CN209578016U - For processing the die device of wave key - Google Patents

For processing the die device of wave key Download PDF

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Publication number
CN209578016U
CN209578016U CN201920128699.8U CN201920128699U CN209578016U CN 209578016 U CN209578016 U CN 209578016U CN 201920128699 U CN201920128699 U CN 201920128699U CN 209578016 U CN209578016 U CN 209578016U
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China
Prior art keywords
mold
die
cavity
processing
locating piece
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Active
Application number
CN201920128699.8U
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Chinese (zh)
Inventor
张岳君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhoushan Ten Thousand Force Mechanical Engineering Maintenance Co Ltd
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Zhoushan Ten Thousand Force Mechanical Engineering Maintenance Co Ltd
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Application filed by Zhoushan Ten Thousand Force Mechanical Engineering Maintenance Co Ltd filed Critical Zhoushan Ten Thousand Force Mechanical Engineering Maintenance Co Ltd
Priority to CN201920128699.8U priority Critical patent/CN209578016U/en
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Abstract

For processing the die device of wave key, including upper mold and lower mold, the upper mold and lower mold include mold set and the locating piece in mold set, the upper mold further includes the dynamic model being installed in mold set, the lower mold further includes the mold cavity being installed in mold set, the mold cavity is divided into two to be made of the mould type cavity block of two mirror images, when lower mold is by the power being pressed downward, the mold meeting spreading of stress, but manually mold cavity is divided into two here, when stress due to mold cavity be divided into two it is automatic separated, therefore power can be released, guarantee the integrality of mold cavity.

Description

For processing the die device of wave key
Technical field
The utility model relates to a kind of molds more particularly to a kind of for processing the die device of wave key.
Background technique
The prior art is generally used hot forging in the past and carries out mold processing, the mold that cannot be beaten with cold forging by rolling.
And cold forging molding is used to have, and required intensity is not achieved in mold, during pressing, since power can not discharge, Easily cause molds break apart or damage.
Utility model content
It is upper defective in order to overcome, this is practical provide it is a kind of for processing the die device of wave key.
The technical solution that the utility model provides to solve the above-mentioned problems:
For processing the die device of wave key, including upper mold and lower mold, the upper mold and lower mold are wrapped Mold set and the locating piece in mold set are included, the upper mold further includes the dynamic model being installed in mold set, described Lower mold further includes the mold cavity being installed in mold set, and the mold cavity is divided into two the mould type by two mirror images Cavity block composition.
The mold cavity upper surface is equipped with location hole, is equipped with locating piece, the upper mold on the location hole Tool is equipped with locating slot, the locating piece and locating slot cooperating.
The locating piece is equipped with inclination angle.
The inclination angle is 15 °.
The mold set is soft material.
The utility model has the advantages that when lower mold is by the power being pressed downward, the mold meeting spreading of stress, but here manually by mould type Chamber is divided into two, and since mold cavity has been divided into two automatic separated when stress, therefore can release power, guarantee mould The integrality of tool type chamber.
Detailed description of the invention
Fig. 1 is upper die structure schematic diagram.
Fig. 2 is lower die structure schematic diagram.
Fig. 3 is lower die structure schematic diagram.
Fig. 4 is lower die cut view.
Fig. 5 is mold cavity block structure schematic diagram.
Fig. 6 is mold cavity block structure schematic diagram.
Upper mold 1, lower mold 2, locating piece 3, dynamic model 4, mold cavity 5, mould type cavity block 6, location hole 8, locating piece 9, Locating slot 10, inclination angle 11, mold set 12.
Specific embodiment
For processing the die device of wave key, including upper mold 1 and lower mold 2, the upper mold 1 and lower mold 2 It include mold set 12 and the locating piece 3 in mold set 12, the upper mold 1 further includes being installed in mold set 12 Dynamic model 4, the lower mold 2 further include be installed on mold set 12 in mold cavity, the mold cavity 5 be divided into two by The mould type cavity block 6 of two mirror images forms.
When lower mold 2 is by the power being pressed downward, the mold meeting spreading of stress, but manually mold cavity one is divided here and is Two, since mold cavity 5 has been divided into two automatic separated when stress, therefore power can be released, guarantee mold cavity 5 Integrality.
The grooving for accurate wave key size, the length of each material to be processed are equipped in the mold cavity 5 It is all not quite similar, therefore grooving is set and can be used to ensure that the size of material.
5 upper surface of mold cavity is equipped with location hole 8, is equipped with locating piece 3 on the location hole 8, described Upper mold is equipped with locating slot 10, the locating piece 3 and 10 cooperating of locating slot, position assurance upper mold 1 and lower 2 energy of mold Precisely molding, guarantees that material to be processed can accurately process required shape.
The locating piece 3 is equipped with inclination angle 11, and the inclination angle 11 is 15 °, and inclination angle 11, which is 15 °, makes locating piece 3 Self-locking, locking phenomenon is formed, is referred to if acting on the position of the resultant force Q of the active force of object within angle of friction, No matter how big this power is, always has a whole resistance R to balance therewith, and object is remain stationary, therefore locating piece 3 is equipped with inclination angle 11 For guaranteeing the positioning of upper mold 1 Yu lower mold 2.
The mold set 12 is soft material, and when mold stress, the part in mold set 12 can rise outward, due to mould Tool set 12 has certain elasticity for soft material, therefore rise outward when will not mold damage set 12.
Generally speaking, when mold 2 is by big power instantly, the part in mold set 12 can rise outward, can be quick-fried, but by It is divided into two in mold cavity 5, even if in the case of by big power, the case where mold cavity 5 pops will not be all generated, because of mould Tool type chamber 5 has been separated into two pieces, while the setting being divided into two can release the big power being subject to, while mold set 12 is The process buffered when mold rises outward to one when soft material prevents mold set 12 to be split up, while 15 ° of locating piece 3 incline Locating piece 3 will not run up in the case that oblique angle 11 also ensures stress.

Claims (6)

1. the die device for processing wave key, including upper mold (1) and lower mold (2), the upper mold (1) and lower die Has the locating piece (3) that (2) include mold set (12) and are located in mold set (12), it is characterised in that: the upper mold (1) It further include the dynamic model (4) being installed in mold set (12), the lower mold (2) further includes the mould being installed in mold set (12) Tool type chamber, the mold cavity (5) is divided into two to be made of two mould type cavity blocks (6).
2. according to claim 1 for processing the die device of wave key, it is characterised in that: two mould types Cavity block (6) is mirror settings.
3. according to claim 2 for processing the die device of wave key, it is characterised in that: the mold cavity (5) upper surface is equipped with location hole (8), is equipped with locating piece (3) on the location hole (8), and the upper mold (1) is equipped with fixed Position slot (10), the locating piece (3) and locating slot (10) cooperating.
4. according to claim 1 for processing the die device of wave key, it is characterised in that: the locating piece (3) Equipped with inclination angle (11).
5. according to claim 4 for processing the die device of wave key, it is characterised in that: the inclination angle (11) It is 15 °.
6. according to claim 1 for processing the die device of wave key, it is characterised in that: the mold set (12) For soft material.
CN201920128699.8U 2019-01-25 2019-01-25 For processing the die device of wave key Active CN209578016U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920128699.8U CN209578016U (en) 2019-01-25 2019-01-25 For processing the die device of wave key

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920128699.8U CN209578016U (en) 2019-01-25 2019-01-25 For processing the die device of wave key

Publications (1)

Publication Number Publication Date
CN209578016U true CN209578016U (en) 2019-11-05

Family

ID=68380507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920128699.8U Active CN209578016U (en) 2019-01-25 2019-01-25 For processing the die device of wave key

Country Status (1)

Country Link
CN (1) CN209578016U (en)

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