CN209591252U - A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect - Google Patents

A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect Download PDF

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Publication number
CN209591252U
CN209591252U CN201822003353.3U CN201822003353U CN209591252U CN 209591252 U CN209591252 U CN 209591252U CN 201822003353 U CN201822003353 U CN 201822003353U CN 209591252 U CN209591252 U CN 209591252U
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CN
China
Prior art keywords
fixedly connected
ontology
heat dissipation
dissipation effect
chip microcontroller
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Expired - Fee Related
Application number
CN201822003353.3U
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Chinese (zh)
Inventor
蔡钊培
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Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd
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Zhangzhou Longwen Jiecheng Electronic Products Manufacturing Co Ltd
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Priority to CN201822003353.3U priority Critical patent/CN209591252U/en
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Publication of CN209591252U publication Critical patent/CN209591252U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model discloses a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect, including ontology, air cooling equipment is fixedly connected at the top of the ontology, liquid cooling apparatus is fixedly connected on the left of the ontology, controller is fixedly connected at the top of the body surface, the air cooling equipment includes ventilation duct, the bottom of the ventilation duct is fixedly connected with ontology, the two sides of the ventilation tube cavity are provided with motor, the output shaft of the motor is fixedly connected with flabellum, and the two sides of the motor are fixedly connected to connecting rod.The utility model is used cooperatively by ventilation duct, motor, flabellum, condensation liquid case, condenser pipe, water pump, hose, single-chip microcontroller, memory module, receiving module, display, control panel and temperature sensor, the temperature to chamber body for capableing of efficient express delivery carries out radiating treatment, greatly improve heat dissipation effect, the service life of ontology is not only extended, but also reduces a possibility that its fire occurs.

Description

A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect
Technical field
The utility model relates to microcontroller development board manufacturing technology field, specially a kind of single-chip microcontroller of good heat dissipation effect is opened Send out panel manufacturing apparatus.
Background technique
The development of singlechip technology is based on the development of microprocessor technology and very large scale integration technology, with wide General application field pulls, and shows the development trend that individual character is had more compared with microprocessor, microcontroller development board be for learning 51, The single chip computer experiment equipment of STC, AVR model, single-chip microcontroller needs to use manufacturing equipment when production, but existing monolithic Machine exploitation panel manufacturing apparatus heat dissipation effect is simultaneously bad, and so the heat deposition inside manufacturing equipment, can not only reduce manufacture The service life of equipment, but also it is likely to cause fire hazard.
Utility model content
The purpose of this utility model is to provide a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect, have heat dissipation The good advantage of effect solves existing microcomputer development panel manufacturing apparatus heat dissipation effect and bad, so manufacturing equipment Internal heat deposition, the problem of not only reducing the service life of manufacturing equipment, but also be likely to cause fire hazard.
To achieve the above object, the utility model provides the following technical solutions: a kind of microcomputer development of good heat dissipation effect Panel manufacturing apparatus, including ontology are fixedly connected with air cooling equipment at the top of the ontology, are fixedly connected on the left of the ontology Liquid cooling apparatus is fixedly connected with controller at the top of the body surface.
Preferably, the air cooling equipment includes ventilation duct, and the bottom of the ventilation duct is fixedly connected with ontology, the ventilation The two sides of tube cavity are provided with motor, and the output shaft of the motor is fixedly connected with flabellum, and the two sides of the motor are fixed It is connected with connecting rod, the side of the connecting rod is fixedly connected with ventilation duct, it is fixed by the connecting rod connection between two motors, Air Filter has been bolted to connection at the top of the ventilation duct.
Preferably, the liquid cooling apparatus includes condensation liquid case and condenser pipe, and the condenser pipe is looped around this by fixing piece The outlet pipe of the inner wall of body, the condenser pipe is connected to by quickly accepting head with the top for condensing liquid case, the condensation liquid case top Liquid supplementation pipe is communicated on the left of portion, the surface of the liquid supplementation pipe is threaded with nut cap, and the bottom of the condensation liquid case is fixed to be connected It is connected to support plate, the right side of the support plate is fixedly connected with ontology, and the bottom of the support plate is fixedly connected with water pump, described Be communicated with hose on the left of water pump, the one end of the hose far from water pump is connected to condensation liquid case, the right side of the water pump with it is cold The water inlet pipe of solidifying pipe is by quickly holding fittings.
Preferably, the controller includes shell, and the back side of the shell is fixedly connected with ontology, the shell inner cavity Bottom is fixedly connected with circuit board, and the two sides at the top of the circuit board have been respectively fixedly connected with single-chip microcontroller and memory module, described The inner cavity of shell and it is located above single-chip microcontroller and memory module and is fixedly connected with receiving module, the top of the case surface is solid Surely it is connected with display, the bottom of the case surface is fixedly connected with control panel, and the bottom of the shell is fixedly connected with The back side of temperature sensor, the temperature sensor is through to the inner cavity of ontology;
The output end of the single-chip microcontroller and the input terminal of memory module are unidirectionally electrically connected, the input terminal of the single-chip microcontroller with The output end of receiving module is unidirectionally electrically connected, and the input terminal of the receiving module and the output end of temperature sensor are unidirectionally electrical Connection, the output end of the single-chip microcontroller and the input terminal of display are unidirectionally electrically connected, the input terminal of the single-chip microcontroller and control The output end of panel is unidirectionally electrically connected, and the output end of the single-chip microcontroller unidirectionally electrically connects with the input terminal of motor and water pump respectively It connects.
Preferably, the bottom of the body surface offers air inlet, the surface of the air inlet by bolt with it is dust-proof Net is fixedly connected.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model passes through ventilation duct, motor, flabellum, condensation liquid case, condenser pipe, water pump, hose, single-chip microcontroller, deposits Storage module, receiving module, display, control panel and temperature sensor are used cooperatively, be capable of efficient express delivery in ontology The temperature of chamber carries out radiating treatment, greatly improves heat dissipation effect, not only extends the service life of ontology, but also reduces A possibility that its fire occurs.
2, the utility model can be carried out proofing dust and protecting to ventilation duct and air inlet, preferably be protected by setting Air Filter The cleanliness for having demonstrate,proved ventilation duct and body interior timely can carry out condensate liquid benefit to condensation liquid case by the way that liquid supplementation pipe is arranged It fills, preferably ensure that the progress of heat dissipation work, by the way that nut cap is arranged, protection can be sealed to liquid supplementation pipe, is preferably protected The cleanliness for having demonstrate,proved condensate liquid, preferably ensure that heat dissipation effect, by the way that air inlet is arranged, can form gas to air cooling equipment Stream, preferably ensure that heat dissipation effect.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model;
Fig. 2 is the utility model air cooling equipment schematic cross-sectional view;
Fig. 3 is the utility model controller schematic cross-sectional view;
Fig. 4 is Tthe utility model system schematic illustration.
In figure: 1 ontology, 2 air cooling equipments, 3 liquid cooling apparatus, 4 controllers, 5 ventilation ducts, 6 motors, 7 flabellums, 8 connecting rods, 9 Air Filter, 10 condensation liquid cases, 11 condenser pipes, 12 liquid supplementation pipes, 13 nut caps, 14 support plates, 15 water pumps, 16 hoses, 17 shells, 18 electricity Road plate, 19 single-chip microcontrollers, 20 memory modules, 21 receiving modules, 22 displays, 23 control panels, 24 temperature sensors, 25 air inlets Mouthful.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-4, a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect, including ontology 1,1 surface of ontology Bottom offer air inlet 25, by be arranged air inlet 25, can to air cooling equipment 2 formed air-flow, preferably ensure that scattered The surface of thermal effect, air inlet 25 is fixedly connected by bolt with Air Filter 9, can be to ventilation duct 5 by the way that Air Filter 9 is arranged Proofing dust and protecting is carried out with air inlet 25, preferably ensure that the cleanliness inside ventilation duct 5 and ontology 1, the top of ontology 1 is fixed It is connected with air cooling equipment 2, air cooling equipment 2 includes ventilation duct 5, and the bottom of ventilation duct 5 is fixedly connected with ontology 1,5 inner cavity of ventilation duct Two sides be provided with motor 6, the output shaft of motor 6 is fixedly connected with flabellum 7, and the two sides of motor 6 are fixedly connected to connection The side of bar 8, connecting rod 8 is fixedly connected with ventilation duct 5, is fixedly connected between two motors 6 by connecting rod 8, ventilation duct 5 Top has been bolted to connection Air Filter 9, and the left side of ontology 1 is fixedly connected with liquid cooling apparatus 3, and liquid cooling apparatus 3 includes cold Lime set case 10 and condenser pipe 11, condenser pipe 11 are looped around the inner wall of ontology 1 by fixing piece, and the outlet pipe of condenser pipe 11 passes through fast Speed is accepted head and is connected to the top for condensing liquid case 10, and the left side at 10 top of condensation liquid case is communicated with liquid supplementation pipe 12, is mended by setting Liquid pipe 12 timely can carry out condensate liquid supplement to condensation liquid case 10, preferably ensure that the progress of heat dissipation work, liquid supplementation pipe 12 surface is threaded with nut cap 13, by the way that nut cap 13 is arranged, can be sealed protection to liquid supplementation pipe 12, preferably guarantee The cleanliness of condensate liquid, preferably ensure that heat dissipation effect, and the bottom of condensation liquid case 10 is fixedly connected with support plate 14, supports The right side of plate 14 is fixedly connected with ontology 1, and the bottom of support plate 14 is fixedly connected with water pump 15, and the left side of water pump 15 is communicated with soft Pipe 16, the one end of hose 16 far from water pump 15 are connected to condensation liquid case 10, and the right side of water pump 15 and the water inlet pipe of condenser pipe 11 are logical It crosses and quickly accepts head connection, controller 4 is fixedly connected at the top of 1 surface of ontology, controller 4 includes shell 17, shell 17 The back side is fixedly connected with ontology 1, and the bottom of 17 inner cavity of shell is fixedly connected with circuit board 18, the two sides difference at 18 top of circuit board It is fixedly connected with single-chip microcontroller 19 and memory module 20, the inner cavity of the shell 17 and top for being located at single-chip microcontroller 19 and memory module 20 is solid Surely it is connected with receiving module 21, display 22 is fixedly connected at the top of 17 surface of shell, the bottom on 17 surface of shell is fixed to be connected It is connected to control panel 23, the bottom of shell 17 is fixedly connected with temperature sensor 24, and the back side of temperature sensor 24 is through to this The inner cavity of body 1;
The output end of single-chip microcontroller 19 and the input terminal of memory module 20 are unidirectionally electrically connected, the input terminal of single-chip microcontroller 19 with connect The output end for receiving module 21 is unidirectionally electrically connected, and the input terminal of receiving module 21 and the output end of temperature sensor 24 are unidirectionally electrical Connection, the output end of single-chip microcontroller 19 are unidirectionally electrically connected with the input terminal of display 22, the input terminal and control plane of single-chip microcontroller 19 The output end of plate 23 is unidirectionally electrically connected, and the output end of single-chip microcontroller 19 is unidirectionally electrical with the input terminal of motor 6 and water pump 15 respectively Connection passes through ventilation duct 5, motor 6, flabellum 7, condensation liquid case 10, condenser pipe 11, water pump 15, hose 16, single-chip microcontroller 19, storage Module 20, receiving module 21, display 22, control panel 23 and temperature sensor 24 are used cooperatively, and are capable of efficiently express delivery Radiating treatment is carried out to the temperature of 1 inner cavity of ontology, heat dissipation effect is greatly improved, not only extends the service life of ontology 1, And reduce a possibility that its fire occurs.
In use, monitoring in real time by temperature of the temperature sensor 24 to 1 inner cavity of ontology, it is logical then to will test result Cross receiving module 21 and be transferred to single-chip microcontroller 19, single-chip microcontroller 19 will test the data that are previously stored inside result and memory module 20 into Row comparison, after temperature is more than specified value, starting air cooling equipment 2 radiates, when the temperature is excessively high, air cooling equipment 2 and liquid cooling Device 3 starts work simultaneously, and then preferably ensure that heat dissipation effect.
In summary: the microcomputer development panel manufacturing apparatus of the good heat dissipation effect, by ventilation duct 5, motor 6, flabellum 7, Condense liquid case 10, condenser pipe 11, water pump 15, hose 16, single-chip microcontroller 19, memory module 20, receiving module 21, display 22, control The cooperation of panel 23 and temperature sensor 24 processed solves existing microcomputer development panel manufacturing apparatus heat dissipation effect and bad, So the heat deposition inside manufacturing equipment, can not only reduce the service life of manufacturing equipment, but also be likely to cause The problem of fire hazard.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect, including ontology (1), it is characterised in that: the ontology (1) Top be fixedly connected with air cooling equipment (2), be fixedly connected with liquid cooling apparatus (3), the ontology on the left of the ontology (1) (1) controller (4) are fixedly connected at the top of surface.
2. a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect according to claim 1, it is characterised in that: described Air cooling equipment (2) includes ventilation duct (5), and the bottom of the ventilation duct (5) is fixedly connected with ontology (1), in the ventilation duct (5) The two sides of chamber are provided with motor (6), and the output shaft of the motor (6) is fixedly connected with flabellum (7), and the two of the motor (6) Side is fixedly connected to connecting rod (8), and the side of the connecting rod (8) is fixedly connected with ventilation duct (5), two motors (6) it Between be fixedly connected by connecting rod (8), be bolted to connection Air Filter (9) at the top of the ventilation duct (5).
3. a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect according to claim 1, it is characterised in that: described Liquid cooling apparatus (3) includes that condensation liquid case (10) and condenser pipe (11), the condenser pipe (11) are looped around ontology (1) by fixing piece Inner wall, the outlet pipe of the condenser pipe (11) is connected to by quickly accepting head with the top of condensation liquid case (10), the condensation Left side at the top of liquid case (10) is communicated with liquid supplementation pipe (12), and the surface of the liquid supplementation pipe (12) is threaded with nut cap (13), institute The bottom for stating condensation liquid case (10) is fixedly connected with support plate (14), and the right side and ontology (1) of the support plate (14) are fixed to be connected It connects, the bottom of the support plate (14) is fixedly connected with water pump (15), is communicated with hose (16), institute on the left of the water pump (15) It states the one end of hose (16) far from water pump (15) to be connected to condensation liquid case (10), the right side and condenser pipe (11) of the water pump (15) Water inlet pipe by quickly holding fittings.
4. a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect according to claim 1, it is characterised in that: described Controller (4) includes shell (17), and the back side of the shell (17) is fixedly connected with ontology (1), shell (17) inner cavity Bottom is fixedly connected with circuit board (18), and the two sides at the top of the circuit board (18) have been respectively fixedly connected with single-chip microcontroller (19) and have deposited It stores up module (20), the inner cavity of the shell (17) and is located to be fixedly connected with above single-chip microcontroller (19) and memory module (20) and connects It receives module (21), is fixedly connected with display (22) at the top of shell (17) surface, the bottom on shell (17) surface It is fixedly connected with control panel (23), the bottom of the shell (17) is fixedly connected with temperature sensor (24), and the temperature passes The back side of sensor (24) is through to the inner cavity of ontology (1);
The output end of the single-chip microcontroller (19) and the input terminal of memory module (20) are unidirectionally electrically connected, the single-chip microcontroller (19) The output end of input terminal and receiving module (21) is unidirectionally electrically connected, the input terminal and temperature sensor of the receiving module (21) (24) output end is unidirectionally electrically connected, and the output end of the single-chip microcontroller (19) unidirectionally electrically connects with the input terminal of display (22) It connects, the output end of the input terminal and control panel (23) of the single-chip microcontroller (19) is unidirectionally electrically connected, the single-chip microcontroller (19) Input terminal of the output end respectively with motor (6) and water pump (15) is unidirectionally electrically connected.
5. a kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect according to claim 1, it is characterised in that: described The bottom on ontology (1) surface offers air inlet (25), and the surface of the air inlet (25) is fixed by bolt and Air Filter (9) Connection.
CN201822003353.3U 2018-12-01 2018-12-01 A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect Expired - Fee Related CN209591252U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822003353.3U CN209591252U (en) 2018-12-01 2018-12-01 A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822003353.3U CN209591252U (en) 2018-12-01 2018-12-01 A kind of microcomputer development panel manufacturing apparatus of good heat dissipation effect

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114480824A (en) * 2020-11-11 2022-05-13 长程电缆有限公司 High-efficient annealing device is used in cable manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114480824A (en) * 2020-11-11 2022-05-13 长程电缆有限公司 High-efficient annealing device is used in cable manufacture

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191105

Termination date: 20211201

CF01 Termination of patent right due to non-payment of annual fee