utility model, "plurality" means two or more, unless otherwise specifically defined.
工作原理:本实用新型在使用时,通过将驱动半齿轮11连接驱动电机,使驱动电机带动驱动半齿轮11转动,通过驱动半齿轮11与移动底座9内的驱动齿条11的配合,带动移动底座9在箱体1内作用来回晃动,并通过搅拌电机6带动转动杆7转动,通过转动杆7转动,使搅拌扇叶8将混合罐2中的胶水原料搅拌混合均匀,并通过该混合罐2的晃动,使搅拌扇叶8相对混合罐2左右移动,进而使胶水的搅拌更均匀,从而使胶水混合效果更好。Working principle: When the utility model is in use, by connecting the driving half gear 11 to the driving motor, the driving motor drives the driving half gear 11 to rotate, and through the cooperation of the driving half gear 11 and the driving rack 11 in the moving base 9, the movement is driven The base 9 shakes back and forth in the box body 1, and drives the rotating rod 7 to rotate through the stirring motor 6, and the rotating rod 7 rotates to make the stirring blade 8 stir and mix the glue raw materials in the mixing tank 2 evenly, and pass through the mixing tank The shaking of 2 makes the stirring blade 8 move left and right relative to the mixing tank 2, thereby making the stirring of the glue more uniform, so that the glue mixing effect is better.
以上所述,仅为本实用新型较佳的具体实施方式,但本实用新型的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本实用新型揭露的技术范围内,根据本实用新型的技术方案及其实用新型构思加以等同替换或改变,都应涵盖在本实用新型的保护范围之内。The above is only a preferred embodiment of the utility model, but the scope of protection of the utility model is not limited thereto. The equivalent replacement or change of the new technical solution and the concept of the utility model shall be covered by the protection scope of the utility model.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822222794.2U CN209663173U (en) | 2018-12-28 | 2018-12-28 | Mixing apparatus is used in a kind of preparation of chip substrate bonded adhesives |
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| CN201822222794.2U CN209663173U (en) | 2018-12-28 | 2018-12-28 | Mixing apparatus is used in a kind of preparation of chip substrate bonded adhesives |
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| CN209663173U true CN209663173U (en) | 2019-11-22 |
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| CN201822222794.2U Expired - Fee Related CN209663173U (en) | 2018-12-28 | 2018-12-28 | Mixing apparatus is used in a kind of preparation of chip substrate bonded adhesives |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375335A (en) * | 2018-12-28 | 2020-07-07 | 海太半导体(无锡)有限公司 | Mixing equipment for preparing chip substrate bonding glue |
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2018
- 2018-12-28 CN CN201822222794.2U patent/CN209663173U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375335A (en) * | 2018-12-28 | 2020-07-07 | 海太半导体(无锡)有限公司 | Mixing equipment for preparing chip substrate bonding glue |
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Granted publication date: 20191122 |